A cutting device for SMT circuit board production

Abstract

The utility model relates to circuit board manufacturing technical field discloses a cutting device for SMT circuit board production, include: cutting support and conveying assembly, cutting support front side is provided with recovery box, the left and right sides of conveying assembly all are fixedly provided with support no.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, specifically to a cutting device for SMT circuit board production. Background Technology

[0002] In the production process of SMT circuit boards, the cutting process is a crucial step, as its precision directly affects the quality of the circuit board and its subsequent performance.

[0003] Currently, existing SMT circuit board production cutting equipment generally has a problem when transporting and cutting circuit boards: due to the lack of efficient and accurate positioning and real-time monitoring and adjustment mechanisms, circuit boards are prone to tilting during transportation due to factors such as vibration and tension changes of the conveyor belt. In addition, most traditional limiting devices have a fixed structure during cutting, which makes it difficult to adapt to the dynamic positioning requirements of circuit boards of different specifications, resulting in the position of the circuit board shifting during the cutting process.

[0004] This skew and offset will result in insufficient cross-sectional accuracy during dimensional cutting, which will not only affect the appearance quality of the circuit board, but may also damage the circuits and components on the circuit board, reducing the product's pass rate and reliability. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a cutting device for SMT circuit board production.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A cutting device for SMT circuit board production includes: a cutting bracket and a conveying assembly. A recycling bin is provided on the front side of the cutting bracket. A bracket 1 and a bracket 2 are fixedly provided on the left and right sides of the conveying assembly. The bracket 1 is threadedly connected to the cutting bracket. A cutting assembly is fixedly provided on the top front side of the cutting bracket. A limit component is fixedly provided on the side of the cutting assembly away from the recycling bin. Laser sensors are provided on the left and right sides of the end of the conveying assembly near the recycling bin. The cutting bracket is used to support the conveying assembly and the cutting assembly. A main unit is provided in the empty compartment at the bottom of the cutting bracket.

[0008] The recycling bin is used to receive SMT circuit boards after they have been cut by the cutting component; the conveying component is used to transport the uncut SMT circuit boards to the cutting component for cutting; the cutting component is used to cut the SMT circuit boards; the host is used to control the operation of the conveying component, the cutting component, and the limiting component; the limiting component is used to clamp and limit the SMT circuit boards when they are transported to the cutting component.

[0009] The limiting component includes: a fixing plate, the fixing plates on both sides of the limiting component are threadedly fixed to the cutting component, a double-rod cylinder is horizontally set on both sides of the fixing plate, a limiting plate is fixedly set on the telescopic rod of the double-rod cylinder, a transition plate is set at the bottom of the fixing plate, the fixing plates on both sides are welded and fixedly connected to the transition plate, and the transition plate is used to receive the SMT circuit board of the conveying component to the cutting component.

[0010] Preferably, the conveying assembly includes: a second motor, rollers are provided on both the front and rear sides of the conveying assembly, a conveyor belt is covered on the rollers on both the front and rear sides of the conveying assembly, the second motor is fixed on the rear side of the cutting bracket, and a chain drive device is provided between the second motor and the roller on the side away from the recycling bin.

[0011] The chain drive device includes: gear one, gear two and chain, motor two shaft is fixedly connected to gear one, roller shaft is fixedly connected to gear two, chain is provided between gear one and gear two, and motor two is used to provide power to transport SMT circuit boards for the conveying component.

[0012] Laser sensors are installed on the left and right sides of the rollers on the side of the conveying assembly closest to the recycling bin. The laser axis is vertically aligned with the edge of the SMT circuit board. The laser sensors are used to measure the width of the SMT circuit board in real time. Once the width changes, the limiting assembly will repeatedly clamp and limit the SMT circuit board.

[0013] Preferably, the cutting assembly includes: a top plate and a cutting frame plate. A motor is set in the center of the top plate. The telescopic rod of the motor passes through the circular through hole in the top plate and is fixedly connected to the cutting frame plate. Multiple sets of buffer rods are installed inside the cutting frame plate. A pressing plate is set at the bottom end of the buffer rod. A cutting blade is fixedly installed on the front side of the cutting frame plate. The bottom of the top plate is threadedly fixedly connected to the fixing plate of the limiting assembly. A U-shaped frame is fixedly installed on both the left and right sides of the end of the top plate away from the recycling bin. The other end of the U-shaped frame is threadedly fixedly connected to the top of the bracket.

