Radio frequency power amplifier front-end core

Abstract

The utility model discloses a kind of radio frequency power amplifier front-end cores, specifically related to radio frequency chip technical field, including chip board, radio frequency chip is installed on the upper end of chip board, including installation part, heat dissipation part and protection part, installation part includes mounting plate and guide seat, guide seat is protruded on the upper end of mounting plate, heat dissipation part includes radiator, radiator is located on the upper end of radio frequency chip, for the heat dissipation cooling of radio frequency chip, protection part includes protective shell and locking piece, protective shell cooperates with guide seat, to install protective shell on mounting plate, heat dissipation part, chip board and radio frequency chip are all contained in protective shell, locking piece is installed on protective shell, to apply pressure force to radiator by protective shell, make radiator and radio frequency chip adhere, can make the efficiency and the stability of radio frequency chip heat dissipation better, and can play the protection effect to radio frequency chip.

Description

Technical Field

[0001] This utility model relates to the field of radio frequency chip technology, and in particular to a radio frequency power amplifier front-end chip. Background Technology

[0002] In electronic devices, the radio frequency (RF) front-end circuit is used to realize the transmission of radio frequency energy and information. As an important component in the RF front-end circuit, the RF front-end chip is one of the components with the highest requirements for stability and reliability in electronic devices. It mainly includes several functional parts such as logic control, RF power amplifier, and RF switch. Among them, the RF power amplifier circuit also requires the design of a load matching circuit.

[0003] If external dust or impurities enter the RF front-end chip and accumulate on it, it will affect its working environment and work efficiency. In addition, since the RF front-end chip generates a lot of heat during use, it needs to be cooled. Therefore, there is an urgent need to propose an RF power amplifier front-end chip that can both prevent dust and provide protection, as well as provide heat dissipation and cooling. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide an RF power amplifier front-end chip that can prevent external dust from accumulating on the RF chip without affecting the heat dissipation efficiency of the RF chip, thereby helping to ensure the working stability and efficiency of the RF chip.

[0005] This utility model provides a radio frequency (RF) power amplifier front-end chip, including a chip board with an RF chip mounted on its upper end. The chip board includes a mounting portion, a heat dissipation portion, and a protective portion. The mounting portion includes a mounting plate and a guide seat, with the guide seat protruding from the upper end of the mounting plate. The heat dissipation portion includes a heat sink plate disposed on the upper end of the RF chip for heat dissipation and cooling. The protective portion includes a protective shell and a locking member. The protective shell cooperates with the guide seat to mount the protective shell onto the mounting plate. The heat dissipation portion, the chip board, and the RF chip are all housed within the protective shell. The locking member is mounted on the protective shell to apply a pressing force to the heat sink plate through the protective shell, causing the heat sink plate to adhere to the RF chip.

[0006] In one embodiment, the upper end of the guide seat is provided with a mounting slide rod, and the chip board and the heat sink are both provided with mounting holes, which are then fitted onto the mounting slide rod.

[0007] In one embodiment, the locking member includes a compression spring and an adjusting rod. The compression spring is sleeved on the adjusting rod. The upper end of the protective shell has a first adjusting hole, and the upper end of the mounting slide rod has a second adjusting hole. The adjusting rod can be fixedly installed in the first adjusting hole and the second adjusting hole. The compression spring can contact the upper end of the protective shell and apply force to apply a clamping force to the heat sink through the protective shell.

[0008] In one embodiment, a sealing sleeve is provided between the protective shell and the mounting plate. The lower end face of the protective shell is provided with a mounting groove, and the upper end of the sealing sleeve is provided with an adapter block. The adapter block can be locked in the mounting groove, and the lower end of the sealing sleeve is in contact with the upper end face of the mounting plate.

[0009] In one embodiment, the heat dissipation part further includes a heat-conducting plate, which is disposed at the upper end of the chip board. The heat dissipation plate is mounted on the upper end of the heat-conducting plate, and a plurality of heat dissipation fins are protruding from the upper end of the heat dissipation plate.

[0010] In one embodiment, the heat dissipation unit further includes a heat dissipation copper pipe located between the heat-conducting plate and the heat dissipation plate, with both ends of the heat dissipation copper pipe used to communicate with an external water supply device to circulate coolant.

[0011] In one embodiment, a support block and a limiting block are protruding from the upper end face of the guide seat. The support block is located in the middle of the upper end face of the guide seat, and the limiting block is located at the corner of the guide seat. The mounting slide is located at the upper end of the limiting block. Both the support block and the limiting block are used to contact the lower end of the chip board.

[0012] In one embodiment, a limiting rod protrudes from the upper end of the heat-conducting plate, and a plurality of the limiting rods together form a limiting area. The heat dissipation copper pipe is installed in the limiting area, and the limiting rod contacts the outer wall of the heat dissipation copper pipe.

