A silicon wafer cutting convenient to move silicon wafer rack
By designing a movable silicon wafer rack and utilizing a gear rack structure and clamping components, the problem of inconvenient silicon wafer handling during cutting was solved, achieving stable cutting and efficient handling of silicon wafers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XINJIANG HORGOS HESHENG NEW ENERGY TECHNOLOGY CO LTD
- Filing Date
- 2025-07-03
- Publication Date
- 2026-06-26
AI Technical Summary
Existing silicon wafer racks are inconvenient to handle during cutting due to the small gaps between the wafers, which reduces work efficiency.
A movable placement rack for silicon wafer cutting was designed, which adopts storage components and clamping components. The rack and pinion structure enables convenient picking up of silicon wafers, and the clamping components keep the silicon wafers stable.
It improves the efficiency of silicon wafer handling, enhances the stability of silicon wafers during the cutting process, and increases work efficiency.
Smart Images
Figure CN224408081U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of placement device technology, specifically a silicon wafer placement rack for easy movement during silicon wafer cutting. Background Technology
[0002] Single-crystal silicon wafers are classified by diameter into 6-inch, 8-inch, 12-inch (300 mm), and 18-inch (450 mm) wafers. Larger diameter wafers can accommodate more integrated circuits, resulting in lower chip costs. However, larger wafers also place higher demands on materials and technology. Single-crystal silicon is grown using different methods, including Czochralski (CZ), floppy zone (FZ), and epitaxy. CZ and FZ methods grow single-crystal silicon rods, while epitaxy grows single-crystal silicon thin films. Single-crystal silicon grown using the CZ method is primarily used in semiconductor integrated circuits, diodes, epitaxial wafer substrates, and solar cells. After production, single-crystal silicon wafers need to be stored using racks for easy access and cutting.
[0003] However, existing wafer racks typically arrange multiple silicon wafers together, which makes them difficult to handle during dicing due to the small gaps between the wafers, thus reducing work efficiency. Therefore, a wafer rack designed for easier handling was developed to address these issues. Utility Model Content
[0004] (a) Technical problems to be solved
[0005] To address the shortcomings of existing technologies, this utility model provides a movable silicon wafer placement rack for silicon wafer cutting, which has the advantages of easy handling and improved work efficiency, and solves the problem of inconvenient handling during use of existing devices.
[0006] (II) Technical Solution
[0007] To achieve the above objectives, this utility model provides the following technical solution: a movable silicon wafer placement rack for silicon wafer cutting, comprising: a mobile trolley with a placement platform on its top; a storage assembly on the top of the placement platform, the storage assembly comprising: a storage shell disposed on the top of the placement platform; a housing disposed on the top of the placement platform; a crossbar disposed inside the housing and connected at both ends to the inner sidewall of the housing; a gear rotatably disposed on the outer sidewall of the crossbar; a sliding groove formed on the outer sidewall of the housing; a slider slidably disposed inside the sliding groove, one of the sliders being connected to one side of the bottom of the storage shell; a rack disposed at one end of the slider and meshing with the gear; a pressure plate disposed on one side of the other slider; and a clamping assembly disposed inside the storage shell for clamping the silicon wafer and keeping it stable.
[0008] Optionally, the slider has an I-shaped design.
[0009] Optionally, the storage component further includes a sponge strip disposed on the top of the pressure plate.
[0010] Optionally, the storage assembly further includes a spring disposed on the top of the placement platform, with its top end connected to the pressure plate.
[0011] Optionally, the storage assembly further includes: a telescopic rod disposed inside the spring, with its bottom end connected to the placement platform and its top end connected to the pressure plate.
[0012] Optionally, the clamping assembly includes: a base plate with one end penetrating through the outer side wall of the storage shell and inserted into the interior; an upright plate disposed inside the storage shell and connected at its bottom end to the base plate; and two springs with both ends connected to the inner side wall of the storage shell and the upright plate.
[0013] Optionally, the clamping assembly further includes a button disposed at one end of the base plate.
[0014] Optionally, the clamping assembly further includes a clamping plate disposed on one side of the upright plate and on the inner sidewall of the storage shell.
[0015] (III) Beneficial Effects
[0016] Compared with the prior art, the present invention provides a movable silicon wafer holder for silicon wafer cutting, which has the following advantages:
[0017] 1. This placement rack and storage component move the pressure plate downwards, causing the slider to slide inside the groove. This drags the rack and gears to engage, causing the storage shell to move upwards, which makes the top of the silicon wafer protrude, making it easier to pick up and cut.
