Microchannel cooler and semiconductor device

Abstract

The application discloses a micro-channel cooler and a semiconductor device. The micro-channel cooler comprises a first substrate, a second substrate and a flow channel layer. The second substrate is arranged opposite to the first substrate along a first direction. The flow channel layer is arranged between the first substrate and the second substrate. The flow channel layer is provided with a fluid channel. The fluid channel comprises a plurality of first channel layers arranged along the first direction. The first channel layer comprises a plurality of first sub-channels. The plurality of first sub-channels of the same first channel layer are arranged in rows along a second direction and arranged in columns along a third direction. Two first sub-channels adjacent along the first direction are staggered and communicated. The first direction, the second direction and the third direction intersect with each other in pairs. The application can improve the heat dissipation performance of the micro-channel cooler.

Description

Technical Field

[0001] This application relates to the field of semiconductor heat dissipation technology, and in particular to a microchannel cooler and semiconductor device. Background Technology

[0002] With the rapid development of high-power semiconductor lasers, high-performance computing chips, and industrial power equipment, the demand for thermal management has increased dramatically. Against this backdrop, microchannel coolers (MCCs), with their micron-level flow channel design, significantly improve heat dissipation efficiency and have become a key technology for solving thermal bottlenecks.

[0003] However, due to structural limitations, the heat dissipation performance of microchannel coolers needs to be improved. Utility Model Content

[0004] This application provides a microchannel cooler and a semiconductor device to improve the heat dissipation performance of the microchannel cooler.

[0005] According to one aspect of this application, a microchannel cooler is provided, comprising a first substrate, a second substrate, and a flow channel layer. The second substrate is disposed opposite to the first substrate along a first direction. The flow channel layer is disposed between the first substrate and the second substrate, and the flow channel layer has fluid channels. The fluid channels include a plurality of first channel layers arranged along the first direction. Each first channel layer includes a plurality of first sub-channels. The plurality of first sub-channels of the same first channel layer are arranged in rows at intervals along a second direction and in columns at intervals along a third direction. Two adjacent first sub-channels along the first direction are staggered and connected. The first direction, the second direction, and the third direction intersect each other.

[0006] In some embodiments, one of the first sub-channels of one of the first channel layers is connected to a plurality of first sub-channels of adjacent first channel layers.

[0007] In some embodiments, the orthographic projection of a first sub-channel of one of the first channel layers onto the first substrate overlaps with the orthographic projections of multiple first sub-channels of adjacent first channel layers onto the first substrate, and the multiple overlapping areas are equal.

[0008] In some embodiments, the plurality of first sub-channels have equal dimensions along the first direction; the plurality of first sub-channels have equal dimensions along the second direction and are evenly spaced along the second direction; the plurality of first sub-channels have equal dimensions along the third direction and are evenly spaced along the third direction.

[0009] In some embodiments, the second substrate is provided with a fluid inlet and a fluid outlet; the fluid channel further includes a second channel layer, the second channel layer including a second sub-channel and a third sub-channel; one end of the second sub-channel along the first direction is connected to the fluid inlet, and the other end is connected to a plurality of first sub-channels; one end of the third sub-channel along the first direction is connected to the fluid outlet, and the other end is connected to a plurality of first sub-channels.

[0010] In some embodiments, the projected area of ​​the second sub-channel on the first substrate is greater than the projected area of ​​the fluid inlet on the first substrate, and is also greater than the projected area of ​​the first sub-channel on the first substrate; the projected area of ​​the third sub-channel on the first substrate is greater than the projected area of ​​the fluid outlet on the first substrate, and is also greater than the projected area of ​​the first sub-channel on the first substrate.

[0011] In some embodiments, the flow channel layer includes a plurality of first flow channel plates stacked sequentially along the first direction, and the first flow channel plates are provided with a plurality of first sub-channels; the first sub-channels on the plurality of first flow channel plates have the same layout; and two adjacent first flow channel plates along the first direction are staggered.

[0012] In some embodiments, adjacent first flow channel plates are welded together via a copper interface.

