A substrate turnover device for semiconductor packaging

Abstract

The application relates to the technical field of semiconductor packaging, in particular to a substrate turnover device for semiconductor packaging. The device comprises: a first conveying unit configured to convey a first material box, the first material box containing first carriers stacked therein, each first carrier carrying a plurality of substrates, and the first material box being provided with a first loading / unloading opening for loading / unloading the first carriers; a second conveying unit configured to convey a second material box, the second material box containing second carriers stacked therein, and the first material box being provided with a second loading / unloading opening for loading / unloading the second carriers; a first loading / unloading unit configured to load / unload the first carriers; a second loading / unloading unit configured to load / unload the second carriers; and a substrate carrying unit configured to carry the substrates from the first carriers to the second carriers. The device can overcome the problems of low efficiency, high cost and quality control difficulty caused by the current manual turnover carrier mode, and further improve the overall production efficiency and product quality of semiconductor packaging.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and more specifically, to a substrate turnover device for semiconductor packaging. Background Technology

[0002] In semiconductor packaging, different process steps have different requirements for carriers. Therefore, carrier replacement is often necessary when transferring products from one process step to the next. For example, initially, the substrate (as raw material) may be placed in a tray, then transferred to a J-type carrier for the oven process. Before mounting capacitors and die chips, the substrate needs to be transferred from the J-type carrier to an M-type carrier to accommodate different process requirements. Similarly, after these operations, the product needs to be transferred back from the M-type carrier to the J-type carrier for the flux clean process. This multi-step carrier transfer requirement aims to meet the different requirements of various processes in semiconductor manufacturing, such as baking, film application, mounting, coating, washing, and curing.

[0003] However, traditional manual turnover methods have many problems. First, manual handling and turnover rely heavily on human resources, requiring a large number of workers to meet the needs of batch turnover. Furthermore, inconsistencies in manual operation and potential operational errors make it difficult to effectively control product quality, resulting in a high scrap rate. In addition, manual turnover is inefficient and has a long turnover cycle, which not only increases production costs but also extends the overall production cycle and reduces overall production efficiency. Utility Model Content

[0004] This application provides at least one semiconductor packaging substrate turnover device, which aims to optimize the turnover process of the carrier through automation, so as to overcome the inefficiency, high cost and quality control problems caused by the current manual turnover method, thereby improving the overall production efficiency and product quality of semiconductor packaging.

[0005] This application provides a semiconductor packaging substrate turnover device, the device comprising:

[0006] The first conveying unit is configured to convey a first material box, in which a first carrier is stacked, and each first carrier carries multiple substrates. The side of the first material box is provided with a first loading and unloading port for loading and unloading the first carrier.

[0007] The second conveying unit is configured to convey a second material box, in which a second carrier is stacked. The side of the first material box is provided with a second loading and unloading port for loading and unloading the second carrier.

[0008] The first loading and unloading unit is configured to load and unload the first vehicle;

[0009] The second loading and unloading unit is configured to load and unload the second vehicle;

[0010] A substrate transport unit is configured to transport the substrate from the first carrier to the second carrier.

[0011] In one optional embodiment, both the first conveying unit and the second conveying unit include a liftable conveying mechanism for conveying the corresponding material box. The liftable conveying mechanism is configured to have a controllable lifting height so that each carrier can be adapted to the loading and unloading height of the corresponding loading and unloading unit.

[0012] In one optional embodiment, both the first conveying unit and the second conveying unit include a loading conveyor belt and a unloading conveyor belt, which are arranged parallel to each other and in opposite directions. The loading conveyor belt is used to transport the corresponding material box from the loading end to the lifting conveyor mechanism, and the unloading conveyor belt is used to transport the corresponding material box from the lifting conveyor mechanism to the unloading end.

[0013] In one optional embodiment, both the first loading / unloading unit and the second loading / unloading unit include a moving mechanism and a gripping mechanism disposed on the moving mechanism. The gripping mechanism is configured to grip a corresponding carrier, and the moving mechanism is configured to drive the gripping mechanism to move in the horizontal direction to load and unload the corresponding carrier.

[0014] In one optional embodiment, the substrate handling unit includes a robotic arm and a first picking mechanism disposed at the end of the robotic arm. The first picking mechanism is configured to pick up and place the substrate, and the robotic arm is configured to move the first picking mechanism to transport the substrate.