[0018] 2. This placement rack, with its clamping assembly, uses a spring-loaded return mechanism to move the upright plate, thereby clamping the silicon wafer and maintaining its stability. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the structure of this utility model;
[0020] Figure 2 This is a schematic diagram of the internal structure of the housing of this utility model;
[0021] Figure 3 This is a schematic diagram of the structure of the storage component of this utility model;
[0022] Figure 4 This is a schematic diagram of the clamping assembly of this utility model.
[0023] In the picture: 11. Mobile cart; 12. Placement platform;
[0024] 2. Storage components; 21. Storage shell; 22. Shell; 23. Crossbar; 24. Gear; 25. Slide groove; 26. Slider; 27. Rack; 28. Pressure plate; 281. Sponge strip; 29. Spring 1; 291. Telescopic rod;
[0025] 3. Clamping assembly; 31. Base plate; 32. Vertical plate; 33. Spring 2; 34. Button; 35. Clamping plate. Detailed Implementation
[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0027] It should be noted that all directional indications in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0028] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0029] In related technologies, placement racks typically arrange multiple silicon wafers together. However, when picking them up for cutting, the small gaps between the wafers make them inconvenient to handle, thus reducing work efficiency.
[0030] To address some of the problems in related technologies, this application provides a movable silicon wafer placement rack for silicon wafer cutting. When silicon wafers need to be cut, a moving trolley 11 is used to move the placement platform 12 to one side of the cutting machine. At this time, the silicon wafer inside the storage shell 21 needs to be removed. Simply push the pressure plate 28 downward, causing the pressure plate 28 to drive the slider 26 to slide inside the slide groove 25. At the same time, push the rack 27 downward to engage with the gear 24. The rotation of the gear 24 will cause the two racks 27 to move alternately. Since the slider 26 at the bottom of the storage shell 21 is connected to the rack 27, it will drive the storage shell 21 to move upward, thereby pushing the silicon wafer upward for easy removal. The removed silicon wafer is then placed into the cutting machine for cutting.
[0031] This application is described below with reference to the accompanying drawings and specific embodiments:
[0032] This application provides a movable silicon wafer placement rack for silicon wafer dicing, comprising: a mobile trolley 11 with a placement platform 12 on its top; a storage assembly 2 on the top of the placement platform 12, the storage assembly 2 comprising: a storage shell 21 disposed on the top of the placement platform 12; a housing 22 disposed on the top of the placement platform 12; a crossbar 23 disposed inside the housing 22 and connected at both ends to the inner sidewall of the housing 22; a gear 24 rotatably disposed on the outer sidewall of the crossbar 23; a slide groove 25 formed on the outer sidewall of the housing 22; a slider 26 slidably disposed inside the slide groove 25, one of the sliders 26 being connected to one side of the bottom end of the storage shell 21; a rack 27 disposed at one end of the slider 26 and meshing with the gear 24; a pressure plate 28 disposed on one side of the other slider 26; and a clamping assembly 3 disposed inside the storage shell 21 for clamping the silicon wafer and keeping it stable.
[0033] Specifically, silicon wafer cutting primarily utilizes diamond wire cutting machines. Diamond wire is made by uniformly bonding diamond micro-powder particles at a specific density onto a base wire (typically high-carbon steel wire). The cutting is achieved through high-speed grinding motion between the diamond wire and the object being cut. Diamond wire cutting offers advantages such as higher wafer yield, faster cutting speed, and less environmental pollution, making it widely used in photovoltaic silicon wafer cutting.
[0034] When silicon wafers need to be cut, the placement platform 12 is moved to one side of the cutting machine using the moving trolley 11. Then, the silicon wafers inside the storage shell 21 need to be removed. This is done by manually pushing the pressure plate 28 downwards, causing the slider 26 to slide inside the groove 25. Simultaneously, the rack 27 moves downwards and engages with the gear 24. The rotation of the gear 24 causes the two racks 27 to move alternately. Because the slider 26 at the bottom of the storage shell 21 is connected to the rack 27, the storage shell 21 moves upwards above the other storage shells 21, thus pushing the silicon wafers upwards as well. This makes the silicon wafers taller than the others, facilitating their removal. The removed silicon wafers are then placed into the cutting machine for cutting. After all the silicon wafers inside the storage shell 21 have been cut, the storage shell 21 needs to be manually replenished.
[0035] Furthermore, the slider 26 has an I-shaped design.
