Compatible shunt and sampling device

Abstract

This application relates to the field of current monitoring technology and discloses a compatible shunt and sampling device. The compatible shunt includes: a resistor element for serving as the main channel for the current to be measured; a composite plate for connecting external circuits, the composite plate being connected to opposite sides of the resistor element; and a sampling structure for outputting a differential voltage signal, the sampling structure being correspondingly connected to the composite plate and close to the resistor element. Each composite plate includes a first metal plate and a second metal plate. At least a portion of the first metal plate is connected to at least one second metal plate in the direction from the first metal plate near the sampling structure to the direction away from the sampling structure. Furthermore, the first metal plate and the second metal plate are metallurgically bonded to form a composite connection between the first metal plate and the second metal plate. This application improves the reliability and cost-effectiveness of the shunt.

Description

Technical Field

[0001] This application relates to the field of current monitoring technology, specifically to a compatible shunt and sampling device. Background Technology

[0002] A shunt is a resistive device used for current measurement. When current flows through the shunt's resistor, a voltage difference is generated between the sampling points of the resistor. Based on this voltage difference and the resistance of the resistor, the current of the shunt can be calculated. Because the resistance of the resistor and the voltage difference between the sampling points are very small, indirect measurement of currents of tens or even hundreds of amperes can be achieved in small current circuits. Therefore, shunts are widely used in current sampling measurement and monitoring scenarios of high-current and high-power equipment. However, shunts in related technologies are often used under harsh operating conditions, and their structure is prone to deformation or loosening due to thermal expansion and contraction or external stress, which affects the reliability of the shunt. Utility Model Content

[0003] In view of this, this application provides a compatible shunt and sampling device to solve the aforementioned technical problems.

[0004] In a first aspect, embodiments of this application disclose a compatible splitter, comprising:

[0005] The resistive element is used as the main channel for the current to be measured.

[0006] A composite board for connecting external circuits, wherein the composite board is connected to the two sides of the resistor respectively;

[0007] A sampling structure for outputting a differential pressure signal is provided, and the sampling structure is connected to the composite board and is close to the resistor.

[0008] The composite plate includes a first metal plate and a second metal plate. In the direction from the first metal plate near the sampling structure to away from the sampling structure, at least a portion of the first metal plate of the same composite plate is connected to at least one second metal plate. The first metal plate and the second metal plate are metallurgically bonded to form a composite connection between the first metal plate and the second metal plate.

[0009] In one possible example, at least one second metal plate of the same composite plate covers the upper or lower surface of the first metal plate, and the vertical projections of the first metal plate and the second metal plate coincide.

[0010] In one possible example, at one end of the first metal plate near the sampling structure, at least one second metal plate of the same composite plate is embedded into the first metal plate by the surface of the first metal plate.

[0011] In one possible example, the ends of both the first and second metal plates facing the resistive element are metallurgically bonded to the resistive element.

[0012] In one possible example, the first metal plate comprises an aluminum plate or an aluminum alloy plate.

[0013] In one possible example, the second metal plate comprises a copper plate or an alloy copper plate.

[0014] In one possible example, the temperature coefficient of resistance of the resistive element is ±20*10. -5 / ℃.

[0015] In one possible example, the sampling structure includes a first sampling patch that is correspondingly attached to the upper surface of the second metal plate.

[0016] In one possible example, the composite panel includes a partition groove formed on a first metal plate and / or a second metal plate and connected to the first sampling patch.

[0017] In one possible example, the sampling structure includes sampling columns that are correspondingly connected to the first metal plate and / or the second metal plate.

[0018] In one possible example, a current bus connection structure is also included, which is connected to the first metal plate and / or the second metal plate.

[0019] In one possible example, the current bus connection structure includes an external through hole, an external threaded hole, or an external stud.

[0020] In one possible example, a first resistance adjustment slot is provided on the resistor and located between the two second metal plates, and a second resistance adjustment slot is provided on the side of the resistor and corresponding to the first resistance adjustment slot.

[0021] Secondly, embodiments of this application disclose a sampling device, which includes the compatible splitter described in any of the above embodiments.