[0014] The buffer rod is used to buffer the SMT circuit board when the cutting frame moves downward under the action of motor one. After the pressing plate fixes the SMT circuit board, the buffer rod provides buffer when the cutting frame continues to move downward until the cutting blade finishes cutting.

[0015] Preferably, the transition plate and the top surface of the conveyor belt of the conveyor assembly are located on the same plane.

[0016] Preferably, a receiving plate is fixedly installed on the corresponding pressing plate of the cutting bracket. The receiving plate and the pressing plate press and fix the SMT circuit board. A transition spring is provided on the side of the cutting bracket on the front side of the receiving plate. The transition spring is used to smoothly eject the cut SMT circuit board into the recycling bin.

[0017] Compared with the prior art, the present invention provides a cutting device for SMT circuit board production, which has the following advantages:

[0018] The limiting assembly includes fixed plates on both sides that are threadedly connected to the cutting assembly. A horizontally mounted double-rod cylinder on the fixed plate can move the limiting plate flexibly via a telescopic rod. When an uncut SMT circuit board is transported to the cutting assembly, the double-rod cylinder can clamp and limit the circuit board according to its actual width by controlling the position of the limiting plate. This adjustable clamping method can accommodate circuit boards of different widths, and the clamping force is uniform and stable, ensuring that the circuit board maintains an accurate position during transportation and cutting, avoiding cutting skew caused by positional deviation. From a mechanical structure perspective, this provides a reliable positioning guarantee for high-precision cutting.

[0019] Laser sensors are installed on both sides of the rollers on the side of the conveyor assembly closest to the recycling bin. The laser axes are perpendicularly aligned with the edge of the SMT circuit board, enabling real-time and accurate measurement of the board's width. When the board's width changes due to production errors or other factors, the laser sensors immediately send a signal back to the host computer. The host computer then controls the limit assembly to repeatedly clamp and limit the board, adjusting its position in a timely manner to achieve dynamic calibration.

[0020] This real-time monitoring and feedback mechanism enables the device to quickly respond to and correct any potential circuit board misalignment during transportation, avoiding the cutting accuracy problems caused by the inability of traditional devices to detect changes in circuit board position in real time, and improving the stability and accuracy of the cutting process. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0022] Figure 2 This is a three-dimensional structural diagram of the interior left side of this utility model;

[0023] Figure 3 This is a three-dimensional structural diagram of the limiting component in this utility model;

[0024] Figure 4 In this utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0025] Figure 5 This is a three-dimensional structural diagram of the cutting component in this utility model;

[0026] Figure 6 This is a schematic diagram of the planar structure of the present invention;

[0027] Figure 7 This is a three-dimensional structural diagram of the cutting bracket in this utility model.

[0028] The components include: 1. Cutting bracket; 2. Recycling bin; 3. Cutting assembly; 5. Conveying assembly; 6. Motor II; 7. Roller; 8. Laser sensor; 9. Limiting assembly; 301. Motor I; 302. Cutting blade; 303. Receiving plate; 304. Pressing plate; 305. Top plate; 306. Cutting and pressing frame plate; 401. Bracket I; 402. Bracket II; 601. Chain drive device; 901. Double-rod cylinder; 902. Limiting plate; 903. Transition plate. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Reference Figures 1-7 As shown, this embodiment of a cutting device for SMT circuit board production includes a cutting bracket 1 and a conveying assembly 5. A recycling bin 2 is provided on the front side of the cutting bracket 1 to receive the cut SMT circuit boards. A first bracket 401 and a second bracket 402 are fixedly provided on both the left and right sides of the conveying assembly 5, wherein the first bracket 401 is threadedly connected to the cutting bracket 1 to provide stable support for the conveying assembly 5. A cutting assembly 3 is fixedly provided on the top front side of the cutting bracket 1, and a limiting assembly 9 is fixedly provided on the side away from the recycling bin 2 to clamp and limit the circuit boards transported to the cutting assembly 3. Laser sensors 8 are provided on the left and right sides of the end of the conveying assembly 5 near the recycling bin 2, with their laser axes perpendicularly aligned with the edge of the circuit board to monitor changes in the circuit board width in real time. A main unit is provided in the empty compartment at the bottom of the cutting bracket 1 to uniformly control the coordinated operation of the conveying assembly 5, the cutting assembly 3, and the limiting assembly 9.

