LED die bonder adhesive plate

Abstract

The application discloses an LED die bonder glue disc, relates to the technical field of die bonder glue discs, and comprises a glue disc main body, a glue groove and a rotating rod, a cover is detachably connected to the upper side of the glue disc main body, the glue groove is arranged on the lower side of the glue disc main body, an installation groove is arranged on the inner side of the glue groove, a glue scraping mechanism is arranged between the glue groove and the installation groove, and a convex plate is fixedly connected to the upper side of the glue scraping mechanism; the rotating rod is rotatably connected to the lower side of the cover, the end of the rotating rod is fixedly connected with a connecting disc, connecting rods are fixedly connected to the two sides of the connecting disc, and a glue scraping mechanism is arranged at the bottom of the connecting rod. The device adopts a symmetrical double-station layout to realize synchronous glue scraping, the wedge-shaped block is driven to rotate and stir glue liquid by centrifugal force to maintain the fluidity of the glue liquid, the elastic element is compressed to store energy and then is rapidly released, the scraper scrapes off the glue at the bottom at high speed, the slope contact control and the detachable structure are combined, and the glue scraping efficiency is improved while glue liquid residue and dripping are completely avoided.

Description

Technical Field

[0001] This utility model relates to the field of die bonder tray technology, and more specifically, to an LED die bonder tray. Background Technology

[0002] Currently, LED die bonders often experience uneven glue distribution during dispensing due to insufficient glue flow, affecting bonding accuracy. Traditional glue trays typically employ a single-station scraper design, limiting scraper speed and making it difficult to thoroughly remove residual glue from the bottom. This residual glue tends to solidify and accumulate, causing fluctuations in subsequent dispensing volumes or dripping. Furthermore, prolonged static dispensing of the glue can lead to stratification. Existing equipment lacks effective agitation mechanisms, relying solely on external heating or stirring devices to maintain flowability. This not only increases energy consumption but also complicates equipment structure, making it difficult to meet the demands of efficient continuous production.

[0003] In existing technologies, the scraping action mostly adopts a rigid drive structure, resulting in low scraping speed and reset efficiency. When the adhesive is not completely scraped off, it is easy to form local accumulation. At the same time, the adhesive tray and the drive component are mostly fixedly connected, requiring complete disassembly for maintenance, which is cumbersome and easily damages precision components. Although some improved solutions introduce elastic elements, they do not combine them with a dynamic energy storage and release mechanism, so the improvement in scraping speed is limited. In addition, traditional adhesive trays lack a dual-station collaborative design, and the coverage area of ​​a single operation is small, making it difficult to adapt to the requirements of high-density die bonding processes, which restricts production efficiency and product yield. Therefore, in order to address the above technical problems, an LED die bonding machine adhesive tray is proposed here. Utility Model Content

[0004] The purpose of this utility model is to provide an LED die bonder tray that adopts a symmetrical dual-station layout to achieve synchronous glue scraping. Centrifugal force drives the wedge block to rotate and stir the glue to maintain its fluidity. Combined with the elastic element, the compressed energy is released quickly, allowing the scraper to scrape off the bottom glue at high speed. With the addition of inclined surface contact control and a detachable structure, the glue scraping efficiency is improved while completely avoiding glue residue and dripping.

[0005] This utility model is achieved through the following technical solution:

[0006] An LED die bonder tray, comprising:

[0007] The main body of the rubber tray has a detachable cover on its upper side;

[0008] The lower glue groove is located on the lower side of the glue tray body. There are two sets of lower glue grooves arranged in a centrally symmetrical manner. An installation groove is provided on the inner side of the lower glue groove. A glue scraping mechanism is installed between the lower glue groove and the installation groove. A protruding plate is fixedly connected to the upper side of the glue scraping mechanism.

[0009] A rotating rod is rotatably connected to the lower side of the cover. A connecting plate is fixedly connected to the end of the rotating rod. Connecting rods are fixedly connected to both sides of the connecting plate. A glue-dispensing mechanism is installed at the bottom of the connecting rod. Two sets of glue-dispensing mechanisms are installed symmetrically at the center. A driving mechanism is installed on the upper side of the cover.

[0010] Preferably, the main body of the rubber tray and the cover are detachably connected by threads.

