A heat dissipation mechanism of an intelligent temperature control PCBA board

Abstract

The utility model discloses a kind of heat dissipation mechanisms of intelligent temperature control PCBA board, it is related to PCBA board heat dissipation technical field, including heat conducting component and combined strut, it is characterized by: the bottom four diagonally of heat conducting component is vertically installed with combined strut, and the bottom end of combined strut is connected with support frame, and the bottom middle of support frame is installed with fan mechanism component, and fan mechanism component and heat conducting component are connected with sensing line between left and right symmetry. The heat dissipation mechanism of this intelligent temperature control PCBA board, by the structural setting of heat conducting component, cooperate the structural setting of fan mechanism component, can be according to the surface temperature of PCBA board Intelligent control is carried out, and good structure heat dissipation is realized, to this end guarantee the good operation of PCBA board, simultaneously cooperate the structural setting of combined strut, can heat conducting component be fixed in the top of support frame, and cooperate the structural characteristics of support frame itself, better structure fixation can be realized, to guarantee the structural stability of PCBA board.

Description

Technical Field

[0001] This utility model relates to the field of PCBA board heat dissipation technology, specifically a heat dissipation mechanism for an intelligent temperature-controlled PCBA board. Background Technology

[0002] PCBA is a finished board in which electronic components are soldered onto a printed circuit board (PCB). It achieves circuit functions through surface mount technology (SMT) and through-hole technology (DIP). PCBA forms a complete circuit system by fixing and soldering electronic components (such as chips, resistors, capacitors, etc.) onto the PCB, supporting the operation of electronic equipment.

[0003] It is widely used in electronic products such as mobile phones, computers, televisions, automotive electronics, and medical equipment, and is a core component for electrical connection and signal transmission.

[0004] PCBA board heat dissipation uses various technologies to dissipate the heat generated by electronic components during operation, preventing component performance degradation or damage due to excessive temperature.

[0005] Conventional PCBA board heat dissipation mechanisms rely on fan structures for cooling, but due to heat conduction and structural limitations, the heat dissipation efficiency is relatively limited. Utility Model Content

[0006] The purpose of this invention is to provide a heat dissipation mechanism for an intelligent temperature-controlled PCBA board to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation mechanism for an intelligent temperature-controlled PCBA board, comprising a heat-conducting component and a combined support rod, characterized in that: a combined support rod is vertically installed at the four diagonal points of the bottom of the heat-conducting component, and a support frame is connected to the bottom end of the combined support rod; a fan mechanism is installed in the middle of the bottom of the support frame; and sensing lines are symmetrically connected between the fan mechanism and the heat-conducting component; the heat-conducting component comprises a thermal plate, a protective layer, and heat dissipation fins; the surface of the thermal plate is coated with a protective layer, and heat dissipation fins are installed at the bottom of the thermal plate.

[0008] Furthermore, the thermal plate is internally equipped with a thermistor, and the heat dissipation fins are tightly fixedly installed in the middle of the bottom of the thermal plate.

[0009] Furthermore, the combined support rod includes a main rod body, a connecting pile, and a limiting nut. The upper end of the main rod body is provided with a connecting pile, and the lower end of the main rod body is provided with two sets of limiting nuts.

[0010] Furthermore, the bottom of the heat dissipation fins is provided with grooves at the four opposite corners that match the top surface structure of the connecting pile, and the main rod and the limiting nut are connected by threads.

[0011] Furthermore, the support frame includes a stabilizing plate, a ventilation opening, fixing piles, and brackets. The stabilizing plate has a ventilation opening in the middle, and fixing piles are provided at the four opposite corners of the stabilizing plate. In addition, brackets are symmetrically installed on the bottom of the stabilizing plate.

[0012] Furthermore, the stabilizing plate, the fixed pile, and the support are integrated into a single structure, and the main rod is vertically threaded through the middle of the fixed pile.

[0013] Furthermore, the fan mechanism includes an intelligent control base, a connecting end, a cooling fan, and support bolts. The connecting end is provided in the middle of the left and right sides of the intelligent control base, and the cooling fan is installed in the middle of the top of the intelligent control base. Support bolts are vertically installed at the four opposite corners of the intelligent control base.

[0014] Furthermore, the upper end of the support bolt is threaded onto the bottom of the stabilizing plate, and both ends of the sensing wire are electrically connected to the side of the thermal plate and one end of the connecting end via a quick-connect structure.

[0015] This utility model provides a heat dissipation mechanism for an intelligent temperature-controlled PCBA board, which has the following beneficial effects:

[0016] 1. This utility model uses a combined support rod structure to fix the heat-conducting component to the top of the support frame, while the entire fan mechanism is fixed to the bottom of the stabilizing plate using support bolts. Since the heat dissipation fins are positioned directly above the vents and the cooling fan is positioned directly below the vents, when the vents operate, the generated airflow quickly blows onto the surface of the heat dissipation fins. Utilizing the structural characteristics of the heat dissipation fins themselves, the incoming airflow is compressed. Furthermore, due to the sufficient contact surface area between the heat dissipation fins and the incoming air, heat is rapidly dissipated, thus maximizing heat removal. The heat generated by the PCBA board during operation is quickly dissipated. The aforementioned structure ensures the thermal conductivity of the entire device, thereby guaranteeing the stability of the PCBA board's operation and preventing disruptions to normal operation due to heat dissipation issues. Furthermore, the thermal plate contains an internal thermistor. The PCBA board, in conjunction with the control chip, actuators, and sensing lines within the intelligent control unit, enables automatic temperature monitoring and regulation of the circuit. For example, when the temperature exceeds a set threshold, the temperature control system triggers a cooling mechanism, activating the fan mechanism; once the PCBA board's temperature returns to normal, it maintains a stable state.

