Water treatment equipment
By embedding heat exchange components into the water exchange tank and combining them with semiconductor cooling chips and cooling pipes, the problem of low efficiency of air-cooled systems in high-temperature environments is solved, achieving efficient and compact water temperature regulation and miniaturized design, thus improving the reliability and flexibility of the equipment.
Patent Information
- Application Number
- CN202521267834.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-19
- Publication Date
- 2026-06-26
- Estimated Expiration
- 2035-06-19
AI Technical Summary
Existing air-cooled systems for water purification equipment have low cooling efficiency in high-temperature environments, occupy a large space, and cannot meet the requirements for miniaturization and high efficiency. In addition, the limited contact area between heat exchange components and heat exchange pipelines leads to unsatisfactory heat exchange efficiency.
A temperature control device is adopted, especially by embedding the heat dissipation end of the heat exchanger into the hot water tank to effectively contact the hot water source. Combined with semiconductor cooling chips and cooling pipes, heat exchange fins and coupling pipes are added to optimize fluid flow and design a compact heat exchange system.
It improves cooling efficiency and stability, reduces equipment space requirements, meets miniaturization needs, enhances heat exchange efficiency and temperature control flexibility, and achieves rapid and uniform water temperature adjustment.