Nanoimprint spin coating device

Abstract

The utility model discloses a kind of nanoimprint uniform glue devices, comprising: uniform glue bottom plate, uniform glue bottom disc, wafer suction cup and uniform glue arm;Uniform glue bottom disc is placed on uniform glue bottom plate, and uniform glue bottom disc has concentrically arranged mutually isolated inner annular groove and outer annular groove, inner annular groove is communicated with suction pipeline, and outer annular groove is communicated with waste liquid discharge pipeline;Wafer suction cup is drivingly connected with uniform glue rotary drive device, and uniform glue rotary drive device is used to drive wafer suction cup and wafer suction cup adsorbed wafer to rotate;Uniform glue arm is equipped with glue pipeline and nozzle, glue pipeline is communicated with glue barrel and nozzle respectively, and nozzle is used to output glue liquid to wafer.The utility model uses the isolation design of double annular groove to avoid that waste liquid is inhaled into work area when suction, cooperate FFU clean air circulation, ensure that uniform glue environment reaches nanometer grade dustless standard;The communication design of outer annular groove and waste liquid pipeline realizes waste liquid high-efficiency collection, prevent wafer from being contaminated.

Description

Technical Field

[0001] This utility model specifically relates to a nano-imprinting uniform coating device. Background Technology

[0002] Nanoimprint lithography is a high-precision micro / nano structure manufacturing process that transfers patterns by imprinting nanopatterns from a template onto an adhesive layer on a wafer surface, followed by curing and demolding. Spin coating, a core pre-process in nanoimprint lithography, requires the formation of a uniform, defect-free nanoscale adhesive film on the wafer surface; its quality directly determines the precision and yield of the imprinted pattern.

[0003] The core function of the spin coating device is to form a uniform adhesive layer on the wafer surface through a spin coating method: the adhesive is output from the nozzle to the center of the wafer, and the motor drives the wafer to rotate, causing the adhesive to spread under centrifugal force, ultimately forming an adhesive film that meets the imprinting requirements. This process requires simultaneous and precise delivery of adhesive, stable wafer rotation, and efficient waste treatment to ensure the uniformity of the adhesive layer at the nanoscale, providing a foundation for high-precision transfer of imprinted patterns.

[0004] However, most existing spin coating devices use a single annular tank or an open waste liquid tank, without physically separating the exhaust area from the waste liquid collection area. When the exhaust system is working, it is easy to draw adhesive droplets or cleaning fluid from the waste liquid tank back into the spin coating chamber, causing particulate contaminants in the air to adhere to the wafer surface, which cannot meet the requirements for nanoscale cleanliness. Utility Model Content

[0005] To address the aforementioned technical problems, this invention proposes a nano-imprinting uniform coating device.

[0006] To achieve the above objectives, the technical solution of this utility model is as follows:

[0007] This utility model discloses a nanoimprint coating apparatus, comprising:

[0008] The base plate is coated with a uniform adhesive.

[0009] A spin coater base is placed on a spin coater plate, and the spin coater base has concentrically arranged, mutually isolated inner and outer annular grooves.

[0010] The inner annular groove is connected to the exhaust duct, which is used to draw the air output by the FFU downward to form a clean air space.

[0011] The outer annular tank is connected to the waste liquid discharge pipeline, which is used to discharge the excess adhesive liquid during wafer homogenization or the cleaning liquid during wafer cleaning that is received in the outer annular tank.

[0012] The wafer chuck is connected to the spin coating rotary drive device, which is used to drive the wafer chuck and the wafer it holds to rotate.

[0013] The coating arm is equipped with a coating pipeline and a nozzle. The coating pipeline is connected to the coating tank and the nozzle, respectively. The nozzle is used to output the coating liquid to the wafer.

[0014] This utility model discloses a nanoimprinting and homogenizing device. Its double-ring groove isolation design prevents waste liquid from being sucked into the working area during ventilation. Combined with FFU clean air circulation, it ensures that the homogenizing environment reaches the nanoscale dust-free standard. The connection design between the outer ring groove and the waste liquid pipeline enables efficient collection of waste liquid and prevents contamination of the wafer.

