Atomizing device

Abstract

The application provides an atomization device, which comprises a suction nozzle shell, a heat-conducting member, an atomization assembly and a refrigeration member. At least part of the heat-conducting member is arranged in the suction nozzle shell, and the heat-conducting member is provided with an air outlet channel. The atomization assembly is provided with an atomization channel which is communicated with the air outlet channel, and the atomization assembly is used for heating aerosol substrate to form aerosol in the atomization channel. The refrigeration member is arranged in the suction nozzle shell and is assembled between the inner wall of the suction nozzle shell and the heat-conducting member. The refrigeration member has a cold end and a hot end. The cold end is arranged close to the inner wall of the suction nozzle shell, and the hot end is arranged close to the air outlet channel. The atomization device is provided with the refrigeration member in the suction nozzle shell. The cold end of the refrigeration member is arranged close to the suction nozzle shell, so that the temperature of the suction nozzle shell can be reduced to prevent the suction nozzle shell from being too hot to burn the mouth. The hot end of the refrigeration member can heat the air outlet channel, so that the temperature of the air outlet channel can be increased to prevent the inner wall of the air outlet channel from being too cold to produce condensed liquid.

Description

Technical Field

[0001] This application relates to the field of electronic atomization technology, specifically to an atomization device. Background Technology

[0002] Atomizing devices are used to heat and atomize an aerosol matrix, causing the matrix to generate an aerosol, which users can then inhale through the nozzle. However, on the one hand, during a single inhalation, the aerosol is prone to pre-cooling and liquefaction, producing condensate, as it flows from the atomizing core to the nozzle; on the other hand, after continuous inhalation, the nozzle can easily become too hot and burn the user's lips due to the heat conduction of the aerosol, resulting in a poor user experience. Utility Model Content

[0003] This application provides an atomizing device that can solve the problems of easy condensation and excessively high nozzle temperature during the suction process.

[0004] To address the aforementioned technical problems, this application provides an atomizing device, comprising a nozzle housing, a heat-conducting element, an atomizing assembly, and a cooling element. At least a portion of the heat-conducting element is disposed within the nozzle housing, and an air outlet channel is provided within the heat-conducting element. The atomizing assembly has an atomizing channel communicating with the air outlet channel, and is used to heat the aerosol matrix to form an aerosol within the atomizing channel. The cooling element is located within the nozzle housing and assembled between the inner wall of the nozzle housing and the heat-conducting element. The cooling element has a cold end and a hot end, with the cold end disposed near the inner wall of the nozzle housing and the hot end disposed near the air outlet channel.

[0005] In one embodiment, the cold end of the cooling component is attached to the nozzle housing, and the hot end is attached to the heat-conducting component.

[0006] In one embodiment, a mounting groove is provided on the outer wall of the heat-conducting component, and an air outlet channel is formed on the inner side of the outer wall of the heat-conducting component, and at least a portion of the cooling component is assembled in the mounting groove.

[0007] In one embodiment, the outer wall of the heat-conducting element is spaced apart from the inner wall of the nozzle housing.

[0008] In one embodiment, the number of cooling elements is at least two, and the at least two cooling elements are arranged around the outer periphery of the air outlet channel.

[0009] In one embodiment, the heat-conducting element has at least one set of heat dissipation fin structures, the heat dissipation fin structures comprising a plurality of fins arranged at intervals between each other.

[0010] In one embodiment, the cooling element is a semiconductor cooling chip, with at least one N-type semiconductor, at least one P-type semiconductor, and multiple conductors sandwiched between the cold end and the hot end. The N-type semiconductor and the P-type semiconductor form a series structure through the conductors, and the two ends of the series structure are led out through two conductors to connect to an external power supply to form a closed loop.

[0011] In one embodiment, the heat-conducting component includes a heat dissipation part and an assembly part. The assembly part is disposed at one end of the heat dissipation part near the atomizing component. The side of the assembly part facing the atomizing component is provided with an assembly groove that communicates with the air outlet channel. One end of the atomizing component abuts against the groove wall of the assembly groove. The atomizing device also includes a liquid suction component, which is assembled in the assembly groove and disposed around the periphery of the atomizing component.

