Medicament cooling cup

Abstract

The application discloses a medicine refrigeration cup, which comprises a refrigeration cup cover and a cup body, a partition plate is arranged in the middle of the refrigeration cup cover, and the upper and lower sides of the inner cavity are divided into a heat dissipation cavity and a cold conduction cavity; a semiconductor refrigeration sheet is embedded in the middle of the partition plate; a heat dissipation piece corresponding to the hot end of the semiconductor refrigeration sheet is arranged in the heat dissipation cavity; the heat dissipation piece comprises vertically arranged and radially distributed heat dissipation fins; the top ends of the heat dissipation fins are L-shaped and form a fixing groove of a limiting fan piece; the fan piece is arranged in the fixing groove; the air outlet end of the fan piece is communicated with an air outlet channel of the heat dissipation piece; a vertical notch is formed in the side of the heat dissipation piece; and a vertically arranged circuit board is arranged in the notch. The medicine refrigeration cup has compact and reasonable structure, improved portability and reduced production cost.

Description

Technical Field

[0001] This application relates to the field of refrigeration cup technology, and more particularly to a drug refrigeration cup. Background Technology

[0002] With advancements in medical technology and the widespread adoption of chronic disease management, certain medications requiring long-term use (such as insulin) have a rigid demand for stable, low-temperature storage environments. This has spurred the development of portable medication refrigeration devices that are convenient for patients to carry daily. Among these, medication refrigerators, due to their compact and portable nature, have become important auxiliary tools. Existing medication refrigerators are mainly divided into two categories: passive insulation and active cooling. Passive insulation refrigerators rely on an internal cold storage bottle to maintain low temperatures. Their advantage lies in their simple structure, but they suffer from a significant drawback: short insulation time, making them unsuitable for extended periods away from home. To extend insulation time, active cooling refrigerators have emerged. They typically employ a hybrid cooling solution combining a semiconductor cooling chip and a cold storage bottle: a semiconductor cooling chip is integrated into the lid, coupling with a phase change material cold storage bottle inside the container via a heat-conducting structure.

[0003] However, this hybrid refrigeration solution still has the following drawbacks: First, in order to achieve functions such as semiconductor refrigeration, power supply, and heat dissipation, the lid needs to integrate many components such as heat sink, fan, and circuit board, which significantly increases the overall height of the lid. This, in turn, damages the overall structural compactness and portability of the refrigerated cup, reducing the convenience for users to carry and use it daily. Second, existing circuit boards are usually placed horizontally above the fan. To avoid blocking the fan's air intake, the circuit board needs to be designed with an irregular shape rather than a standard rectangle. The processing and manufacturing cost of irregularly shaped circuit boards is significantly higher than that of standard circuit boards, thus increasing the overall manufacturing cost of the refrigerated cup. Utility Model Content

[0004] The purpose of this utility model is to solve the above-mentioned technical problems and provide a medicine refrigeration cup. The refrigeration cup lid of this application has a compact and reasonable structure, which improves portability and has low manufacturing cost.

[0005] To achieve the above objectives, the technical solution of this utility model is as follows:

[0006] A medicine refrigeration cup includes a refrigeration lid and a cup body. The refrigeration lid has a partition plate in the middle, which divides the upper and lower sides of the inner cavity into a heat dissipation cavity and a cold conduction cavity. A semiconductor refrigeration chip is embedded in the middle of the partition plate. A heat dissipation component corresponding to the hot end of the semiconductor refrigeration chip is installed in the heat dissipation cavity. The heat dissipation component includes vertically arranged and radially distributed heat dissipation fins. The top ends of multiple heat dissipation fins are L-shaped to form a fixing groove for limiting a fan component. The fan component is placed in the fixing groove, and the air outlet end of the fan component is connected to the air outlet channel of the heat dissipation component. A vertical notch is opened on the side of the heat dissipation component, and a vertically arranged circuit board is installed at the notch.

[0007] In this application, the inner cavity of the refrigeration cup lid is divided by a partition plate, forming a heat dissipation cavity and a cold conduction cavity on the upper two sides respectively. The heat dissipation cavity forms a compact integrated structure. The fan is installed in the fixing groove of the heat dissipation component, and its air outlet is connected to the ventilation channel. At the same time, the circuit board is directly and vertically installed at the mounting port formed on the side of the heat dissipation component. This effectively optimizes the internal space layout of the cup lid, resulting in a compact overall layout. This reduces the overall height of the cup lid, overcomes the portability defects caused by component stacking in the prior art, and improves the structural compactness and daily carrying convenience of the refrigerated cup. In addition, the vertical installation direction of the circuit board effectively utilizes space, making the internal structure of the heat dissipation cavity compact. It also eliminates the need to design irregular structures to avoid the air duct, allowing the use of standard rectangular circuit boards, which effectively reduces the overall production cost.

