A flexible electronic dedicated plasma treater

Abstract

The utility model provides a kind of flexible electronic special plasma processing machine, it includes heat dissipation mechanism, it includes: fixed shell, the heat plate of being arranged in the fixed shell inside, the cold guide plate of being arranged in the heat plate top, the refrigeration wafer of being arranged in the cold guide plate top, the heat dissipation plate of being arranged in the refrigeration wafer top, the heat dissipation column of being arranged in the heat dissipation plate top, the heat dissipation fan of being arranged in the heat dissipation plate top, the shielding cover of being arranged in the fixed shell top outer wall, slot is arranged in the shielding cover around;The utility model is cooperated by heat plate, cold guide plate, refrigeration wafer, heat dissipation plate, heat dissipation column and heat dissipation fan, constructs composite heat dissipation path, realizes heat uniform conduction, active refrigeration intervention, large-area heat exchange and forced convection heat dissipation, with high efficient heat dissipation efficiency and accurate temperature control ability, and adopt compact integrated structure design, improve space utilization and equipment maintenance convenience.

Description

Technical Field

[0001] This utility model relates to the field of flexible electronics technology, and in particular to a plasma processing machine specifically for flexible electronics. Background Technology

[0002] Plasma treatment machines specifically designed for flexible electronics have emerged alongside the development of flexible electronics technology. Due to their lightweight, thin, and flexible characteristics, flexible electronics are widely used in wearable devices, flexible displays, and other fields. Their manufacturing requires high-precision surface treatment to ensure material bonding and performance. The equipment generates active particles by ionizing gases such as argon and oxygen, achieving clean activation and modification of the flexible substrate surface.

[0003] Existing heat dissipation solutions for flexible electronic plasma processors mostly rely on a single passive heat dissipation method and lack active cooling capabilities.

[0004] To address this, a flexible electronic-specific plasma processing machine is proposed. Summary of the Invention

[0005] In view of this, the present invention aims to provide a flexible electronic plasma processing machine to solve or alleviate the technical problems existing in the prior art, or at least provide a beneficial alternative.

[0006] The technical solution of this utility model embodiment is implemented as follows: A flexible electronic plasma processing machine includes a main body and a heat dissipation mechanism disposed on one side of the top of the main body. The heat dissipation mechanism includes: a fixed shell, a heat spreader disposed inside the fixed shell, a cold conduction plate disposed on the top of the heat spreader, a cooling wafer disposed on the top of the cold conduction plate, a heat dissipation plate disposed on the top of the cooling wafer, a heat dissipation column disposed on the top of the heat dissipation plate, a heat dissipation fan disposed on the top of the heat dissipation plate, a shield disposed on the outer wall of the top of the fixed shell, and slots disposed around the shield.

[0007] In some embodiments, the fixed housing is provided with air inlets around its perimeter and an air outlet mesh is provided on the top of the fixed housing.

[0008] In some embodiments, the main body includes a processing box body disposed at the bottom of the fixed shell, and a panel disposed on one side of the processing box body.

[0009] In some embodiments, a knob is provided on one side of the panel, and a processing door is provided on one side of the panel.

[0010] In some embodiments, a mechanical pump is provided on one side of the main body of the processing tank, and a gas cylinder is provided at the bottom of the mechanical pump.

[0011] The present invention has the following advantages due to the adoption of the above technical solution:

[0012] A flexible electronic plasma processor constructs a composite heat dissipation path through the multi-level cooperation of a heat spreader, a cold conduction plate, a cooling wafer, a heat sink, heat dissipation columns, and a heat dissipation fan. This achieves uniform heat conduction, active cooling intervention, large-area heat exchange, and forced convection heat dissipation, providing high heat dissipation efficiency and precise temperature control. Furthermore, its compact integrated structural design improves space utilization and equipment maintenance convenience. At the same time, the selection of low power consumption and corrosion-resistant materials ensures long-term reliable operation.

[0013] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is an overall structural diagram of the present invention;

[0016] Figure 2 This is a structural diagram of the main mechanism of this utility model;

[0017] Figure 3 This is a structural diagram of the heat dissipation mechanism of this utility model.