[0011] Preferably, the adhesive scraping mechanism includes an installation groove, a sliding plate, and a scraper. The lower adhesive groove, the installation groove, and the sliding plate are all arc-shaped structures. The sliding plate is slidably connected to the inner side of the lower adhesive groove and the installation groove. The scraper is fixedly connected to the end of the sliding plate and abuts against one end of the lower adhesive groove. The first compression spring is fixedly connected to the inner side of the installation groove, and the end of the first compression spring is fixedly connected to the other end of the sliding plate.

[0012] Preferably, the convex plate is fixedly connected to the upper side of the slide plate.

[0013] Preferably, the drive mechanism includes a mounting base, a fixing plate, a drive motor, and an electrical control base. The mounting base is fixedly connected to the upper side of the cover, the fixing plate is fixedly connected to the inside of the mounting base, the drive motor is fixedly connected to the outside of the fixing plate, and the top of the rotating rod is fixedly connected to the lower side of the drive motor. The electrical control base is fixedly connected to the outside of the mounting base and provides power to the drive motor.

[0014] Preferably, the glue-applying mechanism includes a fixed cylinder, a wedge block, and a second compression spring. The fixed cylinder is fixedly connected to the bottom of the connecting rod, the wedge block is slidably connected to the lower side of the fixed cylinder, the second compression spring is fixedly connected to the inside of the fixed cylinder, and the end of the second compression spring is fixedly connected to the upper side of the wedge block. One side of the wedge block is provided with an inclined surface, and the inclined surface matches the convex plate.

[0015] Preferably, a connecting plate is fixedly connected to the upper side of the cover, and the connecting plate has mounting holes on its exterior.

[0016] The technical solution of this utility model has at least the following beneficial effects:

[0017] This LED die bonder's adhesive tray improves operational efficiency through dual-station synchronous adhesive scraping. It combines a flexible element compression energy storage and rapid release mechanism to drive the scraper at high speed to thoroughly remove adhesive residue. A rotating wedge block continuously agitates the adhesive under centrifugal force, creating a stable vortex with contact pressure, effectively maintaining adhesive uniformity and preventing stratification. Furthermore, the detachable threaded connection simplifies assembly and disassembly, while the inclined contact control precisely coordinates the scraping action and rotation rhythm. The dual-station layout expands the operational coverage, ensuring high-density die bonding needs. Through the synergistic optimization of enhanced adhesive flowability and scraping efficiency, it not only eliminates the risk of drip contamination but also ensures consistent dispensing volume, ultimately achieving the dual benefits of reduced energy consumption and extended equipment lifespan. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the second overall structure of the present invention;

[0020] Figure 3 for Figure 2 Enlarged view of A in the middle;

[0021] Figure 4 This is a partial cross-sectional view of the present invention;

[0022] Figure 5 for Figure 4 Enlarged view of B in the middle;

[0023] Figure 6 This is a partial structural schematic diagram of the present invention;

[0024] Figure 7 for Figure 6 Enlarged view of C;

[0025] Figure 8 This is a partial front sectional view of the present invention;

[0026] Figure 9 This is a partial structural front sectional view of the present invention;

[0027] Icons: 1. Glue tray body; 2. Cover; 3. Lower glue groove; 4. Mounting groove; 5. Slide plate; 6. Scraper; 7. First compression spring; 8. Protruding plate; 9. Mounting base; 10. Fixing plate; 11. Drive motor; 12. Electrical control base; 13. Rotating rod; 14. Connecting plate; 15. Connecting rod; 16. Fixing cylinder; 17. Wedge block; 18. Second compression spring; 19. Connecting plate. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] Example

[0030] This application discloses an LED die bonder tray, comprising a tray body 1, a lower adhesive groove 3, and a rotating rod 13. A cover 2 is detachably connected to the upper side of the tray body 1, and the tray body 1 and the cover 2 are detachably connected by threads. Installing the cover 2 prevents the silver paste stored in the tray from becoming reactive. The lower adhesive groove 3 is located on the lower side of the tray body 1, and there are two sets of lower adhesive grooves arranged symmetrically at the center. Figure 2 As shown, dual-station die bonding can be achieved by setting two sets of symmetrically installed lower adhesive tanks 3.