[0015] In one alternative embodiment, the device further includes:

[0016] The substrate limiting unit is configured to limit the position of the second carrier carrying the substrate.

[0017] In one optional embodiment, the substrate limiting unit includes a first movable mechanism and a limiting plate disposed on the first movable mechanism. The limiting plate is provided with a plurality of limiting grooves, which are used to limit the position of the second carrier carrying the substrate when the limiting plate covers the second carrier. The first movable mechanism is configured to be able to move the limiting plate to cover or move away from the second carrier.

[0018] In one alternative embodiment, the device further includes:

[0019] A pressure plate placement unit is configured to place a pressure plate, which is used to engage with the bearing surface of the second carrier to form a clamping and fixing of the substrate;

[0020] The pressure plate transport unit is configured to transport the pressure plate to the bearing surface of the second carrier.

[0021] In one optional embodiment, the pressure plate transport unit includes a second movable mechanism and a second picking mechanism disposed on the second movable mechanism. The second picking mechanism is configured to pick up and place the pressure plate, and the second movable mechanism is configured to move the second picking mechanism to transport the pressure plate.

[0022] In one optional embodiment, the pressure plate placement unit includes a support platform and a lifting mechanism. The support platform is configured to stack the pressure plates and has a through hole extending through its height. The lifting mechanism is disposed in the through hole and is configured to lift the pressure plates so that each pressure plate can be adapted to the picking height of the pressure plate handling unit.

[0023] The above-mentioned technical solution of this application has the following beneficial technical effects:

[0024] The semiconductor packaging substrate turnover device of this application aims to optimize the turnover process of the carrier through automation, so as to overcome the inefficiency, high cost and quality control problems caused by the current manual turnover method, thereby improving the overall production efficiency and product quality of semiconductor packaging.

[0025] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 This paper shows a schematic diagram of the structure of a semiconductor packaging substrate turnover device provided in an embodiment of this application;

[0028] Figure 2 It shows Figure 1A schematic diagram of the provided semiconductor packaging substrate turnover device from another perspective;

[0029] In the diagram: 1. First carrier; 2. Second carrier; 3. Pressure plate; 10. First conveying unit; 11. First lifting conveyor mechanism; 12. First loading conveyor belt; 13. First unloading conveyor belt; 20. Second conveying unit; 21. Second lifting conveyor mechanism; 22. Second loading conveyor belt; 23. Second unloading conveyor belt; 30. First loading and unloading unit; 40. Second loading and unloading unit; 50. Substrate handling unit; 51. Robot arm; 52. First picking mechanism; 60. Substrate limiting unit; 61. First moving mechanism; 62. Limiting plate; 70. Pressure plate placement unit; 80. Pressure plate handling unit; 81. Second moving mechanism; 82. Second picking mechanism; 90. Base plate. Detailed Implementation

[0030] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0031] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0033] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0034] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] refer to Figure 1 and Figure 2 This application provides a semiconductor packaging substrate turnover device, comprising: a base plate 90 and a first conveying unit 10, a second conveying unit 20, a first loading / unloading unit 30, a second loading / unloading unit 40, and a substrate handling unit 50 disposed on the base plate 90. The first conveying unit 10 is configured to convey a first material box, in which first carriers 1 are stacked (along the height direction), each first carrier 1 carrying multiple substrates. A first loading / unloading port for loading and unloading the first carriers 1 is provided on the side of the first material box. The second conveying unit 20 is configured to convey a second material box, in which second carriers 2 are stacked (along the height direction). A second loading / unloading port for loading and unloading the second carriers 2 is provided on the side of the first material box. The first loading / unloading unit 30 is configured to load and unload the first carriers 1. The second loading / unloading unit 40 is configured to load and unload the second carriers 2. The substrate handling unit 50 is configured to handle the substrates from the first carriers 1 to the second carriers 2.