[0012] In one embodiment, the atomizing device further includes a first seal, a liquid storage tube, and a second seal, the first seal and the second seal being connected to the two ends of the liquid storage tube in the axial direction, at least a portion of the atomizing component being assembled inside the liquid storage tube, the atomizing component, the liquid storage tube, the first seal and the second seal surrounding and defining a liquid storage cavity for containing the aerosol matrix.

[0013] In one embodiment, the atomizing assembly includes a connecting tube and an atomizing core. One end of the connecting tube passes through a first sealing member and is connected to the air outlet channel of a heat-conducting member. The other end of the connecting tube is connected to the atomizing core, and the atomizing core and the connecting tube cooperate to form an atomizing channel.

[0014] This application provides an atomizing device, which includes a nozzle housing, a heat-conducting element, an atomizing assembly, and a cooling element. At least a portion of the heat-conducting element is disposed within the nozzle housing, and an air outlet channel is provided within the heat-conducting element. The atomizing assembly has an atomizing channel communicating with the air outlet channel, and is used to heat the aerosol matrix to form an aerosol within the atomizing channel. The cooling element is located within the nozzle housing and assembled between the inner wall of the nozzle housing and the heat-conducting element. The cooling element has a cold end and a hot end, with the cold end disposed near the inner wall of the nozzle housing and the hot end disposed near the air outlet channel. This atomizing device incorporates a cooling element within the nozzle housing. This cooling element isolates the heat exchange between the nozzle housing and the air outlet channel. The cold end of the cooling element is positioned close to the nozzle housing to reduce its temperature and prevent burns. The hot end of the cooling element is positioned close to the air outlet channel to heat it. A heat-conducting component transfers the heat from the hot end of the cooling element to all parts of the air outlet channel, thereby increasing its temperature and preventing condensation from forming on the inner wall of the air outlet channel. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of an atomizing device provided in an embodiment of this application;

[0016] Figure 2 This is a cross-sectional view of an atomizing device provided in an embodiment of this application;

[0017] Figure 3 An exploded view of an atomizing device provided in an embodiment of this application;

[0018] Figure 4 This is a schematic diagram of the structure of a heat-conducting component provided in an embodiment of this application;

[0019] Figure 5 This is an exploded structural diagram of an atomizing component, a first seal, a liquid storage tube, a second seal, and a liquid storage component provided in an embodiment of this application.

[0020] Reference numerals: Nozzle housing 10, mounting cavity 11, air outlet 12, heat-conducting component 20, air outlet channel 21, mounting groove 22, heat dissipation fin structure 23, heat dissipation part 24, assembly part 25, assembly groove 251, atomizing component 30, atomizing channel 31, connecting pipe 32, atomizing core 33, atomizing tube 331, liquid guiding component 332, cooling component 40, cold end 41, hot end 42, main body housing 50, liquid suction component 60, first sealing component 70, first through hole 71, liquid storage tube 80, liquid storage cavity 81, liquid storage component 811, second sealing component 90, second through hole 91. Detailed Implementation

[0021] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0022] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments, and the operational steps involved in each embodiment can also be rearranged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for clearly describing a particular embodiment and do not imply that they represent the necessary components and / or order.

[0023] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0024] The terms "parallel" and "perpendicular," etc., are specific to the current technological level, not absolute mathematical definitions. Slight deviations are permissible; approximations of parallelism or perpendicularity are acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, with the angle between A and B ranging from 0° to 10°. Similarly, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, with the angle between A and B ranging from 80° to 100°. The directional terms used in the embodiments of this application, such as "upper," "inner," "outer," and "side," are merely for reference to the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0025] Please refer to Figure 1-3 This application provides an atomizing device, which includes a mouthpiece housing 10, a heat-conducting component 20, an atomizing assembly 30, and a cooling component 40.

[0026] The nozzle housing 10 has an installation cavity 11 inside, and an air outlet 12 is provided on the top wall of the nozzle housing 10 away from the atomizing component 30. Generally, the atomizing device also includes a main housing 50, and one end of the nozzle housing 10 is connected to the main housing 50. In order to facilitate the assembly of the parts inside the nozzle housing 10, the nozzle housing 10 and the main housing 50 can be detachably connected, for example, the nozzle housing 10 and the main housing 50 can be snap-fit ​​connected.