[0015] Based on the above technical solution, the following improvements can be made:

[0016] Using the above preferred embodiment, the nanoimprinting spin coater further includes: a flow guide hood, which is fixedly connected to the spin coater base. The flow guide hood is provided with an inclined flow guide surface for guiding the adhesive or cleaning solution ejected from the wafer edge into the outer annular groove of the spin coater base.

[0017] Using the above-mentioned preferred scheme, the flow guide shroud guides the liquid to flow along a preset path through the inclined structure, avoiding splashing of adhesive and contaminating the chamber, and improving the efficiency of waste liquid collection.

[0018] As a preferred embodiment, the nanoimprinting spin coater further includes: a spin coater cover, which is fixedly connected to the spin coater base. The spin coater cover forms an area for accommodating the wafer and prevents the adhesive or cleaning solution ejected from the wafer edge from overflowing.

[0019] By adopting the above-mentioned preferred solution, the glue coating cover creates an independent working space, isolating it from external pollution. At the same time, the physical enclosure prevents the glue from splashing outside the equipment, thus improving safety.

[0020] As a preferred embodiment, the spin coating drive device is installed on the spin coating lifting plate, and the spin coating lifting plate is connected to the spin coating lifting drive device. The spin coating lifting drive device drives the wafer chuck and the wafer adsorbed by the wafer chuck to lift and lower, so that the wafer is more than 10mm higher than the spin coating cover during loading and unloading.

[0021] By adopting the above-mentioned preferred scheme, the lifting structure enables automated loading and unloading of wafers, avoiding contamination from manual intervention. At the same time, height control ensures the operating space for the robotic arm and improves the automation level of the equipment.

[0022] As a preferred embodiment, the nanoimprinting spin coater further includes: a spin coater tray, which is fixedly connected to the spin coater base, and a back-washing component for cleaning the back edge of the wafer is installed on the spin coater tray.

[0023] By adopting the above-mentioned preferred solution, the back-washing assembly can effectively remove the residual adhesive layer on the back edge of the wafer, avoid the wafer from sticking to the fixture during imprinting, and improve the ease of demolding.

[0024] As a preferred embodiment, the coating arm is also equipped with a side-washing component for cleaning the edge of the wafer front side.

[0025] Using the above-mentioned preferred solution, the edge washing component is used to specifically remove the adhesive layer on the front edge to prevent edge adhesion after imprinting and ensure smooth separation of the wafer and the template after pattern transfer.

[0026] As a preferred embodiment, the backwash assembly and / or sidewash assembly includes: a spray pipe connected to a cleaning liquid tank, the cleaning liquid tank having a gas inlet and a liquid outlet, the gas inlet being connected to a nitrogen source for driving the cleaning liquid to flow from the liquid outlet to the spray pipe.

[0027] The preferred solution described above uses nitrogen pressure to deliver the cleaning fluid, eliminating the need for an additional pump, simplifying the pipeline structure, and ensuring the stability and controllability of the cleaning fluid output.

[0028] As a preferred embodiment, the glue dispensing pipeline includes: a horizontal pipeline installed on the glue dispensing arm and a vertical glue outlet provided at the end of the glue dispensing arm. The top end of the vertical glue outlet is sealed and connected to the outlet end of the horizontal pipeline, and the bottom end is connected to the nozzle inlet to form an L-shaped glue dispensing channel.

[0029] By adopting the above-mentioned preferred solution, the traditional right-angle bend of the pipeline is replaced with a combination structure of horizontal pipeline and vertical hole, which eliminates the external bend of the pipeline, greatly reduces the space occupied by the coating arm in the vertical direction, makes the equipment structure more compact, and adapts to the miniaturization trend of nanoimprinting equipment.

[0030] As a preferred embodiment, the spin coater arm is connected to the swing drive device, which drives the spin coater arm to swing horizontally, allowing the nozzle to move to any position above the wafer.

[0031] By adopting the above-mentioned preferred solution, the oscillation function enables flexible adjustment of the nozzle position, adapting to the center coating requirements of wafers of different sizes and improving the versatility of the equipment.