[0008] In one embodiment, the cooling cup lid includes an upper cover and a connecting cover. The upper cover is snapped onto the connecting cover to form the heat dissipation cavity. The connecting cover has a corresponding snap-fit ​​at the notch. The bottom of the circuit board is snapped onto the snap-fit ​​on both sides to keep the circuit board vertically fixed.

[0009] In one embodiment, the connecting cover has parallel mounting ribs extending in the direction of the notch, and each mounting rib has the bayonet.

[0010] In one embodiment, a display module is connected in the vertical direction of the circuit board and at the top edge of the circuit board, and the display end of the display module faces the vertical direction of the circuit board or forms an acute angle with the vertical direction.

[0011] In one embodiment, the radial distance between the outer end face of the circuit board and the inner wall of the top cover is d, where 6mm≤d≤8mm.

[0012] In one embodiment, the outer end face of the circuit board is provided with a power connector, which is embedded in the side wall of the top cover.

[0013] In one embodiment, one end of the fan component is inserted into the fixing slot, and the other end abuts against the top cover; the upper surface of the top cover has an air inlet corresponding to the air inlet end of the fan component; the middle part of the heat sink has a connecting slot corresponding to the air outlet end of the fan component, and the heat sink fins form an air outlet channel communicating with the connecting slot; the two side walls of the top cover have obliquely distributed air outlets, the air outlets are connected to the air outlet channels, and the top cover has a closed surface at the side wall close to the circuit board.

[0014] In one embodiment, the partition plate is located on the connecting cover, the top of the partition plate is covered with a heat insulation plate, and the semiconductor cooling chip is embedded in a through hole penetrating the partition plate and the heat insulation plate.

[0015] In one embodiment, the bottom of the heat sink is fixed to the partition plate by a threaded connection, and a heat-insulating silicone component is sandwiched between the heat sink and the thermoelectric cooler; a cooling block is connected to the bottom of the partition plate, and a thermally conductive silicone component is sandwiched between the thermoelectric cooler and the cooling block.

[0016] In one embodiment, the system further includes a cold storage bottle and a cap. The cold storage bottle is L-shaped, and when the cold storage bottle is placed inside the cup, the cap seals the cup. Attached Figure Description

[0017] Figure 1 A cross-sectional view of the structure of the drug refrigeration cup provided by this utility model;

[0018] Figure 2 An exploded view of the structure of the medicine refrigeration cup provided by this utility model;

[0019] Figure 3 An exploded view of the structure of the refrigeration cup lid provided by this utility model;

[0020] Figure 4 This is a structural cross-sectional view of the refrigeration cup lid provided by this utility model;

[0021] Figure 5 This is a cross-sectional view of the cooling cup lid provided by this utility model from another angle.

[0022] Figure 6 An exploded view of the structure of the cold storage bottle and cup body provided by this utility model. Detailed Implementation

[0023] This application provides a medicine refrigeration cup to solve the technical problems of existing refrigeration cups, which significantly increase the overall height of the lid, thereby compromising the overall structural compactness and portability of the refrigeration cup and reducing the convenience for users to carry and use daily; and the processing and manufacturing cost of irregularly shaped circuit boards is significantly higher than that of standard circuit boards, thus increasing the overall manufacturing cost of the refrigeration cup.

[0024] To make the inventive objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] Please see Figures 1 to 6 This application provides a medicine refrigeration cup, including a refrigeration cup lid 100 and a cup body 200. The refrigeration cup lid 100 has a partition plate 110 in the middle, which divides the upper and lower sides of the inner cavity into a heat dissipation cavity 120 and a cold conduction cavity 130. A semiconductor cooling chip 300 is embedded in the middle of the partition plate 110. A heat dissipation component 400 corresponding to the hot end of the semiconductor cooling chip 300 is installed in the heat dissipation cavity 120. The heat dissipation component 400 includes vertically arranged and radially distributed heat dissipation fins 410. The top ends of multiple heat dissipation fins 410 are L-shaped to form a fixing groove 420 for limiting a fan component 500. The fan component 500 is placed in the fixing groove 420, and the air outlet end of the fan component 500 is connected to the air outlet channel of the heat dissipation component 400. A vertical notch 430 is opened on the side of the heat dissipation component 400, and a vertically arranged circuit board 600 is installed at the notch 430.