[0013] In some embodiments, the microchannel cooler further includes a first inner pad disposed on the side of the first substrate facing the second substrate and a second inner pad disposed on the side of the second substrate facing the first substrate; the first flow channel plate is welded to the first substrate through the first inner pad, and the first flow channel plate is welded to the second substrate through the second inner pad.

[0014] According to another aspect of this application, a semiconductor device is provided, including a chip and the aforementioned microchannel cooler, wherein the chip is fixed to the first substrate.

[0015] The microchannel cooler of this application embodiment includes a first substrate and a second substrate disposed opposite each other along a first direction, and a flow channel layer disposed between the first substrate and the second substrate. The flow channel layer has a plurality of first channel layers arranged along the first direction, each first channel layer including a plurality of first sub-channels. The first sub-channels of the same first channel layer are arranged in rows at intervals along a second direction and in columns at intervals along a third direction. Adjacent first sub-channels along the first direction are staggered and connected, wherein the first direction, the second direction, and the third direction intersect each other. In this way, the plurality of first sub-channels are uniformly distributed in the plane formed by the second direction and the third direction, improving heat dissipation efficiency and heat flux density carrying capacity. Furthermore, due to the staggered arrangement of adjacent first sub-channels along the first direction, the proportion of coolant turbulence is increased, thereby improving heat dissipation uniformity. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A schematic diagram of a microchannel cooler in one embodiment of this application is shown.

[0018] Figure 2 A schematic diagram of the flow channel design of a microchannel cooler in one embodiment of this application is shown.

[0019] Explanation of reference numerals in the attached figures:

[0020] 1. Microchannel cooler;

[0021] 10. First substrate; 11. First inner pad; 12. First outer pad;

[0022] 20. Second substrate; 20a. Fluid inlet; 20b. Fluid outlet; 21. Second inner pad; 22. Second outer pad;

[0023] 30. Flow channel layer; 31a. First channel layer; 31. First flow channel plate; 311. First sub-channel; 32. Second flow channel plate; 32a. Second channel layer; 321. Second sub-channel; 322. Third sub-channel;

[0024] X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0026] In the following description, when referring to the accompanying drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0027] With the rapid development of high-power semiconductor lasers, high-performance computing chips, and industrial power equipment, the demand for thermal management has increased dramatically. Traditional air cooling or macrochannel water cooling technologies are limited by low heat dissipation efficiency, large size, and high energy consumption, making it difficult to meet the heat dissipation requirements of modern high-power-density devices. For example, the power density of semiconductor lasers has exceeded 100W / cm². 2 The high-frequency operation of electric vehicle fast charging technology and industrial automation equipment further exacerbates the heat load. Against this backdrop, the microchannel cooler (MCC) has become a key technology for solving the thermal bottleneck by significantly improving heat dissipation efficiency with its micron-level flow channel design. It achieves efficient heat dissipation through the microchannel structure, supporting the stable operation of lasers at power levels of over 100 watts.

[0028] The uniformity of coolant flow in a microchannel cooler directly determines the efficient heat dissipation and device stability, and the channel layer design is a core factor affecting coolant flow distribution. In related technologies, the channel layer of microchannel coolers uses uniformly distributed parallel microchannels, which easily leads to a phenomenon of "high flow velocity at the beginning and decreased flow rate at the end," potentially causing localized overheating in high power density scenarios. Furthermore, due to manufacturing limitations, the branch structure of uniformly distributed parallel microchannels cannot guarantee symmetry; insufficient symmetry exacerbates flow distribution differences and reduces heat dissipation uniformity.

[0029] Combination Figure 1 and Figure 2 To address the aforementioned issues, this application provides a microchannel cooler 1, which includes a first substrate 10, a second substrate 20, and a flow channel layer 30.

[0030] The first substrate 10 and the second substrate 20 are disposed opposite to each other along a first direction X. The material of the first substrate 10 includes at least one of aluminum nitride ceramic, alumina ceramic, and diamond substrate, and the material of the second substrate 20 is at least one of aluminum nitride ceramic, alumina ceramic, and diamond substrate.