[0031] The limiting component 9 includes fixed plates on both sides that are threadedly fixed to the cutting component 3. A double-rod cylinder 901 is horizontally mounted on the fixed plate, and a limiting plate 902 is fixedly connected to its telescopic rod. The spacing of the limiting plates 902 can be adjusted by extending and retracting the cylinders to clamp circuit boards of different widths. A transition plate 903 is welded to the bottom of the fixed plate. The transition plate 903 is on the same plane as the top surface of the conveyor belt of the conveying component 5 to ensure that the circuit board is smoothly transferred to the cutting component 3.

[0032] Rollers 7 are installed on both the front and rear sides of the conveying assembly 5, and a conveyor belt covers the outer side. The second motor 6 is fixed to the rear side of the cutting bracket 1 and is connected to the roller 7 on the side away from the recycling bin 2 through a chain drive device 601. The chain drive device 601 includes a first gear, a second gear, and a chain. The shaft of the second motor 6 is fixed to the first gear, and the shaft of the roller 7 is fixed to the second gear. Power is transmitted through the chain to achieve stable conveying motion.

[0033] The cutting assembly 3 includes a top plate 305 and a cutting frame plate 306. A motor 301 is located in the center of the top plate 305, and its telescopic rod passes through a circular through hole in the top plate and is fixedly connected to the cutting frame plate 306. Multiple sets of buffer rods pass through the cutting frame plate 306, and a pressing plate 304 is connected to the bottom end. A cutting blade 302 is fixed to the front side. The bottom of the top plate 305 is threadedly connected to the fixing plate of the limiting assembly 9, and the end away from the recycling bin 2 is threadedly fixed to the top of the bracket 402 through a "┐" frame, forming a stable cutting structure.

[0034] In some examples, laser sensors 8 are installed on both sides of the roller 7 near the recycling bin 2 of the conveying assembly 5, with their laser axes perpendicularly aligned with the edge of the circuit board. When the width of the circuit board changes due to production errors or transmission vibrations, the laser sensors 8 feed back signals to the host in real time. The host then controls the double-rod cylinder 901 of the limiting assembly 9 to adjust the position of the limiting plate 902, dynamically clamping and calibrating the circuit board to avoid transmission skewing caused by width changes and ensure cutting position accuracy.

[0035] In some examples, the buffer rod installed inside the cutting frame plate 306 of the cutting assembly 3 provides cushioning force when the cutting frame plate 306 is driven downward by the motor 301. The pressing plate 304 first contacts the circuit board and is fixed by the receiving plate 303. At this time, the buffer rod compresses to provide cushioning force, allowing the cutting frame plate 306 to continue downward until the cutting blade 302 completes the cutting. This cushioning design avoids circuit board displacement caused by rigid downward pressure, and, in conjunction with the clamping of the limiting assembly 9, further improves the stability of the cutting process.

[0036] In some examples, a receiving plate 303 is fixedly installed on the cutting bracket 1 at the position corresponding to the pressing plate 304. The two work together to clamp the circuit board, ensuring that the circuit board is completely attached and fixed during cutting. A transition spring is provided on the side of the cutting bracket 1 in front of the receiving plate 303. After cutting, the elastic action of the transition spring allows the circuit board to smoothly spring into the recycling bin 2, preventing the cut circuit board from remaining in the cutting area and improving production efficiency.

[0037] In some examples, the transition plate 903 of the limiting component 9 is kept strictly on the same plane as the top surface of the conveyor belt of the conveying component 5, eliminating the height difference during the transmission process, reducing the positional shift of the circuit board due to bumps or jams, ensuring that the circuit board enters the cutting area smoothly, and providing the preconditions for the precise clamping of the limiting component 9.

[0038] In some examples, gear one and gear two of the chain drive device 601 are connected by a chain. Compared with belt drive, chain drive has higher transmission accuracy and wear resistance, avoids transmission speed fluctuations caused by transmission slippage, and ensures that the circuit board is transported to the cutting position at a stable speed, in conjunction with the real-time monitoring of laser sensor 8.