[0036] In practical use, the first conveying unit 10 conveys the first material box. When the first material box reaches the turnover position, the first loading and unloading unit 30 removes a first carrier 1 from the first material box and places it in the transport position. Then, the substrate transport unit 50 begins to transport the substrate on the first carrier 1. Simultaneously, the second conveying unit 20 conveys the second material box. When the second material box reaches the turnover position, the second loading and unloading unit 40 removes a second carrier 2 from the second material box and places it in the loading position, so that the substrate transport unit 50 can place the transported substrate onto the second carrier 2. After the above process is completed, the first loading and unloading unit 30 loads the first carrier 1 back into the first material box, and the second loading and unloading unit 40 loads the second carrier 2 back into the second material box.

[0037] The semiconductor packaging substrate turnover device of this application aims to optimize the turnover process of the carrier through automation, so as to overcome the inefficiency, high cost and quality control problems caused by the current manual turnover method, thereby improving the overall production efficiency and product quality of semiconductor packaging.

[0038] In some embodiments, the first conveying unit 10 includes a first liftable conveying mechanism 11, which is used to convey the first material box. The first liftable conveying mechanism 11 is configured to have a controllable lifting height, so that each first carrier 1 in the first material box can be adapted to the loading and unloading height of the corresponding loading and unloading unit. Specifically, after the first loading and unloading unit 30 completes the loading and unloading of each first carrier 1, the first liftable conveying mechanism 11 can be raised or lowered by a certain height, so that the next first carrier 1 reaches the loading and unloading height of the first loading and unloading unit 30. In a specific configuration, the first liftable conveying mechanism 11 may include a longitudinal track, a conveying device, and a power push rod. The longitudinal track is mounted on the base plate 90, the conveying device is slidably mounted on the longitudinal track, and the power push rod is mounted on the base plate 90 and connected to the conveying device. The power push rod can extend and retract when activated to drive the conveying device to move up and down. Of course, the construction of the first conveying unit 10 is not limited to the above-discussed method and can be selected according to the actual situation.

[0039] In some embodiments, the first conveying unit 10 further includes a first loading conveyor belt 12 and a first unloading conveyor belt 13. The first loading conveyor belt 12 and the first unloading conveyor belt 13 are arranged vertically parallel to each other and in opposite directions. The first loading conveyor belt 12 is used to transport the first material box from the loading end to the first lifting conveyor mechanism 11, and the first unloading conveyor belt 13 is used to transport the first material box from the first lifting conveyor mechanism 11 to the unloading end. Compared to using a single conveyor belt for loading and unloading, using two conveyor belts for loading and unloading the material box separately can accelerate the turnover efficiency of the material box, thereby improving the turnover efficiency of the substrate. In addition, since the two conveyor belts are arranged vertically parallel to each other, the system footprint can be reduced.

[0040] In some embodiments, the second conveying unit 20 includes a second liftable conveying mechanism 21 for conveying the second material box. The second liftable conveying mechanism 21 is configured to have a controllable lifting height, so that each second carrier 2 of the second material box can be adapted to the loading and unloading height of the second loading and unloading unit 40. Alternatively, after the second loading and unloading unit 40 completes the loading and unloading of each second carrier 2, the second liftable conveying mechanism 21 can be raised or lowered by a certain height, allowing the next second carrier 2 to reach the loading and unloading height of the second loading and unloading unit 40. In specific configurations, the second liftable conveying mechanism 21 can adopt the same structure as the first liftable conveying mechanism 11. That is, the second liftable conveying mechanism 21 can include a longitudinal track, a conveying device, and a power push rod. The longitudinal track is mounted on the base plate 90, the conveying device is slidably mounted on the longitudinal track, and the power push rod is mounted on the base plate 90 and connected to the conveying device. The power push rod can extend and retract when activated to drive the conveying device to move up and down. Of course, the structure of the second conveying unit 20 is not limited to the above-discussed configuration and can be selected according to actual conditions.

[0041] In some embodiments, the second conveying unit 20 further includes a second loading conveyor belt 22 and a second unloading conveyor belt 23. The second loading conveyor belt 22 and the second unloading conveyor belt 23 are arranged parallel to each other vertically and in opposite directions. The second loading conveyor belt 22 is used to transport the second material box from the loading end to the second lifting conveyor mechanism 21, and the second unloading conveyor belt 23 is used to transport the second material box from the second lifting conveyor mechanism 21 to the unloading end. Compared to using a single conveyor belt for loading and unloading, using two conveyor belts for loading and unloading the material box separately can facilitate faster turnover of the material box, thereby improving the turnover efficiency of the substrate. In addition, since the two conveyor belts are arranged parallel to each other vertically, the system footprint can be reduced.