[0022] In summary, compared with the prior art, this application discloses a compatible shunt and sampling device. The composite plate of the compatible shunt for connecting external circuits is arranged opposite to the two sides of the resistor body used as the main channel for the current to be measured. Its sampling structure is connected to the composite plate and is close to the resistor body. The first metal plate and the second metal plate of the composite plate are metallurgically bonded. In the direction from the first metal plate close to the sampling structure to the farthest from the sampling structure, at least a portion of the first metal plate of the same composite plate is connected to at least one second metal plate to form a composite connection between the first metal plate and the second metal plate, thereby improving the reliability and cost performance of the shunt. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a three-dimensional structural diagram of the first compatible shunt according to an embodiment of this application;

[0025] Figure 2 This is a side view of the second type of compatible shunt according to an embodiment of this application;

[0026] Figure 3 This is a side view of the third type of compatible shunt according to an embodiment of this application;

[0027] Figure 4 This is a side view of the fourth type of compatible shunt according to an embodiment of this application;

[0028] Figure 5 This is a three-dimensional structural diagram of the fifth compatible shunt according to an embodiment of this application;

[0029] Figure 6 This is a three-dimensional structural diagram of the sixth compatible shunt according to an embodiment of this application;

[0030] Figure 7 This is a three-dimensional structural diagram of the seventh compatible shunt according to an embodiment of this application. Detailed Implementation

[0031] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0032] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0033] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0034] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.

[0035] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0036] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.

[0037] Please refer to Figures 1 to 7The compatible shunt in this application includes a resistor 1, a composite board 2, and a sampling structure 3. The resistor 1 is used as the main channel for the current to be measured, the composite board 2 is used to connect to an external circuit, and the sampling structure 3 is used to output a differential pressure signal.

[0038] In one possible implementation of this application, the sampling structure 3 is connected to the composite plate 2 and is close to the resistor 1. The composite plates 2 are arranged opposite to each other on both sides of the resistor 1 and each includes a first metal plate 21 and a second metal plate 22. In the direction from the first metal plate 21 to the direction away from the sampling structure 3, at least a portion of the first metal plate 21 of the same composite plate 2 is connected to at least one second metal plate 22. The first metal plate 21 and the second metal plate 22 are metallurgically bonded to form a composite connection between the first metal plate 21 and the second metal plate 22.

[0039] During the operation of the compatible splitter, based on the structural design of connecting at least a portion of the first metal plate 21 and at least one second metal plate 22 of the same composite plate 2, the first metal plate 21 and the second metal plate 22 form a composite connection structure, thereby improving the plate strength and thermal stability of the splitter, suppressing the deformation or loosening of the splitter plate due to thermal expansion and contraction or external stress, and dispersing the external stress transmission path through the buffering characteristics of the composite structure, thereby improving the overall resistance to deformation.

[0040] If the first metal plate 21 or the second metal plate 22 is connected to the device under test, such as the busbar, and the materials are the same or of the same system, then the thermal expansion coefficients, hardness, and potential differences of the two are the same or very small. Therefore, the connection interface between the two will not produce electrochemical corrosion, and the small thermal stress is not easy to cause deformation or loosening. This is suitable for high reliability scenarios such as electric vehicle BMS and industrial power modules.

[0041] In one possible implementation of this application, the first metal plate 21 includes an aluminum plate or an aluminum alloy plate. It is understood that in related technologies, the shunt plates used to connect external circuits are all made of copper. However, copper plates are expensive and highly susceptible to fluctuations in global copper prices, especially in high-current, large-size shunt applications, which significantly increases material costs. Furthermore, copper plates have high density and weight, which is detrimental to overall weight reduction design in applications with high lightweight requirements. Additionally, copper plates easily form copper oxide in the air, causing their surface to blacken and reducing conductivity, necessitating electroplating with nickel or other metals. Tin increases process complexity and cost. Therefore, the first metal plate 21 in this embodiment includes an aluminum plate or an aluminum alloy plate to optimize material costs. This is especially true in high-current, high-volume scenarios, where significant savings are achieved. It is also more suitable for applications with high lightweight requirements. At the same time, the natural oxide film of aluminum has a self-protective function, which helps to improve long-term stability. Furthermore, the composite connection design with the second metal plate 22 ensures the structural strength and reliability of the aluminum plate or aluminum alloy plate. While meeting the conductivity requirements, it also achieves the lightweight and cost reduction requirements of the shunt, thereby improving the reliability and cost-effectiveness of the shunt.

