Laser glass cutting and splitting integrated machine

Abstract

The utility model discloses a kind of laser glass cutting and splitting integrated machines, relate to glass processing technical field, specifically a kind of laser glass cutting and splitting integrated machines, including rack, the middle position of the upper surface of the rack is fixedly installed with two parallel Y-axis linear module, the upper of Y-axis linear module is provided with the slide of front and rear movement. Through the cooperation of Y-axis linear module, front X-axis linear module and rear X-axis linear module, the laser glass cutting and splitting integrated machine has the effect of high processing efficiency, through the cooperation of Y-axis linear module and backing plate, the laser glass cutting and splitting integrated machine has the effect of applicable to glass of all sizes, through the cooperation of labyrinth support, baffle, backing plate and inner sealing plate, the laser glass cutting and splitting integrated machine has the effect of avoiding waste material to be leaked into guide rail or wire slot, through the cooperation of backing plate, waste material groove and waste material trolley, the laser glass cutting and splitting integrated machine has the effect of facilitating waste material disposal.

Description

Technical Field

[0001] This utility model relates to the field of glass processing technology, specifically to a laser glass cutting and splitting integrated machine. Background Technology

[0002] Existing technology uses an infrared picosecond laser cutting machine to create a microcrack array within the glass, and then uses a carbon dioxide laser to heat the glass, causing it to crack from the cracks. However, cutting and cracking the glass require two separate machines. While this combination is suitable for large glass pieces, it involves many steps and is inefficient. Some machines combine the two machines into one, but the limited space between the two machines restricts the use of large-format glass. Furthermore, the machine layout has flaws; waste material can easily fall onto the tracks or cables, causing secondary malfunctions or accidents. Glass cutting generates a significant amount of waste. Current technology typically involves picking up the waste material from the pallet and placing it in a waste bin. Because glass is flat, difficult to grasp, and sharp, this process is time-consuming and poses safety hazards. Utility Model Content

[0003] (a) Technical problems to be solved

[0004] To address the shortcomings of existing technologies, this utility model provides a laser glass cutting and splitting integrated machine, which solves the problems mentioned in the background art.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, this utility model provides the following technical solution: A laser glass cutting integrated machine includes a frame. Two parallel Y-axis linear modules are fixedly installed at the middle of the upper surface of the frame. A sliding plate that moves back and forth is provided above the Y-axis linear modules. A maze support is fixedly installed above the sliding plate. A partition covering the perimeter of the Y-axis linear modules is fixedly installed inside the maze support. A support plate is fixedly installed above the maze support. Main beams spanning the Y-axis linear modules are fixedly installed on both sides of the upper surface of the frame. A front X-axis linear module is fixedly installed in front of the main beam. A front Z-axis linear module and a vision sensor are fixedly installed in front of the front X-axis linear module. The front Z-axis linear module is close to the vision sensor. An infrared picosecond laser cutting head is installed on one side of the sensor. A rear X-axis linear module is fixedly installed behind the main beam. A rear Z-axis linear module is fixedly installed behind the rear X-axis linear module. A carbon dioxide laser cutting head is installed on one side of the rear Z-axis linear module. An infrared picosecond laser cutter host and a carbon dioxide laser host are fixedly installed on the top of the main beam. A bottom cover is fixedly installed around the perimeter of the platform. Support plates located on both sides of the Y-axis linear module are fixedly installed on the upper surface of the platform. An inner sealing plate supported by the support plates is installed inside the bottom cover. A top cover is installed above the bottom cover. A controller is installed in front of one side of the top cover. A waste chute is set in front of the bottom cover. A waste trolley is set below the waste chute.

[0007] Preferably, the two trays have the same length, width, and installation height, and there is a very small gap between the two trays. The glass to be processed is placed on the trays.

[0008] Preferably, the inner sealing plate covers the Y-axis linear module below it. The inner sealing plate has slots for the maze support to move back and forth. The width of the slots is slightly larger than the width of the maze support. The slots are surrounded by baffles. The length and width of the support plate are much larger than the length and width of the maze support. The distance between the support plate and the inner sealing plate is small.