[0042] In some embodiments, the first loading / unloading unit 30 includes a first moving mechanism and a first gripping mechanism disposed on the first moving mechanism. The first gripping mechanism is configured to grip the first carrier 1, and the moving mechanism is configured to drive the gripping mechanism to move horizontally to load and unload the first carrier 1. In use, the first moving mechanism first drives the first gripping mechanism to move horizontally to approach the first material box. After the first gripping mechanism grips the first carrier 1, the first moving mechanism drives the first gripping mechanism to reset, so that the first carrier 1 reaches the transport position, thereby enabling the substrate transport mechanism to transport the substrate on the first carrier 1. In specific configurations, the first moving mechanism may include a mounting frame and a linear module that drives the mounting frame to move horizontally. The first gripping mechanism may be a pneumatic gripper, a hydraulic gripper, or an electric gripper, etc. Of course, the construction of the first loading / unloading unit 30 is not limited to the methods discussed above and can be selected according to actual conditions.

[0043] In some embodiments, the second loading / unloading unit 40 includes a second moving mechanism and a second gripping mechanism disposed on the second moving mechanism. The second gripping mechanism is configured to grip the second carrier 2, and the second moving mechanism is configured to drive the second gripping mechanism to move horizontally to load and unload the second carrier 2. In use, the second moving mechanism first drives the second gripping mechanism to move horizontally to approach the second material box. After the second gripping mechanism grips the second carrier 2, the second moving mechanism drives the second gripping mechanism to reset, so that the second carrier 2 reaches the loading position, thereby enabling the substrate transport mechanism to place the transported substrate onto the second carrier 2. In specific configurations, the second loading / unloading unit 40 can adopt the same structure as the first loading / unloading unit 30. That is, the second moving mechanism can include a mounting frame and a linear module that drives the mounting frame to move horizontally, and the first gripping mechanism can be a pneumatic gripper, a hydraulic gripper, or an electric gripper, etc. Of course, the structure of the second loading / unloading unit 40 is not limited to the above-discussed methods and can be selected according to the actual situation.

[0044] In one optional embodiment, the substrate handling unit 50 includes a robotic arm 51 and a first picking mechanism 52 disposed at the end of the robotic arm 51. The first picking mechanism 52 is configured to pick up and place a substrate, and the robotic arm 51 is configured to move the first picking mechanism 52 to handle the substrate. During use, the robotic arm 51 can first move the first picking mechanism 52 above the handling position so that the first picking mechanism 52 can pick up the substrate from the first carrier 1. Then, the robotic arm 51 can move the first picking mechanism 52 above the loading position to place the picked-up substrate onto the second carrier 2. Specifically, the robotic arm 51 can be a three-axis robotic arm 51, a four-axis robotic arm 51, a five-axis robotic arm 51, or a six-axis robotic arm 51, etc., and the first picking mechanism 52 can use a suction cup to pick up the substrate. Of course, the construction of the substrate handling unit 50 is not limited to the methods discussed above and can be selected according to the actual situation.

[0045] In some embodiments, the substrate handling unit 50 is configured to handle multiple substrates simultaneously. The first picking mechanism 52 may be equipped with multiple suction cups, each corresponding to a different substrate. This allows the first picking mechanism 52 to pick up multiple substrates simultaneously during a picking operation, thereby enabling it to work in conjunction with the robotic arm 51 to simultaneously handle multiple substrates. It should be understood that the multiple substrates in this embodiment can be all substrates on each of the first carriers 1.

[0046] In some embodiments, the apparatus further includes a substrate positioning unit 60, which is configured to limit the position of the substrate carried by the second carrier 2. That is, the substrate positioning unit 60 enables each substrate to be placed in a corresponding position on the second carrier 2, thereby ensuring the mounting accuracy of the substrate and saving the step of positioning the substrate in subsequent processes.