[0042] In one possible implementation of this application, the second metal plate 22 includes a copper plate or an alloy copper plate. The resistor 1 and the first metal plate 21 are connected based on the second metal plate 22. The second metal plate 22, which includes a copper plate or an alloy copper plate, has excellent electrical performance and can better connect to the resistor 1. This helps to reduce welding stress and contact resistance, thereby improving the reliability and overall performance of the shunt.

[0043] In one possible implementation of this application, the first metal plate 21 includes an aluminum plate or an aluminum alloy plate, and the second metal plate 22 includes a copper plate or an alloy copper plate. In this case, the composite plate 2 of the shunt is a copper-aluminum composite connection structure. At least a portion of the aluminum material of the first metal plate 21 of the same composite plate 2 is connected to at least one copper material of the second metal plate 22 to improve the mechanical strength and thermal stability of the shunt, optimize material costs, meet the requirements of lightweighting, and also ensure the connection strength between the plate body of the shunt connected to the external circuit and the resistor 1, reduce its welding stress and contact resistance, thereby improving the reliability and overall performance of the shunt.

[0044] It is understood that at least a portion of the first metal plate 21 is connected to at least one second metal plate 22 to form a metal interlocking structure, which helps to resist tension and shear. A metallurgical diffusion layer is formed between the first metal plate 21 and the second metal plate 22 to build a stable conductive channel and a strong connection structure, improve the bonding strength of the dissimilar metal interface, avoid thermal expansion stress leading to detachment or cracking, and enhance the working reliability of the shunt in high current and complex environments.

[0045] In one example, the outer surface of the second metal plate 22 is plated with a metal protective layer, and the metal protective layer is formed by at least one of tin, tin alloy, nickel, nickel alloy, gold, and silver. This effectively reduces its oxidation rate in air, improves its oxidation resistance, and enhances its affinity with solder, thereby improving the connection stability and conduction reliability of the shunt and adapting to high current sampling accuracy and harsh environmental requirements.

[0046] In one possible implementation of this application, reference is made to... Figure 1 and Figure 2 At least one second metal plate 22 of the same composite plate 2 covers the upper or lower surface of the first metal plate 21, and the vertical projections of the first metal plate 21 and the second metal plate 22 coincide, thereby constructing a stacked metallurgical connection structure of the first metal plate 21 and the second metal plate 22. This can prevent the metal plates from warping, displacing or loosening under long-term thermal expansion, vibration and other working conditions, and improve the overall reliability and fatigue resistance of the connection structure.

[0047] It should be noted that the position of the second metal plate 22 covering the first metal plate 21 can be determined according to the specific material of the connection end of the device under test, such as the busbar. That is, if the busbar and the first metal plate 21 are made of the same material or are of the same system, the second metal plate 22 can be selected to cover the lower surface of the first metal plate 21. If the busbar and the second metal plate 22 are made of the same material or are of the same system, the second metal plate 22 can be selected to cover the upper surface of the first metal plate 21 to ensure that the connection material of the composite plate 2 and the connection end of the device under test is the same, and to avoid electrochemical corrosion.

[0048] In one possible implementation of this application, reference is made to... Figure 3 At one end of the first metal plate 21 near the sampling structure 3, at least one second metal plate 22 of the same composite plate 2 is embedded into the first metal plate 21 from the surface of the first metal plate 21, thereby forming a partially interlocked structure between the first metal plate 21 and the second metal plate 22, which improves the connection strength and thermal stability of the splitter plate, so as to suppress the deformation or loosening of the splitter plate due to thermal expansion and contraction or external stress, and disperse the external stress transmission path through the buffering characteristics of the composite structure, thereby improving the overall resistance to deformation.