[0027] At least a portion of the heat-conducting element 20 is disposed within the nozzle housing 10, that is, at least a portion of the heat-conducting element 20 is disposed within the mounting cavity 11, and the heat-conducting element 20 is provided with an exhaust channel 21 communicating with the exhaust port 12. The heat-conducting element 20 can be configured with a material with high thermal conductivity, for example, the heat-conducting element 20 can be configured with a thermal conductivity greater than or equal to 50 W / (m·K), such as aluminum alloy, aluminum, copper, etc.

[0028] The atomizing component 30 is disposed inside the main body shell 50. The atomizing component 30 has an atomizing channel 31, which is connected to the air outlet channel 21. The atomizing component 30 is used to heat the aerosol matrix stored inside the main body shell 50 to form an aerosol in the atomizing channel 31. During suction, the aerosol can flow from the atomizing channel 31 to the air outlet channel 21 of the heat conductor 20, and finally flow out from the air outlet 12.

[0029] In one embodiment, the nozzle housing 10 extends inward from the air outlet 12 to form an air outlet channel, which is located within the air outlet channel 21 of the heat-conducting component 20.

[0030] The cooling element 40 is located inside the nozzle housing 10, and is assembled between the inner wall of the nozzle housing 10 and the heat-conducting element 20. The cooling element 40 has a cold end 41 and a hot end 42. Generally, the cooling element 40 can be a thermoelectric cooling element, which is a heat transfer device based on the Peltier effect. For example, a semiconductor cooling chip can be used. When current flows through the thermocouple pair formed by the connection of N-type semiconductor materials and P-type semiconductor materials, heat transfer occurs between the two ends of the semiconductor cooling chip, and heat is transferred from one end to the other, thereby creating a temperature difference that forms the cold end 41 and the hot end 42. Semiconductor cooling chips are small in size, have no vibration or noise, and are easy to design in small atomization devices.

[0031] In one embodiment, the cooling element 40 is a semiconductor cooling chip. At least one N-type semiconductor, at least one P-type semiconductor, and multiple conductors are sandwiched between the cold and hot ends. The N-type and P-type semiconductors are connected in series via the conductors. Preferably, multiple N-type and P-type semiconductors are present between the cold and hot ends, and these multiple N-type and P-type semiconductors are alternately connected via multiple conductors to form a series structure. The conductors can be, for example, copper. The cold and hot ends can be configured as insulating ceramics, and both the cold and hot ends are connected to the N-type and P-type semiconductors via conductors. The two ends of the series structure along the current flow are led out via two conductors, which are used to connect to an external power source to form a closed loop. For example, this external power source can be a power supply within the atomizing device used to power the atomizing assembly 30.

[0032] The cold end 41 is located near the inner wall of the nozzle housing 10, i.e., near the inner wall of the mounting cavity 11, while the hot end 42 is located near the air outlet channel 21, i.e., near the heat-conducting element 20. This atomizing device uses a cooling element 40 inside the nozzle housing 10 to isolate heat exchange between the nozzle housing 10 and the air outlet channel 21. On one hand, the cold end 41 of the cooling element 40, located near the nozzle housing 10, reduces the temperature of the nozzle housing 10, preventing it from becoming too hot and scalding the mouth. On the other hand, the hot end 42 of the cooling element 40, located near the air outlet channel 21, heats the air outlet channel 21. The heat-conducting element 20 transfers the heat from the hot end 42 of the cooling element 40 to all parts of the air outlet channel 21, thereby increasing the temperature of the air outlet channel 21 and preventing the inner wall temperature of the air outlet channel 21 from becoming too low, which would cause condensation when the aerosol passes through the air outlet channel 21. If heat is not conducted through the heat-conducting component 20, but instead a component with low thermal conductivity is used to form the air outlet channel 21, the heating effect of the cooling component 40 on the air outlet channel 21 will be limited. It is possible that only the air outlet channel 21 directly opposite the cooling component 40 will not produce condensate, while the temperature rise of the air outlet channel 21 at a distance from the cooling component 40 will be limited, and condensate may still be produced. However, by using the heat-conducting component 20 with high thermal conductivity to form the air outlet channel 21, the heat transferred to the heat-conducting component 20 can be easily transferred to the entire heat-conducting component 20, thereby ensuring that the entire air outlet channel 21 is not prone to condensate production.

