Heat dissipation module and photovoltaic inverter

Abstract

The utility model belongs to photovoltaic inverter technical field discloses a kind of heat dissipation module and photovoltaic inverter.The heat dissipation module includes fixed unit, airflow acceleration unit and airflow guide unit, and the fixed seat of fixed unit is provided with through hole;Airflow acceleration unit's air inlet side is towards through hole;Airflow guide unit includes flow guide cover and air outlet nozzle, flow guide cover is set on fixed seat, airflow acceleration unit is located in flow guide cover inside, flow guide cover is provided with several air outlet nozzles, and the air outlet side of each air outlet nozzle is located the same side of flow guide cover.The utility model can accelerate the airflow flow in photovoltaic inverter, and the temperature of PCBA circuit board can be effectively reduced.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic inverter technology, and in particular to heat dissipation modules and photovoltaic inverters. Background Technology

[0002] Photovoltaic power generation, as a highly representative and promising technology among many ways to utilize solar energy resources, has been deeply integrated into and significantly improved people's lives. From independent power supply systems in remote mountainous areas to distributed energy solutions for large commercial buildings in cities, photovoltaic power generation has been vigorously promoted and popularized globally due to its many advantages such as being clean, renewable, and sustainable. It provides people with stable and environmentally friendly power support and has become an important force in promoting energy transformation and green development.

[0003] Currently, with continuous technological advancements and increasingly stringent requirements for performance indicators such as power generation efficiency and power output, most photovoltaic inverter models are showing a trend of gradual increase in power and size. While this change improves inverter performance, it also presents significant challenges to internal heat dissipation.

[0004] In the internal structure of a photovoltaic (PV) inverter, the PCBA (Printed Circuit Board Assembly) is a crucial component for high-power devices, housing numerous high-power components. During normal operation, these components generate significant heat due to current flow and resistive losses. This heat generation is particularly rapid and substantial under high-power operation. However, current PV inverter internal designs suffer from significant deficiencies in airflow, resulting in slow airflow and an inability to create effective heat dissipation circulation. This leads to heat accumulation around the PCBA, causing a sharp rise in localized temperatures far exceeding the normal heat dissipation temperature range that the PCBA and its components can withstand. Prolonged exposure to such high temperatures gradually degrades the performance of components on the PCBA, drastically shortening their lifespan. Furthermore, high temperatures can cause a series of problems, including reduced insulation performance of the circuit board and loosening of solder joints on electronic components, leading to a significant increase in the PV inverter's failure rate. Frequent failures not only affect the normal operation of the PV power generation system, reducing power generation efficiency and increasing maintenance costs, but may also threaten the stability of the entire power system. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation module and a photovoltaic inverter that can accelerate the airflow inside the photovoltaic inverter and effectively reduce the temperature of the PCBA circuit board.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] The heat dissipation module includes:

[0008] A fixing unit includes a fixing base, on which a vent hole is provided through;

[0009] An airflow acceleration unit, wherein the air inlet side of the airflow acceleration unit faces the vent.

[0010] An airflow guiding unit includes a hood and an air outlet. The hood is mounted on the fixed base, and the airflow acceleration unit is located inside the hood. The hood has several air outlets, and the air outlet side of each air outlet is located on the same side of the hood.

[0011] As an optional solution for the heat dissipation module, a plurality of the air outlets are spaced apart on the shroud along a first direction, and each air outlet extends along a second direction.

[0012] As an optional solution for the heat dissipation module, the end of the heat sink near the fixed base is provided with a first flange in the circumferential direction, and the first flange is attached and connected to the fixed base.

[0013] As an optional solution for the heat dissipation module, the first flange is provided with a plurality of first connecting holes, and the fixing base is provided with a plurality of second connecting holes. The first fastener passes through the first connecting holes and connects with the second connecting holes.

[0014] As an optional solution for the heat dissipation module, the airflow guiding unit also includes several reinforcing ribs, which are disposed between the outer wall of the airflow shroud and the first flange.

