Chip temperature control adsorption device

Abstract

The application relates to a chip temperature-controllable adsorption device. The chip temperature-controllable adsorption device comprises: a suction disc, which has an adsorption surface for adsorbing a chip and a heat conduction surface opposite to the adsorption surface; a flow channel disc, which is arranged on one side of the heat conduction surface of the suction disc; a plurality of heating elements, which are arranged between the suction disc and the flow channel disc and are used for heat conduction and temperature control of the suction disc; and a supporting disc, which is arranged on the side, away from the suction disc, of the flow channel disc and is used for supporting the flow channel disc, a wire outlet gap being formed between the supporting disc and the flow channel disc; wherein the plurality of heating elements comprise a plurality of electric connection wires, the plurality of electric connection wires extend through the flow channel disc to the space between the supporting disc and the flow channel disc and extend laterally and outwardly through the wire outlet gap. The application optimizes the wiring mode of the electric connection wires of the heating elements, avoids the problems of wire outlet below the suction disc, reduced heat conduction efficiency of the flow channel to the suction disc due to large thermal resistance, and difficult guarantee of flatness due to easy space interference, and significantly improves the uniformity, response speed and flatness of temperature control.

Description

Technical Field

[0001] This application relates to the field of semiconductor chip testing technology, and in particular to a chip temperature-controlled adsorption device. Background Technology

[0002] In the field of semiconductor chip testing, precise temperature control of chips is one of the key technologies to ensure testing accuracy. In existing technologies, a suction device (i.e., a chuck) with temperature control function is usually used to fix and control the temperature of the chip. Its core structure usually includes a suction cup, a heating element, and a cooling plate. The heating element and the cooling plate work together to control the temperature of the suction cup.

[0003] In existing technologies, the heating element is typically attached directly to the back of the suction cup, with its leads extending from between the back of the suction cup and the cooling plate. However, this arrangement results in a large number of leads between the cooling plate and the suction cup, leading to higher thermal resistance and reduced heat transfer efficiency from the cooling plate to the suction cup, making it difficult to meet the requirements for high-precision, fast-response temperature control. Furthermore, the large number of leads between the cooling plate and the suction cup, along with the need for the cooling plate itself to connect to components such as media inlet and outlet pipes, complicates the assembly process, increases the risk of spatial interference, and affects the flatness of the suction cup.

[0004] Therefore, it is necessary to propose a new technical solution to overcome the shortcomings of existing technologies. Utility Model Content

[0005] Based on this, this application provides a chip temperature-controlled adsorption device, which aims to improve the problems of poor temperature uniformity and flatness of the suction cups in the prior art.

[0006] Therefore, this application adopts the following technical solution: a chip temperature-controlled adsorption device, comprising:

[0007] A suction cup having an adsorption surface for adsorbing chips and a heat-conducting surface opposite to the adsorption surface;

[0008] A flow channel plate is disposed on one side of the heat-conducting surface of the suction cup;

[0009] Multiple heating elements are disposed between the suction cup and the flow channel plate for heat transfer and temperature control of the suction cup; and

[0010] A support plate is provided on the side of the flow channel plate away from the suction cup to support the flow channel plate, and a wire exit gap is formed between the support plate and the flow channel plate.

[0011] The plurality of heating elements include a plurality of electrical connecting wires, which extend through the flow channel plate to the space between the support plate and the flow channel plate and extend laterally outward through the wire outlet gap.

[0012] In some embodiments, the flow channel plate is provided with a plurality of mounting grooves on the side near the suction cup, and the heat-conducting surface of the suction cup is provided with a contact boss corresponding to the mounting groove. The heating element is installed in the mounting groove, and the contact boss is pressed against the heating element.

[0013] In some embodiments, the heating element is fixed to the flow channel plate by a fixing block, which is locked onto the flow channel plate by screws and presses the heating element.

