Wafer pick-and-place device

Abstract

The utility model provides a kind of wafer taking and placing device, including frame body, stem, material moving part, support arm and positioning piece, stem is slidably connected in frame body along first direction;Material moving part is connected in stem, and can move along with stem;Support arm is at least provided with two groups, and all are connected in frame body, wherein two groups of support arm are distributed along second direction and located the two sides of material moving part;Positioning piece is connected in the front end of support arm away from stem along first direction, and positioning piece includes at least one positioning part, positioning part can be inserted into material taking space, and abuts along third direction with baffle, material moving part is configured to be able to slide relative to stem after abutting with baffle in positioning part, to take and place wafer to corresponding material taking space, third direction, first direction and second direction intersect each other in twos.The wafer taking and placing device of the utility model can accurately place wafer into slot of wafer box, reduce scratch in the process of taking and placing wafer.

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