[0013] In one embodiment, the orthographic projection of the guide seat in the vertical direction matches the orthographic projection of the protective shell in the vertical direction, so that the inner sidewall of the protective shell can contact the sidewall of the guide seat.

[0014] In one embodiment, the guide seat is integrally formed with the mounting plate.

[0015] The beneficial effects of this utility model are as follows:

[0016] The mounting section enables the installation of the chip board and the heat sink. The guide seat cooperates with the protective shell to enable the installation of the protective shell. The protective shell houses the heat sink, the chip board and the RF chip inside, thus protecting the chip board and the RF chip. It can effectively prevent external dust and impurities from falling on the chip board and the RF chip, and can also prevent the chip board and the RF chip from being damaged when bumped.

[0017] The heat sink can dissipate heat and cool the radio frequency chip. By setting a locking device on the protective shell, the locking device and the protective shell can apply a clamping force to the heat sink, thereby attaching the heat sink to the radio frequency chip. This increases the contact area between the heat sink and the radio frequency chip, which helps to ensure the heat dissipation and cooling efficiency of the radio frequency chip. In this way, it can provide overall protection for the radio frequency chip and improve its working performance. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model.

[0020] Figure 2 for Figure 1 Enlarged diagram of point A in the middle.

[0021] Figure 3 This is a cross-sectional view of the overall structure of an embodiment of the present utility model.

[0022] Figure 4 for Figure 3 Enlarged diagram of point B in the middle.

[0023] Figure 5 This is an exploded view of an embodiment of the present invention.

[0024] In the picture:

[0025] 1-Mounting plate; 2-Protective shell; 3-Heat sink; 4-Heat sink fins; 5-Guide seat; 6-Support block; 7-Limit block; 8-Mounting slide bar; 9-Chip board; 10-RF chip; 11-Mounting slot; 12-Heat conduction plate; 13-Copper heat dissipation pipe; 14-Limit rod; 15-Sealing sleeve; 16-Mounting groove; 17-Adaptor block; 18-Compression spring; 19-Adjusting rod. Detailed Implementation

[0026] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this utility model. Based on the description of this utility model, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this utility model.

[0027] Unless otherwise explicitly specified and limited, the terms "setup," "installation," and "connection" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of these terms based on the specific circumstances.

[0028] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0029] The terms “first,” “second,” “third,” etc., are used merely to distinguish elements with similar properties, not to indicate or imply relative importance or a specific order.

[0030] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0031] Combination Figure 1 , Figure 3 and Figure 5 This utility model provides a radio frequency power amplifier front-end chip, including a chip board 9, on which a radio frequency chip 10 is mounted. Specifically, it includes a mounting part, a heat dissipation part, and a protective part. The mounting part includes a mounting plate 1 and a guide seat 5. The guide seat 5 protrudes from the upper end of the mounting plate 1. The heat dissipation part includes a heat dissipation plate 3, which is disposed on the upper end of the radio frequency chip 10 for heat dissipation and cooling of the radio frequency chip 10. The protective part includes a protective shell 2 and a locking member. The protective shell 2 cooperates with the guide seat 5 to install the protective shell 2 on the mounting plate 1, and to accommodate the heat dissipation part, the chip board 9, and the radio frequency chip 10 within the protective shell 2. The locking member is installed on the protective shell 2 to apply a pressing force to the heat dissipation plate 3 through the protective shell 2, so that the heat dissipation plate 3 is in contact with the radio frequency chip 10.

[0032] The installation part enables the installation of the chip board 9 and the heat dissipation part. The guide seat 5 cooperates with the protective shell 2 to enable the installation of the protective shell 2. The protective shell 2 houses the heat dissipation part, the chip board 9 and the radio frequency chip 10 inside it, so as to protect the chip board 9 and the radio frequency chip 10. It can effectively prevent external dust, impurities and other objects from falling on the chip board 9 and the radio frequency chip 10, and can prevent the chip board 9 and the radio frequency chip 10 from being damaged when bumped.

[0033] The heat sink 3 can dissipate heat and cool the RF chip 10. By setting a locking member on the protective shell 2, the locking member cooperates with the protective shell 2 to apply a clamping force to the heat sink 3, thereby attaching the heat sink 3 to the RF chip 10, increasing the contact area between the heat sink 3 and the RF chip 10, which helps to ensure the heat dissipation and cooling efficiency of the RF chip 10, thus providing overall protection for the RF chip 10 and improving the working performance of the RF chip 10.

[0034] In one alternative, the heat dissipation unit includes a heat-conducting plate 12, which is disposed on the upper end of the chip board 9. A heat dissipation plate 3 is installed on the upper end of the heat-conducting plate 12. The upper end of the heat dissipation plate 3 is provided with heat dissipation fins 4, which can increase the heat dissipation area of ​​the heat dissipation plate 3 and thus improve the heat dissipation efficiency of the heat dissipation plate 3.

