A silicon wafer alignment device

Abstract

The utility model discloses a kind of silicon wafer normalizing equipment, including mounting bracket, further include driving assembly and at least one slidingly arranged in mounting bracket clamping arm assembly, the clamping arm assembly is driven to realize relative motion by driving assembly, the clamping arm assembly includes two oppositely arranged clamping arms, corresponding setting in the opposite side of two clamping arms dog element, several wind knives respectively arranged on clamping arm, the dog element forms several clamping grooves, and the wind knife is used to blow the silicon wafer remaining in clamping groove. Advantage: by setting wind knife, the silicon wafer fragment remaining in clamping groove is blown off, prevent the silicon wafer remaining in next time normalizing process from damaging next batch normalizing silicon wafer, reduce the maintenance frequency of equipment.

Description

Technical Field

[0001] This utility model relates to the field of solar cell equipment, specifically a silicon wafer alignment device. Background Technology

[0002] In the production of solar cells, wafer alignment is a crucial step. Traditional wafer alignment equipment typically uses mechanical clamping arms and toothed structures to position and align the wafers. However, in practice, wafers are prone to fragmentation during alignment due to mechanical contact or improper handling. These fragments often remain in the slots of the toothed structure and are difficult to remove completely. Residual wafer fragments cause a series of problems: firstly, in subsequent alignment processes, residual fragments may hinder the correct alignment of new wafers, leading to inaccurate positioning; secondly, fragments may scratch or damage new batches of wafers, affecting product quality; furthermore, frequent fragment accumulation increases equipment maintenance frequency and reduces production efficiency. Currently, common solutions involve manual cleaning or vibration to remove fragments, but these methods are inefficient and cannot completely solve the problem, especially in high-frequency production environments.

[0003] Therefore, it is necessary to provide a silicon wafer alignment device. Summary of the Invention

[0004] The present invention provides a silicon wafer alignment device that effectively solves the problem that existing silicon wafer alignment equipment is prone to leaving fragments that affect the next alignment.

[0005] The technical solution adopted in this utility model is:

[0006] A silicon wafer alignment device includes a mounting frame, a drive assembly, and at least one clamping arm assembly slidably disposed on the mounting frame. The clamping arm assembly is driven by the drive assembly to achieve relative movement. The clamping arm assembly includes two clamping arms disposed opposite each other, a toothed component disposed on opposite sides of the two clamping arms, and a plurality of air knives disposed on the clamping arms respectively. The toothed component forms a plurality of slots, and the air knives are used to blow away the silicon wafers remaining in the slots.

[0007] Furthermore, each of the clamping arms is provided with an air knife at its end, with the air outlet of the air knife facing the other end of the clamping arm.

[0008] Furthermore, the clamping tooth includes a plurality of limiting posts equidistantly arranged on opposite sides of the clamping arm. Each limiting post includes a cylinder fixedly arranged on the side of the clamping arm and a conical head fixedly arranged at the end of the cylinder. A gap is provided between adjacent limiting posts.

[0009] Furthermore, the mounting frame includes a first frame and a second frame arranged opposite to each other, a first guide rail arranged on the side of the first frame opposite to the second frame, and a second guide rail arranged on the second frame opposite to the first frame. The two ends of the clamping arm are slidably connected to the first guide rail and the second guide rail, respectively.

[0010] Furthermore, the drive assembly includes two first belt assemblies symmetrically arranged on the first and second frames, two second belt assemblies symmetrically arranged on the first and second frames, a first motor assembly for driving the two first belt assemblies to move synchronously, and a second motor assembly for driving the two second belt assemblies to move synchronously. The first belt assemblies are located above the second belt assemblies and have the same structure. The first motor assembly and the second motor assembly have the same structure. The two clamping arms of the same clamping arm assembly are driven by the first belt assembly and the second belt assembly, respectively.

[0011] Furthermore, the first belt assembly includes a first driving pulley, a first timing belt, and a first driven pulley on the first frame. The first timing belt is wound around the first driving pulley and the first driven pulley. The clamping arm driven by the first belt assembly is connected to the first timing belt.

[0012] Furthermore, the No. 1 motor assembly includes a drive shaft and a motor. The drive shaft is coaxially and fixedly connected to the No. 1 drive pulley of the two No. 1 belt assemblies, and the motor drives the drive shaft to rotate.

[0013] Furthermore, it also includes a connecting plate, and the number of clamping arm assemblies is two, with two clamping arms spaced apart by the connecting plate.

[0014] The beneficial effects of this utility model are: by setting an air knife to blow away the residual silicon wafer fragments in the slot, the residual silicon wafers in the next alignment process are prevented from damaging the next batch of aligned silicon wafers, thus reducing the maintenance frequency of the equipment. Attached Figure Description

[0015] Figure 1 This is an overall schematic diagram from one perspective of the silicon wafer alignment device provided in an embodiment of this application.

[0016] Figure 2 This is an overall schematic diagram from another perspective of the silicon wafer alignment device provided in an embodiment of this application.

[0017] Figure 3 This is a schematic diagram of the clamping arm assembly of a silicon wafer alignment device provided in an embodiment of this application.