[0031] A flow channel layer 30 is disposed between the first substrate 10 and the second substrate 20. The flow channel layer 30 has fluid channels, including multiple first channel layers 31a arranged along a first direction X. Each first channel layer 31a includes multiple first sub-channels 311. The multiple first sub-channels 311 of the same first channel layer 31a are arranged in rows at intervals along a second direction Y and in columns at intervals along a third direction Z. Two adjacent first sub-channels 311 along the first direction X are staggered and connected. The first direction X, the second direction Y, and the third direction Z intersect each other in pairs, for example, they are perpendicular to each other, the angle between each pair is acute, or one of them is perpendicular to the other two and the angle between the two is acute or obtuse.

[0032] Based on this, multiple first sub-channels 311 are uniformly distributed in the plane formed by the second direction Y and the third direction Z, improving heat dissipation efficiency and heat flux density carrying capacity. Furthermore, since the adjacent first sub-channels 311 are staggered along the first direction X, a multi-level turbulence channel is formed, increasing the proportion of coolant turbulence and improving heat dissipation uniformity.

[0033] Optionally, the orthographic projection shape of the first sub-channel 311 on the first substrate 10 can be a circle, ellipse, triangle, quadrilateral, pentagon, hexagon, or a combination thereof. This expands the range of shape design options. Furthermore, when the orthographic projection shape of the first sub-channel 311 on the first substrate 10 is a polygon, it can specifically be a regular polygon. This allows multiple first sub-channels 311 to be arranged more closely and uniformly, thereby increasing the fluid flow area and flow uniformity, and consequently improving heat dissipation efficiency and heat dissipation uniformity.

[0034] In an exemplary embodiment, the first sub-channel 311 has a regular hexagonal shape projected onto the first substrate 10. The multiple regular hexagonal first sub-channels 311 are arranged in a honeycomb pattern, thereby increasing the arrangement density and uniformity, and thus improving heat dissipation efficiency and uniformity.

[0035] Optionally, one first sub-channel 311 of one of the first channel layers 31a is connected to multiple first sub-channels 311 of adjacent first channel layers 31a. For example, one first sub-channel 311 of one of the first channel layers 31a is connected to two, three, or more first sub-channels 311 of adjacent first channel layers 31a. In this way, the fluid flow within the flow channel layer 30 is diverted multiple times during the flow process, adjusting the fluid flow direction and flow pressure, reducing the flow rate difference between the fluid inlet 20a and the fluid outlet 20b, and improving the uniformity of the fluid flow.

[0036] Optionally, the orthographic projection of a first sub-channel 311 of one of the first channel layers 31a onto the first substrate 10 overlaps with the orthographic projections of multiple first sub-channels 311 of adjacent first channel layers 31a onto the first substrate 10, and the areas of the overlapping regions are equal. For example, the orthographic projection of a first sub-channel 311 of one of the first channel layers 31a onto the first substrate 10 overlaps with the orthographic projections of three first sub-channels 311 of adjacent first channel layers 31a onto the first substrate 10, and the areas of the overlapping regions are equal. In other words, after fluid flows from one first sub-channel 311 of one of the first channel layers 31a to an adjacent first channel layer 31a, it is evenly distributed to the three first sub-channels 311, making the fluid pressure in each channel more uniform.

[0037] In some embodiments, the plurality of first sub-channels 311 have equal dimensions along the first direction X; the plurality of first sub-channels 311 have equal dimensions along the second direction Y, and the plurality of first sub-channels 311 are evenly spaced along the second direction Y; the plurality of first sub-channels 311 have equal dimensions along the third direction Z, and the plurality of first sub-channels 311 are evenly spaced along the third direction Z. This further improves the uniformity of fluid flow.