[0031] An installation groove 4 is provided on the inner side of the lower glue groove 3. A scraping mechanism is installed between the lower glue groove 3 and the installation groove 4. The scraping mechanism includes the installation groove 4, a sliding plate 5, and a scraper 6. The lower glue groove 3, the installation groove 4, and the sliding plate 5 are all arc-shaped. The sliding plate 5 is slidably connected to the inner side of the lower glue groove 3 and the installation groove 4. The scraper 6 is fixedly connected to the end of the sliding plate 5, and the scraper 6 abuts against one end of the lower glue groove 3. A first compression spring 7 is fixedly connected to the inner side of the installation groove 4, and the end of the first compression spring 7 is fixedly connected to the other end of the sliding plate 5. A protruding plate 8 is fixedly connected to the upper side of the sliding plate 5. Figure 2-5 As shown, the lower adhesive groove 3, mounting groove 4, and sliding plate 5 all have an arc-shaped structure to ensure that the sliding plate can be completely fitted when sliding inside the lower adhesive groove 3 and mounting groove 4. In addition, the scraper 6 abuts against the other end of the lower adhesive groove 3 to prevent silver paste leakage.

[0032] Rotating rod 13 is rotatably connected to the lower side of cover 2. A connecting plate 14 is fixedly connected to the end of rotating rod 13. Connecting rods 15 are fixedly connected to both sides of connecting plate 14. Two sets of connecting rods 15 can achieve synchronous glue application. A glue application mechanism is installed at the bottom of the connecting rod 15. The two glue application mechanisms are centrally symmetrically installed. The glue application mechanism includes a fixed cylinder 16, a wedge block 17, and a second compression spring 18. The fixed cylinder 16 is fixedly connected to the bottom of connecting rod 15. The wedge block 17 is slidably connected to the lower side of the fixed cylinder 16. The second compression spring 18 is fixedly connected inside the fixed cylinder 16, and its end is fixedly connected to the upper side of the wedge block 17. A slope is provided on one side of the wedge block 17, and the slope matches the protruding plate 8. Figure 6 , Figure 7 as well as Figure 9As shown, by applying pressure through the contact between the inclined surface of the wedge block 17 and the convex plate 8, the wedge block 17 can slide upward under the limiting action of the fixed cylinder 16 to compress the second compression spring 18. At the same time, it drives the slide plate 5 to retract into the mounting groove 4 and compress the first compression spring 7, realizing the silver glue application operation. When the wedge block 17 and the convex plate 8 are disengaged due to the upward sliding of the wedge block 17, the slide plate 5 can drive the scraper 6 to perform glue scraping operation under the elastic force of the first compression spring 7. At the same time, the second compression spring 18 will drive the wedge block 17 to push downward, and through the characteristics of the spring, it will achieve up and down stirring, improving the fluidity of the glue.

[0033] A drive mechanism is mounted on the upper side of the cover 2. The drive mechanism includes a mounting base 9, a fixing plate 10, a drive motor 11, and an electrical control base 12. The mounting base 9 is fixedly connected to the upper side of the cover 2, the fixing plate 10 is fixedly connected to the inside of the mounting base 9, the drive motor 11 is fixedly connected to the outside of the fixing plate 10, and the top of the rotating rod 13 is fixedly connected to the lower side of the drive motor 11. The electrical control base 12 is fixedly connected to the outside of the mounting base 9 and provides power to the drive motor 11. Figure 8 As shown, the drive motor 11 is powered by the electrical control base 12, which in turn drives the rotating rod 13 to rotate, thereby providing power for a series of operations such as applying glue, scraping glue, and stirring glue.

[0034] A connecting plate 19 is fixedly connected to the upper side of the cover 2, and the connecting plate 19 has mounting holes on its exterior, such as... Figure 1 As shown, the installation of the adhesive tray and the LED die bonder can be achieved through the connecting plate 19 and the mounting holes opened on its exterior.

[0035] The working principle of the LED die bonding machine tray based on the embodiment is to achieve efficient die bonding operation through dual-station collaborative operation. Two sets of lower glue grooves 3 are symmetrically arranged below the tray body 1 and embedded in the mounting grooves 4 to form a dual-station glue scraping system. After the drive motor 11 is powered by the electric control base 12, it drives the rotating rod 13 to drive the connecting plate 14 to rotate, so that the connecting rods 15 on both sides rotate synchronously around the axis. The fixed cylinder 16 and wedge block 17 at the end of the connecting rod 15 expand outward under the action of centrifugal force. The wedge block 17 at the bottom continuously stirs the glue liquid in the tray body 1. The rotational motion maintains the uniform flow of the glue liquid and prevents the glue from solidifying or separating.