[0009] Preferably, the distance between the infrared picosecond laser cutting head and the front end face of the platform is greater than the depth dimension of the support plate, the length dimension of the front X-axis linear module is greater than the span of the two support plates, the vision sensor and the infrared picosecond laser cutting head are installed side by side at close range in front of the front Z-axis linear module, the height of the vision sensor is fixed and its lower end is higher than the lower end face of the front Z-axis linear module, the infrared picosecond laser cutting head can move up and down through the drive of the front Z-axis linear module, and the lower end of the infrared picosecond laser cutting head is lower than the lower end face of the front Z-axis linear module.

[0010] Preferably, the distance between the CO2 laser cutting head and the rear end face of the stand is greater than the depth dimension of the tray, the length dimension of the rear X-axis linear module is greater than the span of the two trays, the CO2 laser cutting head can move up and down by the drive of the rear Z-axis linear module, and the lower end of the CO2 laser cutting head is lower than the lower end face of the rear Z-axis linear module.

[0011] Preferably, the length of the upper port of the waste trough is the same as the length of the bottom cover, the height of the upper port of the waste trough is the same as the height of the inner sealing plate, and the lower port of the waste trough narrows downward into a funnel shape and bends into the bottom cover.

[0012] This utility model provides a laser glass cutting and splitting integrated machine, which has the following beneficial effects:

[0013] 1. This laser glass cutting and cracking integrated machine, through the coordinated setup of the Y-axis linear module, the front X-axis linear module and the rear X-axis linear module, achieves high processing efficiency. It integrates glass cutting and cracking processes into one machine, allowing the glass to be positioned only once and the two processes to be performed simultaneously, thereby improving processing efficiency.

[0014] 2. This laser glass cutting and cleaving machine, through the coordinated arrangement of the Y-axis linear module and the pallet, enables it to be suitable for both large and small glass. Since the two Y-axis linear modules are parallel to each other, the two pallets are independent, and the spacing between them is small and the height is the same, when processing small-sized glass, one piece of glass is placed in each of the two pallets, and when processing large-sized glass, the two pallets can jointly support one piece of glass. Therefore, it is suitable for processing both large and small glass.

[0015] 3. This laser glass cutting and cleaving integrated machine, through the coordinated arrangement of the labyrinth bracket, partition, tray, and inner sealing plate, can prevent waste material from leaking into the guide rail or wire groove. The inner sealing plate separates the tray from the guide rail and wire groove, and the mating gaps between the labyrinth bracket, partition, tray, and inner sealing plate are winding and meandering, which further prevents waste material from falling into the guide rail or wire groove through the mating gaps.

[0016] 4. This laser glass cutting and cleaving integrated machine, through the coordinated arrangement of the pallet, waste trough and waste trolley, enables the laser glass cutting and cleaving integrated machine to facilitate waste processing. Since the waste trough is located at the front and lower part of the pallet and has a sufficiently large length, the waste on the pallet can be directly pushed forward into the waste trough. Furthermore, the lower end of the waste trough tapers downward and bends inward, thus allowing the waste to be concentrated and sent to the waste trolley hidden under the frame. Attached Figure Description

[0017] Figure 1 This is a structural schematic diagram of the appearance view of this utility model;

[0018] Figure 2 This is a structural schematic diagram of the overall cross-sectional view of this utility model;

[0019] Figure 3 This is a structural schematic diagram of the main view of this utility model;

[0020] Figure 4 This is a structural schematic diagram of the first partial three-dimensional view of the present invention;

[0021] Figure 5 This is a structural schematic diagram of the first partial perspective view of the present invention.

[0022] Figure 6 This is a structural schematic diagram of the second partial perspective view of the present invention;

[0023] Figure 7 This is a partial cross-sectional view of the present invention.

[0024] Figure 8 This is a structural schematic diagram of a partial sectional view of the present invention.

[0025] In the diagram: 1. Stand; 2. Y-axis linear module; 201. Slide plate; 3. Maze support; 4. Partition plate; 5. Support plate; 6. Main beam; 7. Front X-axis linear module; 8. Front Z-axis linear module; 9. Vision sensor; 10. Infrared picosecond laser cutting head; 11. Rear X-axis linear module; 12. Rear Z-axis linear module; 13. Carbon dioxide laser cutting head; 14. Infrared picosecond laser cutter main unit; 15. Carbon dioxide laser main unit; 16. Bottom cover; 1601. Waste trough; 17. Support plate; 18. Inner sealing plate; 1801. Slot; 1802. Edge guard; 19. Top cover; 20. Controller; 21. Waste trolley. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0027] Example