[0015] As an optional solution for the heat dissipation module, the air intake shroud has an air inlet and an air outlet. The air intake shroud is provided with a flow guiding channel. Both the air inlet and the air outlet are connected to the flow guiding channel. The flow guiding channel is curved in an arc shape. The air inlet faces the fixed base and is connected to the vent hole. The air outlet faces the air outlet nozzle and is connected to the air outlet nozzle.

[0016] As an optional solution for the heat dissipation module, a buffer slot is provided on the side of the mounting base away from the airflow acceleration unit, and the vent hole penetrates the bottom of the buffer slot.

[0017] As an optional solution for the heat dissipation module, a second flange is provided at the opening of the buffer slot, which is used to attach and connect to an external fixed object.

[0018] As an optional solution for the heat dissipation module, the airflow acceleration unit includes a mounting frame and a fan. The fan is rotatably mounted inside the mounting frame. The mounting frame is provided with a plurality of third connection holes, and the fixing base is provided with a plurality of fourth connection holes. A second fastener passes through the third connection holes and connects to the fourth connection holes.

[0019] A photovoltaic inverter includes a protective housing, a PCBA circuit board, and a heat dissipation module as described in any of the preceding claims, wherein the PCBA circuit board and the heat dissipation module are both disposed within the protective housing, and the air outlet of the heat dissipation module faces the PCBA circuit board.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0021] The heat dissipation module provided by this utility model assembles the mounting frame of the airflow acceleration unit onto the mounting base of the fixing unit. The air inlet side of the fan inside the mounting frame faces the vent on the fixing base. The airflow guide shroud of the airflow guiding unit is installed on the fixing base, and the airflow acceleration unit is located inside the airflow guide shroud. After the heat dissipation module is assembled inside the inverter, several air outlets on the airflow guide shroud face the PCBA circuit board inside the inverter. The fan of the airflow acceleration unit draws air from inside the inverter into the heat dissipation module, and the air entering the heat dissipation module is then precisely blown onto the high-power devices that need to be cooled through the several air outlets. The heat dissipation module can improve the airflow circulation inside the inverter and simultaneously dissipate heat from the high-power devices.

[0022] The photovoltaic inverter provided by this utility model has both the PCBA circuit board and the heat dissipation module housed inside a protective shell. The air outlet of the heat dissipation module faces the PCBA circuit board. The heat dissipation module can accelerate the airflow inside the photovoltaic inverter and effectively reduce the temperature of the PCBA circuit board. Attached Figure Description

[0023] Figure 1 This is a first-view structural schematic diagram of the heat dissipation module in an embodiment of this utility model;

[0024] Figure 2 This is a structural schematic diagram of the heat dissipation module from a second perspective in an embodiment of this utility model;

[0025] Figure 3 This is an assembly diagram of the airflow acceleration unit and the fixing unit in an embodiment of this utility model;

[0026] Figure 4 This is a schematic diagram of the structure of the photovoltaic inverter in this embodiment of the present invention.

[0027] In the picture:

[0028] 100. Heat dissipation module; 200. PCBA circuit board; 300. Protective case;

[0029] 1. Fixed unit; 2. Airflow acceleration unit; 3. Airflow guiding unit;

[0030] 11. Fixing base; 111. Vent hole; 112. Second connecting hole; 113. Fourth connecting hole; 114. Buffer slot; 12. Second flange;

[0031] 21. Mounting rack; 211. Third connection hole; 22. Fan;

[0032] 31. Drainage cover; 32. Air outlet; 33. First flange; 331. First connecting hole; 34. Reinforcing rib. Detailed Implementation

[0033] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0034] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0037] In the internal structure of a photovoltaic inverter, the PCBA (Printed Circuit Board Assembly) is a crucial component for high-power devices, housing numerous high-power components. During normal operation, these components generate significant heat due to current flow and resistive losses. This heat generation is particularly rapid and substantial under high-power operation. However, current photovoltaic inverter designs suffer from significant deficiencies in airflow, resulting in slow airflow and an inability to achieve effective heat dissipation circulation. This leads to heat accumulation around the PCBA, causing a sharp rise in localized temperatures far exceeding the normal heat dissipation temperature range that the PCBA and its components can withstand. Prolonged exposure to such high temperatures gradually degrades the performance of the components on the PCBA, drastically shortening their lifespan.