[0039] In some examples, the main unit installed in the bottom empty compartment of the cutting bracket 1 adopts a modular integrated design, integrating functional modules such as sensor signal processing, cylinder drive control, and motor speed adjustment. Cutting parameters of different specifications of circuit boards can be preset through the human-machine interface, realizing intelligent collaborative control of the clamping distance of the limit component 9, the pressing speed of the cutting component 3, and the transmission rate of the conveying component 5, which significantly improves the automation level and applicability of the device.

[0040] The working principle of this utility model is as follows:

[0041] When using this SMT circuit board production cutting device, the equipment layout must first be planned according to the SMT circuit board production process, and the cutting bracket 1 should be stably fixed in the corresponding position on the production line. Through the threaded connection structure of bracket 1 401, the conveyor assembly 5 is horizontally installed on both sides of the cutting bracket 1, ensuring that the conveyor belt of the conveyor assembly 5 and the top surface of the transition plate 903 are on the same plane. Simultaneously, the "┐" frame at the top of bracket 2 402 is threadedly fixed to the top plate 305 of the cutting assembly 3, forming a stable support structure. The laser sensor 8 is aligned with the edge of the circuit board at the end of the conveyor belt, and the host computer completes the initial calibration of each component.

[0042] When the device is started, the main unit controls motor 6 to drive the conveyor assembly 5 via chain transmission device 601. The shaft of motor 6 drives gear 1 to rotate, which in turn drives gear 2 and roller 7 to rotate synchronously via the chain, thereby driving the conveyor belt to transport the uncut SMT circuit board towards the cutting assembly 3. During the conveying process, the laser sensor 8 near the recycling bin 2 emits a laser perpendicular to the edge of the circuit board in real time to continuously measure the width of the circuit board. If the width data changes due to differences in circuit board specifications or transmission vibration, the laser sensor 8 immediately feeds the signal back to the main unit. The main unit synchronously controls the double-rod cylinder 901 of the limiting assembly 9 to adjust the travel of the telescopic rod, causing the limiting plate 902 to move towards each other, dynamically clamping and limiting the circuit board to ensure that it enters the cutting area in a precise position.

[0043] When the circuit board is conveyed to the transition plate 903 of the limiting assembly 9, the double-rod cylinder 901 has completed the position calibration of the limiting plate 902 based on the real-time data of the laser sensor 8. The limiting plates 902 on both sides apply uniform clamping force from both sides of the circuit board to keep it in a centered state. At this time, the motor 301 of the main control cutting assembly 3 starts, and the telescopic rod drives the cutting frame plate 306 to move downward. The pressing plate 304 inside the cutting frame plate 306 first contacts the circuit board and cooperates with the receiving plate 303 on the cutting bracket 1 to completely fix the circuit board. As the cutting frame plate 306 continues to descend, the buffer rod compresses to generate buffering force, ensuring that the pressing plate 304 remains fixed. The cutting blade 302 on the front side of the cutting frame plate 306 finally contacts the circuit board and completes the cutting. During the cutting process, the buffering effect of the buffer rod avoids the displacement of the circuit board caused by rigid downward pressure. Combined with the precise clamping of the limiting assembly 9, it ensures high accuracy of the cross-sectional dimensions.

[0044] After cutting, motor 301 drives the cutting frame plate 306 to reset, and the pressing plate 304 disengages from the circuit board. At this time, the transition spring on the front side of the receiving plate 303 uses elastic deformation to smoothly spring the cut circuit board into the recycling bin 2, avoiding manual intervention or circuit board retention.

[0045] The gears and chain of the chain drive device 601 can be quickly disassembled and cleaned, and the double-rod cylinder 901 of the limit component 9 can be replaced independently, ensuring long-term stable operation of the equipment. The linkage mechanism between the laser sensor 8 and the limit component 9 effectively solves the cutting accuracy problem caused by the skewed transmission of the circuit board in traditional devices, and improves the production efficiency and yield of SMT circuit boards through automated control.