[0032] As a preferred embodiment, the swing drive device is installed on the arm lifting plate, and the arm lifting plate is connected to the arm lifting drive device in a transmission manner, with the arm lifting drive device driving the uniform adhesive arm to rise and fall.

[0033] By adopting the above-mentioned preferred scheme, the combined motion of lifting and swinging allows the coating arm to adjust its position in three-dimensional space, which facilitates avoiding the robot arm when loading and unloading wafers, while optimizing the coating trajectory planning. Attached Figure Description

[0034] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the nanoimprinting and homogenizing device provided in an embodiment of the present invention.

[0036] Figure 2 A cross-sectional view of the nanoimprinting uniform coating device provided in an embodiment of this utility model.

[0037] Figure 3 This is a partial schematic diagram of the coating arm provided in an embodiment of the present invention.

[0038] Figure 4 This is a partial schematic diagram of the adhesive dispensing pipeline provided in an embodiment of the present invention.

[0039] Figure 5 This is a partial enlarged view of the adhesive dispensing pipeline provided in an embodiment of the present invention.

[0040] Figure 6 This is a schematic diagram of adhesive delivery provided for an embodiment of the present invention.

[0041] Figure 7 A schematic diagram of the nanoimprinting and coating device provided in this embodiment of the present invention during wafer loading and unloading.

[0042] Figure 8 This is a schematic diagram of the nanoimprinting and coating apparatus provided in this embodiment of the present invention during wafer coating.

[0043] Figure 9 This is a schematic diagram of the position of the uniform coating arm when the nanoimprinting uniform coating device provided in this embodiment of the utility model is not uniformly coated.

[0044] Figure 10 This is a schematic diagram showing the position of the coating arm during coating in the nanoimprint coating device provided in this embodiment of the present invention.

[0045] The components are: 1-Spreading base plate, 2-Spreading base plate, 21-Inner annular groove, 22-Outer annular groove, 23-Exhaust pipe, 24-Waste liquid discharge pipe, 3-Wafer suction cup, 4-Spreading arm, 41-Spreading pipe, 411-Horizontal pipe, 412-Vertical dispensing hole, 42-Nozzle, 5-Spreading rotation drive device, 51-Vacuum channel, 6-Guide shroud, 61-Inclined guide surface, 7-Spreading outer cover, 8-Spreading lifting drive device, 9-Spreading middle plate, 10-Back washing assembly, 11-Side washing assembly, 12-Swing drive device, 13-Arm lifting drive device, 14-Reducer, 15-Wafer. Detailed Implementation

[0046] The preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0047] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0048] The expression “includes” is an “open-ended” expression, which means that there is a corresponding component and should not be interpreted as excluding additional components.

[0049] To achieve the objectives of this utility model, in some embodiments of a nanoimprinting and coating apparatus, such as... Figure 1-2 As shown, the nanoimprinting spin coater includes: a spin coater base plate 1, a spin coater tray 2, a wafer chuck 3, and a spin coater arm 4.

[0050] The spin coating tray 2 is placed on the spin coating base plate 1, and the spin coating tray 2 has concentrically arranged and mutually isolated inner annular grooves 21 and outer annular grooves 22. The inner annular groove 21 is connected to the exhaust pipe 23, which is used to draw the air output by the FFU downward to form a clean air space; the outer annular groove 22 is connected to the waste liquid discharge pipe 24, which is used to discharge the excess adhesive liquid during the spin coating of the wafer 15 or the cleaning liquid during the cleaning of the wafer 15 held in the outer annular groove 22.

[0051] The wafer chuck 3 is connected to the spin coating rotary drive device 5 (e.g., spin coating motor) for driving the wafer chuck 3 and the wafer 15 adsorbed by the wafer chuck 3 to rotate.

[0052] The spin coating rotary drive 5 has a built-in vacuum channel 51 that communicates with the wafer chuck 3.

[0053] The coating arm 4 is equipped with a coating pipe 41 and a nozzle 42. The coating pipe 41 is connected to the coating tank and the nozzle 42 respectively. The nozzle 42 is used to output the coating liquid to the wafer 15.