[0038] In some embodiments, the second substrate 20 is provided with a fluid inlet 20a and a fluid outlet 20b. The fluid channel further includes a second channel layer 32a, which includes a second sub-channel 321 and a third sub-channel 322. One end of the second sub-channel 321 is connected to the fluid inlet 20a along a first direction X, and the other end is connected to a plurality of first sub-channels 311. One end of the third sub-channel 322 is connected to the fluid outlet 20b along the first direction X, and the other end is connected to a plurality of first sub-channels 311. Thus, the fluid entering through the fluid inlet 20a first passes through the second sub-channel 321, then enters the first sub-channel 311, then enters the third sub-channel 322, and finally flows out from the fluid outlet 20b. Based on this, the shape and size of the second sub-channel 321 and the third sub-channel 322 can be adaptively adjusted to avoid interference with the fluid entry and exit process.

[0039] Optionally, the first substrate 10 is used to fix the chip. Based on this, the fluid inlet 20a and the fluid outlet 20b are both located on the second substrate 20. This can avoid the fluid inlet 20a and the fluid outlet 20b interfering with the chip in terms of position, and there is no need to reserve more space on the first substrate 10 to set the fluid inlet 20a and the fluid outlet 20b, thereby reducing the size of the microchannel cooler 1.

[0040] Optionally, the projected area of ​​the second sub-channel 321 on the first substrate 10 is larger than the projected area of ​​the fluid inlet 20a on the first substrate 10, and larger than the projected area of ​​the first sub-channel 311 on the first substrate 10; the projected area of ​​the third sub-channel 322 on the first substrate 10 is larger than the projected area of ​​the fluid outlet 20b on the first substrate 10, and larger than the projected area of ​​the first sub-channel 311 on the first substrate 10. This avoids interference between the second sub-channel 321 and the third sub-channel 322 on the fluid flow process.

[0041] Optionally, the orthographic projection of a second sub-channel 321 on the first substrate 10 overlaps with the orthographic projections of multiple first sub-channels 311 on the first substrate 10; the orthographic projection of a third sub-channel 322 on the first substrate 10 overlaps with the orthographic projections of multiple second sub-channels 321 on the first substrate 10. Thus, the fluid entering through the fluid inlet 20a first passes through the second sub-channel 321, then flows into the multiple first sub-channels 311, achieving fluid pressure adjustment. The fluid pressure is further adjusted during flow through the multiple first channel layers 31a, then through the third sub-channel 322, and finally flows out from the fluid outlet 20b, thereby more effectively improving the uniformity of fluid flow.

[0042] In some embodiments, the flow channel layer 30 includes a plurality of first flow channel plates 31 stacked sequentially along a first direction X. The material of the first flow channel plates 31 includes at least one of copper and aluminum. A plurality of first sub-channels 311 are provided on the first flow channel plates 31. The first sub-channels 311 on the plurality of first flow channel plates 31 have the same layout, and two adjacent first flow channel plates 31 are staggered along the first direction X. This simplifies the structure and manufacturing process of the microchannel cooler 1 while ensuring uniform fluid flow. When the microchannel cooler 1 is applied to chip packaging, the flow channel shape design ensures that the fluid flow distribution matches the chip power, and the structural design increases the proportion of coolant turbulence, ensuring longitudinal flow and heat exchange of the coolant, thus improving heat dissipation efficiency.

[0043] Optionally, two adjacent first flow channel plates 31 are bonded together via a copper interface. It should be noted that traditional microchannel coolers 1 use indium solder encapsulation, which has a low melting point (157°C). Under long-term high-temperature operation, it is prone to electrothermal migration, leading to device failure and a significantly shortened lifespan. This embodiment uses copper interface bonding technology to replace traditional indium solder encapsulation, solving the problems of solder joint failure and short lifespan in the microchannel cooler 1 product under high temperatures.

[0044] Optionally, the flow channel layer 30 further includes a second flow channel plate 32 disposed between the first flow channel plate 31 and the second substrate 20, and the second flow channel plate 32 is provided with a second sub-channel 321 and a third sub-channel 322.