[0014] In some embodiments, the chip temperature-controlled adsorption device further includes several temperature sensors, each temperature sensor having a sensor probe extending into the suction cup and a connecting lead electrically connected to the sensor probe. The connecting lead passes through the flow channel plate, extends between the support plate and the flow channel plate, and extends laterally outward through the wire gap.

[0015] In some embodiments, the fixing block has a perforation through which the temperature sensor passes, and the temperature sensor is fixed by the fixing block.

[0016] In some embodiments, the support disk is provided with a plurality of support protrusions, which support the flow channel disk to form the outlet gap.

[0017] In some embodiments, the chip temperature-controlled adsorption device further includes a gas distribution block surrounding the flow channel disk. The gas distribution block has a plurality of gas distribution channels, each having a pipe interface for connecting to a suction pipe and a top surface interface on the top surface of the gas distribution block. The edge of the suction cup is pressed against the top surface of the gas distribution block, thereby connecting the airflow channel inside the suction cup with the top surface interface.

[0018] In some embodiments, the suction cup has an adsorption hole that connects to the airflow channel and penetrates the adsorption surface. The adsorption surface of the suction cup is provided with cross-shaped adsorption grooves corresponding to each adsorption hole, and the cross-shaped adsorption grooves intersect at the adsorption hole.

[0019] In some embodiments, the gas distributor is connected to a gas distributor bracket, and the gas distributor bracket is connected to the support plate.

[0020] In some embodiments, both the gas distribution block and the gas distribution block support are insulating components.

[0021] The chip temperature control adsorption device provided in this application includes a support plate, a flow channel plate, and a suction cup stacked in sequence. Multiple heating elements are disposed between the suction cup and the flow channel plate. Multiple electrical connection wires of the heating elements extend through the flow channel plate to the space between the support plate and the flow channel plate and extend laterally outward through the wire exit gap between the support plate and the flow channel plate. By optimizing the routing of the electrical connection wires of the heating elements, the problem of electrical connection wires exiting below the suction cup, which would reduce the heat transfer efficiency of the flow channel to the suction cup due to high thermal resistance, and the problem of difficulty in ensuring flatness due to easy spatial interference is avoided, thus significantly improving the uniformity of temperature control, response speed, and flatness. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional assembly diagram of the chip temperature control adsorption device of this application.

[0024] Figure 2 This is an exploded perspective view of the chip temperature-controlled adsorption device of this application.

[0025] Figure 3 This is a cross-sectional view of the chip temperature-controlled adsorption device of this application.

[0026] Figure 4 This is another cross-sectional view of the chip temperature-controlled adsorption device of this application.

[0027] Figure 5 for Figure 4 A magnified view of a portion of point A in the middle.

[0028] Figure 6 This is a front view of the suction cup in the chip temperature control adsorption device of this application.

[0029] Figure 7 This is a rear view of the suction cup in the chip temperature control adsorption device of this application.

[0030] Figure 8 This is a three-dimensional view of the gas distribution block in the chip-controlled temperature adsorption device of this application.

[0031] Figure 9 This is a three-dimensional composite view of the chip temperature-controlled adsorption device of this application from another perspective.

[0032] The component labels are as follows: 100, chip temperature control adsorption device; 1, suction cup; 11, adsorption surface; 110, adsorption hole; 111, strip adsorption groove; 12, heat-conducting surface; 121, contact boss; 122, assembly groove; 123, air hole; 2, flow channel plate; 21, mounting groove; 3, support plate; 301, wire outlet gap; 31, support protrusion; 4, heating element; 41, electrical connection wire; 5, gas distribution block; 51, pipeline interface; 52, top surface interface; 53, pipeline connector; 55, gas distribution block bracket; 6, temperature sensor; 61, connecting lead wire; 7, fixing block; 70, through hole; 71, screw; 9, chip. Detailed Implementation

[0033] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0034] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0037] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0038] This application provides a chip temperature-controlled adsorption device. By optimizing the wiring layout of the heating element and temperature sensor, the temperature uniformity, temperature control response speed, and flatness accuracy of the chip temperature-controlled adsorption device are improved. The structural features and implementation methods of this embodiment are described in detail below with reference to the accompanying drawings.