[0018] Figure 4 for Figure 3 An enlarged schematic diagram of region A in the middle.

[0019] The following are labeled in the diagram: 1. Mounting bracket; 2. Drive assembly; 3. Clamping arm assembly; 31. Clamping arm; 32. Clamping teeth; 33. Air knife; 331. Cylindrical column; 332. Conical head; 11. Frame 1; 12. Frame 2; 13. Guide rail 1; 14. Guide rail 2; 21. Belt assembly 1; 22. Belt assembly 2; 23. Motor assembly 1; 24. Motor assembly 2; 34. Connecting plate. Detailed Implementation

[0020] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0021] like Figure 1 and Figure 3 As shown, an embodiment of this application provides a silicon wafer alignment device, including a mounting frame 1, a driving component 2, and at least one clamping arm assembly 3 slidably disposed on the mounting frame 1. The clamping arm assembly 3 is driven by the driving component 2 to achieve relative movement. The clamping arm assembly 3 includes two clamping arms 31 disposed opposite to each other, a toothed component 32 disposed on opposite sides of the two clamping arms 31, and a plurality of air knives 33 respectively disposed on the clamping arms 31. The toothed component 32 forms a plurality of slots, and the air knives 33 are used to blow away the silicon wafers remaining in the slots.

[0022] In actual use, the two clamping arms 31 of the clamping arm assembly 3 are driven to move relative to each other by the driving component 2. Several silicon wafers are arranged at equal intervals by the toothed component 32. After one alignment is completed, there may be fragments in the slot of the toothed component 32. The air knife 33 blows over the toothed component 32 and uses the airflow to carry the fragments out of the slot.

[0023] In the above design, the residual silicon wafer fragments in the slot are blown away by the air knife 33 to prevent the residual silicon wafers from damaging the next batch of silicon wafers during the next alignment process.

[0024] Specifically: such as Figure 3 As shown, each clamping arm 31 is provided with an air knife 33 at its end, and the air outlet of the air knife 33 faces the other end of the clamping arm 31.

[0025] In actual use, the two air knives 33 blow air into the middle of the clamping arm 31 at the same time. The airflow reduces the pressure above the slot, causing the residual decontamination fragments in the slot to fly out.

[0026] In the above design, by setting air blades 33 at both ends of the clamping arm 31, the air force can be guaranteed to ensure that all the fragments in the slots can be blown out.

[0027] Specifically: such as Figure 3 and Figure 4As shown, the clamping tooth 32 includes a plurality of limiting posts equidistantly arranged on opposite sides of the clamping arm 31. Each limiting post includes a cylinder 331 fixedly arranged on the side of the clamping arm 31 and a conical head 332 fixedly arranged at the end of the cylinder 331. A gap is provided between adjacent limiting posts.

[0028] In actual use, the silicon wafer to be aligned is fixedly placed, and the two clamping arms 31 are closed, so that the two sides of the silicon wafer extend into the space between the two limiting posts. If the silicon wafer is in a skewed state during the process of the silicon wafer extending into the two limiting posts, the conical head 332 extends into the gap between the adjacent silicon wafers through the contraction structure, so as to prevent the adjacent silicon wafers from misaligning on both sides when aligning.

[0029] In the above design, the structural design and specific implementation of the toothed component 32 facilitate the prevention of misalignment of the skewed silicon wafer during the straightening process.

[0030] Specifically: such as Figure 1 and Figure 2 As shown, the mounting frame 1 includes a first frame 11 and a second frame 12 arranged opposite to each other, a first guide rail 13 arranged on the side of the first frame 11 opposite to the second frame 12, and a second guide rail 14 arranged on the second frame 12 opposite to the first frame 11. The two ends of the clamping arm 31 are slidably connected to the first guide rail 13 and the second guide rail 14 respectively.

[0031] In actual use, the two clamping arms 31 slide relative to each other via the first guide rail 13 and the second guide rail 14 after being driven by the drive component 2.

[0032] The above design facilitates the opening and closing movement of the clamping components and reduces the friction of the clamping arm 31 during movement.

[0033] Specifically: such as Figure 1 and Figure 2 As shown, the drive assembly 2 includes two first belt assemblies 21 symmetrically arranged on the first frame 11 and the second frame 12, two second belt assemblies 22 symmetrically arranged on the first frame 11 and the second frame 12, a first motor assembly 23 for driving the two first belt assemblies 21 to move synchronously, and a second motor assembly 24 for driving the two second belt assemblies 22 to move synchronously. The first belt assembly 21 is located above the second belt assembly 22 and has the same structure. The first motor assembly 23 and the second motor assembly 24 have the same structure. The two clamping arms 31 of the same clamping arm assembly 3 are driven by the first belt assembly 21 and the second belt assembly 22 respectively.

[0034] In actual use, the first motor assembly 23 drives the first belt assembly 21 for transmission, and the second motor assembly 24 drives the second belt assembly 22 for transmission, so that the two clamping arms 31 of the same clamping arm assembly 3 can open and close. When the two clamping arms 31 move towards each other, the two sides of the silicon wafer come into contact with the two clamping arms 31, thereby aligning the silicon wafer.