[0054] The outer annular groove 22 is used to collect waste liquid, and the inner annular groove 21 is used for ventilation. The two are isolated from each other to prevent the liquid left behind from being sucked away during ventilation.

[0055] To maintain the cleanliness of the air in the spin coater chamber, there is an FFU (Fan Filter Unit) above the chamber. The FFU blows out clean air, which is then drawn down by the exhaust fan, creating a clean air space. This prevents dust and other particles from adhering to the spin coat during the spin coat process, ensuring that the resulting spin coat layer is clean and free of particles at the nanometer level.

[0056] This utility model discloses a nanoimprinting and homogenizing device. Its double-ring groove isolation design prevents waste liquid from being sucked into the working area during ventilation. Combined with FFU clean air circulation, it ensures that the homogenizing environment reaches the nanoscale dust-free standard. The connection design between the outer ring groove 22 and the waste liquid pipeline 24 enables efficient collection of waste liquid and prevents contamination of the wafer 15.

[0057] To further optimize the implementation effect of this utility model, in some other embodiments, the remaining features are the same, except that the nanoimprinting uniform coating device further includes: a flow guide 6, which is fixedly connected to the uniform coating base 2. The flow guide 6 is provided with an inclined flow guide surface 61, which is used to guide the adhesive or cleaning liquid thrown off the edge of the wafer 15 into the outer annular groove 22 of the uniform coating base 2.

[0058] Using the preferred scheme described above, the flow guide shroud 6 guides the liquid to flow along a preset path through its inclined structure, avoiding splashing of adhesive and contaminating the chamber, and improving waste liquid collection efficiency.

[0059] To further optimize the implementation effect of this utility model, in some other embodiments, the remaining features are the same, except that the nanoimprinting spin coater also includes a spin coater cover 7, which is fixedly connected to the spin coater base 2. The spin coater cover 7 forms an area for accommodating the wafer 15 and prevents the adhesive or cleaning solution splashed from the edge of the wafer 15 from overflowing.

[0060] Using the above-mentioned preferred solution, the glue coating cover 7 creates an independent working space, isolating external pollution, and at the same time, physical barriers prevent glue from splashing outside the equipment, thus improving safety.

[0061] To further optimize the implementation effect of this utility model, in some other embodiments, the remaining features are the same, except that the spin coating drive device is installed on the spin coating lifting plate, and the spin coating lifting plate is connected to the spin coating lifting drive device 8 (e.g., a cylinder). The spin coating lifting drive device 8 drives the wafer chuck 3 and the wafer 15 adsorbed by the wafer chuck 3 to rise and fall, so that the wafer 15 is more than 10mm higher than the spin coating cover when loading and unloading.

[0062] Using the above-mentioned preferred solution, the lifting structure enables automated loading and unloading of wafer 15, avoiding contamination from manual intervention. At the same time, height control ensures the operating space for the robotic arm and improves the automation level of the equipment.

[0063] To further optimize the implementation effect of this utility model, in some other embodiments, the remaining features are the same, except that the nanoimprinting spin coater also includes: a spin coater plate 9, which is fixedly connected to the spin coater base plate 2, and a back washing component 10 for cleaning the back edge of the wafer 15 is installed on the spin coater plate 9.

[0064] Using the above-mentioned preferred scheme, during the coating process, the adhesive liquid is driven by the motor to drive the wafer 15 to rotate slowly. When the adhesive liquid is dropped in the middle, it slowly spreads with the rotation. When it spreads to the edge, the adhesive liquid will flow to the edge of the back side. As the speed increases, the adhesive liquid at the edge will also be flung off. However, a very thin layer of adhesive will remain on the edge of the back side. This layer of adhesive will stick the wafer (glass) to the fixture during subsequent imprinting, making separation difficult.

[0065] The present invention uses a back-washing component 10, which can effectively remove residual adhesive layer on the back edge of the wafer 15, avoid the wafer 15 from sticking to the fixture during imprinting, and improve the convenience of demolding.

[0066] Furthermore, based on the above embodiments, a side-washing assembly 11 for cleaning the front edge of the wafer 15 is also installed on the plating arm 4.