[0039] Please see Figures 1 to 9 As shown, the chip temperature-controlled adsorption device 100 provided in this application includes a suction cup 1, a flow channel plate 2, a support plate 3, and multiple heating elements 4. The suction cup 1 has an adsorption surface 11 for adsorbing chips 9 and a heat-conducting surface 12 opposite to the adsorption surface 11. The flow channel plate 2 is disposed on one side of the heat-conducting surface 12 of the suction cup 1. Multiple heating elements 4 are disposed between the suction cup 1 and the flow channel plate 2 for heat transfer and temperature control of the suction cup 1. The support plate 3 is disposed on the side of the flow channel plate 2 opposite to the suction cup 1 for supporting the flow channel plate 2, and a wire exit gap 301 is formed between the support plate 3 and the flow channel plate 2. The multiple heating elements 4 include multiple electrical connection wires 41, which extend through the flow channel plate 2 to the space between the support plate 3 and the flow channel plate 2, and extend laterally outward through the wire exit gap 301.

[0040] The chip temperature control adsorption device 100 provided in this application includes a support plate 3, a flow channel plate 2, and a suction cup 1 stacked in sequence. Multiple heating elements 4 are disposed between the suction cup 1 and the flow channel plate 2. Multiple electrical connection wires 41 of the multiple heating elements 4 extend through the flow channel plate 2 to the space between the support plate 3 and the flow channel plate 2 and extend laterally outward through the wire exit gap 301 between the support plate 3 and the flow channel plate 2. This arrangement optimizes the routing of the electrical connection wires 41 of the heating elements 4, avoiding the problems of reduced heat transfer efficiency of the flow channel plate 2 to the suction cup 1 due to high thermal resistance caused by the electrical connection wires 41 exiting below the suction cup 1, and the problem of difficulty in ensuring flatness due to easy spatial interference. It significantly improves the uniformity of temperature control, response speed, and flatness.

[0041] Please see Figure 1 and Figure 2 As shown, suction cup 1 is located on the top layer and is a key component that supports chip 9, directly contacting chip 9. In some embodiments, suction cup 1 may be made of copper and plated with electroless nickel to give the material itself good heat exchange performance. Please refer to the following for details. Figure 6 and Figure 7 As shown, the suction cup 1 has an adsorption surface 11 and a heat-conducting surface 12. The adsorption surface 11 is used to attach the chip 9, and the heat-conducting surface 12 faces the flow channel disk 2 to contact the flow channel disk 2 and transfer heat. An airflow channel is provided inside the suction cup 1 to connect to a negative pressure device to form a negative pressure adsorption force at the adsorption surface 11.

[0042] Please see Figure 6 As shown, the suction cup 1 has an adsorption hole 110 that connects to the airflow channel and penetrates the adsorption surface 11. Corresponding to each adsorption hole 110, the adsorption surface 11 of the suction cup 1 has intersecting strip-shaped adsorption grooves 111. In other words, multiple adsorption holes 110 are distributed on the adsorption surface 11, and each adsorption hole 110 has intersecting strip-shaped adsorption grooves 111. The strip-shaped adsorption grooves 111 converge at the adsorption hole 110 to form an X-shaped groove, and each X-shaped groove corresponds to one chip 9. During negative pressure adsorption, a negative pressure is formed within the X-shaped groove. Compared to adsorption using only a single hole, the adsorption area achieved by the X-shaped groove is two linear regions, which ensures a uniform distribution of adsorption force and enhances the adsorption effect on the chip 9.