[0026] Specifically, the cooling cup lid 100 is fitted onto the cup body 200. The middle of the cooling cup lid 100 is a partition plate 110, which divides the inner cavity of the lid into a heat dissipation cavity 120 and a cooling conduction cavity 130. The heat dissipation side of the semiconductor cooling chip 300 installed in the middle of the partition plate 110 is located in the heat dissipation cavity 120, and the cold end is located in the cooling conduction cavity 130, allowing the cooling cup lid 100 to provide a cold source for the medicine stored in the cup body 200. A heat dissipation component 400 is attached to the hot end of the semiconductor cooling chip 300 in the heat dissipation cavity 120. The outer periphery of the heat dissipation component 400 is formed by radially arranged and vertically positioned heat dissipation fins 410, some of which have an L-shaped upper surface, thus forming a fixing groove 420 that matches the outer contour shape of the fan component 500. The fan component 500 is inserted into the fixing groove 420, thereby fixing and limiting the fan component 500, allowing the fan component 500 to... The air outlet of the heat sink 400 is connected to the air outlet channel of the fan 500, which facilitates the installation of the fan 500 and makes efficient use of the space of the heat dissipation cavity 120. The heat sink 400 conducts the heat generated by the semiconductor cooling chip 300 and then removes the heat through the air outlet of the fan 500, ensuring that the semiconductor cooling chip 300 can stably perform cooling. On one side of the heat sink 400, there is a vertical notch 430, which forms a space for the circuit board 600. The circuit board 600 is vertically installed at the notch 430. The rectangular circuit board 600 is installed using the space at the installation location and is placed vertically, making the overall structure compact and reducing the volume and height of the cooling cup lid 100, thereby improving the portability of the medicine refrigeration cup. In addition, the circuit board 600 is placed in this position and can be of a conventional shape, without the need to make irregular shapes to avoid the air inlet channel, which effectively reduces production costs.

[0027] Furthermore, the cooling cup lid 100 includes an upper cover 140 and a connecting cover 150. The upper cover 140 is snapped onto the connecting cover 150 to form the heat dissipation cavity 120. The connecting cover 150 has opposing latches 151 at the notch 430. The bottom of the circuit board 600 is snapped onto the latches 151 on both sides to keep the circuit board 600 vertically fixed. The connecting cover 150 has parallel mounting ribs 152 extending towards the notch 430, and each mounting rib 152 has a latch 151. After the upper cover 140 and the connecting cover 150 are assembled, the inner cavity of the upper cover 140 forms a heat dissipation cavity 120, while the lower part of the connecting cover 150 forms a cooling cavity 130. The heat sink 400 is tightly installed on the hot end of the semiconductor cooling chip 300. The annular heat sink 400 has a fan-shaped notch 430 vertically opened on one side, and the edge of the connecting cover 150 extends towards the notch 430 to form a parallel mounting rib 152. The mounting rib 152 is provided with a latch 151. The bottom of the circuit board 600 is engaged with the latch 151 so that the circuit board 600 can be vertically fixed at the notch 430. This allows the circuit board 600 to be positioned and supported in the vertical direction. The installation is simple and does not require other fastening structures, simplifying the assembly process. It also avoids poor contact caused by displacement of the circuit board 600 under vibration. Furthermore, it makes full use of the lateral space of the heat sink 400 to compress the installation thickness, further optimizing the internal space utilization of the cup lid.

[0028] Furthermore, a display module 610 is connected in the vertical direction of the circuit board 600, located at the top edge of the circuit board 600. The display end of the display module 610 faces the vertical direction of the circuit board 600 or forms an acute angle with the vertical direction. The display module 610 is electrically connected to the upper side of the circuit board 600. In this embodiment, the display end of the display module 610 is fixed to the top of the upper cover 140 and is on the same vertical plane as the circuit board 600. In other embodiments, the display end of the display module 610 may form an acute angle with the vertical direction of the circuit board 600, so that the display end of the display module is tilted and located at the edge of the upper cover. The connection route between the display module 610 and the circuit board 600 is short and easy to connect, with a compact structure, and its installation position is convenient for user interaction.