[0067] Using the above-mentioned preferred solution, the edge washing component 11 removes the adhesive layer on the front edge in a targeted manner to prevent edge adhesion after imprinting and ensure smooth separation of the wafer 15 from the template after pattern transfer.

[0068] Furthermore, based on the above embodiments, the back washing assembly 10 and the side washing assembly 11 each include: a spray pipe connected to the cleaning liquid tank, the cleaning liquid tank being provided with a gas inlet and a liquid outlet, the gas inlet being connected to a nitrogen source, used to drive the cleaning liquid to flow from the liquid outlet to the spray pipe.

[0069] The preferred solution described above uses nitrogen pressure to deliver the cleaning fluid, eliminating the need for an additional pump, simplifying the pipeline structure, and ensuring the stability and controllability of the cleaning fluid output.

[0070] To further optimize the implementation effect of this utility model, in some other embodiments, the remaining technical features are the same, the difference being that, for example... Figure 3-5 As shown, the glue dispensing pipeline 41 includes: a horizontal pipeline 411 installed on the glue dispensing arm 4 and a vertical glue outlet 412 disposed at the end of the glue dispensing arm 4. The top end of the vertical glue outlet 412 is sealed and connected to the outlet end of the horizontal pipeline 411, and the bottom end is connected to the inlet of the nozzle 42 to form an L-shaped glue dispensing channel.

[0071] Using the preferred scheme described above, nanoimprinting requires a spin coater to drop the adhesive onto wafer 15. Commonly used structures directly connect the tube to the spin coater arm 4. However, PFA tubes are relatively rigid, and turning them 180 degrees from bottom to top would occupy a significant amount of space on the spin coater. If the tube is bent directly at a right angle, a bend would occur at the right angle, affecting liquid flow.

[0072] This invention replaces the traditional right-angle bend in the pipeline with a combination of a horizontal pipeline 411 and a vertical hole, eliminating external bends in the pipeline and significantly reducing the space occupied by the top-and-bottom splicing arm 4. This results in a more compact equipment structure, adapting to the miniaturization trend of nanoimprinting equipment. The vertical splice hole 412 features a smooth inner wall through-hole design, avoiding the pipe diameter shrinkage or uneven inner wall caused by material deformation at the bends of traditional PFA pipelines. This reduces adhesive flow resistance, minimizes the risk of liquid stagnation, and ensures stable adhesive delivery. The vertical splice hole 412 can be directly formed at the end of the top-and-bottom splicing arm 4 through machining. Compared to traditional pipelines that require complex bending processes, this structure offers higher machining precision and facilitates sealing connections, reducing production difficulty and cost. The modular design of the horizontal pipeline 411 and the vertical splice hole 412 facilitates disassembly and cleaning, allowing for quick replacement of the nozzle 42 or unclogging of blocked channels, shortening equipment maintenance time and improving production efficiency.

[0073] In order to further optimize the implementation effect of this utility model, in some other embodiments, the remaining features are the same, except that the coating arm 4 is connected to the swing drive device 12 (e.g., swing motor) for transmission. The swing drive device 12 drives the coating arm 4 to swing in the horizontal direction, so that the nozzle 42 can be moved to any position above the wafer 15.

[0074] By adopting the above-mentioned preferred scheme, the oscillation function enables flexible adjustment of the nozzle 42 position, adapting to the center coating requirements of wafers 15 of different sizes and improving the equipment's versatility. Furthermore, the oscillation drive device 12 is connected to the coating arm 4 via a reducer 14.

[0075] Furthermore, based on the above embodiments, the swing drive device 12 is installed on the arm lifting plate, and the arm lifting plate is connected to the arm lifting drive device 13 (e.g., a cylinder) for transmission. The arm lifting drive device 13 drives the glue-coating arm 4 to lift.

[0076] By adopting the above-mentioned preferred scheme, the combined motion of lifting and swinging allows the coating arm 4 to adjust its position in three-dimensional space, which facilitates avoiding the robot arm when loading and unloading wafers 15, while optimizing the coating trajectory planning.