[0038] To accelerate airflow within the photovoltaic inverter and effectively reduce the temperature of the PCBA circuit board, this embodiment provides a heat dissipation module and a photovoltaic inverter, which are described below in conjunction with... Figures 1 to 4 The specific content of this embodiment will be described in detail. It should be noted that the first direction mentioned in this embodiment is... Figure 1 The X direction, the second direction mentioned in this embodiment, and the height direction are... Figure 1 The Z direction in the equation.

[0039] like Figures 1 to 3 As shown, the heat dissipation module 100 in this embodiment includes a fixing unit 1, an airflow acceleration unit 2, and an airflow guiding unit 3. The fixing unit 1 includes a fixing base 11, on which a vent 111 is provided. The airflow acceleration unit 2 includes a mounting frame 21 and a fan 22. The fan 22 is rotatably mounted within the mounting frame 21, which is mounted on the fixing base 11. The air inlet side of the fan 22 faces the vent 111. The airflow guiding unit 3 includes a shroud 31 and an air outlet 32. The shroud 31 is fastened to the fixing base 11, and the airflow acceleration unit 2 is located inside the shroud 31. The shroud 31 is provided with several air outlets 32, with the air outlet side of each air outlet 32 ​​located on the same side of the shroud 31.

[0040] The heat dissipation module 100 mainly consists of three parts: a fixing unit 1, an airflow acceleration unit 2, and an airflow guiding unit 3. These units cooperate to complete the efficient heat dissipation task. The fixing unit 1, as the basic support structure of the entire heat dissipation module 100, plays a crucial role. The fixing unit 1 includes a fixing base 11, which possesses sufficient strength and stability to ensure stable support for other components in the complex working environment inside the inverter. The vent 111, which runs through the fixing base 11, is a key channel for airflow circulation in the entire heat dissipation module 100. The vent 111 allows for maximum airflow while maintaining structural strength, providing a good foundation for subsequent airflow acceleration and guidance. The airflow acceleration unit 2 is the core power source of the heat dissipation module 100. The airflow acceleration unit 2 consists of a mounting frame 21 and a fan 22. The mounting frame 21 not only provides a stable mounting position for the fan 22 but also provides a certain degree of protection, preventing the fan 22 from being interfered with or damaged by external objects during operation. As a key component for airflow acceleration, fan 22 is rotatably mounted within mounting frame 21. Mounting frame 21 is precisely positioned on base 11, ensuring the air intake side of fan 22 faces the vent 111 on base 11. When fan 22 starts, it uses powerful suction to rapidly draw air from inside the inverter into the cooling module 100. This efficient air intake provides ample power for subsequent airflow guidance and heat dissipation. Simultaneously, the fan speed and airflow can be flexibly adjusted according to the actual operating conditions and cooling requirements of the inverter to achieve optimal heat dissipation. The airflow guiding unit 3 is crucial for the precise heat dissipation of the cooling module 100. Airflow guiding unit 3 includes a shroud 31 and an exhaust nozzle 32. The shroud 31 is fastened to base 11, completely enclosing the airflow acceleration unit 2, forming a relatively independent airflow channel. This design not only effectively guides the airflow direction but also reduces airflow leakage and turbulence, improving heat dissipation efficiency. The air shroud 31 is equipped with several air outlets 32, all located on the same side of the shroud 31. After being accelerated by the airflow acceleration unit 2, the airflow flows along the airflow channels inside the shroud 31 and is ultimately directed precisely through the air outlets 32 to the high-power devices requiring cooling. This precise airflow guidance ensures that the high-power devices receive adequate cooling, preventing performance degradation or damage caused by localized overheating.

