Quick heat-conducting silica gel pad for electronic appliances

Abstract

The utility model relates to the technical field of heat conduction silica gel pad, specifically relates to a kind of fast heat conduction silica gel pad for electronic appliances, including silica gel pad main body, the silica gel pad main body is composed of first silica gel layer and second silica gel layer, the first silica gel layer is located at the top of second silica gel layer, the top of second silica gel layer is equipped with anti-deformation component, the outside of silica gel pad main body is equipped with connecting sleeve;The anti-deformation component is used to increase the anti-deformation effect of silica gel pad main body, the anti-deformation component is composed of multiple first metal wires, multiple second metal wires and multiple connecting strips, compared with existing heat conduction silica gel pad, anti-deformation component is matched through the cooperation of triangular structure design and connecting strip, effectively resist and constrain the deformation of silica gel pad main body is realized, when being subjected to external force, the shape of silica gel pad main body can be kept stable, after the disappearance of external force, it can quickly recover to original shape, so as to guarantee the heat conduction performance and service life of silica gel pad main body.

Description

Technical Field

[0001] This utility model relates to the field of thermally conductive silicone pad technology, specifically to a fast thermally conductive silicone pad for electronic appliances. Background Technology

[0002] Thermal pads are high-performance gap-filling thermally conductive materials, mainly used as the interface between electronic devices and heat sinks or product housings. They have good adhesion, flexibility, good compressibility, and excellent thermal conductivity, which allows air to be completely expelled between electronic components and heat sinks during use, so as to achieve sufficient contact and significantly increase heat dissipation.

[0003] Thermally conductive silicone pads are widely used in the electronics industry. These pads possess excellent thermal conductivity and high pressure resistance. By eliminating air gaps, they can reduce vibration and improve overall heat transfer, enabling timely heat dissipation in electronic devices, enhancing user experience, and extending device lifespan. However, it's also worth noting that silicone pads are relatively soft and susceptible to significant deformation under external forces, causing considerable damage and uneven heat dissipation. Therefore, improving existing thermally conductive silicone pads and designing a new type of fast-conducting silicone pad for electronic devices to address these technical shortcomings and enhance overall practicality is of paramount importance. Utility Model Content

[0004] The purpose of this invention is to provide a fast-conducting silicone pad for electronic appliances. The anti-deformation component, through the triangular structure design and the cooperation of the connecting strip, effectively resists and constrains the deformation of the silicone pad body. When subjected to external force, it can maintain the shape stability of the silicone pad body, and after the external force disappears, it can quickly return to its original shape, thereby ensuring the thermal conductivity and service life of the silicone pad body, and solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A fast-conducting silicone pad for electronic appliances includes a silicone pad body, which is composed of a first silicone layer and a second silicone layer. The first silicone layer is located on top of the second silicone layer, and an anti-deformation component is provided on the top of the second silicone layer. A connecting sleeve is provided on the outer side of the silicone pad body.

[0007] The anti-deformation component is used to increase the anti-deformation effect of the silicone pad body. The anti-deformation component consists of multiple sets of first metal wires, multiple sets of second metal wires, and multiple sets of connecting strips. The first metal wires are fixedly connected to the top of the second silicone layer, the second metal wires are located outside the first metal wires, and the multiple sets of connecting strips are respectively fixedly connected to both ends of the top of the second silicone layer.

[0008] As a preferred embodiment of this utility model, the first metal wire and the second metal wire are fixedly connected to each other, and the first metal wire and the second metal wire are connected to each other to form multiple sets of triangular structure designs.

[0009] As a preferred embodiment of this utility model, the connecting strip has a sloping structure design, and multiple sets of connecting grooves are formed in both groups at the bottom of the first silicone layer. The internal structure size of the connecting groove corresponds to the external structure size of the connecting strip, and the first silicone layer is connected to the connecting strip through the connecting groove.

[0010] As a preferred embodiment of this utility model, the second silicone layer has multiple sets of first heat dissipation holes inside, and the first silicone layer has multiple sets of second heat dissipation holes inside, with the first heat dissipation holes and the second heat dissipation holes being interconnected.

[0011] As a preferred embodiment of this utility model, the interior of the second heat dissipation hole is designed with a conical structure, and a heat sink is fixedly connected inside the second silicone layer and at the bottom of the multiple sets of first heat dissipation holes.

[0012] As a preferred embodiment of this utility model, the connecting sleeve is internally fixedly connected with multiple sets of tensile bars, and the multiple sets of tensile bars are designed in a triangular structure inside the connecting sleeve.

[0013] As a preferred embodiment of this utility model, the tensile strip has a reinforcing wire embedded inside, and the reinforcing wire is a metal reinforcing wire.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. In this utility model, through the design of the anti-deformation component, the anti-deformation component, through the triangular structure design and the cooperation of the connecting strip, effectively resists and constrains the deformation of the silicone pad body. When subjected to external force, it can maintain the shape stability of the silicone pad body. After the external force disappears, it can quickly return to its original shape, thereby ensuring the thermal conductivity and service life of the silicone pad body.