[0029] Furthermore, the radial distance between the outer end face of the circuit board 600 and the inner wall of the upper cover 140 is d, where 6mm≤d≤8mm. In this embodiment, the radial distance d between the circuit board 600 and the inner wall of the upper cover 140 is 6.8mm, and the outer end face of the circuit board 600 is provided with a power insertion interface 620, which is embedded in the side wall of the upper cover 140. The radial distance d ensures that the side of the circuit board 600 near the heat sink 400 has sufficient space to accommodate components and is not easily affected by the heat of the heat sink fins 410. The power insertion interface 620 can be directly embedded in the opening on the side wall of the upper cover 140. The structure is simple and reasonable, and it is convenient for the operation of making the cup lid electrically connected.

[0030] Furthermore, one end of the fan component 500 is inserted into the fixing groove 420, and the other end abuts against the upper cover 140; the upper surface of the upper cover 140 is provided with an air inlet 141 corresponding to the air inlet end of the fan component 500; the middle part of the heat sink 400 is a connecting groove 440 corresponding to the air outlet end of the fan component 500, and an air outlet channel is formed between the heat sink fins 410 that communicates with the connecting groove 440; the two side walls of the upper cover 140 are provided with obliquely distributed air outlets 142, the air outlets 142 are connected to the air outlet channels, and the side wall of the upper cover 140 near the circuit board 600 is a closed surface. A circular connecting groove 440 is provided in the middle of the annular heat sink 400. The connecting groove 440 is connected to the air outlet end of the fan 500. Air outlet channels are formed between the spaced heat dissipation fins 410 distributed circumferentially around the heat sink 400 and are connected to the connecting groove 440. When the airflow from the fan 500 flows between the heat dissipation fins 410, the airflow diffuses circumferentially along the heat sink 400, effectively improving the convective heat transfer efficiency of the heat sink surface and efficiently removing heat from the heat sink 400. The air inlet end of the fan 500 is connected to the air inlet 141 opened in the upper cover 140, and the fan 500 is connected to the upper cover 140. The cover 140 abuts against the fan, thus the fan 500 is doubly limited, forming an axial rigid support to suppress operating vibration. The precise alignment design between the air inlet 141 and the fan air inlet shortens the air intake channel and reduces wind resistance and noise. The display module 610, which is set in the space on the side of the air inlet 141 of the cover 140, is integrated into the cover 140 and directly connected to the circuit board 600. This effectively utilizes space and improves user interaction convenience. In addition, the cover 140 is a closed surface at the mounting cavity where the circuit board 600 is located, forming an installation space without affecting the airflow and heat dissipation effect due to the setting of the circuit board 600.

[0031] Furthermore, the partition plate 110 is located on the connecting cover 150, and the top of the partition plate 110 is covered with a heat insulation plate 160. The thermoelectric cooler 300 is embedded in a through hole penetrating the partition plate 110 and the heat insulation plate 160. The partition plate 110 is formed in the middle of the connecting cover 150, and a heat insulation plate 160 that matches the shape of the connecting cover 150 is installed on the upper side of the partition plate 110. A groove is provided in the middle of the partition plate 110 and the heat insulation plate 160, and the thermoelectric cooler 300 is embedded in the groove. The heat insulation plate 160 further ensures that the heat in the heat dissipation cavity 120 does not easily affect the cooling cavity 130 at the bottom of the partition plate 110, thus ensuring cooling efficiency.

[0032] Furthermore, the bottom of the heat sink 400 is fixed to the partition plate 110 via a threaded connection, and a heat-insulating silicone component 700 is sandwiched between the heat sink 400 and the thermoelectric cooler 300; a cooling block 170 is connected to the bottom of the partition plate 110, and a thermally conductive silicone component 800 is sandwiched between the thermoelectric cooler 300 and the cooling block 170. A cooling block 170 is fixed to the lower center of the partition plate 110 below the cold end of the thermoelectric cooler 300, and a cooling sleeve 180 is fixed to the outer periphery of the cooling block 170. The cooling sleeve 180 extends into the cup body 200 to better retain the cold source within the cup body 200 with maximum efficiency. The bottom of the heat sink 400 has holes, and a fixed connection is formed with the partition plate 110 via screws. The threaded connection achieves rigid fixation between the heat sink 400 and the partition plate 110, and the structure is simple. The thermoelectric cooler 300... The heat-insulating silicone part 700 sandwiched between the heat sink 400 and the heat dissipation component 120 blocks the heat conduction loss from the heat dissipation cavity 120 to the cooling cavity 130; the combination of the cooling block 170 and the heat-conducting silicone part 800 optimizes the heat transfer path from the cold side of the semiconductor cooling chip 300 to the cooling sleeve 180, and improves the cooling efficiency simultaneously through dual thermal management design; and a temperature sensing probe 171 is provided in the cooling block 170 to detect the temperature, and the temperature parameter is visualized and monitored by integrating with the electronic display module 610, which is convenient for users.