[0077] like Figure 7-10 As shown, the working process of this novel nanoimprinting and coating device is as follows:

[0078] 1) Wafer loading and positioning: The spin coating lifting drive device 8 drives the spin coating lifting plate to rise, so that the wafer chuck 3 and the adsorbed wafer 15 are more than 10mm higher than the spin coating cover. The wafer robot places the wafer 15 on the wafer chuck 3 to complete the loading. Then, the spin coating lifting drive device 8 drives the wafer chuck 3 to descend to the spin coating position.

[0079] 2) Clean environment construction: The FFU outputs clean air, and the exhaust pipe 23 draws air downward through the inner annular groove 21 of the homogenizing chassis 2, forming a clean air space from top to bottom, providing a dust-free environment for the homogenizing process.

[0080] 3) Adhesive delivery and coating: Nitrogen gas is injected through the gas inlet of the adhesive tank, forcing the adhesive out from the bottom of the tank through the adhesive flow pipe 41, and sequentially passing through the buffer device, pump, filter, and on / off valve, such as... Figure 6 As shown, the adhesive is distributed through the horizontal pipe 411 and vertical dispensing hole 412 on the spin coater 4, and finally output to the center of the wafer 15 through the nozzle 42. At the same time, the spin coater rotation drive 5 drives the wafer chuck 3 and the wafer 15 to gradually accelerate from 0 to 3000-5000 rpm. Centrifugal force is used to spread the adhesive evenly. By adjusting the viscosity of the adhesive and the rotation speed, the thickness tolerance of the adhesive layer is controlled within ±3%.

[0081] 4) Edge cleaning and waste liquid treatment: After the adhesive is applied, the back cleaning assembly 10 and the edge cleaning assembly 11 clean the back and front edges of the wafer 15 by driving the liquid spraying pipeline with nitrogen. The inclined guide surface 61 of the guide shroud 6 guides the cleaning liquid and excess adhesive to the outer annular groove 22 of the uniform adhesive base 2, and then discharges it through the waste liquid discharge pipeline 24.

[0082] 5) Coating completion and wafer unloading: The swing drive device 12 drives the coating arm 4 to swing and retract, and the arm lifting drive device 13 drives the coating arm 4 to rise; the coating lifting drive device 8 drives the wafer suction cup 3 to rise, so that the wafer 15 is higher than the coating cover 7, and the wafer robot takes away the wafer 15 that has completed coating, and the entire workflow ends.

[0083] In summary, the nanoimprinting and coating device of this invention has the following beneficial effects:

[0084] First, achieve clean environment and efficient wastewater treatment through structural innovation:

[0085] The double-ring groove design of the spin coating chassis 2 isolates the inner groove 21 for ventilation and the outer groove 22 for waste liquid collection. Combined with the FFU clean air circulation, it forms a dust-free working space, avoiding the backflow of waste liquid during ventilation and preventing contamination of the wafer 15, thus ensuring that the adhesive layer achieves nanoscale cleanliness. The outer ring groove 22 is connected to the waste liquid pipeline 24, which efficiently collects the adhesive liquid and cleaning liquid splashed out during spin coating.

[0086] The flow guide 6 guides the liquid to the outer annular groove 22 through the inclined flow guide surface 61 to prevent the adhesive from splashing, and the uniform adhesive cover 7 further blocks contamination and prevents the adhesive from overflowing.

[0087] Second, improve process precision and ease of operation through functional integration:

[0088] The back wash assembly 10 and the side wash assembly 11 use nitrogen gas to pressurize and deliver cleaning fluid, which specifically removes residual adhesive layers from the front and back edges of the wafer 15, preventing it from sticking to the fixture after imprinting and improving demolding efficiency; the jet pipeline design simplifies the structure and ensures stable output of cleaning fluid.

[0089] The L-shaped dispensing channel avoids liquid stagnation caused by the bending of traditional pipelines, and the vertical dispensing saves space and ensures smooth delivery of adhesive.

[0090] The lifting structure of the coating drive device enables automated loading and unloading of wafer 15. The arm swing and lifting functions flexibly adjust the position of nozzle 42 to adapt to the coating needs of wafer 15 of different sizes, improving the equipment's versatility and automation.