[0043] Please see Figure 7 As shown, the heat-conducting surface 12 has a contact boss 121 corresponding to the heating element 4. The contact boss 121 protrudes from the surface of the heat-conducting surface 12 and is used to press against the heating element 4 to achieve efficient heat transfer. The heat-conducting surface 12 also has an assembly groove 122 for accommodating the fixing block 7 for fixing the heating element 4 and the temperature sensor 6, such as... Figure 5 As shown. Multiple air holes 123 are also provided on the edge region of the heat-conducting surface 12. The inner ends of the air holes 123 are connected to the airflow channel inside the suction cup 1, and the outer ends of the air holes 123 are connected to a negative pressure device (such as a vacuum pump) through the gas distribution block 5 to draw gas from the airflow channel and form a negative pressure adsorption force at the adsorption hole 110. The specific cooperation relationship between the heat-conducting surface 12, the temperature sensor 6, the fixing block 7, and the gas distribution block 5 will be described in detail later.

[0044] Please see Figure 2 and Figure 3As shown in the figure, the flow channel plate 2 is arranged on one side of the heat conduction surface 12 of the suction cup 1. A cooling medium flow channel is arranged inside the flow channel plate 2. A medium flow inlet and a flow outlet are formed on the side surface of the flow channel plate 2 to connect an external cooling device to adjust the temperature of the cooling medium. A plurality of installation grooves 21 are formed on the side of the flow channel plate 2 close to the suction cup 1 for accommodating the heating element 4. The shape of the installation groove 21 matches the shape of the heating element 4, and the depth of the installation groove 21 is greater than the thickness of the heating element 4, so that the heating element 4 can be completely installed in the installation groove 21. The layout of the installation grooves 21 corresponds to the contact bosses 121 of the suction cup 1 one by one, and one heating element 4 is installed in each installation groove 21. When the suction cup 1 is installed in place above the flow channel plate 2, the contact bosses 121 on the heat conduction surface 12 of the suction cup 1 are pressed against the heating element 4, ensuring that the heat generated by the heating element 4 is efficiently transferred to the suction cup 1. In this embodiment, the suction cup 1 and the flow channel plate 2 are fixedly connected by bolts. During operation, the flow channel plate 2 absorbs or supplements heat through the cooling medium flowing in its internal cooling medium flow channel, so as to jointly achieve precise temperature control of the suction cup 1 with the heating element 4.

[0045] Please refer to Figure 5 and Figure 6 As shown in the figure, the flow channel plate 2 is further provided with a plurality of through holes penetrating up and down. The through holes form a wire passing channel for the electrical connection wire 41 of the heating element 4 and the connection lead 61 of the temperature sensor 6 to pass through the flow channel plate 2 from top to bottom. It can be understood that the through holes are not connected to the cooling medium flow channel inside the flow channel plate 2, that is, the position where the through holes are arranged should avoid the cooling medium flow channel to prevent the cooling medium from leaking through the through holes.

[0046] Please refer to Figures 1 to 3 As shown in the figure, the support plate 3 is arranged below the flow channel plate 2 to provide support for the flow channel plate 2 and the suction cup 1. In this embodiment, the support plate 3 is a ceramic plate. An outlet wire gap 301 is formed between the support plate 3 and the flow channel plate 2. In this embodiment, the support plate 3 is provided with a plurality of support protrusions 31, and the plurality of support protrusions 31 support the flow channel plate 2 to form the outlet wire gap 301. Specifically, the suction cup 1, the flow channel plate 2 and the support plate 3 are all substantially circular. The upper surface of the support plate 3 is provided with a plurality of support protrusions 31, and the plurality of support protrusions 31 are arranged along multiple radial directions of the support plate 3. In this embodiment, the plurality of support protrusions 31 are substantially arranged in a "rice" shape, and the support protrusions 31 contact the lower surface of the flow channel plate 2, and the formed outlet wire gap 301 is in the shape of a plurality of fan-shaped spaces. The electrical connection wire 41 of the heating element 4 and the connection lead 61 of the temperature sensor 6 can be arranged in the outlet wire gaps 301 in the shape of fan-shaped spaces and led out laterally to be connected to the relevant control circuits. The support plate 3 is further provided with auxiliary ribs connecting the plurality of support protrusions 31 to improve the strength of the support plate 3 and resist the thermal deformation of the flow channel plate 2.