[0041] In the actual assembly process, the mounting frame 21 of the airflow acceleration unit 2 is first assembled onto the mounting base 11 of the fixing unit 1. During assembly, it is necessary to ensure that the air inlet side of the fan 22 inside the mounting frame faces the vent 111 on the mounting base 11 to ensure smooth airflow. Next, the airflow guide shroud 31 of the airflow guide unit 3 is installed on the mounting base 11, and the airflow acceleration unit 2 is located inside the airflow guide shroud 31. The entire assembly process is simple and quick, effectively improving production efficiency. After the heat dissipation module 100 is assembled into the inverter, several air outlets 32 on the airflow guide shroud 31 face the PCBA circuit board 200 inside the inverter. During inverter operation, the high-power devices generate a large amount of heat, causing the internal temperature of the inverter to rise. At this time, the fan 22 of the airflow acceleration unit 2 starts to work, drawing air from inside the inverter into the heat dissipation module 100. The air entering the heat dissipation module 100 is precisely blown onto the high-power devices to be cooled through several air outlets 32 under the action of the airflow guide unit 3. This heat dissipation method has significant technical benefits.

[0042] First, the heat dissipation module 100 significantly improves airflow circulation within the inverter. Traditional inverter heat dissipation methods often suffer from uneven airflow distribution and localized airflow obstruction, resulting in poor heat dissipation. However, the heat dissipation module 100 in this embodiment, through its rational design and layout, allows air to circulate orderly within the inverter, effectively improving heat dissipation efficiency. Simultaneously, precise airflow guidance prevents unnecessary interference with other components that do not require cooling, further enhancing the targeted and effective nature of heat dissipation. Second, the heat dissipation module 100 provides precise cooling for high-power devices. High-power devices are the most heat-generating components in the inverter; if they are not effectively cooled in a timely manner, it will severely impact the inverter's performance and lifespan. In this embodiment, the heat dissipation module 100, through the air outlet 32 ​​of the airflow guiding unit 3, precisely directs cooling airflow towards the high-power devices, quickly removing the heat generated by them and reducing their operating temperature. This precise heat dissipation method not only ensures the normal operation of high-power devices but also extends their lifespan and improves the overall reliability of the inverter. Furthermore, the heat dissipation module 100 also boasts advantages such as compact structure and convenient installation. Its compact design enables the heat dissipation module 100 to achieve efficient heat dissipation within the limited space inside the inverter, without occupying excessive space. At the same time, its simple installation method allows the heat dissipation module 100 to be easily integrated into the inverter, reducing production costs and maintenance complexity.

[0043] For example, a plurality of air outlets 32 are spaced apart along a first direction on the shroud 31, and each air outlet 32 ​​extends along a second direction. In practical applications, the high-power devices inside the inverter typically have a certain area and distribution range. Arranging multiple air outlets 32 at equal intervals along the first direction ensures that the air inside the shroud 31 is blown towards the high-power devices in a uniform manner. The equal interval arrangement makes the heat dissipation area handled by each air outlet 32 ​​relatively balanced, avoiding situations where the local airflow is too strong or too weak. When the airflow flows out uniformly from each air outlet 32, a stable and uniform airflow field is formed on the surface of the high-power devices. This uniform airflow helps to quickly remove the heat generated by the high-power devices, enabling the high-power devices to achieve uniform heat dissipation as a whole. If the heat dissipation is uneven, the temperature in some areas may be too high, which may lead to a decrease in device performance, a shortened lifespan, or even failure. The air outlet 32 ​​layout of this embodiment effectively avoids this problem, ensuring that the high-power devices operate in a stable temperature environment and improving their reliability and stability. From the shape of the air outlets 32, each air outlet 32 ​​extends along the second direction (i.e., the height direction). This design gives the air outlets 32 a flat shape, which has unique technical advantages. In actual heat dissipation processes, high-power devices often have structural features along the height direction, such as multi-layer circuit boards and heat sinks. The air outlets 32 extending along the height direction allow the airflow flowing from each air outlet 32 ​​to fully cover the structure of the high-power device along the height direction. The flat shape of the air outlets 32 can increase the contact area between the airflow and the high-power device, allowing the airflow to exchange heat with the device surface more effectively. When the airflow flows along the height direction of the high-power device, it can penetrate into every corner of the device and carry away the heat generated in various parts.