[0028] Please see Figures 1 to 8 This utility model provides a technical solution: a laser glass cutting integrated machine, including a frame 1. Two parallel Y-axis linear modules 2 are fixedly installed at the middle position of the upper surface of the frame 1. A sliding plate 201 that moves back and forth is set above the Y-axis linear modules 2. A maze support 3 is fixedly installed above the sliding plate 201. A partition 4 covering the perimeter of the Y-axis linear modules 2 is fixedly installed inside the maze support 3. A support plate 5 is fixedly installed above the maze support 3. Main beams 6 that span the Y-axis linear modules 2 are fixedly installed on both sides of the upper surface of the frame 1. A front X-axis linear module 7 is fixedly installed in front of the main beam 6. A front Z-axis linear module 8 and a vision sensor 9 are fixedly installed in front of the front X-axis linear module 7. An infrared picosecond laser cutting head 1 is installed on the side of the front Z-axis linear module 8 near the vision sensor 9. 0. A rear X-axis linear module 11 is fixedly installed behind the main beam 6. A rear Z-axis linear module 12 is fixedly installed behind the rear X-axis linear module 11. A carbon dioxide laser cutting head 13 is installed on one side of the rear Z-axis linear module 12. An infrared picosecond laser cutter host 14 and a carbon dioxide laser host 15 are fixedly installed on the top of the main beam 6. A bottom cover 16 is fixedly installed around the perimeter of the platform 1. Support plates 17 located on both sides of the Y-axis linear module 2 are fixedly installed on the upper surface of the platform 1. An inner sealing plate 18 supported by the support plates 17 is installed inside the bottom cover 16. A top cover 19 is installed above the bottom cover 16. A controller 20 is installed in front of one side of the top cover 19. A waste chute 1601 is set in front of the bottom cover 16. A waste trolley 21 is set below the waste chute 1601.

[0029] Specifically, the infrared picosecond laser cutter host 14 is connected to the infrared picosecond laser cutter head 10 via an optical cable, and a speed-increasing mirror and a reflector are also provided in the connection path. The speed-increasing mirror changes the laser size, and the reflector changes the laser path. The carbon dioxide laser host 15 provides the light source to the carbon dioxide laser cutter head 13 through a reflector, and a speed-increasing mirror is also provided in the path to change the laser size. The bottom cover 16 is made of thin steel plate and is not in contact with the ground but is fixed to the periphery of the platform 1 by screws. The top cover 19 is made of steel plate and has windows on the side. The controller 20 has the functions of setting parameters, controlling the movement of components, importing and editing graphics, and saving. The platform 1 has data processing and other functions. Support legs are provided at the bottom of the four corners. The function of the support legs is to raise the platform 1 and adjust its balance. The height of the platform 1 is greater than the thickness of the waste cart 21. The waste cart 21 can be completely inserted under the platform 1. At least two waste carts 21 are required for easy replacement. The length of the upper port of the waste trough 1601 is the same as the length of the bottom cover 16. The height of the upper port of the waste trough 1601 is the same as the height of the inner sealing plate 18. The lower port of the waste trough 1601 is narrowed downward into a funnel shape and bends into the bottom cover 16 so that the waste cart 21 inserted under the platform 1 is just below the lower port of the waste trough 1601.

[0030] Please see Figure 4 The two pallets 5 have the same length, width and installation height, and there is a very small gap between them. The glass to be processed is placed on the pallets 5.

[0031] Specifically, when the length and width of the glass are smaller than those of the pallet 5, one piece of glass is placed in each pallet 5. The two pieces of glass are independently transported to the underside of the infrared picosecond laser cutting head 10 and the carbon dioxide laser cutting head 13 via two Y-axis linear modules 2. The two pieces of glass can be cut and cracked simultaneously, which can improve processing efficiency. When the length and width of the glass are larger than those of the pallet 5, the glass is lifted by the two pallets 5 together. Then, the two Y-axis linear modules 2 move forward and backward synchronously to deliver the large glass to the underside of the infrared picosecond laser cutting head 10 and the carbon dioxide laser cutting head 13. This allows the glass to be cut in one positioning, thereby improving efficiency.

[0032] Please see Figures 7 to 8 The inner sealing plate 18 covers the Y-axis linear module 2 below it. The inner sealing plate 18 has a slot 1801 for the maze support 3 to move back and forth. The width of the slot 1801 is slightly larger than the width of the maze support 3. The perimeter of the slot 1801 is provided with a retaining edge 1802. The length and width of the support plate 5 are much larger than the length and width of the maze support 3. The distance between the support plate 5 and the inner sealing plate 18 is small.