[0016] 2. In this utility model, through the design of the first and second heat dissipation holes, the heat sink effectively transfers heat from the silicone layer to a wider area, improving the heat conduction efficiency. The high thermal conductivity of the metal wires allows heat to be quickly conducted through these paths, further enhancing the heat conduction effect. The second heat dissipation hole is interconnected with the first heat dissipation hole. After the heat is transferred to the first silicone layer through the first heat dissipation hole and multiple sets of metal wires, it is then dissipated into the environment through the second heat dissipation hole. The second heat dissipation hole has a conical internal structure design, which helps to prevent impurities from clogging the channels and optimizes the heat dissipation effect. The connecting strip is fixedly connected to the top of the second silicone layer and cooperates with the connecting groove at the bottom of the first silicone layer. This design not only increases the friction between the two silicone layers to prevent delamination, but also helps to transfer heat evenly. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the anti-deformation component structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the first silicone layer structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the internal structure of the connecting sleeve of this utility model.

[0021] In the figure: 1. Silicone pad body; 2. First silicone layer; 3. Second silicone layer; 4. Deformation-resistant component; 5. Connecting sleeve; 6. First metal wire; 7. Second metal wire; 8. Connecting strip; 9. Connecting groove; 10. First heat dissipation hole; 11. Second heat dissipation hole; 12. Heat sink; 13. Tensile strip. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0023] Example:

[0024] Please see Figures 1-4 This utility model provides a technical solution:

[0025] A fast-conducting silicone pad for electronic appliances includes a silicone pad body 1, which is composed of a first silicone layer 2 and a second silicone layer 3. The first silicone layer 2 is located on top of the second silicone layer 3. An anti-deformation component 4 is provided on the top of the second silicone layer 3. A connecting sleeve 5 is provided on the outer side of the silicone pad body 1.

[0026] The anti-deformation component 4 is used to increase the anti-deformation effect of the silicone pad body 1. The anti-deformation component 4 consists of multiple sets of first metal wires 6, multiple sets of second metal wires 7 and multiple sets of connecting strips 8. The first metal wires 6 are fixedly connected to the top of the second silicone layer 3, the second metal wires 7 are located outside the first metal wires 6, and the multiple sets of connecting strips 8 are respectively fixedly connected to both ends of the top of the second silicone layer 3.

[0027] Furthermore, the first metal wire 6 and the second metal wire 7 are fixedly connected to each other, forming multiple sets of triangular structure designs. When the silicone pad body 1 is in use, the triangular structure design formed by the fixed connection between the first metal wire 6 and the second metal wire 7 can increase the deformation resistance of the silicone pad body 1. When the silicone pad body 1 is subjected to external force and deforms, the multiple sets of first metal wire 6 and second metal wire 7 can pull the silicone pad body 1 back to its original position, preventing large deformation that could cause significant damage to the silicone pad body 1. Moreover, deformation can lead to uneven heat dissipation.

[0028] The connecting strip 8 has a sloping structure design. The bottom of the first silicone layer 2 has multiple sets of connecting grooves 9. The internal structure size of the connecting groove 9 corresponds to the external structure size of the connecting strip 8. The first silicone layer 2 is connected to the connecting strip 8 through the connecting groove 9. When the silicone pad body 1 is in use, the connecting strip 8 and the connecting groove 9 can increase the friction between the first silicone layer 2 and the second silicone layer 3, preventing the silicone pad body 1 from delaminating and affecting its use.

[0029] Secondly, the interior of the second silicone layer 3 has multiple sets of first heat dissipation holes 10, and the interior of the first silicone layer 2 has multiple sets of second heat dissipation holes 11. The first heat dissipation holes 10 and the second heat dissipation holes 11 are interconnected. The interior of the second heat dissipation hole 11 has a conical structure design. A heat sink 12 is fixedly connected to the interior of the second silicone layer 3 at the bottom of the multiple sets of first heat dissipation holes 10. When the silicone pad body 1 is in use, the bottom of the silicone pad body 1 is in contact with electronic appliances. The heat dissipation holes 12 transfer the heat emitted by the electronic appliances. The first heat dissipation holes 10, the first metal wire 6 and the second metal wire 7 conduct the heat, and then dissipate the heat through the second heat dissipation holes 11. The conical structure design of the second heat dissipation holes 11, which is smaller at the top and larger at the bottom, can prevent impurities from entering the interior of the second heat dissipation holes 11, causing the second heat dissipation holes 11 to become blocked and affecting the use.