[0047] Please refer to Figure 2As shown, in this embodiment, the heating element 4 is a ceramic heating plate. Most of the ceramic heating plates are rectangular, while a few ceramic heating plates near the edge of the flow channel disk 2 are arranged in a fan shape or triangle to fit the circular flow channel disk 2. Please refer to [further details omitted]. Figure 4 and Figure 5 As shown, in this embodiment, the heating element 4 is fixed in the mounting groove 21 of the flow channel plate 2 by a fixing block 7. Specifically, an opening is provided in the middle of the ceramic heating plate, and a screw hole is provided in the fixing block 7. When the screw hole is aligned with the opening, at least a portion of the fixing block 7 is pressed against the upper part of the ceramic heating plate. Then, a screw 71 is passed through the screw hole and connected to the flow channel plate 2 to lock the fixing block 7 onto the flow channel plate 2 and press the ceramic heating plate. Since a portion of the fixing block 7 is located on the upper part of the ceramic heating plate, a matching assembly groove 122 is provided on the heat-conducting surface 12 of the suction cup 1 to accommodate this portion of the fixing block 7 protruding from the upper part of the ceramic heating plate. In this embodiment, the electrical connection wire 41 of the heating element 4 is led out from the bottom of the mounting groove 21, passes through the pre-set wire channel inside the flow channel plate 2, and extends to the wire exit gap 301 between the support plate 3 and the flow channel plate 2. Electrical connection wire 41 is arranged laterally within this gap and is eventually led out laterally to the external circuit through the outlet on the side of the support plate 3. In this embodiment, to enhance the reliability of heat transfer between the heating element 4 and the suction cup 1 and the flow channel plate 2, a thermally conductive pad, such as a graphene pad, or a thermally conductive silicone ester coating may also be provided between the heating element 4 and the suction cup 1 and the flow channel plate 2.

[0048] The fixing block 7 also has a through hole 70 through which the temperature sensor 6 can extend into the suction cup 1 via the heating element 4. The temperature sensor 6 is fixed by the fixing block 7. Specifically, the temperature sensor 6 has a sensor probe extending into the suction cup 1 and a connecting lead 61 electrically connected to the sensor probe. The connecting lead 61 extends through the flow channel plate 2 to the support plate 3. In this embodiment, the sensor probe of the temperature sensor 6 extends into the suction cup 1 and is located directly below each chip 9, which is beneficial for accurately monitoring temperature fluctuations and achieving accurate temperature detection. Furthermore, a small amount of thermal grease can be applied to the head of the sensor probe before it is installed in the suction cup 1 to reduce contact thermal resistance and improve recognition accuracy. The connecting lead 61 of the temperature sensor 6 passes through the flow channel plate 2 and enters the wire exit gap 301. The connecting lead 61 is arranged laterally in this gap and finally leads out laterally through the wire exit gap 301 to connect with relevant circuit components.

[0049] Please see Figures 7 to 9As shown, to facilitate the airflow connection between the negative pressure device and the suction cup 1, in this embodiment, the chip temperature-controlled adsorption device 100 further includes an air distribution block 5 surrounding the flow channel disk 2. The air distribution block 5 has several air distribution channels, each with a pipe interface 51 for connecting to the suction pipe and a top surface interface 52 on the top surface of the air distribution block 5. The edge of the suction cup 1 is pressed against the top surface of the air distribution block 5, allowing the airflow channel inside the suction cup 1 to connect with the top surface interface 52. In this embodiment, the air distribution block 5 consists of multiple blocks, each in an arc-shaped strip. Multiple pipe interfaces 51 are located on the outer surface of the air distribution block 5, each marked with a corresponding label to the adsorption holes 110 of the suction cup 1, enabling precise control of each adsorption hole 110. A pipe connector 53 is connected to the pipe interface 51 for connecting to the suction pipe. The top surface interface 52 is located on the top surface of the air distribution block 5. The top surface of the air distribution block 5 is fixed to the suction cup 1 by screws to ensure that the top surface interface 52 and the air hole 123 on the edge of the suction cup 1 are sealed and connected.