[0033] Specifically, the inner sealing plate 18 separates the tray 5 from the guide rail and the wire groove. Although there is inevitably a gap between the maze support 3, the partition 4, the tray 5 and the inner sealing plate 18, the gap is winding and convoluted. If waste material is to enter the guide rail, it first needs to be moved horizontally between the tray 5 and the inner sealing plate 18 to the side of the slot 1801, then jump over the edge 1802 and fall from the slot 1801. After that, it is blocked by the partition 4 and falls onto the platform 1. If it is dust, it can flow with the air, but the air also needs to go around the maze support 3 before it can fall onto the guide rail. Therefore, large solid particles of waste cannot be on the guide rail. Dust needs to go through a winding path to do so, but it is difficult to achieve.

[0034] Please see Figures 4 to 5 The distance between the infrared picosecond laser cutting head 10 and the front end face of the stand 1 is greater than the depth dimension of the support plate 5. The length dimension of the front X-axis linear module 7 is greater than the span of the two support plates 5. The vision sensor 9 and the infrared picosecond laser cutting head 10 are installed side by side at close range in front of the front Z-axis linear module 8. The height of the vision sensor 9 is fixed and its lower end is higher than the lower end face of the front Z-axis linear module 8. The infrared picosecond laser cutting head 10 can move up and down by being driven by the front Z-axis linear module 8. The lower end of the infrared picosecond laser cutting head 10 is lower than the lower end face of the front Z-axis linear module 8.

[0035] Specifically, the distance between the infrared picosecond laser cutting head 10 and the front end face of the stand 1 is greater than the depth of the support plate 5, and the length of the front X-axis linear module 7 is greater than the span of the two support plates 5, allowing the support plates 5 to deliver various positions of the glass to the underside of the infrared picosecond laser cutting head 10. The vision sensor 9 can detect the distance between the upper surface of the glass and the front Z-axis linear module 8. Then, the front Z-axis linear module 8 drives the infrared picosecond laser cutting head 10 to move downwards and closer to the glass based on this distance data. When the infrared picosecond laser cutting head 10 is working, it emits a laser beam vertically downwards, and the laser beam is focused on the glass surface. Picosecond lasers possess extremely high peak power and extremely short pulse widths, enabling them to instantly heat glass materials to extremely high temperatures, causing them to melt and vaporize rapidly. Simultaneously, the energy distribution of the laser beam exhibits a Gaussian pattern, with high energy at the center and low energy at the edges, resulting in smooth and clean cuts. During the cutting process, an auxiliary gas system injects high-pressure gas, typically oxygen or nitrogen, into the cutting area. These gases serve to blow away molten and vaporized glass fragments, preventing them from adhering to the cut surface and affecting cutting quality. They also act as a cooling agent, reducing the heat-affected zone.

[0036] Please see Figure 6The distance between the CO2 laser cutting head 13 and the rear end face of the stand 1 is greater than the depth dimension of the support plate 5. The length dimension of the rear X-axis linear module 11 is greater than the span of the two support plates 5. The CO2 laser cutting head 13 can move up and down by being driven by the rear Z-axis linear module 12. The lower end of the CO2 laser cutting head 13 is lower than the lower end face of the rear Z-axis linear module 12.

[0037] Specifically, the distance between the CO2 laser cutting head 13 and the rear end face of the stand 1 is greater than the depth dimension of the support plate 5, and the length dimension of the rear X-axis linear module 11 is greater than the span of the two support plates 5, so that the support plates 5 can deliver various positions of the glass to the bottom of the CO2 laser cutting head 13. The rear Z-axis linear module 12 still drives the CO2 laser cutting head 13 to move downward and approach the glass according to the distance data detected by the vision sensor 9. When the CO2 laser cutting head 13 is working, it focuses the laser beam on the glass surface. The glass material absorbs the laser energy and converts it into heat energy, causing the local temperature of the glass to rise rapidly. Since glass is a poor conductor of heat, the heat cannot be evenly diffused in a short time, resulting in thermal stress in the heated area. When the thermal stress exceeds the strength limit of the infrared picosecond laser cut, cracks will appear at the cut of the glass.