[0018] Figure label:

[0019] 100. Main body; 101. Processing box body; 102. Panel; 103. Knob; 104. Processing door; 105. Gas cylinder; 106. Mechanical pump; 200. Heat dissipation mechanism; 201. Fixed shell; 202. Heat spreader; 203. Cold conduction plate; 204. Refrigeration chip; 205. Heat sink; 206. Heat dissipation column; 207. Heat dissipation fan; 208. Air inlet; 209. Air outlet; 210. Shield; 211. Slotting. Detailed Implementation

[0020] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0021] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0022] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Example 1

[0023] like Figure 1-3 As shown, a flexible electronic plasma processor includes a main body 100 and a heat dissipation mechanism 200 installed on one side of the top of the main body 100. The heat dissipation mechanism 200 includes: a fixed shell 201, a heat spreader 202 installed inside the fixed shell 201, a cold conduction plate 203 installed on top of the heat spreader 202, a cooling wafer 204 installed on top of the cold conduction plate 203, a heat sink 205 installed on top of the cooling wafer 204, a heat dissipation column 206 installed on top of the heat sink 205, a heat dissipation fan 207 installed on top of the heat sink 205, a shield 210 installed on the outer wall of the top of the fixed shell 201, and slots 211 formed around the shield 210. Through the multi-level cooperation of the heat spreader 202, the cold conduction plate 203, the cooling wafer 204, the heat sink 205, the heat dissipation column 206, and the heat dissipation fan 207, a composite heat dissipation path is constructed to achieve uniform heat conduction and active cooling intervention.

[0024] In this embodiment, the fixed shell 201 has air inlets 208 around its perimeter and an air outlet net 209 is installed on the top of the fixed shell 201.

[0025] In this embodiment, the main body 100 includes a processing box body 101 installed at the bottom of the fixed shell 201, and a panel 102 installed on one side of the processing box body 101. A knob 103 is rotatably connected to one side of the panel 102, and a processing door 104 is rotatably connected to one side of the panel 102 for convenient operation.

[0026] In this embodiment, a mechanical pump 106 is installed on one side of the processing box body 101, and a gas cylinder 105 is installed at the bottom of the mechanical pump 106.

[0027] In this embodiment, a composite heat dissipation path is constructed through the multi-level cooperation of heat dissipation plate 202, cold conduction plate 203, cooling chip 204, heat sink 205, heat dissipation column 206 and heat dissipation fan 207, so as to achieve uniform heat conduction, active cooling intervention, large-area heat exchange and forced convection heat dissipation, which has high heat dissipation efficiency and precise temperature control capability. Moreover, the compact integrated structure design improves space utilization and equipment maintenance convenience. At the same time, the low power consumption and corrosion-resistant materials ensure long-term reliable operation.

[0028] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A flexible electronic plasma processing machine, comprising a main body (100) and a heat dissipation mechanism (200) disposed on one side of the top of the main body (100), characterized in that: The heat dissipation mechanism (200) includes: a fixed shell (201), a heat spreader (202) disposed inside the fixed shell (201), a heat conduction plate (203) disposed on the top of the heat spreader (202), a cooling chip (204) disposed on the top of the heat conduction plate (203), a heat sink (205) disposed on the top of the cooling chip (204), a heat dissipation column (206) disposed on the top of the heat sink (205), a heat dissipation fan (207) disposed on the top of the heat sink (205), a shield (210) disposed on the outer wall of the top of the fixed shell (201), and slots (211) disposed around the shield (210).

2. The flexible electronic plasma processing machine according to claim 1, characterized in that: The fixed shell (201) is provided with air inlets (208) around its perimeter, and an air outlet net (209) is provided on the top of the fixed shell (201).

3. The flexible electronic plasma processing machine according to claim 2, characterized in that: The main body (100) includes a processing box body (101) disposed at the bottom of the fixed shell (201) and a panel (102) disposed on one side of the processing box body (101).

4. A flexible electronic plasma processing machine according to claim 3, characterized in that: A knob (103) is provided on one side of the panel (102), and a processing door (104) is provided on one side of the panel (102).

5. A flexible electronic plasma treatment machine according to claim 4, characterized in that: A mechanical pump (106) is provided on one side of the main body (101) of the processing box, and a gas cylinder (105) is provided at the bottom of the mechanical pump (106).

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