[0036] When the drive mechanism is running, the inclined surface of the wedge block 17 at the bottom of the connecting rod 15 periodically contacts the convex plate 8 on the upper side of the slide plate 5, forcing the slide plate 5 to slide inward along the lower glue groove 3 and the mounting groove 4. At the same time, the first compression spring 7 is compressed to store energy. At the moment of disengagement, the first compression spring 7 quickly releases its elastic potential energy, pushing the slide plate 5 to reset outward, driving the scraper 6 at the end to scrape the bottom of the glue tray at high speed. This elastic energy storage and release mechanism significantly improves the scraping speed, ensures that the glue is completely blocked, and avoids glue residue. During the scraping process, the arc trajectory of the slide plate 5 and the symmetrical layout of the lower glue groove 3 are matched, so that the dual-station scraper 6 can complete the scraping action synchronously.

[0037] In addition, the second compression spring 18 inside the fixed cylinder 16 continuously applies downward pressure to the wedge block 17, so that the wedge block 17 always maintains contact pressure with the adhesive surface, forming an adhesive vortex during rotation, further promoting uniform distribution of the adhesive. The connecting plate 19 achieves rapid positioning of the equipment through the external mounting hole, and the threaded connection between the adhesive tray body 1 and the cover 2 facilitates disassembly and maintenance. This design, through the combination of mechanical linkage and elastic energy storage, effectively solves the problems of adhesive dripping and bottom residue while improving the adhesive scraping efficiency.

[0038] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A die bonder tray for LEDs, characterized in that, include: The main body of the rubber tray (1) has a detachable cover (2) on its upper side. The lower glue groove (3) is located on the lower side of the glue tray body (1), and there are two sets of lower glue grooves (3) arranged in a centrally symmetrical manner. The inner side of the lower glue groove (3) is provided with an installation groove (4). A scraping glue mechanism is installed between the lower glue groove (3) and the installation groove (4). A protruding plate (8) is fixedly connected to the upper side of the scraping glue mechanism. A rotating rod (13) is rotatably connected to the lower side of the cover (2). A connecting plate (14) is fixedly connected to the end of the rotating rod (13). Connecting rods (15) are fixedly connected to both sides of the connecting plate (14). A glue-dip mechanism is installed at the bottom of the connecting rod (15). The two sets of glue-dip mechanisms are installed in a centrally symmetrical manner. A driving mechanism is installed on the upper side of the cover (2).

2. The LED die bonder tray according to claim 1, characterized in that: The main body (1) of the rubber disc and the cover (2) are detachably connected by threads.

3. The LED die bonder tray according to claim 1, characterized in that: The glue scraping mechanism includes an installation groove (4), a sliding plate (5), and a scraper (6). The lower glue groove (3), the installation groove (4), and the sliding plate (5) are all arc-shaped structures. The sliding plate (5) is slidably connected to the inner side of the lower glue groove (3) and the installation groove (4). The scraper (6) is fixedly connected to the end of the sliding plate (5), and the scraper (6) abuts against one end of the lower glue groove (3). The first compression spring (7) is fixedly connected to the inner side of the installation groove (4), and the end of the first compression spring (7) is fixedly connected to the other end of the sliding plate (5).

4. The LED die bonder tray according to claim 3, characterized in that: The convex plate (8) is fixedly connected to the upper side of the slide plate (5).

5. The LED die bonder tray according to claim 1, characterized in that: The drive mechanism includes a mounting base (9), a fixing plate (10), a drive motor (11), and an electrical control base (12). The mounting base (9) is fixedly connected to the upper side of the cover (2). The fixing plate (10) is fixedly connected to the inside of the mounting base (9). The drive motor (11) is fixedly connected to the outside of the fixing plate (10), and the top of the rotating rod (13) is fixedly connected to the lower side of the drive motor (11). The electrical control base (12) is fixedly connected to the outside of the mounting base (9), and the electrical control base (12) provides power to the drive motor (11).

6. The LED die bonder tray according to claim 1, characterized in that: The glue-applying mechanism includes a fixed cylinder (16), a wedge block (17), and a second compression spring (18). The fixed cylinder (16) is fixedly connected to the bottom of the connecting rod (15). The wedge block (17) is slidably connected to the lower side of the fixed cylinder (16). The second compression spring (18) is fixedly connected to the inside of the fixed cylinder (16), and the end of the second compression spring (18) is fixedly connected to the upper side of the wedge block (17). One side of the wedge block (17) is provided with an inclined surface, and the inclined surface matches the convex plate (8).

7. The LED die bonder tray according to claim 1, characterized in that: The upper side of the cover (2) is fixedly connected to a connecting plate (19), and the connecting plate (19) has an installation hole on its exterior.

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