A base for wafer cleaning machine

By using magnetic bearings, drive discs, clamping plates, and bevel gear transmission, the problems of high frictional resistance, low power transmission efficiency, and contamination in the wafer cleaning machine base are solved, achieving efficient centering clamping and equipment stability, and extending the equipment's lifespan.

CN224402087UActive Publication Date: 2026-06-23WEIJIA MECHANICAL & ELECTRICAL TECHNOLOGY (TIANJIN) CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
WEIJIA MECHANICAL & ELECTRICAL TECHNOLOGY (TIANJIN) CO LTD
Filing Date
2025-07-17
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

Existing wafer cleaning machines suffer from problems such as high frictional resistance, low power transmission efficiency, poor stability, low centering accuracy, and cleaning fluid contamination, which affect the cleaning effect and equipment lifespan.

Method used

Magnetic bearings are used to reduce friction, the drive disc and clamping plate work together to achieve centering and clamping, bevel gear transmission improves power transmission efficiency, stabilizing grooves limit the rotation trajectory, and water baffles prevent contamination.

Benefits of technology

It improves the smoothness of base operation, clamping accuracy and equipment stability, prevents contamination and extends equipment life.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN224402087U_ABST
    Figure CN224402087U_ABST
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Abstract

The utility model discloses a kind of wafer cleaning machine bases, it is related to wafer cleaning appliance technical field, including the base of wafer shape, the water baffle is installed in base bottom end, and base axis bottom end is fixedly connected with mounting table, two equidistance magnetic bearings are installed in mounting table inner side, and circular wafer-shaped mounting cavity is opened in base, and driving assembly is installed in mounting cavity;In the utility model, through the cooperation between mounting table and magnetic bearing, the effect of reducing the friction when base and pivot drive is played, the problem of big friction resistance of traditional contact type transmission is solved, and the smoothness of base operation is improved;Through the cooperation between the driving groove of driving disc and clamping plate, the effect of driving clamping plate and clamping table to move towards when driving disc rotates is played, the problem of unstable wafer clamping, low centering precision is solved, and the centering clamping precision to wafer is improved.
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Description

Technical Field

[0001] This utility model relates to the technical field of wafer cleaning equipment, and in particular to a base for a wafer cleaning machine. Background Technology

[0002] In the wafer manufacturing and processing process, the cleaning process is a key step to ensure the quality of wafers. The base of the wafer cleaning machine is the core component that supports and drives the wafers, and its performance directly affects the cleaning efficiency, wafer clamping stability and equipment lifespan.

[0003] In practical applications, existing wafer cleaning machine bases typically employ a traditional contact-type structure connected to a pivot. The direct surface contact between the base and pivot results in significant frictional resistance during transmission, affecting not only the smoothness of base operation but also causing wear and tear over time, reducing the equipment's operational accuracy and lifespan. Furthermore, in the wafer clamping stage, traditional base drive mechanisms often suffer from low power transmission efficiency and poor stability, making it difficult for the clamping components to achieve precise centering and clamping of the wafers. This can lead to wafer misalignment or unstable clamping, consequently affecting the cleaning effect. In addition, the drive components are prone to shaking during high-speed operation, reducing the overall stability of the equipment. Furthermore, the wastewater generated during the cleaning process easily splashes onto the bottom of the base and the pivot, causing component contamination and corrosion, further shortening the equipment's maintenance cycle and service life. Among these issues, unstable wafer clamping and low centering accuracy are prominent problems restricting the improvement of the cleaning process quality. The drive transmission structure design of traditional clamping mechanisms is unreasonable, making it difficult to achieve synchronous and precise opposite movement of clamping components during the drive process. This leads to wafers being prone to eccentricity and tilting during clamping, which not only affects the uniform contact between the cleaning fluid and the wafer surface but may also cause edge damage to the wafer due to uneven clamping force, seriously affecting the quality stability of subsequent processing steps. Therefore, the above problems need to be solved. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a base for a wafer cleaning machine.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a base for a wafer cleaning machine, comprising a disc-shaped base, a water baffle plate installed at the bottom end of the base, and a mounting platform fixedly connected to the bottom end of the base axis, two equidistant magnetic bearings installed on the inner side of the mounting platform, and a disc-shaped mounting cavity opened in the base, wherein a drive assembly is installed in the mounting cavity.