[0035] Furthermore, such as Figure 5 As shown, the heat dissipation part also includes a heat dissipation copper pipe 13, which is located between the heat conduction plate 12 and the heat dissipation plate 3. Both ends of the heat dissipation copper pipe 13 are used to connect with an external water supply device so that coolant can be introduced into the interior of the heat dissipation copper pipe 13 through the water supply device. The heat dissipation copper pipe 13 can contact the heat conduction plate 12 and the heat dissipation plate 3, thereby increasing the heat dissipation efficiency of the heat conduction plate 12 and the heat dissipation plate 3.

[0036] Understandably, the protective shell 2 has pipe holes for passing through coolant connection pipes.

[0037] For example, both the heat-conducting plate 12 and the heat dissipation copper pipe 13 are made of copper.

[0038] For example, the heat sink 3 is an aluminum component.

[0039] In one of the alternative solutions, such as Figure 5 As shown, the upper end of the guide seat 5 is provided with a mounting slide rod 8. The chip board 9, heat sink 3 and heat conduction plate 12 are respectively provided with mounting holes 11. The mounting holes 11 cooperate with the mounting slide rod 8. During installation, the chip board 9, heat sink 3 and heat conduction plate 12 are all fitted onto the mounting slide rod 8 through the mounting holes 11.

[0040] In one alternative, combining Figure 3 and Figure 5The upper surface of the guide seat 5 is provided with a support block 6 and a limiting block 7. The support block 6 is located in the middle of the guide seat 5 and is used to contact the lower end of the chip board 9, thereby supporting the chip board 9 and making the middle part of the chip board 9 more flat. The limiting block 7 is located at the corner of the upper surface of the guide seat 5, and the mounting slide rod 8 is located at the upper end of the limiting block 7. The limiting block 7 is used to contact the lower end of the chip board 9. The cooperation of the support block 6 and the limiting block 7 can leave a gap between the chip board 9 and the mounting plate 1 to avoid the pins at the lower end of the chip board 9.

[0041] For example, the support block 6 is a rubber component, and the upper end surface of the support block 6 is flush with the upper end surface of the limiting block 7.

[0042] In one of the alternative solutions, such as Figure 5 As shown, the upper end of the heat-conducting plate 12 is provided with several limiting rods 14, which together form a limiting area. The heat dissipation copper pipe 13 is installed in the limiting area, and the limiting rods 14 are in contact with the outer wall of the heat dissipation copper pipe 13. The setting of the limiting rods 14 can limit the heat dissipation copper pipe 13 between the heat-conducting plate 12 and the heat dissipation plate 3, which helps to ensure the installation stability of the heat dissipation copper pipe 13.

[0043] In one of the alternative solutions, such as Figure 3 As shown, the orthographic projection of the guide seat 5 in the vertical direction matches the orthographic projection of the protective shell 2 in the vertical direction, so that the inner sidewall of the protective shell 2 can contact the sidewall of the guide seat 5, thereby playing a guiding role in the installation of the protective shell 2 and improving the installation stability of the protective shell 2.

[0044] For example, the guide seat 5 is integrally formed with the mounting plate 1.

[0045] In one alternative, combining Figure 2 and Figure 4 The lower end face of the protective shell 2 is provided with an installation groove 16, and the lower end of the protective shell 2 is provided with a sealing sleeve 15. The upper end of the sealing sleeve 15 is provided with an adapter block 17. The installation groove 16 and the adapter block 17 cooperate. When the protective shell 2 is installed, the adapter block 17 can be locked in the installation groove 16, and the lower end of the sealing sleeve 15 contacts the upper end face of the mounting plate 1 so as to seal the protective shell 2 and the mounting plate 1.

[0046] For example, the sealing sleeve 15 is a rubber component.

[0047] In one of the alternative solutions, such as Figure 2As shown, the locking component includes a compression spring 18 and an adjusting rod 19. The upper end of the protective shell 2 has a first adjusting hole, and the mounting slide rod 8 has a second adjusting hole. Both the first and second adjusting holes are fitted with the adjusting rod 19. The compression spring 18 is sleeved on the adjusting rod 19. During installation, the operator directly puts the protective shell 2 on the upper end of the heat sink 3 and puts the compression spring 18 on the adjusting rod 19. Then, the adjusting rod 19 is passed through the first adjusting hole and fixed into the second adjusting hole. The compression spring 18 can contact the upper end of the protective shell 2 and apply force to apply a clamping force to the heat sink 3 through the protective shell 2.

[0048] Furthermore, the adjusting rod 19 is fixed with a screw, and the second adjusting hole is a screw hole.