[0049] In one possible implementation of this application, reference is made to... Figure 4The second metal plate 22 of the same composite plate 2 can also be symmetrically embedded into the first metal plate 21 from the upper / lower surface of the first metal plate 21, so that the first metal plate 21 and the second metal plate 22 form a partially interlocked structure. The ends of the first metal plate 21 and the second metal plate 22 facing the resistor 1 are metallurgically bonded to the resistor 1, which makes the current conduction path from the composite plate 2 to the resistor 1 more uniform and the contact resistance smaller. Furthermore, due to the synergistic effect of the two metal materials of the first metal plate 21 and the second metal plate 22, it helps to distribute the welding stress, reduce the risk of single interface thermal fatigue, and improve the long-term stability of the shunt under high current and high temperature conditions.

[0050] In one possible implementation of this application, the resistor 1 includes a manganese copper plate to ensure the sampling accuracy of the shunt based on its material properties. The manganese copper plate has good metallurgical connection performance, and the resulting connection layer is stable, which helps to maintain the stability of the connection layer resistance, so as to be suitable for the micro voltage difference sampling of the shunt and avoid thermocouple errors.

[0051] It should be noted that the temperature coefficient of resistance of resistor 1 is ±20*10. -5 / ℃, to ensure that the resistance value of resistor 1 is less affected by temperature, thereby ensuring high-precision measurement of the shunt.

[0052] In one example, the temperature coefficient of resistance of resistor 1 is ±15*10. -5 / ℃, ±10*10 -5 / ℃, ±8*10 -5 / ℃, ±6*10 -5 / ℃, ±4*10 -5 / ℃ or ±2*10 -5 / ℃.

[0053] In one example, a first resistance adjustment groove 11 is provided on the resistor 1 and located between the two second metal plates 22, so as to adjust the specific resistance value of the resistor 1 before operation by adjusting the groove size of the first resistance adjustment groove 11.

[0054] Furthermore, a second resistance adjustment groove 12 is provided on the side of the resistor 1 and corresponding to the first resistance adjustment groove 11, so as to adjust the specific resistance value of the resistor 1 before operation by adjusting the groove size of the second resistance adjustment groove 12, thereby ensuring the high-precision measurement of the shunt.

[0055] In conjunction with the foregoing embodiments, the sampling structure 3 of the compatible shunt includes a first sampling patch 31, which is attached to the upper surface of the second metal plate 22 so that the shunt can output the differential voltage signal of the resistor 1 through the first sampling patch 31.

[0056] In one example, a metallurgical diffusion layer is formed between the first sampling patch 31 and the second metal plate 22 to construct a stable conductive channel and a robust connection structure, improve the bonding strength of the dissimilar metal interface, avoid thermal expansion stress leading to detachment or cracking, and enhance the reliability of the shunt in high current and complex environments.

[0057] In one example, the composite panel 2 includes a partition groove 23, which is formed on the upper surface of the first metal plate 21 and / or the second metal plate 22 and connected to the first sampling patch 31.

[0058] Therefore, the isolation between the first sampling patch 31 and the composite board 2 is constructed by the partition groove 23, while ensuring the soldering effect between the first sampling patch 31 and the external circuit board. For example, when the first sampling patch 31 is soldered to the PCB pad, the solder should be separated from the sampling patch area by the surrounding material under the action of affinity wetting force, thereby improving the connection quality between the sampling patch and the PCB pad, avoiding parasitic current interference with the differential voltage sampling accuracy, and also helping the structural positioning of the first sampling patch 31 to improve the measurement accuracy.

[0059] In one example, the depth of the partition groove 23 is ≥0.1mm.

[0060] In one example, the depth of the partition groove 23 includes 0.5mm, 0.3mm, and 0.6mm.

[0061] In one example, the first sampling patch 31 protrudes from the resistor 1 and the composite plate 2. Specifically, the upper surface of the first sampling patch 31 protrudes from the second metal plate 22 by a height ≥ 0.1 mm, and the length of the first sampling patch 31 is ≥ 0.4 mm, so as to facilitate the electrical connection of the first sampling patch 31 during operation.