[0006] Preferably, the drive assembly includes a drive disk mounted on the coaxial end of the mounting cavity, the drive disk having a plurality of equidistant drive slots, and the bottom end of the drive disk having a circular stabilizing slot.

[0007] Preferably, a clamping plate is installed in the drive groove, and a clamping platform made of PEEK polymer is fixed to the other end of the clamping plate.

[0008] Preferably, a drive motor is installed on one side of the bottom end of the mounting cavity, and a first bevel gear is installed at the output end of the drive motor.

[0009] Preferably, a second bevel gear is fixedly connected to the bottom end of the drive disk, and multiple equidistant stabilizing platforms are installed above the inner wall of the mounting cavity.

[0010] Preferably, the stabilizing platform is installed higher than the drive motor installed in the mounting cavity, and the second bevel gear meshes with the first bevel gear installed at the output end of the drive motor.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: In this utility model, the cooperation between the mounting platform and the magnetic bearing reduces friction between the base and the pivot during drive, solving the problem of high frictional resistance in traditional contact transmission and improving the smoothness of base operation; the cooperation between the drive groove of the drive disk and the clamping plate enables the clamping plate and the clamping platform to move in opposite directions when the drive disk rotates, solving the problems of unstable wafer clamping and low centering accuracy, and improving the centering and clamping accuracy of the wafer; the meshing cooperation between the first bevel gear and the second bevel gear achieves... The efficient transmission of power from the drive motor to the drive plate solves the problems of high power loss and poor stability during power transmission, thus improving transmission efficiency and stability. The cooperation between the stabilizing groove and the stabilizing platform at the bottom of the drive plate restricts the rotation trajectory of the drive plate, solving the problem of easy shaking during drive plate rotation and improving the dynamic stability of the drive plate during rotation. The cooperation between the base and the baffle plate prevents cleaning water from splashing onto the bottom of the base, solving the problem of cleaning water contaminating and corroding the bottom of the base and the pivot, thus improving the cleanliness and service life of the equipment. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0013] Figure 1 This is a schematic diagram of the overall structure proposed in this utility model;

[0014] Figure 2 This is a partial sectional view of the overall structure proposed in this utility model;

[0015] Figure 3 This is a half-sectional schematic diagram of the overall structure proposed in this utility model;

[0016] Figure 4 The present utility model proposes Figure 3 Enlarged schematic diagram of part A in the middle.

[0017] The numbers in the diagram are: 1. Base; 2. Water baffle; 3. Mounting platform; 4. Magnetic bearing; 5. Mounting cavity; 6. Drive plate; 7. Drive groove; 8. Clamping plate; 9. Clamping platform; 10. Drive motor; 11. First bevel gear; 12. Second bevel gear; 13. Stabilizing platform. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Example: See Figure 1-4 This utility model discloses a base for a wafer cleaning machine, comprising a disc-shaped base 1, which facilitates the installation of subsequent drive components; a baffle plate 2 is installed at the bottom of the base 1 to prevent cleaning water from rinsing the wafers from splashing onto the bottom of the base 1; a mounting platform 3 is fixedly connected to the bottom of the base 1 along its axis, which facilitates the installation of a pivot; two equidistant magnetic bearings 4 are installed on the inner side of the mounting platform 3 to reduce friction during drive; a disc-shaped mounting cavity 5 is provided inside the base 1 to facilitate the installation of the drive components; the drive components are installed in the mounting cavity 5, and the drive components include a drive disk 6 installed on the coaxial end of the mounting cavity 5, which facilitates the installation of a clamping plate 8 by opening drive grooves 7; multiple equidistant drive grooves 7 are provided on the drive disk 6 to facilitate the installation of the clamping plate 8; a circular stabilizing groove is provided at the bottom of the drive disk 6.