[0091] In the description of this utility model, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "side", "top", "inner", "front", "center", "both ends", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0092] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0093] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications may be made to this utility model without departing from its spirit and scope. All such changes and modifications fall within the scope of protection of this utility model as defined by the appended claims and their equivalents.

[0094] The control method of this utility model is to control the device by manually starting and stopping the switch. The wiring diagram of the power element and the supply of power are common knowledge in the field. Since this utility model is mainly used to protect mechanical devices, the control method and wiring layout will not be explained in detail.

Claims

1. A spin coater for nanoimprint, characterized by, include: The base plate is coated with a uniform adhesive. A spin coating base plate is provided, wherein the spin coating base plate is placed on the spin coating base plate, and the spin coating base plate has concentrically arranged and mutually isolated inner annular grooves and outer annular grooves. The inner annular groove is connected to the exhaust pipe, which is used to draw the air output by the FFU downward to form a clean air space. The outer annular groove is connected to the waste liquid discharge pipeline, which is used to discharge the excess adhesive liquid during wafer homogenization or the cleaning liquid during wafer cleaning that is received in the outer annular groove. A wafer chuck, wherein the wafer chuck is connected to a spin coating rotary drive device, and the spin coating rotary drive device is used to drive the wafer chuck and the wafer adsorbed by the wafer chuck to rotate. A coating arm is provided with a coating pipeline and a nozzle. The coating pipeline is connected to a coating tank and a nozzle, respectively. The nozzle is used to output coating liquid to the wafer.

2. The nanoimprint glue uniformizing apparatus according to claim 1, wherein The nanoimprinting and homogenizing device further includes a flow guide hood, which is fixedly connected to the homogenizing base. The flow guide hood is provided with an inclined flow guide surface for guiding the adhesive or cleaning solution ejected from the wafer edge into the outer annular groove of the homogenizing base.

3. The nanoimprint glue uniformizing apparatus according to claim 1, wherein The nanoimprinting and coating apparatus further includes a coating cover, which is fixedly connected to the coating base. The coating cover forms an area for accommodating the wafer and prevents the coating liquid or cleaning solution splashed from the edge of the wafer from overflowing.

4. The nanoimprint glue uniformizing apparatus according to claim 1, wherein The spin coating drive device is installed on the spin coating lifting plate, and the spin coating lifting plate is connected to the spin coating lifting drive device. The spin coating lifting drive device drives the wafer chuck and the wafer adsorbed by the wafer chuck to lift and lower, so that the wafer is more than 10mm higher than the spin coating cover during loading and unloading.

5. The nanoimprint uniform coating device of claim 1, wherein The nanoimprinting and spin coating device further includes a spin coating tray, which is fixedly connected to the spin coating base plate, and a back-washing component for cleaning the back edge of the wafer is installed on the spin coating tray.

6. The nanoimprint uniform coating device according to claim 5, wherein The coating arm is also equipped with a side-washing assembly for cleaning the edge of the front side of the wafer.

7. The nanoimprint uniform coating device according to claim 6, wherein The backwash assembly and / or sidewash assembly includes: a spray pipe connected to a cleaning liquid tank, wherein the cleaning liquid tank is provided with a gas inlet and a liquid outlet, the gas inlet being connected to a nitrogen source for driving the cleaning liquid to flow from the liquid outlet to the spray pipe.

8. The nanoimprint glue uniformizing apparatus according to claim 1, wherein The adhesive dispensing pipeline includes: a horizontal pipeline installed on the adhesive spreading arm and a vertical dispensing hole located at the end of the adhesive spreading arm. The top end of the vertical dispensing hole is sealed and connected to the outlet end of the horizontal pipeline, and the bottom end is connected to the nozzle inlet to form an L-shaped adhesive dispensing channel.

9. The nanoimprint glue uniformizing apparatus according to claim 1, wherein The spin coater arm is connected to the swing drive device, which drives the spin coater arm to swing horizontally, allowing the nozzle to move to any position above the wafer.

10. The nanoimprint uniform coating device of claim 9, wherein, The swing drive device is mounted on the arm lifting plate, and the arm lifting plate is connected to the arm lifting drive device in a transmission manner. The arm lifting drive device drives the uniform adhesive arm to lift and lower.

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