[0033] See Figure 6It also includes a cold storage bottle 900 and a cap (not shown in the figure). The cold storage bottle 900 is L-shaped. When the cold storage bottle 900 is placed inside the cup body 200, the cap (not shown in the figure) seals the cup body 200. When using a regular cap, it does not have an active cooling function. The cold energy stored in the cold storage agent inside the cold storage bottle 900 can provide a certain cold source, improving the usage scenarios of the refrigerated cup. When the user only needs to carry it for a short time, the cold energy provided by the cold storage bottle 900 can keep the medicine cold, making it more portable. When the L-shaped cold storage bottle 900 is placed inside the cup body 200, its bottom can be adapted to the bottom of the cup body 200, and the center of gravity is located at the bottom. While maintaining sufficient cold insulation cavity inside the cup body 200, it provides sufficient cold source to ensure the low temperature environment of the medicine.

[0034] Based on the disclosure and teachings of the above specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, this utility model is not limited to the specific embodiments disclosed and described above, and some modifications and changes to this utility model should also fall within the protection scope of the claims of this utility model. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on this utility model.

Claims

1. A pharmaceutical cold cup comprising a refrigeration cup cover and a cup body, characterized in that, The cooling cup lid has a partition plate in the middle, which divides the upper and lower sides of the inner cavity into a heat dissipation cavity and a cooling conduction cavity. A semiconductor cooling chip is embedded in the middle of the partition plate. A heat dissipation component corresponding to the hot end of the semiconductor cooling chip is installed in the heat dissipation cavity. The heat dissipation component includes vertically arranged and radially distributed heat dissipation fins. The top ends of multiple heat dissipation fins are L-shaped to form a fixing groove for limiting the fan component. The fan component is placed in the fixing groove, and the air outlet end of the fan component is connected to the air outlet channel of the heat dissipation component. A vertical notch is opened on the side of the heat dissipation component, and a vertically arranged circuit board is installed at the notch.

2. The pharmaceutical cool cup of claim 1, wherein, The cooling cup lid includes an upper cover and a connecting cover. The upper cover is snapped into the connecting cover to form the heat dissipation cavity. The connecting cover has a corresponding snap-fit ​​at the notch. The bottom of the circuit board is snapped into the snap-fit ​​on both sides to keep the circuit board vertically fixed.

3. The medicine refrigeration cup according to claim 2, characterized in that, The connecting cover has parallel mounting ribs extending in the direction of the notch, and each mounting rib has a slot.

4. The medicine refrigeration cup according to claim 2, characterized in that, A display module is connected in the vertical direction of the circuit board and at the top edge of the circuit board. The display end of the display module faces the vertical direction of the circuit board or forms an acute angle with the vertical direction.

5. The medicine refrigeration cup according to claim 2, characterized in that, The radial distance between the outer end face of the circuit board and the inner wall of the top cover is d, where 6mm≤d≤8mm.

6. The medicine refrigeration cup according to claim 2, characterized in that, The circuit board has a power connector on its outer end face, which is embedded in the side wall of the top cover.

7. The medicine refrigeration cup according to claim 2, characterized in that, One end of the fan component is inserted into the fixing slot, and the other end abuts against the top cover; the upper surface of the top cover has an air inlet corresponding to the air inlet end of the fan component; the middle part of the heat sink has a connecting slot corresponding to the air outlet end of the fan component, and the heat sink fins form an air outlet channel communicating with the connecting slot; the two side walls of the top cover have obliquely distributed air outlets, the air outlets are connected to the air outlet channels, and the side wall of the top cover near the circuit board is a closed surface.

8. The medicine refrigeration cup according to claim 2, characterized in that, The partition plate is located on the connecting cover, and the top of the partition plate is covered with a heat insulation plate. The semiconductor cooling chip is embedded in a through hole that passes through the partition plate and the heat insulation plate.

9. The medicine refrigeration cup according to claim 1, characterized in that, The bottom of the heat sink is fixed to the partition plate by a threaded connection, and a heat-insulating silicone component is sandwiched between the heat sink and the semiconductor refrigeration chip; a cooling block is connected to the bottom of the partition plate, and a thermally conductive silicone component is sandwiched between the semiconductor refrigeration chip and the cooling block.

10. The medicine refrigeration cup according to claim 1, characterized in that, It also includes a cold storage bottle and a cap. The cold storage bottle is L-shaped. When the cold storage bottle is placed in the cup body, the cap seals the cup body.

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