[0033] In one embodiment, such as Figure 2 As shown, the cooling component 40 can be disposed between the inner wall of the mounting cavity 11 and the outer wall of the heat-conducting component 20. The inner wall of the mounting cavity 11 and the outer wall of the heat-conducting component 20 can be walls extending along or approximately along the axial direction of the air outlet channel 21, or having an angle of less than 45 degrees with the axial direction of the air outlet channel 21. The cooling component 40 can be tightly fitted between the nozzle housing 10 and the heat-conducting component 20. For example, the thickness of the cooling component 40 is approximately equal to the gap between the nozzle housing 10 and the heat-conducting component 20, so that the cooling component 40 is not easily moved within the gap between the nozzle housing 10 and the heat-conducting component 20. Alternatively, the nozzle housing 10 and / or the heat-conducting component 20 can be provided with a mounting groove 22, and the cooling component 40 can be assembled within the mounting groove 22. The mounting groove 22 can limit the movement of the cooling component 40 between the nozzle housing 10 and the heat-conducting component 20. For example, as... Figure 2-4 As shown, in one embodiment, the heat-conducting component 20 has a mounting groove 22 on its outer wall, and an air outlet channel 21 is formed on the inner side of the outer wall of the heat-conducting component 20. At least a portion of the cooling component 40 is assembled in the mounting groove 22. The connection between the cooling component 40 and the mounting groove 22 can be a tight fit connection, a snap-fit ​​connection, an adhesive connection, or the like.

[0034] In this design, the cold end 41 of the cooling component 40 is attached to the nozzle housing 10, and the hot end 42 is attached to the heat-conducting component 20. This allows the cooling component 40 to directly cool the nozzle housing 10 and directly heat the heat-conducting component 20, improving energy transfer efficiency. If there is a gap between the cooling component 40 and the nozzle housing 10 or the heat-conducting component 20, some energy will be lost during the transfer process through the air gap, potentially leading to poor cooling of the nozzle housing 10 and heating of the heat-conducting component 20. Therefore, in Figure 2 In one embodiment, the hot end 42 of the cooling component 40 is disposed in the mounting groove 22 and fits against the groove wall of the mounting groove 22, and the cold end 41 of the cooling component 40 extends out of the mounting groove 22 and fits against the cavity wall of the mounting cavity 11.

[0035] In one embodiment, such as Figure 2 As shown, the outer wall of the heat-conducting element 20 is spaced apart from the inner wall of the nozzle housing 10, that is, there is an annular gap between the outer wall of the heat-conducting element 20 and the inner wall of the mounting cavity 11. Due to the presence of the air gap, the transfer of heat from the heat-conducting element 20 to the nozzle housing 10 can be reduced, preventing the nozzle housing 10 from becoming too hot.

[0036] In one embodiment, such as Figure 2 and Figure 3 As shown, the number of cooling components 40 is at least two, and at least two cooling components 40 are arranged around the outer periphery of the air outlet passage 21. For example, in Figure 2 In one embodiment, there are two cooling components 40, which are respectively disposed on two opposite outer walls of the heat-conducting component 20. Each of the two opposite outer walls of the heat-conducting component 20 has a mounting groove 22 for mounting the two cooling components 40. In other embodiments, there may be more than two cooling components 40. Each cooling component 40 can be arranged circumferentially in the air outlet channel 21, and some cooling components 40 can also be arranged sequentially along the length of the gap between the heat-conducting component 20 and the nozzle housing 10.

[0037] In one embodiment, such as Figure 4 As shown, the heat-conducting component 20 has at least one set of heat dissipation fin structures 23. The heat dissipation fin structure 23 includes multiple fins arranged at intervals. In some embodiments, the outer surface of the heat-conducting component 20 is recessed to form multiple intervals, and the structure of the heat-conducting component 20 between adjacent grooves is the fin. By adding heat dissipation fin structures 23 to the heat-conducting component 20, the outer surface area of ​​the heat-conducting component 20 can be increased, thereby improving the heat dissipation area of ​​the heat-conducting component 20. Specifically, heat dissipation fin structures 23 can be provided on each circumferential surface of the heat-conducting component 20.