[0047] In some embodiments, the substrate positioning unit 60 includes a first movable mechanism 61 and a positioning plate 62 disposed on the first movable mechanism 61. The positioning plate 62 is provided with a plurality of positioning grooves, which are used to limit the position of the substrate carried by the second carrier 2 when the positioning plate 62 covers the second carrier 2. The first movable mechanism 61 is configured to move the positioning plate 62 to cover or move away from the second carrier 2. Alternatively, the first movable mechanism 61 may first move the positioning plate 62 horizontally above the second carrier 2, and then move the positioning plate 62 vertically to cover the upper surface of the second carrier 2. At this time, the plurality of positioning grooves of the positioning plate 62 correspond to the loading positions of a plurality of substrates. When the substrate transport unit 50 transports the substrate, the substrate transport unit 50 can identify the position of the positioning grooves through machine vision or other means, and place the transported substrate into the corresponding positioning groove. In a specific configuration, the first movable mechanism 61 may include an electric trolley and a lifting bracket. The electric trolley is movably mounted on the base plate 90, and the lifting bracket is mounted on the electric trolley and used to mount the limiting plate 62. The electric trolley can drive the lifting bracket and the limiting plate 62 to move horizontally, and the lifting bracket can rise and fall to drive the limiting plate 62 to move vertically. Of course, the construction of the base plate limiting unit 60 is not limited to the above-discussed method and can be selected according to the actual situation.

[0048] In some embodiments, the apparatus further includes a pressure plate 3 placement unit and a pressure plate 3 transport unit. The pressure plate 3 placement unit is configured to place the pressure plate 3, which is used to adhere to the bearing surface of the second carrier 2 to form a clamping and fixing of the substrate. The pressure plate 3 transport unit is configured to transport the pressure plate 3 to the bearing surface of the second carrier 2. Specifically, after the substrate is transported onto the second carrier 2, the pressure plate 3 transport unit can transport the pressure plate 3 from the pressure plate 3 placement unit to the second carrier 2, so that the pressure plate 3 adheres to and fixes the substrate with the bearing surface of the second carrier 2. It should be noted that the pressure plate 3 is provided with multiple through holes penetrating its thickness, each through hole corresponding to multiple substrates, and each through hole can expose the processing area of ​​the corresponding substrate to facilitate subsequent packaging processes on the substrate.

[0049] In some embodiments, the pressure plate 3 transport unit includes a second movable mechanism 81 and a second picking mechanism 82 disposed on the second movable mechanism 81. The second picking mechanism 82 is configured to pick up and place the pressure plate 3, and the second movable mechanism 81 is configured to move the second picking mechanism 82 to transport the pressure plate 3. Alternatively, after the second picking mechanism 82 picks up the pressure plate 3, the second movable mechanism 81 first moves the second picking mechanism 82 vertically upward, then moves the second picking mechanism 82 horizontally above the second carrier 2, and finally moves the second picking mechanism 82 vertically downward so that the picked-up pressure plate 3 covers the substrate and the second carrier 2. In a specific configuration, the second movable mechanism 81 may include a transverse slide rail, a frame, a first lead screw and nut mechanism, and a second lead screw and nut mechanism. The transverse slide rail is mounted on the base plate 90, and the frame is slidably mounted on the side of the transverse slide rail. The second picking mechanism 82 is slidably mounted on the bottom of the frame. The first lead screw and nut mechanism is mounted on the transverse slide rail and is used to drive the frame to move horizontally relative to the transverse slide rail. The second lead screw and nut mechanism is mounted on the frame and connected to the second picking mechanism 82, and is used to drive the second picking mechanism 82 to move vertically relative to the frame. The second picking mechanism 82 can use a suction cup to pick up the pressure plate 3. Of course, the construction of the pressure plate 3 transport unit is not limited to the above-discussed method and can be selected according to the actual situation.

[0050] In some embodiments, the pressure plate 3 placement unit includes a support platform and a lifting mechanism. The support platform is configured to stack the pressure plates 3 and has a through hole extending through its height. The lifting mechanism is disposed within the through hole and is configured to lift the pressure plates 3 so that each pressure plate 3 can be adapted to the pick-up height of the pressure plate 3 transport unit. Alternatively, after the pressure plates 3 are transported to the second carrier 2, the lifting mechanism can lift the remaining pressure plates 3 on the support platform, so that the uppermost pressure plate 3 reaches the pick-up height of the second pick-up mechanism 82. Of course, the construction of the pressure plate 3 placement unit is not limited to the methods discussed above and can be selected according to actual conditions.