[0062] It is understood that, based on the aforementioned structural design in which at least a portion of the first metal plate 21 of the same composite plate 2 is connected to at least one second metal plate 22 in the direction from the first metal plate 21 to the direction away from the sampling structure 3, the corresponding partition groove 23 can be opened on the upper surface of the first metal plate 21 and connected to the first sampling patch 31, or the partition groove 23 can be opened on the upper surfaces of the first metal plate 21 and the second metal plate 22 and connected to the first sampling patch 31, which will not be elaborated here.

[0063] In one possible implementation of this application, the sampling structure 3 includes a sampling post 32, which is connected to the upper surface of the first metal plate 21 and / or the second metal plate 22, so that the shunt can output the differential pressure signal of the resistor 1 through the sampling post 32.

[0064] Optionally, the sampling column 32 is riveted or welded to the first metal plate 21 and / or the second metal plate 22.

[0065] refer to Figure 5 In one possible implementation of this application, the sampling structure 3 further includes a heat dissipation groove 35, which is spaced from the sampling column 32. It is disposed on the composite plate 2 and penetrates the first metal plate 21 and the second metal plate 22 to provide a heat dissipation channel for the first metal plate 21 and the second metal plate 22 of the composite plate 2, thereby improving the reliability of the splitter.

[0066] The heat dissipation groove 35 is arc-shaped and wrapped around the sampling column 32 to optimize the heat dissipation effect at the connection between the sampling column 32 and the second metal plate 22.

[0067] In one possible implementation of this application, reference is made to... Figure 6 The sampling structure 3 includes a sampling threaded hole 33, which is opened on the upper surface of the first metal plate 21 and / or the second metal plate 22, for connecting the sampling circuit so that the shunt can output the differential pressure signal of the resistor 1 through the sampling threaded hole 33.

[0068] The sampling threaded hole 33 is designed as a blind hole to prevent metal shavings from falling out when the adapter is connected to the sampling threaded hole 33, which could endanger the system safety.

[0069] In one example, the sampling threaded hole 33 is provided with a sampling step 33a, the height of which is less than or equal to the thickness of the external circuit board, so as to facilitate electrical connection with the pads of the external circuit board and to guide the external circuit board to the installation, positioning and support of the sampling structure 3.

[0070] In one possible implementation of this application, reference is made to... Figure 7 The sampling structure 3 includes a heat dissipation through hole 37, which is opened at one end of the composite plate 2 near the resistor 1 and connected to the resistor 1. A second sampling patch 36 is exposed inside the heat dissipation through hole 37 and is connected to the side of the resistor 1. Thus, the shunt acquires the differential voltage signal of the resistor 1 through the second sampling patch 36, and provides a heat dissipation channel for the second sampling patch 36 and the composite plate 2 through the heat dissipation through hole 37, thereby improving the reliability of the shunt.

[0071] The compatible shunt of this application includes a current bus connection structure 4, which is disposed on the composite plate 2 and located at the end of the composite plate 2 away from the resistor 1, for docking with the busbar or high-power connector of external equipment.

[0072] In one possible implementation of this application, the current busbar connection structure 4 includes an external through hole 41 disposed on the first metal plate 21 and / or the second metal plate 22.

[0073] Among them, the diameter of the external through hole 41 is ≥2mm.

[0074] refer to Figure 2 and Figure 6 In one possible implementation of this application, the current busbar connection structure 4 may further include an external threaded hole 42, which is connected to the first metal plate 21 and / or the second metal plate 22. The external threaded hole 42 is used to connect external adapters so that the shunt can be connected to the busbar or high-power connector of an external device through the current busbar connection structure 4.

[0075] Furthermore, the current busbar connection structure 4 may also include an external stud 43, which is fixed to the first metal plate 21 and the second metal plate 22 by riveting or welding to ensure the reliability of the shunt's external connection.

[0076] It should be noted that the upper surface of the composite plate 2 can also be a smooth, one-piece flat surface, so that the composite plate 2 of the distributor can be connected to external equipment by laser or ultrasonic welding.