[0050] In use, a negative pressure device, such as a vacuum pump, provides negative pressure to the gas distribution block 5 through the suction pipe and pipe interface 51. The airflow passes through the top interface 52, the air hole 123 of the suction cup 1 and the adsorption hole 110 in sequence, and finally forms an adsorption force on the adsorption surface 11.

[0051] Please see Figure 8 and Figure 9 As shown, in this embodiment, the air distributor 5 is connected to the support plate 3 via an air distributor bracket 55. Specifically, the air distributor bracket 55 is U-shaped, having an upper horizontal plate portion supporting the air distributor 5 below, a lower horizontal plate portion extending below the support plate 3, and a longitudinal connecting portion connecting the upper and lower horizontal plate portions. The upper horizontal plate portion of the air distributor 5 is connected to the air distributor 5 by screws. Furthermore, a support column can be provided between the upper horizontal plate portion and the air distributor 5 to increase the stability of the screw connection. In this embodiment, the air distributor 5 is supported by the U-shaped air distributor bracket 55, which has a simple structure and reliable connection.

[0052] In this embodiment, both the gas distribution block 5 and the gas distribution block support 55 are insulating components. Specifically, the gas distribution block 5 and the gas distribution block support 55 are made of PEEK insulating material, providing strong insulation and preventing static electricity generated by air tube friction from affecting the test. In other embodiments, the gas distribution block 5 and the gas distribution block support 55 may also be made of other insulating materials, such as insulating ceramics.

[0053] When assembling one embodiment of the chip temperature control adsorption device provided in this application, the support plate 3 is first placed horizontally on the assembly table with the pre-set support protrusion 31 on its surface facing upwards; then the flow channel plate 2 is placed above the support plate 3, and the flow channel plate 2 is positioned by contact with the support protrusion 31, at which time a wire exit gap 301 is formed between the lower surface of the flow channel plate 2 and the upper surface of the support plate 3; next, the heating elements 4 are inserted one by one into the pre-set mounting grooves 21 of the flow channel plate 2, and the heating elements 4 are installed and fixed with the fixing block 7; the probe of the temperature sensor 6 is inserted into the pre-set sensor mounting hole of the suction cup 1. The electrical connection wire 41 of the heating element 4 and the connection lead wire 61 of the temperature sensor 6 pass through the wire passage of the flow channel plate 2 and extend to the wire outlet gap 301, extending laterally within the wire outlet gap 301; then the gas distribution block 5 is placed around the outer periphery of the flow channel plate 2, and is positioned by connecting the gas distribution block bracket 55 to the support plate 3; finally, the suction cup 1 is placed above the flow channel plate 2, so that the contact boss 121 of the suction cup 1 is fully pressed against the surface of the heating element 4, and the air hole 123 on the edge of the suction cup 1 is aligned with the top interface 52 of the gas distribution block 5. The overall assembly is completed by connecting and fixing all components.

[0054] As can be seen from the above description of the specific embodiments, the chip temperature control adsorption device 100 provided in this application forms a wire exit gap 301 between the flow channel plate 2 and the support plate 3, so that the electrical connection wire 41 of the heating element 4 and the connection lead 61 of the temperature sensor 6 can pass through the gap below the flow channel plate 2 without occupying the heat transfer path between the flow channel plate 2 and the suction cup 1, thereby improving the heat exchange efficiency between the cooling medium and the suction cup 1; moreover, the electrical connection wire 41 of the heating element 4 and the connection lead 61 of the temperature sensor 6 are arranged laterally in the wire exit gap 301 below the flow channel plate 2, avoiding interference with the flatness of the suction cup 1, so that the chip temperature control adsorption device 100 has better flatness and meets the requirements of high-precision chip testing.