[0051] It should be noted that the semiconductor packaging substrate turnover device of this application embodiment can also be used to transport the substrate on the second carrier 2 to the first carrier 1. Correspondingly, the pressure plate transport unit 80 can be used to transport the pressure plate on the second carrier 2 to the pressure plate placement unit 70 to facilitate subsequent transport operations.

[0052] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.

[0053] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A substrate turnover device for semiconductor packaging, characterized in that, The device includes: The first conveying unit is configured to convey a first material box, in which a first carrier is stacked, and each first carrier carries multiple substrates. The side of the first material box is provided with a first loading and unloading port for loading and unloading the first carrier. The second conveying unit is configured to convey a second material box, in which a second carrier is stacked. The side of the first material box is provided with a second loading and unloading port for loading and unloading the second carrier. The first loading and unloading unit is configured to load and unload the first vehicle; The second loading and unloading unit is configured to load and unload the second vehicle; A substrate transport unit is configured to transport the substrate from the first carrier to the second carrier.

2. The semiconductor packaging substrate turnover device according to claim 1, characterized in that, Both the first conveying unit and the second conveying unit include a liftable conveying mechanism, which is used to convey the corresponding material box. The liftable conveying mechanism is configured to have a controllable lifting height so that each carrier can be adapted to the loading and unloading height of the corresponding loading and unloading unit.

3. The semiconductor packaging substrate turnover device according to claim 2, characterized in that, Both the first conveying unit and the second conveying unit include a loading conveyor belt and a unloading conveyor belt. The loading conveyor belt and the unloading conveyor belt are arranged parallel to each other and in opposite directions. The loading conveyor belt is used to transport the corresponding material box from the loading end to the lifting conveyor mechanism, and the unloading conveyor belt is used to transport the corresponding material box from the lifting conveyor mechanism to the unloading end.

4. The semiconductor packaging substrate turnover device according to claim 1, characterized in that, Both the first loading / unloading unit and the second loading / unloading unit include a moving mechanism and a gripping mechanism disposed on the moving mechanism. The gripping mechanism is configured to grip the corresponding vehicle, and the moving mechanism is configured to drive the gripping mechanism to move in the horizontal direction to load and unload the corresponding vehicle.

5. The semiconductor packaging substrate turnover device according to claim 1, characterized in that, The substrate handling unit includes a robotic arm and a first picking mechanism disposed at the end of the robotic arm. The first picking mechanism is configured to pick up and place the substrate, and the robotic arm is configured to move the first picking mechanism to transport the substrate.

6. The semiconductor packaging substrate turnover device according to claim 1, characterized in that, The device further includes: The substrate limiting unit is configured to limit the position of the second carrier carrying the substrate.

7. The semiconductor packaging substrate turnover device according to claim 6, characterized in that, The substrate limiting unit includes a first movable mechanism and a limiting plate disposed on the first movable mechanism. The limiting plate is provided with a plurality of limiting grooves. The limiting grooves are used to limit the position of the second carrier carrying the substrate when the limiting plate covers the second carrier. The first movable mechanism is configured to be able to move the limiting plate to cover or move away from the second carrier.

8. The semiconductor packaging substrate turnover device according to claim 1, characterized in that, The device further includes: A pressure plate placement unit is configured to place a pressure plate, which is used to engage with the bearing surface of the second carrier to form a clamping and fixing of the substrate; The pressure plate transport unit is configured to transport the pressure plate to the bearing surface of the second carrier.

9. The semiconductor packaging substrate turnover device according to claim 8, characterized in that, The pressure plate transport unit includes a second movable mechanism and a second picking mechanism disposed on the second movable mechanism. The second picking mechanism is configured to pick up and place the pressure plate, and the second movable mechanism is configured to move the second picking mechanism to transport the pressure plate.

10. The semiconductor packaging substrate turnover device according to claim 8, characterized in that, The pressure plate placement unit includes a support platform and a lifting mechanism. The support platform is configured to stack the pressure plates and has a through hole extending through its height. The lifting mechanism is disposed in the through hole and is configured to lift the pressure plates so that each pressure plate can be adapted to the picking height of the pressure plate handling unit.

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