[0046] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cutting device for SMT circuit board production, characterized in that, include: A cutting bracket (1) and a conveying assembly (5) are provided. A recycling bin (2) is provided on the front side of the cutting bracket (1). A bracket one (401) and a bracket two (402) are fixedly provided on the left and right sides of the conveying assembly (5). The bracket one (401) is threadedly connected to the cutting bracket (1). A cutting assembly (3) is fixedly provided on the top front side of the cutting bracket (1). A limit assembly (9) is fixedly provided on the side of the cutting assembly (3) away from the recycling bin (2). Laser sensors (8) are provided on the left and right sides of the end of the conveying assembly (5) close to the recycling bin (2). The cutting bracket (1) is used to support the conveying assembly (5) and the cutting assembly (3). The main unit is provided in the empty compartment at the bottom of the cutting bracket (1). The recycling bin (2) is used to receive the SMT circuit boards cut by the cutting component (3); the conveying component (5) is used to transport the uncut SMT circuit boards to the cutting component (3) for cutting; the cutting component (3) is used to cut the SMT circuit boards; the host is used to control the operation of the conveying component (5), the cutting component (3) and the limiting component (9); the limiting component (9) is used to clamp and limit the SMT circuit boards when the uncut SMT circuit boards are transported to the cutting component (3); The limiting component (9) includes: a fixing plate, the fixing plates on both sides of the limiting component (9) are threadedly fixed to the cutting component (3), a double-rod cylinder (901) is horizontally arranged on both sides of the fixing plate, a limiting plate (902) is fixedly arranged on the telescopic rod of the double-rod cylinder (901), a transition plate (903) is arranged at the bottom of the fixing plate, the fixing plates on both sides are welded and fixedly connected to the transition plate (903), and the transition plate (903) is used to receive the SMT circuit board of the conveying component to the cutting component (3).

2. The cutting device for SMT circuit board production according to claim 1, characterized in that, The conveying assembly (5) includes: a second motor (6), rollers (7) are provided on both the front and rear sides of the conveying assembly (5), and a conveyor belt is covered on the rollers (7) on both the front and rear sides of the conveying assembly (5). The second motor (6) is fixed on the rear side of the cutting bracket (1), and a chain drive device (601) is provided between the second motor (6) and the roller (7) on the side away from the recycling box (2). The chain drive device (601) includes: a first gear, a second gear and a chain, a second motor (6) shaft fixedly connected to the first gear, a roller (7) shaft fixedly connected to the second gear, a chain is provided between the first gear and the second gear, and the second motor (6) is used to provide power to the conveying assembly (5) to transport SMT circuit boards. Laser sensors (8) are installed on the left and right sides of the rollers on the side of the conveying component (5) near the recycling bin (2). The laser axis is vertically aligned with the edge of the SMT circuit board. The laser sensor (8) is used to measure the width of the SMT circuit board in real time. Once the width changes, the limiting component (9) will repeatedly clamp and limit the SMT circuit board.

3. The cutting device for SMT circuit board production according to claim 1, characterized in that, The cutting assembly (3) includes: a top plate (305) and a cutting frame plate (306). A motor (301) is provided in the center of the top plate (305). The telescopic rod of the motor (301) passes through the circular through hole on the top plate (305) and is fixedly connected to the cutting frame plate (306). Multiple sets of buffer rods are installed inside the cutting frame plate (306). A pressing plate (304) is provided at the bottom of the buffer rod. A cutting blade (302) is fixedly installed on the front side of the cutting frame plate (306). The bottom of the top plate (305) is threadedly fixedly connected to the fixing plate of the limiting assembly (9). A "┐" frame is fixedly installed on both the left and right sides of the end of the top plate away from the recycling box (2). The other end of the "┐" frame is threadedly fixedly connected to the top of the bracket (402). The buffer rod is used to buffer the cutting frame plate (306) when it moves downward under the action of motor (301). After the pressing plate (304) fixes the SMT circuit board, the buffer rod provides buffer when the cutting frame plate (306) continues to move downward until the cutting blade (302) finishes cutting.

4. The cutting device for SMT circuit board production according to claim 1, characterized in that, The transition plate (903) and the top surface of the conveyor belt of the conveyor assembly (5) are on the same plane.

5. A cutting device for SMT circuit board production according to claim 1, characterized in that, A receiving plate (303) is fixedly installed on the corresponding pressing plate (304) of the cutting bracket (1). The receiving plate (303) and the pressing plate (304) press and fix the SMT circuit board. A transition spring is provided on the side of the front cutting bracket (1) on the receiving plate (303). The transition spring is used to smoothly spring the cut SMT circuit board into the recycling box (2).

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