[0077] In one example, the first metal plate 21 includes an aluminum plate or an aluminum alloy plate, which is connected to the aluminum or aluminum alloy busbar or high-power connector of the external device to prevent deformation and loosening when different metal materials, such as copper and aluminum, are electrically connected due to their different coefficients of thermal expansion and hardness. At the same time, there is a potential difference between the two materials, and the contact surface of the two metals may be subject to electrochemical corrosion under the combined action of moisture, carbon dioxide and other impurities in the air, thereby improving the reliability of the shunt. Similarly, the second metal plate 22 includes a copper plate or an alloy copper plate, which is connected to the copper or copper alloy busbar or high-power connector of the external device.

[0078] In one possible implementation of this application, a notch 5 is provided at the top corner of any composite plate 2 away from the resistor 1 to indicate the specific direction of the shunt during installation. Of course, the embodiments of this application are not limited to this, and the notch 5 can also be other numerical markings, sticker markings, scale markings or color markings, etc.

[0079] This application also discloses a sampling device, which includes a compatible splitter as described in any of the above embodiments.

[0080] For other working principles and processes of the sampling device in this embodiment, please refer to the description of the compatible splitter in the foregoing embodiment, which will not be repeated here.

[0081] The compatible shunt and sampling device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. It should be noted that the descriptions of each embodiment in this application have different focuses, and parts not described in detail or in a certain embodiment can be referred to the relevant descriptions of other embodiments.

[0082] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. The technical features of the technical solution of this application can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are also included within the patent protection scope of this application, as long as the combination of these technical features does not contradict each other.

Claims

1. A compatible shunt, characterized in that, include: The resistive element is used as the main channel for the current to be measured. A composite board for connecting external circuits, wherein the composite board is connected to the two sides of the resistor respectively; A sampling structure for outputting a differential pressure signal is provided, and the sampling structure is connected to the composite board and is close to the resistor. The composite plate includes a first metal plate and a second metal plate. In the direction from the first metal plate near the sampling structure to away from the sampling structure, at least a portion of the first metal plate of the same composite plate is connected to at least one second metal plate. The first metal plate and the second metal plate are metallurgically bonded to form a composite connection between the first metal plate and the second metal plate.

2. The compatible shunt as described in claim 1, characterized in that, At least one second metal plate of the same composite plate covers the upper or lower surface of the first metal plate, and the vertical projections of the first metal plate and the second metal plate coincide.

3. The compatible shunt as described in claim 1, characterized in that, At one end of the first metal plate near the sampling structure, at least one second metal plate of the same composite plate is embedded into the first metal plate from the surface of the first metal plate.

4. The compatible shunt as described in any one of claims 1 to 3, characterized in that, The ends of both the first metal plate and the second metal plate facing the resistive element are metallurgically bonded to the resistive element.

5. The compatible shunt as described in claim 1, characterized in that, The first metal plate includes an aluminum plate or an aluminum alloy plate.

6. The compatible shunt as described in claim 1, characterized in that, The second metal plate includes a copper plate or an alloy copper plate.

7. The compatible shunt as described in claim 1, characterized in that, The temperature coefficient of resistance of the resistive element is ±20*10. -5 / ℃.

8. The compatible shunt as described in claim 1, characterized in that, The sampling structure includes a first sampling patch, which is attached to the upper surface of the second metal plate.

9. The compatible shunt as described in claim 8, characterized in that, The composite panel includes a partition groove formed on a first metal plate and / or a second metal plate, and is connected to the first sampling patch.

10. The compatible shunt as described in claim 1, characterized in that, The sampling structure includes sampling columns, which are connected to the first metal plate and / or the second metal plate.

11. The compatible shunt as described in claim 1, characterized in that, It also includes a current bus connection structure, which is connected to the first metal plate and / or the second metal plate.

12. The compatible shunt as described in claim 11, characterized in that, The current busbar connection structure includes an external through hole, an external threaded hole, or an external stud.

13. The compatible shunt as described in claim 1, characterized in that, A first resistance adjustment groove is provided on the resistor body and located between the two second metal plates, and a second resistance adjustment groove is provided on the side of the resistor body and corresponding to the first resistance adjustment groove.

14. A sampling device, characterized in that, The sampling device includes the compatible splitter as described in any one of claims 1 to 13.

Images