[0020] In this invention, a clamping plate 8 is installed in the drive groove 7, which facilitates the installation of a clamping stage 9. A clamping stage 9 made of PEEK polymer is fixed to the other end of the clamping plate 8, which facilitates the clamping of the wafer by the drive disk 6. A drive motor 10 is installed on one side of the bottom of the mounting cavity 5, which facilitates the provision of driving force to the first bevel gear 11. The first bevel gear 11 is installed at the output end of the drive motor 10, which facilitates the transmission of the driving force of the drive motor 10 to the second bevel gear 12. The second bevel gear 12 is fixed to the bottom of the drive disk 6, which facilitates the rotation of the drive disk 6 by the driving force of the drive motor 10. Multiple equidistant stabilizing platforms 13 are installed above the inner wall of the mounting groove 5, which facilitates the stability of the drive disk 6 during rotation. The installation position of the stabilizing platform 13 is higher than that of the drive motor 10 installed in the mounting cavity 5, and the second bevel gear 12 meshes with the first bevel gear 11 installed at the output end of the drive motor 10.

[0021] Working principle: In use, the base 1 is fixed to the pivot via the mounting platform 3. After the device is powered on, the magnetic bearing 4 effectively reduces the contact area between the base 1 and the pivot. With the help of external equipment (such as an open-loop mechanism like a robotic arm), the wafer is suspended and positioned at the horizontal line of the opposing clamping ends of the multiple clamping platforms 9. The drive motor 10 assembled in the mounting cavity 5 is started, and its output shaft drives the first bevel gear 11 to rotate. The first bevel gear 11 meshes with the second bevel gear 12, driving the second bevel gear 12 to rotate synchronously. This drives the drive disk 6 to rotate. Since the drive groove 7 of the drive disk 6 forms a guide limit for the clamping plate 8, when the drive disk 6 rotates, the clamping plate 8 will carry the clamping stage 9 to move in opposite directions along the axis of the base 1, so as to realize the centering and clamping of the wafer by the clamping stage 9. At the same time, the stabilizing stage 13 configured in the stabilizing groove at the bottom of the drive disk 6 can ensure the dynamic stability of the drive disk 6 during rotation. When the wafer is engraved and washed, the baffle plate 2 installed at the bottom of the base 1 will prevent water stains from splashing onto the pivot and the bottom of the base 1.

[0022] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A base for a wafer cleaning machine, comprising a disc-shaped base (1), characterized in that: A baffle plate (2) is installed at the bottom of the base (1), and a mounting platform (3) is fixedly connected to the bottom of the axis of the base (1). Two equidistant magnetic bearings (4) are installed on the inner side of the mounting platform (3), and a disc-shaped mounting cavity (5) is opened in the base (1). A drive assembly is installed in the mounting cavity (5).

2. The base for a wafer cleaning machine according to claim 1, characterized in that: The drive assembly includes a drive disk (6) installed on the coaxial end of the mounting cavity (5), the drive disk (6) having multiple equally spaced drive slots (7), and the bottom of the drive disk (6) having a circular stabilizing slot.

3. The base for a wafer cleaning machine according to claim 2, characterized in that: A clamping plate (8) is installed in the drive groove (7), and a clamping platform (9) made of PEEK polymer is fixed to the other end of the clamping plate (8).

4. A base for a wafer cleaning machine according to claim 2, characterized in that: A drive motor (10) is installed on one side of the bottom of the mounting cavity (5), and a first bevel gear (11) is installed at the output end of the drive motor (10).

5. A base for a wafer cleaning machine according to claim 2, characterized in that: The bottom end of the drive disk (6) is fixed with a second bevel gear (12), and multiple equidistant stabilizing platforms (13) are installed above the inner wall of the mounting cavity (5).

6. A base for a wafer cleaning machine according to claim 5, characterized in that: The mounting position of the stabilizing platform (13) is higher than the drive motor (10) inside the mounting cavity (5), and the second bevel gear (12) meshes with the first bevel gear (11) installed at the output end of the drive motor (10).