[0038] When used, there are two processing options for glass of the following sizes:

[0039] The first scenario involves processing glass with dimensions smaller than those of pallet 5. During processing, the machine is first reset, at which point both pallets 5 move to their forward positions and are parallel. A small piece of glass is then placed into one of the designated pallets 5 according to the placement requirements, and the processing button is pressed. At this point, the Y-axis linear module 2 moves the pallet 5 containing the glass to below the front Z-axis linear module 8. Simultaneously, the vision sensor 9 operates, and the Y-axis linear module 2 fine-tunes the front-rear position of the pallet 5, while the front X-axis linear module 7 fine-tunes the left-right position of the vision sensor 9, ensuring that the vision sensor 9 is positioned precisely at one corner of the glass. All of these process steps are pre-set. The vision sensor 9 can determine whether the corner of the glass is directly below it. At this point, the relative position and height difference between the infrared picosecond laser cutting head 10 and the glass can be determined. Then, the front Z-axis linear module 8 drives the infrared picosecond laser cutting head 10 downwards towards the glass. Afterwards, the Y-axis linear module... Module 2, in conjunction with the front X-axis linear module 7, begins cutting glass according to the pattern. Simultaneously, the worker places another small piece of glass onto another tray 5. After the first piece of glass is cut, the Y-axis linear module 2 transports it to the rear. Then, the rear X-axis linear module 11 drives the CO2 laser cutting head 13 above the already cut glass. After aligning the position of the CO2 laser cutting head 13 with the glass, the cutting marks are heated sequentially to cause them to crack automatically. At the same time, the infrared picosecond laser cutting head 10 cuts the second piece of glass in front. After all the cutting marks on the first piece of glass have cracked, the Y-axis linear module 2 sends it to the front of the table 1. Then, the worker begins to separate the product from the waste. The product is removed, and the waste is directly pushed down into the waste trough 1601. Then, the third piece of glass is placed in. This process can be repeated to achieve simultaneous cutting and cracking of glass by a single machine, thereby greatly improving the efficiency of processing small pieces of glass.

[0040] The second scenario involves processing glass with dimensions larger than those of pallet 5. During processing, the machine is first reset, at which point both pallets 5 move to their forward positions and are parallel. Then, a large piece of glass is placed at a set angle directly above the two pallets 5, meaning the center of the large glass is at the center of the two pallets 5. Next, two Y-axis linear modules 2 work simultaneously and synchronously to move the large glass directly below the main beam 6. Finally, the vision sensor 9 determines the height of the upper surface of the large glass. Although the height and position of each component within the machine are fixed parameters, manual placement of the glass introduces some error. Therefore, while the relative position of the large glass is basically determined, there is still a positional deviation. If the glass processing... If the pattern is relatively large from the edge, there is no need to worry about cutting out the edge; you can directly press the switch to start cutting. If the pattern is small and you are worried about cutting out the edge, you need to calibrate the position of the large glass. The specific calibration method is the same as that for small glass, but at least three points need to be calibrated to determine the specific position of the large glass. When processing the large glass, the infrared picosecond laser cutting head 10 first cuts, and then the carbon dioxide laser cutting head 13 heats symmetrically from the outside to the inside to make the waste material fall off symmetrically, so as to prevent the large glass from losing its center of gravity and falling. After the processing is completed, both pallets 5 move to the front. Then the worker removes the product and cleans the inner sealing plate 18 and the waste material on the pallets 5. This allows for one-time positioning and processing of large glass.

[0041] In summary, this laser glass cutting and cracking integrated machine combines glass cutting and cracking processes into one machine. The glass only requires one positioning, and both processes can be performed simultaneously, thus improving processing efficiency. Because the two Y-axis linear modules 2 are parallel, and the two support plates 5 are independent, with a small distance between them and the same height, each support plate 5 can hold one piece of glass when processing small-sized glass, while the two support plates 5 can jointly support one piece of glass when processing large-sized glass. Therefore, it is suitable for processing glass of all sizes. (The last sentence appears to be incomplete and possibly refers to a different machine.) Plate 18 separates the pallet 5 from the guide rail and the wire groove. The mating gaps between the labyrinth bracket 3, partition 4, pallet 5 and inner sealing plate 18 are winding and meandering, which can prevent waste from falling into the guide rail or wire groove through the mating gaps. Since the waste trough 1601 is located in front of and below the pallet 5 and has a sufficiently large length, the waste on the pallet 5 can be directly pushed forward into the waste trough 1601. The lower end of the waste trough 1601 is tapered downward and bent inward, so the waste can be concentrated and sent to the waste trolley 21 hidden under the frame 1.