[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A chip temperature-controlled adsorption device, characterized in that, include: The suction cup (1) has an adsorption surface (11) for adsorbing the chip (9) and a heat-conducting surface (12) opposite to the adsorption surface (11); The flow channel plate (2) is located on one side of the heat-conducting surface (12) of the suction cup (1); Multiple heating elements (4) are disposed between the suction cup (1) and the flow channel plate (2) for heat transfer and temperature control of the suction cup (1); as well as A support plate (3) is provided on the side of the flow channel plate (2) away from the suction cup (1) to support the flow channel plate (2). A wire exit gap (301) is formed between the support plate (3) and the flow channel plate (2). The plurality of heating elements (4) include a plurality of electrical connecting wires (41), which extend through the flow channel plate (2) to the space between the support plate (3) and the flow channel plate (2) and extend laterally outward through the wire outlet gap (301).

2. The chip temperature-controlled adsorption device as described in claim 1, characterized in that, The flow channel plate (2) is provided with several mounting grooves (21) on the side near the suction cup (1). The heat-conducting surface (12) of the suction cup (1) is provided with a contact boss (121) corresponding to the mounting groove (21). The heating element (4) is installed in the mounting groove (21), and the contact boss (121) is pressed against the heating element (4).

3. The chip temperature-controlled adsorption device as described in claim 2, characterized in that, The heating element (4) is fixed to the flow channel plate (2) by a fixing block (7), and the fixing block (7) is locked to the flow channel plate (2) by screws (71) and presses the heating element (4).

4. The chip temperature-controlled adsorption device as described in claim 3, characterized in that, The chip temperature control adsorption device (100) also includes several temperature sensors (6), each temperature sensor (6) having a sensor probe extending into the suction cup (1) and a connecting lead (61) electrically connected to the sensor probe. The connecting lead (61) passes through the flow channel plate (2) and extends to the space between the support plate (3) and the flow channel plate (2), and extends laterally outward through the wire exit gap (301).

5. The chip temperature-controlled adsorption device as described in claim 4, characterized in that, The fixing block (7) has a through hole (70) through which the temperature sensor (6) passes, and the temperature sensor (6) is fixed by the fixing block (7).

6. The chip temperature-controlled adsorption device as described in claim 1, characterized in that, The support plate (3) is provided with a plurality of support protrusions (31), which support the flow channel plate (2) to form the wire outlet gap (301).

7. The chip temperature-controlled adsorption device as described in any one of claims 1 to 6, characterized in that, The chip temperature control adsorption device (100) further includes a gas distribution block (5) surrounding the outer periphery of the flow channel disk (2). The gas distribution block (5) has a plurality of gas distribution channels. The gas distribution channels have a pipeline interface (51) for connecting to the suction pipeline and a top surface interface (52) opened on the top surface of the gas distribution block (5). The edge of the suction cup (1) is pressed against the top surface of the gas distribution block (5) so that the airflow channel inside the suction cup (1) is connected to the top surface interface (52).

8. The chip temperature-controlled adsorption device as described in claim 7, characterized in that, The suction cup (1) has an adsorption hole (110) that connects to the airflow channel and penetrates the adsorption surface (11). The adsorption surface (11) of the suction cup (1) is provided with a strip-shaped adsorption groove (111) arranged in a cross pattern for each adsorption hole (110). The strip-shaped adsorption groove (111) intersects at the adsorption hole (110).

9. The chip temperature-controlled adsorption device as described in claim 7, characterized in that, The gas distribution block (5) is connected to a gas distribution block bracket (55), and the gas distribution block bracket (55) is connected to the support plate (3).

10. The chip temperature-controlled adsorption device as described in claim 9, characterized in that, Both the gas distribution block (5) and the gas distribution block support (55) are insulating components.

Images