[0044] Furthermore, the number of air outlets 32 in this embodiment can be determined according to actual usage, which provides greater flexibility for the design and application of the heat dissipation module 100. Different inverters differ in power, size, and operating environment, and their heat dissipation requirements also vary. Determining the number of air outlets 32 based on actual usage allows for optimization of the structure and cost of the heat dissipation module 100 while meeting heat dissipation requirements. For example, for inverters with lower power and lower heat generation, the number of air outlets 32 can be appropriately reduced to decrease the complexity and cost of the heat dissipation module 100; while for inverters with higher power and higher heat generation, the number of air outlets 32 can be increased to improve heat dissipation efficiency.

[0045] Furthermore, a first flange 33 is circumferentially provided at one end of the shroud 31 near the fixed base 11, and the first flange 33 is attached and connected to the fixed base 11. By adding the first flange 33, the contact area between the shroud 31 and the fixed base 11 is greatly increased. If the shroud 31 and the fixed base 11 are connected only through local point contact or small area surface contact, this connection method is prone to stress concentration when subjected to external forces, causing the connection part to bear excessive pressure, thereby increasing the risk of connection failure. The setting of the first flange 33 creates a larger contact area between the shroud 31 and the fixed base 11. When the heat dissipation module 100 is working inside the inverter, it may be subjected to external forces such as vibration and impact from various directions. Due to the increase in contact area, these external forces can be more evenly distributed across the entire connection surface, avoiding excessive local stress, thereby improving the stability and reliability of the connection. Uniform force distribution not only helps to ensure the firmness of the connection, but also reduces structural deformation caused by stress concentration. During long-term operation of the heat dissipation module 100, deformation of the connection parts may affect the sealing between the drain cover 31 and the fixing base 11, leading to airflow leakage and reduced heat dissipation efficiency. The first flange 33 effectively prevents such deformation by evenly distributing the force, ensuring the stability of the heat dissipation module 100 structure and providing a basic guarantee for the normal functioning of heat dissipation.

[0046] During the assembly of the heat dissipation module 100, the installation accuracy directly affects the relative positions of the components and the smoothness of the airflow channels. If the contact surface between the heat dissipation shroud 31 and the mounting base 11 is uneven or has gaps, it may cause the heat dissipation shroud 31 to be installed crookedly, thereby affecting the airflow direction and airflow distribution of the air outlet 32. The face-to-face contact between the first flange 33 and the mounting base 11 allows the heat dissipation shroud 31 to be positioned more accurately during installation. During the assembly process, the operator can easily determine whether the heat dissipation shroud 31 is installed correctly by observing the fit between the first flange 33 and the mounting base 11. This face-to-face contact method can effectively reduce installation errors and ensure the relative positional accuracy between the heat dissipation shroud 31 and the mounting base 11. When the heat dissipation shroud 31 is accurately installed, the airflow generated by the airflow acceleration unit 2 can smoothly pass through the heat dissipation shroud 31 as designed and be precisely blown towards the high-power devices through the air outlet 32, thereby improving the targeting and effectiveness of heat dissipation.