[0036] When in use, the I-shaped design allows the slider 26 to slide stably inside the groove 25 without detaching from it.
[0037] Furthermore, the storage component 2 also includes a sponge strip 281 disposed on the top of the pressure plate 28.
[0038] The design of the sponge strip 281 during use can improve comfort when pressing the pressure plate 28, and also increase friction.
[0039] Furthermore, the storage component 2 also includes a spring 29 disposed on the top of the placement platform 12, and the top end of the spring is connected to the pressure plate 28.
[0040] When in use, the design of spring 29 can push the pressure plate 28 to move upward, so after the pressure plate 28 is released, the spring 29 can better push the pressure plate 28 to reset.
[0041] Furthermore, the storage component 2 also includes: a telescopic rod 291 disposed inside the spring 29, with its bottom end connected to the placement platform 12 and its top end connected to the pressure plate 28.
[0042] The design of the telescopic rod 291 ensures that the spring 29 will not bend when compressed, thus better protecting the spring 29.
[0043] Furthermore, the clamping assembly 3 includes: a base plate 31 with one end penetrating through the outer side wall of the storage shell 21 and inserted into the interior; a vertical plate 32 disposed inside the storage shell 21 and connected at its bottom end to the base plate 31; and two springs 33 with both ends connected to the inner side wall of the storage shell 21 and the vertical plate 32.
[0044] When placing the silicon wafer into the housing 21, simply push the base plate 31 into the housing 21 while moving the upright plate 32 and compressing the spring 33. After placing the silicon wafer into the housing 21, release the base plate 31 and the spring 33 will rebound and push the upright plate 32 to move, which can clamp the silicon wafer and keep it stable.
[0045] Furthermore, the clamping assembly 3 also includes a button 34 disposed at one end of the base plate 31.
[0046] When in use, the button 34 is designed to make it easy to push the base plate 31 into the inside of the storage shell 21.
[0047] Furthermore, the clamping assembly 3 also includes a clamping plate 35 disposed on one side of the upright plate 32 and on the inner sidewall of the storage shell 21.
[0048] When in use, the clamping plate 35 has a triangular design on the inside, which makes it less likely for the silicon wafer to move when clamping it.
[0049] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," and "some examples" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.
[0050] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0051] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A movable silicon wafer holder for silicon wafer dicing, comprising: A mobile cart with a platform on top; The feature is that: a storage component is provided on the top of the placement platform, the storage component comprising: A storage shell is disposed on top of the placement platform; A housing is disposed on top of the placement platform; A crossbar is disposed inside the housing and its two ends are connected to the inner sidewall of the housing; A gear is rotatably mounted on the outer wall of the crossbar; A groove is formed on the outer side wall of the housing; A slider is slidably disposed inside the groove, and one of the sliders is connected to one side of the bottom end of the storage shell; A rack is disposed at one end of the slider and meshes with the gear; A pressure plate is disposed on one side of the other slider; The storage shell is equipped with a clamping assembly inside to hold the silicon wafer and keep it stable.
2. The silicon wafer placement rack for easy movement during silicon wafer cutting according to claim 1, characterized in that: The slider has an I-shaped design.
3. The silicon wafer placement rack for easy movement during silicon wafer dicing according to claim 1, characterized in that: The storage component also includes: A sponge strip is placed on top of the pressure plate.
4. A movable silicon wafer holder for silicon wafer dicing according to claim 1, characterized in that: The storage component also includes: Spring 1 is located at the top of the placement platform, and its top end is connected to the pressure plate.
5. A movable silicon wafer holder for silicon wafer dicing according to claim 4, characterized in that: The storage component also includes: The telescopic rod is located inside the spring and its bottom end is connected to the placement platform, while its top end is connected to the pressure plate.
6. A movable silicon wafer holder for silicon wafer dicing according to claim 1, characterized in that: The clamping assembly includes: The base plate extends through the outer wall of the storage shell at one end and is inserted into the interior; An upright plate is disposed inside the storage shell and its bottom end is connected to the bottom plate; Spring 2 has both ends connected to the inner sidewall of the storage shell and the upright plate.
7. A movable silicon wafer holder for silicon wafer dicing according to claim 6, characterized in that: The clamping assembly further includes: A button is located at one end of the base plate.
8. A movable silicon wafer holder for silicon wafer dicing according to claim 6, characterized in that: The clamping assembly further includes: A clamping plate is disposed on one side of the upright plate and on the inner side wall of the storage shell.