[0038] In one embodiment, such as Figure 2 and Figure 4As shown, the heat-conducting component 20 includes a heat dissipation part 24 and an assembly part 25. The assembly part 25 is disposed at one end of the heat dissipation part 24 near the atomizing component 30, and the assembly part 25 and the heat dissipation part 24 can be integrally formed. The heat dissipation part 24 is provided with a mounting groove 22, a heat dissipation fin structure 23, and an air outlet channel 21.

[0039] The assembly part 25 has an assembly groove 251 on the side facing the atomizing component 30, which communicates with the air outlet channel 21. One end of the atomizing component 30 abuts against the groove wall of the assembly groove 251, and the atomizing channel 31 of the atomizing component 30 is connected to the air outlet channel 21. The atomizing device also includes a liquid suction component 60, which is assembled in the assembly groove 251 and arranged around the periphery of the atomizing component 30 located in the assembly groove 251. By providing the liquid suction component 60, the liquid suction component 60 can absorb the condensate generated in the heat-conducting component 20 and the atomizing component 30, further preventing the condensate from leaking through the gap between the heat-conducting component 20 and the atomizing component 30. The liquid suction component 60 can be made of a material with a porous structure, such as cotton or porous ceramic.

[0040] Please refer to Figure 2 and Figure 5 In one embodiment, the atomizing device further includes a first sealing element 70, a liquid storage tube 80, and a second sealing element 90. The first sealing element 70 and the second sealing element 90 are respectively connected to both ends of the liquid storage tube 80 along its axial direction. Specifically, the first sealing element 70 and the second sealing element 90 can be made of elastic material, such as silicone. The first sealing element 70 and the second sealing element 90 are respectively press-fitted to both ends of the liquid storage tube 80 along its axial direction to seal both ends of the liquid storage tube 80 and prevent liquid leakage. At least a portion of the atomizing component 30 is assembled inside the liquid storage tube 80. The atomizing component 30, the liquid storage tube 80, the first sealing element 70, and the second sealing element 90 enclose and define a liquid storage cavity 81, which is used to contain the aerosol matrix. The aerosol matrix generally refers to a liquid matrix. A liquid storage element 811 with a porous structure can also be provided inside the liquid storage cavity 81 to store the aerosol matrix.

[0041] The first sealing element 70 is disposed at the end near the heat-conducting element 20, and the second sealing element 90 is disposed at the end away from the heat-conducting element 20. The first sealing element 70 has a first through hole 71, and the second sealing element 90 has a second through hole 91. One end of the atomizing assembly 30 is sealed to the first through hole 71. The first through hole 71 is used to allow the atomizing channel 31 to connect with the air outlet channel 21. Figure 2In this embodiment, one end of the atomizing component 30 passes through the first through hole 71 to abut against the mounting groove 251 of the heat-conducting component 20. The other end of the atomizing component 30 is sealed to a second through hole 91, which is used to allow the atomizing channel 31 to connect with the air inlet channel of the atomizing device. By providing the first sealing element 70 and the second sealing element 90, it can be ensured that the aerosol matrix in the liquid storage chamber 81 is not easily leaked.

[0042] In one embodiment, one end of the heat-conducting element 20 abuts against the nozzle housing 10, and the other end of the heat-conducting element 20 abuts against the first sealing element 70. Specifically, one end of the heat-conducting element 20 abuts against the inner wall of the mounting cavity 11 of the nozzle housing 10, and connects the air outlet channel 21 with the air outlet 12. The assembly part 25 of the heat-conducting element 20 abuts against the first sealing element 70.