[0047] Furthermore, the first flange 33 is provided with a plurality of first connecting holes 331, and the fixing base 11 is provided with a plurality of second connecting holes 112. The first fastener passes through the first connecting holes 331 and connects with the second connecting holes 112. The addition of the first connecting holes 331 and the second connecting holes 112 provides reliable connection points between the drain cover 31 and the fixing base 11. During the operation of the heat dissipation module 100, it will be subjected to various complex forces from inside the inverter, such as the vibration generated by the operation of the fan 22, the mechanical vibration of the inverter as a whole during operation, and the thermal stress caused by possible temperature changes. If there are not enough connection points, the drain cover 31 and the fixing base 11 may become loose, displaced, or even fall off, which will seriously affect the airflow guidance and heat dissipation effect of the heat dissipation module 100. The cooperation of multiple first connecting holes 331 and second connecting holes 112 forms a multi-point fixed connection between the drain cover 31 and the fixing base 11. This multi-point fixation can effectively disperse the various forces mentioned above, and evenly transmit the force to each connection point, thereby greatly improving the stability of the connection. Even in harsh working environments, the drain cover 31 maintains a tight connection with the mounting base 11, ensuring the normal operation of the heat dissipation module 100. The number of drain covers 31 needs to be determined by comprehensively considering factors such as its size, weight, and the forces it withstands. Too many connecting holes may increase manufacturing costs and assembly difficulty, while too few connecting holes may not meet the requirements for a stable connection. A reasonable distribution ensures that the connection points are evenly distributed on the contact surface between the drain cover 31 and the mounting base 11, further improving the stability and reliability of the connection. For example, multiple first connecting holes 331 are evenly distributed on the first flange 33, allowing the drain cover 31 to be effectively fixed in all directions, avoiding connection failure due to excessive localized stress.

[0048] For example, the first fastener can be, but is not limited to, bolts, screws, etc. Different types of fasteners have different characteristics and applicable scenarios. Furthermore, when maintenance or component replacement is required for the heat dissipation module 100, the cooling shroud 31 can be easily removed from the mounting base 11 simply by loosening the first fastener. After maintenance, the cooling shroud 31 can be reinstalled onto the mounting base 11 and tightened using the first fastener. This convenient disassembly and installation method significantly shortens maintenance time, reduces maintenance costs, and improves the maintainability of the heat dissipation module 100.

[0049] Furthermore, the airflow guiding unit 3 also includes several reinforcing ribs 34, which are disposed between the outer wall of the flow guide shroud 31 and the first flange 33. By adding reinforcing ribs 34, the overall structural strength of the flow guide shroud 31 can be improved.

[0050] During the operation of the heat dissipation module 100, the cooling shroud 31 is subjected to various forces. On the one hand, the powerful airflow generated by the airflow acceleration unit 2 exerts pressure on the inner wall of the cooling shroud 31, especially under high-power operation, where the airflow speed increases and the pressure rises, requiring the cooling shroud 31 to withstand greater internal pressure. On the other hand, the heat dissipation module 100 may be subjected to external mechanical forces such as vibration and impact inside the inverter, which are transmitted to the cooling shroud 31 through the mounting base 11. Without the support of the reinforcing ribs 34, the cooling shroud 31 is easily deformed under these forces, such as bending or twisting. If the cooling shroud 31 deforms, its internal airflow channels will change, resulting in uneven airflow distribution. The originally designed airflow direction and airflow speed may be disrupted, making it impossible for the cooling airflow to accurately reach the high-power devices. The reinforcing ribs 34 act like sturdy "skeletons," evenly distributed between the outer wall of the cooling shroud 31 and the first flange 33, connecting the various parts of the cooling shroud 31 into an organic whole. When subjected to external forces, the reinforcing ribs 34 can effectively disperse and bear these forces, transferring the force to other parts of the drainage hood 31, avoiding local stress concentration, and thus greatly improving the drainage hood 31's ability to resist deformation.

[0051] Optionally, the reinforcing ribs 34 can be in the form of trapezoids, triangles, or other shapes with good mechanical properties, which can provide greater support in a smaller space. The number of reinforcing ribs 34 can be determined according to the actual application and is not subject to much restriction here.