[0042] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A laser glass cutting and splitting integrated machine, comprising a frame (1), characterized in that: Two parallel Y-axis linear modules (2) are fixedly installed at the middle position of the upper surface of the platform (1). A sliding plate (201) that moves back and forth is set above the Y-axis linear module (2). A maze bracket (3) is fixedly installed above the sliding plate (201). A partition (4) covering the periphery of the Y-axis linear module (2) is fixedly installed inside the maze bracket (3). A support plate (5) is fixedly installed above the maze bracket (3). A main beam (6) spanning above the Y-axis linear module (2) is fixedly installed on both sides of the upper surface of the platform (1). A front X-axis linear module (7) is fixedly installed in front of the main beam (6). A front Z-axis linear module (8) and a vision sensor (9) are fixedly installed in front of the front X-axis linear module (7). An infrared picosecond laser cutting head (10) is installed on the side of the front Z-axis linear module (8) close to the vision sensor (9). A rear X-axis linear module (10) is fixedly installed behind the main beam (6). The X-axis linear module (11) is fixedly installed behind the rear X-axis linear module (11), and a carbon dioxide laser cutting head (13) is installed on one side of the rear Z-axis linear module (12). An infrared picosecond laser cutting host (14) and a carbon dioxide laser host (15) are fixedly installed on the top of the main beam (6). A bottom cover (16) is fixedly installed around the frame (1). Support plates (17) located on both sides of the Y-axis linear module (2) are fixedly installed on the upper surface of the frame (1). An inner sealing plate (18) supported by the support plate (17) is installed inside the bottom cover (16). A top cover (19) is installed above the bottom cover (16). A controller (20) is installed in front of one side of the top cover (19). A waste trough (1601) is set in front of the bottom cover (16). A waste trolley (21) is set below the waste trough (1601).

2. The laser glass cutting and splitting integrated machine according to claim 1, characterized in that: The two trays (5) have the same length, width and installation height, and a very small gap is set between the two trays (5). The glass to be processed is placed on the trays (5).

3. The laser glass cutting and splitting integrated machine according to claim 1, characterized in that: The inner sealing plate (18) covers the Y-axis linear module (2) below it. The inner sealing plate (18) has a slot (1801) for the maze support (3) to move back and forth. The width of the slot (1801) is slightly larger than the width of the maze support (3). The perimeter of the slot (1801) is provided with a retaining edge (1802). The length and width of the support plate (5) are much larger than the length and width of the maze support (3). The distance between the support plate (5) and the inner sealing plate (18) is small.

4. The laser glass cutting and splitting integrated machine according to claim 1, characterized in that: The distance between the infrared picosecond laser cutting head (10) and the front end face of the stand (1) is greater than the depth dimension of the tray (5). The length dimension of the front X-axis linear module (7) is greater than the span of the two trays (5). The vision sensor (9) and the infrared picosecond laser cutting head (10) are installed side by side at close range in front of the front Z-axis linear module (8). The height of the vision sensor (9) is fixed and its lower end is higher than the lower end face of the front Z-axis linear module (8). The infrared picosecond laser cutting head (10) can move up and down through the drive of the front Z-axis linear module (8). The lower end of the infrared picosecond laser cutting head (10) is lower than the lower end face of the front Z-axis linear module (8).

5. The laser glass cutting and splitting integrated machine according to claim 1, characterized in that: The distance between the carbon dioxide laser cutting head (13) and the rear end face of the stand (1) is greater than the depth dimension of the tray (5). The length dimension of the rear X-axis linear module (11) is greater than the span of the two trays (5). The carbon dioxide laser cutting head (13) can move up and down by the drive of the rear Z-axis linear module (12). The lower end of the carbon dioxide laser cutting head (13) is lower than the lower end face of the rear Z-axis linear module (12).

6. The laser glass cutting and splitting integrated machine according to claim 1, characterized in that: The length of the upper port of the waste trough (1601) is the same as the length of the bottom cover (16), and the height of the upper port of the waste trough (1601) is the same as the height of the inner sealing plate (18). The lower port of the waste trough (1601) is narrowed downwards into a funnel shape and turns into the bottom cover (16).

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