[0035] In the above design, the structural design and specific implementation of the drive component 2 can achieve the stability of the clamping arm component 3 during the movement process, and prevent the clamping arm 31 from shaking too much and causing damage to the silicon wafer.

[0036] Specifically: The first belt assembly 21 includes a first driving pulley, a first synchronous belt, and a first driven pulley on the first frame 11. The first synchronous belt is wound around the first driving pulley and the first driven pulley. The clamping arm 31 driven by the first belt assembly 21 is connected to the first synchronous belt.

[0037] In actual use, the No. 1 driving wheel rotates, which, with the cooperation of the No. 1 synchronous belt, drives the No. 1 driven wheel to rotate synchronously.

[0038] In the above design, the structural design and specific implementation of the No. 1 belt assembly 21 can effectively achieve rapid transmission.

[0039] Specifically: The first motor assembly 23 includes a drive shaft and a motor. The drive shaft is coaxially and fixedly connected to the first drive pulley of the two first belt assemblies 21. The motor drives the drive shaft to rotate.

[0040] In actual use, the transmission shaft is driven by a motor to rotate, which in turn drives the No. 1 drive wheel to rotate, thus realizing the transmission of the No. 1 belt assembly 21.

[0041] In the above design, the structural design and specific implementation of the No. 1 motor assembly 23 can realize the synchronous drive of the two No. 1 belt assemblies 21.

[0042] Specifically: such as Figure 3 As shown, it also includes a connecting plate 34, and there are two clamping arm assemblies 3. The two clamping arms 31 of the two clamping arm assemblies 3 are fixedly connected by the connecting plate 34.

[0043] In actual use, the two clamping arm assemblies 3 work together to simultaneously align the silicon wafers in the two areas.

[0044] The above design can further improve the silicon wafer alignment efficiency.

[0045] In further detail, it should be understood that the above description is only a specific embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A silicon wafer alignment device, comprising a mounting frame (1), characterized in that: It also includes a drive assembly (2) and at least one clamping arm assembly (3) slidably disposed on the mounting bracket (1). The clamping arm assembly (3) is driven by the drive assembly (2) to achieve relative movement. The clamping arm assembly (3) includes two clamping arms (31) disposed opposite to each other, a toothed member (32) disposed on the opposite side of the two clamping arms (31), and a number of air knives (33) disposed on the clamping arms (31). The toothed member (32) forms a number of slots. The air knives (33) are used to blow away the silicon wafers remaining in the slots.

2. The silicon wafer alignment device according to claim 1, characterized in that: Each clamping arm (31) is provided with an air knife (33) at its end, with the air outlet of the air knife (33) facing the other end of the clamping arm (31).

3. The silicon wafer alignment device according to claim 1, characterized in that: The clamping tooth (32) includes a plurality of limiting posts equidistantly arranged on opposite sides of the clamping arm (31). Each limiting post includes a cylinder (331) fixedly arranged on the side of the clamping arm (31) and a conical head (332) fixedly arranged at the end of the cylinder (331). A gap is provided between adjacent limiting posts.

4. The silicon wafer alignment device according to claim 1, characterized in that: The mounting frame (1) includes a first frame (11) and a second frame (12) arranged opposite to each other, a first guide rail (13) arranged on the side of the first frame (11) opposite to the second frame (12), and a second guide rail (14) arranged on the second frame (12) opposite to the first frame (11). The two ends of the clamping arm (31) are slidably connected to the first guide rail (13) and the second guide rail (14) respectively.

5. The silicon wafer alignment device according to claim 1, characterized in that: The drive assembly (2) includes two belt assemblies (21) symmetrically arranged on the first frame (11) and the second frame (12), two belt assemblies (22) symmetrically arranged on the first frame (11) and the second frame (12), a motor assembly (23) for driving the two belt assemblies (21) to move synchronously, and a motor assembly (24) for driving the two belt assemblies (22) to move synchronously. The belt assemblies (21) are located above the belt assemblies (22) and have the same structure. The motor assemblies (23) and (24) have the same structure. The two clamping arms (31) of the same clamping arm assembly (3) are driven by the belt assemblies (21) and (22) respectively.

6. The silicon wafer alignment device according to claim 5, characterized in that: The first belt assembly (21) includes a first driving pulley, a first synchronous belt, and a first driven pulley on the first frame (11). The first synchronous belt is wound around the first driving pulley and the first driven pulley. The clamping arm (31) driven by the first belt assembly (21) is connected to the first synchronous belt.

7. The silicon wafer alignment device according to claim 5, characterized in that: The first motor assembly (23) includes a drive shaft and a motor. The drive shaft is coaxially and fixedly connected to the first drive pulley of the two first belt assemblies (21). The motor drives the drive shaft to rotate.

8. The silicon wafer alignment device according to claim 1, characterized in that: It also includes a connecting plate (34), and there are two clamping arm assemblies (3), with two clamping arms (31) of the two clamping arm assemblies (3) fixedly connected by the connecting plate (34).

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