[0052] Furthermore, the flow guide hood 31 has an air inlet and an air outlet, and a flow guide channel is provided inside the flow guide hood 31. Both the air inlet and the air outlet are connected to the flow guide channel. The flow guide channel inside the flow guide hood 31 is curved in an arc shape. The air inlet faces the fixed base 11 and is connected to the vent 111, and the air outlet faces the air outlet 32 ​​and is connected to the air outlet 32. From the perspective of changing the airflow direction, the arc-shaped flow guide channel can guide the airflow in a gentle and efficient way. In a straight flow guide channel, when the airflow encounters a path bend, it will generate severe turbulence, noise, and energy loss due to the sudden change in direction. However, the arc-shaped flow guide channel is different; it provides a smooth transition area for the airflow. When the airflow enters the flow guide hood 31, it flows along the arc-shaped flow guide channel and can change direction relatively smoothly. This smooth change of direction reduces the severe collision and friction between the airflow and the wall of the flow guide channel, allowing the airflow to flow more orderly. For example, in some inverters with high heat dissipation requirements, cooling airflow needs to enter the shroud 31 from a specific direction and then be precisely directed towards high-power devices. The arc-shaped guide channel can precisely guide the airflow to change direction according to actual needs, ensuring that the airflow accurately reaches the target area and improving the accuracy of airflow guidance. During airflow, any form of obstruction will lead to increased airflow pressure and reduced flow velocity, thus affecting the heat dissipation effect. The curved shape of the arc-shaped guide channel can better conform to the natural flow trend of the airflow, reducing the vertical collision between the airflow and the wall. As the airflow flows along the arc path, the obstruction effect of the wall on the airflow is dispersed and weakened, allowing the airflow to pass through the shroud 31 more smoothly. In a heat dissipation system, the airflow velocity directly affects its ability to remove heat. Higher flow velocities allow for more thorough heat exchange between the airflow and the surface of high-power devices, quickly removing heat. If the airflow velocity decreases, the heat exchange efficiency will decrease significantly, resulting in poor heat dissipation of high-power devices, increased temperature, and consequently affecting their performance and lifespan. The arc-shaped guide channel maintains the airflow velocity during the flow process by reducing obstruction. When the cooling airflow passes through the shroud 31 at a high velocity and blows towards the high-power device, it can quickly remove the heat generated by the device, keeping the device operating within a lower temperature range.

[0053] Furthermore, a buffer slot 114 is provided on the side of the mounting base 11 away from the airflow acceleration unit 2, and the vent 111 penetrates the bottom of the buffer slot 114. By adding the buffer slot 114, a portion of the airflow can be temporarily stored, and the presence of the buffer slot 114 plays a positive role in the stability of the airflow. The airflow generated by the airflow acceleration unit 2 may be affected by various factors during its flow, such as the resistance of the pipe and the fluctuations of the airflow acceleration unit 2 itself, resulting in unstable airflow speed and pressure. The buffer slot 114 can act as a buffer. When the airflow speed is too fast or the pressure is too high, some airflow will enter the buffer slot 114 for buffering, reducing the impact force of the airflow; while when the airflow speed is too slow or the pressure is too low, the airflow in the buffer slot 114 can be replenished in time to maintain stable airflow. This stable airflow is crucial for the heat dissipation of high-power devices, because stable airflow can ensure the uniformity and effectiveness of heat exchange, avoiding problems such as local overheating or insufficient heat dissipation of devices due to airflow fluctuations.

[0054] Furthermore, the buffer slot 114 helps improve heat dissipation. Without the buffer slot 114, airflow would flow directly from the airflow acceleration unit 2 to the high-power device, potentially resulting in uneven airflow distribution on the device surface. Some areas might dissipate heat too quickly due to excessively concentrated airflow, while other areas might dissipate heat slowly due to insufficient airflow. The buffer slot 114 allows the airflow to undergo a buffering and redistribution process before entering the high-power device area. When the airflow exits from the buffer slot 114 through the vent 111, a relatively uniform airflow distribution is formed around the bottom of the slot before flowing to the high-power device. In this way, the airflow can cover the device surface more evenly, improving the uniformity of heat dissipation, ensuring effective heat dissipation for all parts of the device, and extending the device's lifespan.

[0055] Furthermore, a second flange 12 is provided at the opening of the buffer slot 114. The second flange 12 is used to attach and connect to an external fixed object. By adding the second flange 12, the contact area between the fixing seat 11 and the fixed object can be increased. In this embodiment, the second flange 12 has a similar effect to the first flange 33, and no further limitations are imposed here.