[0043] In one embodiment, the atomizing assembly 30 includes a connecting tube 32 and an atomizing core 33. One end of the connecting tube 32 passes through the first sealing member 70 and is connected to the air outlet channel 21 of the heat-conducting member 20. The other end of the connecting tube 32 is connected to the atomizing core 33. The atomizing core 33 and the connecting tube 32 cooperate to form an atomizing channel 31. Specifically, the atomizing core 33 includes an atomizing tube 331, a liquid guiding member 332, and a heating member. The atomizing tube 331 and the connecting tube 32 are connected to form the atomizing channel 31. At least a portion of the structure of the liquid guiding member 332 and the heating member are disposed within the atomizing tube 331. The liquid guiding member 332 is connected to the liquid passage of the liquid storage chamber 81 so that the aerosol matrix in the liquid storage chamber 81 can flow to the liquid guiding member 332. The liquid guiding member 332 is used to guide the aerosol matrix to the heating member so that the heating member heats and atomizes the aerosol matrix. Specifically, the atomizing tube 331 is provided with an opening so that the liquid in the liquid storage chamber 81 can flow to the liquid guide 332. In some embodiments, a portion of the liquid guide 332 can extend into the liquid storage chamber 81 through the opening to guide the aerosol matrix to the heating element.

[0044] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. An atomizing device, characterized in that, include: The nozzle casing; A heat-conducting component, at least a portion of which is disposed within the nozzle housing, and an air outlet channel is provided within the heat-conducting component; An atomizing component, wherein the atomizing component has an atomizing channel that communicates with the air outlet channel, and the atomizing component is used to heat the aerosol matrix to form an aerosol in the atomizing channel; The cooling component is located inside the nozzle housing and is assembled between the inner wall of the nozzle housing and the heat-conducting component. The cooling component has a cold end and a hot end. The cold end is disposed near the inner wall of the nozzle housing, and the hot end is disposed near the air outlet channel.

2. The atomizing device according to claim 1, characterized in that, The cold end of the cooling component is attached to the nozzle housing, and the hot end is attached to the heat-conducting component.

3. The atomizing device according to claim 2, characterized in that, The outer wall of the heat-conducting component is provided with an installation groove, and the air outlet channel is formed on the inner side of the outer wall of the heat-conducting component. At least a portion of the cooling component is assembled in the installation groove.

4. The atomizing device according to claim 1, characterized in that, The outer wall of the heat-conducting component is spaced apart from the inner wall of the nozzle housing.

5. The atomizing device according to claim 1, characterized in that, The number of the refrigeration components is at least two, and at least two of the refrigeration components are arranged around the outer periphery of the air outlet channel.

6. The atomizing device according to claim 1, characterized in that, The heat-conducting component has at least one set of heat dissipation fin structures, the heat dissipation fin structures comprising a plurality of fins arranged at intervals.

7. The atomizing device according to any one of claims 1 to 6, characterized in that, The cooling element is a semiconductor cooling chip. At least one N-type semiconductor, at least one P-type semiconductor, and multiple conductors are sandwiched between the cold end and the hot end. The N-type semiconductor and the P-type semiconductor are connected in series through the conductors, and the two ends of the series structure are led out through the two conductors to connect with an external power supply to form a closed loop.

8. The atomizing device according to claim 7, characterized in that, The heat-conducting component includes a heat dissipation part and an assembly part. The assembly part is disposed at one end of the heat dissipation part near the atomizing component. The assembly part has an assembly groove on the side facing the atomizing component that communicates with the air outlet channel. One end of the atomizing component abuts against the groove wall of the assembly groove. The atomizing device also includes a liquid suction component, which is assembled in the assembly groove and arranged around the periphery of the atomizing component.

9. The atomizing device according to claim 8, characterized in that, It also includes a first seal, a liquid storage tube, and a second seal. The first seal and the second seal are respectively connected to both ends of the liquid storage tube in the axial direction. At least a portion of the atomizing component is assembled inside the liquid storage tube. The atomizing component, the liquid storage tube, the first seal, and the second seal enclose and define a liquid storage cavity, which is used to contain the aerosol matrix.

10. The atomizing device according to claim 9, characterized in that, The atomizing component includes a connecting tube and an atomizing core. One end of the connecting tube passes through the first sealing member and is connected to the air outlet channel of the heat-conducting member. The other end of the connecting tube is connected to the atomizing core. The atomizing core and the connecting tube cooperate to form the atomizing channel.

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