[0049] When the fixing screw is rotated and fixed into the second adjustment hole, the clamping spring 18 will be gradually compressed. The clamping spring 18 will exert force on the upper end surface of the protective shell 2, thus pressing the protective shell 2 tightly. In this way, the heat sink 3 and the heat conduction plate 12 are pressed against the upper end of the RF chip 10, thereby effectively increasing the stability of the contact between the heat conduction plate 12 and the RF chip 10 and improving the cooling efficiency of the RF chip 10. When the clamping force of the clamping spring 18 decreases due to long-term use, the clamping spring 18 can be replaced on the outside of the protective shell 2 without making a lot of structural modifications. This will improve the convenience of maintenance and will not interfere with the chip board 9 and the RF chip 10 on it.

[0050] Finally, it should be noted that the accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0051] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A radio frequency power amplifier front-end chip, comprising a chip board (9), wherein a radio frequency chip (10) is mounted on the upper end of the chip board (9), characterized in that, The device includes an installation part, a heat dissipation part, and a protective part. The installation part includes an installation plate (1) and a guide seat (5). The guide seat (5) protrudes from the upper end of the installation plate (1). The heat dissipation part includes a heat dissipation plate (3). The heat dissipation plate (3) is disposed on the upper end of the radio frequency chip (10) and is used to dissipate heat and cool the radio frequency chip (10). The protective part includes a protective shell (2) and a locking member. The protective shell (2) cooperates with the guide seat (5) to install the protective shell (2) on the installation plate (1). The heat dissipation part, the chip board (9), and the radio frequency chip (10) are all accommodated in the protective shell (2). The locking member is installed on the protective shell (2) to apply a pressing force to the heat dissipation plate (3) through the protective shell (2) so that the heat dissipation plate (3) is in contact with the radio frequency chip (10).

2. The RF power amplifier front-end die of claim 1, wherein, The upper end of the guide seat (5) is provided with a mounting slide rod (8), and the chip board (9) and the heat sink (3) are both provided with mounting holes (11), and are fitted onto the mounting slide rod (8) through the mounting holes (11).

3. The RF power amplifier front-end die of claim 2, wherein, The locking component includes a compression spring (18) and an adjusting rod (19). The compression spring (18) is sleeved on the adjusting rod (19). The upper end of the protective shell (2) is provided with a first adjusting hole, and the upper end of the mounting slide rod (8) is provided with a second adjusting hole. The adjusting rod (19) can be fixedly installed in the first adjusting hole and the second adjusting hole. The compression spring (18) can contact the upper end of the protective shell (2) and apply force to apply a clamping force to the heat sink (3) through the protective shell (2).

4. The RF power amplifier front-end die of claim 1, wherein, A sealing sleeve (15) is provided between the protective shell (2) and the mounting plate (1). The lower end face of the protective shell (2) is provided with a mounting groove (16). The upper end of the sealing sleeve (15) is provided with an adapter block (17). The adapter block (17) can be locked in the mounting groove (16), and the lower end of the sealing sleeve (15) is in contact with the upper end face of the mounting plate (1).

5. The RF power amplifier front-end die of claim 1, wherein, The heat dissipation part also includes a heat-conducting plate (12), which is located at the upper end of the chip board (9). The heat dissipation plate (3) is installed on the upper end of the heat-conducting plate (12), and a plurality of heat dissipation fins (4) are protruding from the upper end of the heat dissipation plate (3).

6. The RF power amplifier front-end die of claim 5, wherein, The heat dissipation unit also includes a heat dissipation copper pipe (13), which is located between the heat conduction plate (12) and the heat dissipation plate (3). Both ends of the heat dissipation copper pipe (13) are used to connect with an external water supply device to circulate coolant.

7. The RF power amplifier front-end die of claim 2, wherein: The upper end face of the guide seat (5) is provided with a support block (6) and a limiting block (7). The support block (6) is located in the middle of the upper end face of the guide seat (5), and the limiting block (7) is located at the corner of the guide seat (5). The mounting slide rod (8) is located at the upper end of the limiting block (7). Both the support block (6) and the limiting block (7) are used to contact the lower end of the chip board (9).

8. The RF power amplifier front-end core of claim 6, wherein, The upper end of the heat-conducting plate (12) is provided with a limiting rod (14), and a plurality of the limiting rods (14) are arranged to form a limiting area. The heat dissipation copper pipe (13) is installed in the limiting area, and the limiting rod (14) is in contact with the outer wall of the heat dissipation copper pipe (13).

9. The RF power amplifier front-end die of claim 1, wherein, The orthographic projection of the guide seat (5) in the vertical direction matches the orthographic projection of the protective shell (2) in the vertical direction, so that the inner sidewall of the protective shell (2) can contact the sidewall of the guide seat (5).

10. The RF power amplifier front-end core of claim 9, wherein, The guide seat (5) and the mounting plate (1) are integrally formed.

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