[0045] Optionally, the microchannel cooler 1 further includes a first inner pad 11 disposed on the side of the first substrate 10 facing the second substrate 20, and a second inner pad 21 disposed on the side of the second substrate 20 facing the first substrate 10; the first flow channel plate 31 is soldered to the first substrate 10 through the first inner pad 11, and the first flow channel plate 31 is soldered to the second substrate 20 through the second inner pad 21. In this way, the flow channel layer 30 can be fixed to the first substrate 10 and the second substrate 20.

[0046] Optionally, the microchannel cooler 1 further includes a first outer pad 12 disposed on the side of the first substrate 10 facing away from the second substrate 20, and a second outer pad 22 disposed on the side of the second substrate 20 facing away from the first substrate 10. The first outer pad 12 can be used for bonding to a chip, and can also be used to form a circuit, such as a circuit coupled to an external power supply, thereby controlling the flow state of the fluid.

[0047] The following are examples illustrating some steps in the above-mentioned microchannel cooler molding process.

[0048] Step S1: Provide a first substrate and a second substrate.

[0049] Step S2: Provide the flow channel layer.

[0050] Step S3: Fix the flow channel layer to the first substrate and the second substrate.

[0051] See Figure 1 and Figure 2 Specifically, in step S1, providing the first substrate 10 includes, for example, providing an aluminum nitride ceramic, an alumina ceramic, or a diamond substrate.

[0052] The second substrate 20 is provided, for example, an aluminum nitride ceramic, alumina ceramic, or a diamond substrate. Holes are laser-drilled in the second substrate 20 to form flow channel inlets and outlets, with a hole diameter of 3mm-5mm. The laser-processed second substrate 20 is cleaned using an alkaline solution / HF to remove slag generated during laser processing. The alkaline solution can be NaOH or KOH.

[0053] A seed layer metal is sputtered on the surfaces of the first substrate 10 and the second substrate 20 using magnetron sputtering. The thickness of the seed layer metal is 0.5um-3um, and the seed layer metal can be a metal layer such as titanium or copper.

[0054] Using photoresist combined with exposure and development technology, the required pad pattern is transferred to the surface of the first substrate 10 and the second substrate 20 based on the seed layer metal.

[0055] The surface of the pad pattern is filled with copper using an electroplating process.

[0056] The electroplated first substrate 10 and second substrate 20 are leveled to improve the flatness of the pad surface, so as to facilitate subsequent soldering and other processes.

[0057] The solder pad lines on the surfaces of the first substrate 10 and the second substrate 20 are etched out by removing the film.

[0058] In step S2, the flow channel layer 30 is provided, for example, by etching the required flow channel pattern on a 0.2mm-1mm thick copper foil using methods such as laser etching or chemical etching, to form a first flow channel plate 31 with a first sub-channel 311, and a second flow channel plate 32 with a second sub-channel 321 and a third sub-channel 322. The number of flow channel copper foil layers in a single microchannel cooler 1 product is 2-100 layers.

[0059] Multiple first flow channel plates 31 and second flow channel plates 32 are welded together using copper interface welding technology.

[0060] In step S3, fixing the flow channel layer 30 to the first substrate 10 and the second substrate 20 includes, for example, using copper interface welding technology to weld the flow channel layer 30 to the first substrate 10 and the first substrate 10 together.

[0061] The surface treatment of the welded products is carried out by physical grinding and chemical polishing.

[0062] A chemically plated surface finishing layer is applied. This finishing layer can be a silver layer, a nickel-gold layer, or a nickel-palladium-gold layer, with a thickness ranging from 0.5µm to 5µm.

[0063] The resulting microchannel cooler (MCC) is based on a micron-level channel structure and multi-stage turbulence enhancement design, significantly improving heat dissipation efficiency and heat flux density carrying capacity, increasing the upper limit of the operating temperature of MCC products, and solving the problem of interface welding failure at high temperatures. The miniaturized heat dissipation effect is enhanced by thinning the channel plate. The unique channel shape design ensures that the flow distribution matches the chip power, and the structural design increases the proportion of coolant turbulence, improving chip temperature uniformity by more than 50%. This microchannel cooler is suitable for high-power semiconductor devices (such as IGBTs and SiC / GaN modules), new energy vehicle electric drive systems, industrial servo equipment, 5G communication base stations, fiber lasers, and aerospace electronic equipment. Its compact and lightweight design achieves efficient thermal management, effectively suppressing performance degradation and safety hazards caused by high temperatures. This technology combines high efficiency, low energy consumption, and high adaptability, providing innovative thermal management solutions for new energy, high-end equipment, and intelligent manufacturing fields.