[0030] Furthermore, the connecting sleeve 5 has multiple sets of tensile strips 13 fixedly connected inside. The multiple sets of tensile strips 13 are designed in a triangular structure inside the connecting sleeve 5. Reinforcing wires are embedded inside the tensile strips 13. The reinforcing wires are metal reinforcing wires. When the silicone pad body 1 is in use, the connecting sleeve 5, together with the tensile strips 13 and the reinforcing wires inside the tensile strips 13, can increase the tensile strength of the silicone pad body 1 and prevent the silicone pad body 1 from deforming and affecting its use.

[0031] In this embodiment, the specific implementation scenario is as follows: In actual use, the second silicone layer 3 comes into contact with electronic devices. When the silicone pad body 1 is subjected to external force, such as compression or stretching, it tends to deform. At this time, the triangular structure design formed by multiple sets of first metal wires 6 and second metal wires 7 begins to play its role. The triangular structure has high mechanical stability and can resist deformation under external force, thereby maintaining the shape stability of the silicone pad body 1. At the same time, the cooperation between the connecting strip 8 and the connecting groove 9 also plays a restraining role. The connecting strip 8, through its inclined structure design, increases the friction between itself and the connecting groove 9, further preventing the silicone pad body 1 from delaminating or deforming when subjected to external force. When the external force disappears, due to the stability of the triangular structure and the restraining effect of the connecting strip 8, the silicone pad... The main body 1 can quickly return to its original shape. This repositioning effect helps maintain the thermal conductivity and lifespan of the silicone pad main body 1. The heat sink 12 effectively transfers heat from the silicone layer to a wider area, improving heat conduction efficiency. The high thermal conductivity of the metal wires allows heat to be conducted quickly through these paths, further enhancing the heat conduction effect. The second heat dissipation hole 11 is interconnected with the first heat dissipation hole 10. After heat is transferred to the first silicone layer 2 through the first heat dissipation hole 10 and multiple sets of metal wires, it is then dissipated into the environment through the second heat dissipation hole 11. The second heat dissipation hole 11 has a conical internal structure design, which helps prevent impurities from clogging the channels and optimizes the heat dissipation effect. The connecting strip 8 is fixedly connected to the top of the second silicone layer 3 and cooperates with the connecting groove 9 at the bottom of the first silicone layer 2. This design not only increases the friction between the two silicone layers to prevent delamination, but also helps to distribute heat evenly. Compared with existing thermal conductive silicone pads, this utility model improves the overall practicality of thermal conductive silicone pads through design.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A fast-conducting thermal pad for electronic appliances, comprising a silicone pad body (1), characterized in that: The silicone pad body (1) is composed of a first silicone layer (2) and a second silicone layer (3). The first silicone layer (2) is located on top of the second silicone layer (3). The top of the second silicone layer (3) is provided with an anti-deformation component (4). The outer side of the silicone pad body (1) is provided with a connecting sleeve (5). The anti-deformation component (4) is used to increase the anti-deformation effect of the silicone pad body (1). The anti-deformation component (4) consists of multiple sets of first metal wires (6), multiple sets of second metal wires (7) and multiple sets of connecting strips (8). The first metal wires (6) are fixedly connected to the top of the second silicone layer (3), the second metal wires (7) are located outside the first metal wires (6), and the multiple sets of connecting strips (8) are respectively fixedly connected to both ends of the top of the second silicone layer (3).

2. The fast-conducting thermal pad for electronic appliances according to claim 1, characterized in that: The first metal wire (6) and the second metal wire (7) are fixedly connected to each other, and the first metal wire (6) and the second metal wire (7) are connected to each other to form multiple triangular structure designs.

3. The fast-conducting silicone pad for electronic appliances according to claim 1, characterized in that: The connecting strip (8) has a sloping structure design. The bottom of the first silicone layer (2) has two sets of connecting grooves (9). The internal structure size of the connecting groove (9) is designed to correspond to the external structure size of the connecting strip (8). The first silicone layer (2) is connected to the connecting strip (8) through the connecting groove (9).

4. The fast-conducting thermal pad for electronic appliances according to claim 1, characterized in that: The second silicone layer (3) has multiple sets of first heat dissipation holes (10) inside, and the first silicone layer (2) has multiple sets of second heat dissipation holes (11) inside. The first heat dissipation holes (10) and the second heat dissipation holes (11) are interconnected.

5. The fast-conducting silicone pad for electronic appliances according to claim 4, characterized in that: The interior of the second heat dissipation hole (11) is designed with a conical structure, and a heat sink (12) is fixedly connected inside the second silicone layer (3) and at the bottom of multiple sets of first heat dissipation holes (10).

6. The fast-conducting silicone pad for electronic appliances according to claim 1, characterized in that: The connecting sleeve (5) has multiple sets of tensile strips (13) fixedly connected inside, and the multiple sets of tensile strips (13) are designed in a triangular structure inside the connecting sleeve (5).

7. The fast-conducting silicone pad for electronic appliances according to claim 6, characterized in that: The tensile strip (13) has a reinforcing wire embedded inside, and the reinforcing wire is a metal reinforcing wire.

Images