[0056] Furthermore, the mounting frame 21 is provided with several third connecting holes 211, and the fixing base 11 is provided with several fourth connecting holes 113. The second fastener passes through the third connecting holes 211 and connects with the fourth connecting holes 113. By adding the third connecting holes 211 and the fourth connecting holes 113, the installation stability of the mounting frame 21 and the fixing base 11 is ensured.

[0057] like Figure 1 Combination Figure 4As shown, this embodiment also provides a photovoltaic inverter, which includes a protective housing 300, a PCBA circuit board 200, and the aforementioned heat dissipation module 100. Both the PCBA circuit board 200 and the heat dissipation module 100 are housed within the protective housing 300, with the air outlet 32 ​​of the heat dissipation module 100 facing the PCBA circuit board 200. The heat dissipation module 100 can accelerate airflow within the photovoltaic inverter, effectively reducing the temperature of the PCBA circuit board 200.

[0058] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A heat dissipation module, characterized in that, include: The fixing unit (1) includes a fixing base (11), and a vent hole (111) is provided through the fixing base (11); Airflow acceleration unit (2), the air inlet side of the airflow acceleration unit (2) faces the vent (111); The airflow guiding unit (3) includes a flow guide hood (31) and an air outlet (32). The flow guide hood (31) is mounted on the fixed base (11). The airflow acceleration unit (2) is located inside the flow guide hood (31). The flow guide hood (31) is provided with a plurality of air outlets (32), and the air outlet side of each air outlet (32) is located on the same side of the flow guide hood (31).

2. The heat dissipation module (100) according to claim 1, characterized in that, A plurality of the air outlets (32) are spaced apart on the shroud (31) along a first direction, and each of the air outlets (32) extends along a second direction.

3. The heat dissipation module (100) according to claim 1, characterized in that, The drainage cover (31) has a first flange (33) circumferentially provided at one end near the fixed base (11), and the first flange (33) is attached to and connected to the fixed base (11).

4. The heat dissipation module (100) according to claim 3, characterized in that, The first flange (33) is provided with a plurality of first connecting holes (331), and the fixing base (11) is provided with a plurality of second connecting holes (112). The first fastener passes through the first connecting hole (331) and connects with the second connecting hole (112).

5. The heat dissipation module (100) according to claim 3, characterized in that, The airflow guiding unit (3) also includes several reinforcing ribs (34), which are disposed between the outer wall of the flow guide hood (31) and the first flange (33).

6. The heat dissipation module (100) according to claim 1, characterized in that, The air intake hood (31) has an air inlet and an air outlet. The air intake hood (31) is provided with a flow guiding channel. The air inlet and the air outlet are both connected to the flow guiding channel. The flow guiding channel is curved in an arc. The air inlet faces the fixed base (11) and is connected to the vent (111). The air outlet faces the air outlet (32) and is connected to the air outlet (32).

7. The heat dissipation module (100) according to claim 1, characterized in that, A buffer slot (114) is provided on the side of the fixed base (11) away from the airflow acceleration unit (2), and the vent (111) penetrates the bottom of the buffer slot (114).

8. The heat dissipation module (100) according to claim 7, characterized in that, The cache slot (114) is provided with a second flange (12) at the slot opening, and the second flange (12) is used to attach and connect to external fixed objects.

9. The heat dissipation module (100) according to any one of claims 1-8, characterized in that, The airflow acceleration unit (2) includes a mounting frame (21) and a fan (22). The fan (22) is rotatably mounted inside the mounting frame (21). The mounting frame (21) is provided with a plurality of third connection holes (211). The fixing base (11) is provided with a plurality of fourth connection holes (113). The second fastener passes through the third connection hole (211) and connects to the fourth connection hole (113).

10. A photovoltaic inverter, characterized in that, The device includes a protective shell (300), a PCBA circuit board (200), and a heat dissipation module (100) as described in any one of claims 1-9. The PCBA circuit board (200) and the heat dissipation module (100) are both disposed inside the protective shell (300), and the air outlet (32) of the heat dissipation module (100) faces the PCBA circuit board (200).

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