[0064] Based on the same inventive concept, this application also provides a semiconductor device, which includes a chip and the microchannel cooler of the above embodiments, wherein the chip is fixed to a first substrate, for example, the chip and the first substrate are fixed by soldering pads.

[0065] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" means at least two, for example, two, three, four, etc. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0066] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with the claims of this application shall still fall within the scope of this application.

Claims

1. A microchannel cooler characterized by, include: First substrate; The second substrate is disposed opposite to the first substrate along a first direction; A flow channel layer is disposed between the first substrate and the second substrate. The flow channel layer is provided with a fluid channel. The fluid channel includes a plurality of first channel layers arranged along the first direction. The first channel layer includes a plurality of first sub-channels. The plurality of first sub-channels of the same first channel layer are arranged in rows at intervals along the second direction and in columns at intervals along the third direction. Two adjacent first sub-channels along the first direction are staggered and connected. The first direction, the second direction, and the third direction intersect each other.

2. The micro-channel cooler of claim 1, wherein, One of the first sub-channels of the first channel layer is connected to multiple first sub-channels of adjacent first channel layers.

3. The micro-channel cooler of claim 2, wherein, The orthographic projection of one of the first sub-channels of one of the first channel layers on the first substrate overlaps with the orthographic projections of multiple first sub-channels of adjacent first channel layers on the first substrate, and the multiple overlapping areas are equal.

4. The micro-channel cooler of claim 1, wherein, The dimensions of the plurality of first sub-channels are equal along the first direction; The plurality of first sub-channels have the same size along the second direction, and the plurality of first sub-channels are evenly spaced along the second direction; The plurality of first sub-channels have equal dimensions along the third direction, and the plurality of first sub-channels are evenly spaced along the third direction.

5. The micro-channel cooler of claim 1, wherein, The second substrate is provided with a fluid inlet and a fluid outlet; The fluid channel further includes a second channel layer, which includes a second sub-channel and a third sub-channel; One end of the second sub-channel along the first direction is connected to the fluid inlet, and the other end is connected to multiple first sub-channels; One end of the third sub-channel along the first direction is connected to the fluid outlet, and the other end is connected to multiple first sub-channels.

6. The micro-channel cooler of claim 5, wherein, The projected area of ​​the second sub-channel on the first substrate is larger than the projected area of ​​the fluid inlet on the first substrate, and is also larger than the projected area of ​​the first sub-channel on the first substrate. The projected area of ​​the third sub-channel on the first substrate is greater than the projected area of ​​the fluid outlet on the first substrate, and is also greater than the projected area of ​​the first sub-channel on the first substrate.

7. The micro-channel cooler of claim 1, wherein, The flow channel layer includes a plurality of first flow channel plates stacked sequentially along the first direction, and the first flow channel plates are provided with a plurality of first sub-channels; The layout of the first sub-channels on multiple first flow channel plates is the same; The two adjacent first flow channel plates along the first direction are staggered.

8. The micro-channel cooler of claim 7, wherein, The two adjacent first flow channel plates are welded together via a copper interface.

9. The micro-channel cooler of claim 7, wherein, The microchannel cooler further includes a first inner pad disposed on the side of the first substrate facing the second substrate, and a second inner pad disposed on the side of the second substrate facing the first substrate. The first flow channel plate is soldered to the first substrate through the first inner pad, and the first flow channel plate is soldered to the second substrate through the second inner pad.

10. A semiconductor device, characterized by comprising: include: chip; The microchannel cooler as described in any one of claims 1-9; The chip is fixed with the first substrate. The chip is fixed with the first substrate. The chip is fixed with the first substrate. The chip is

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