[0017] 2. This utility model, by setting up a combined support rod, wherein the main rod body is screwed into the fixed pile, and the connecting pile is embedded in the bottom four diagonal positions of the heat dissipation fins, thereby realizing the combined connection of the heat-conducting component and the support frame. By screwing the upper end of the support bolt vertically installed at the diagonal of the intelligent control seat into the bottom of the stabilizing plate, and the two ends of the sensor wire are electrically connected to the side of the thermal plate and one end of the connecting end through a quick connector structure, the heat-conducting component, combined support rod, support frame, fan component and sensor wire are modularly set up to facilitate the assembly and disassembly of the structure. This ensures that the device as a whole has sufficient structural maintenance convenience, and also ensures that the entire device structure has sufficient structural combination stability, thereby ensuring the operational stability and robustness of the device. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the heat dissipation mechanism of an intelligent temperature-controlled PCBA board according to the present invention.

[0019] Figure 2 This is a schematic diagram of the heat dissipation mechanism of an intelligent temperature-controlled PCBA board according to the present invention.

[0020] Figure 3 This is a three-dimensional structural diagram of the combined support rod of the heat dissipation mechanism of an intelligent temperature-controlled PCBA board according to the present invention.

[0021] Figure 4 This is a three-dimensional structural diagram of the support frame for the heat dissipation mechanism of an intelligent temperature-controlled PCBA board according to the present invention.

[0022] Figure 5 This is a three-dimensional structural diagram of the heat dissipation mechanism of an intelligent temperature-controlled PCBA board according to the present invention.

[0023] In the diagram: 1. Heat-conducting component; 101. Thermosensitive plate; 102. Protective layer; 103. Heat dissipation fins; 2. Combined support rod; 201. Main rod body; 202. Connecting pile; 203. Limiting nut; 3. Support frame; 301. Stabilizing plate; 302. Ventilation opening; 303. Fixing pile; 304. Bracket; 4. Fan component; 401. Intelligent control base; 402. Connecting end; 403. Cooling fan; 404. Support bolt; 5. Sensor wire. Detailed Implementation

[0024] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0025] like Figures 1 to 5As shown, a heat dissipation mechanism for an intelligent temperature-controlled PCBA board includes a heat-conducting component 1 and a combined support rod 2. The combined support rod 2 is vertically installed at the four diagonal corners of the bottom of the heat-conducting component 1, and a support frame 3 is connected to the bottom of the combined support rod 2. A fan component 4 is installed in the middle of the bottom of the support frame 3, and sensor lines 5 are symmetrically connected between the fan component 4 and the heat-conducting component 1. The heat-conducting component 1 includes a thermistor plate 101, a protective layer 102, and heat dissipation fins 103. The surface of the thermistor plate 101 is coated with the protective layer 102, and heat dissipation fins 103 are installed at the bottom of the thermistor plate 101. A thermistor is installed inside the thermistor plate 101, and the heat dissipation fins 103 are tightly fixedly installed in the middle of the bottom of the thermistor plate 101. The fan component 4 includes an intelligent control base 401, a connecting end 402, and a cooling fan 4. 03 and support bolts 404, the intelligent control base 401 has connecting ends 402 in the middle of the left and right sides, and a cooling fan 403 is installed in the middle of the top of the intelligent control base 401. Support bolts 404 are vertically installed at the four opposite corners of the intelligent control base 401. The upper end of the support bolt 404 is threaded to the bottom of the stabilizing plate 301, and the two ends of the sensing wire 5 are electrically connected to the side of the thermal plate 101 and one end of the connecting end 402 through a quick connector structure. When the vent 302 is operating, the generated wind will quickly blow towards the surface of the heat dissipation fins 103. Utilizing the characteristics of the heat dissipation fins 103 themselves, the flowing air entering the interior will be compressed. At the same time, due to the structural characteristics of the heat dissipation fins 103 themselves, the contact surface area between the contact surface and the flowing air has a certain number of bones, thereby realizing the operation of quickly removing heat.

[0026] like Figures 1 to 5 As shown, the combined support rod 2 includes a main rod body 201, connecting piles 202, and limiting nuts 203. The upper end of the main rod body 201 is provided with connecting piles 202, and the lower end of the main rod body 201 is provided with two sets of limiting nuts 203. The bottom of the heat dissipation fins 103 has four opposite corners with groove structures matching the top surface structure of the connecting piles 202. The main rod body 201 and the limiting nuts 203 are connected by threads. The support frame 3 includes a stabilizing plate 301, a vent 302, a fixing pile 303, and a bracket 304. The stabilizing plate 301 has a vent 302 in the middle, and the four opposite corners of the stabilizing plate 301 have groove structures matching the top surface structure of the connecting piles 202. Fixed piles 303 are provided at each corner, and brackets 304 are symmetrically installed on the bottom of the stabilizing plate 301. The stabilizing plate 301, fixed piles 303 and brackets 304 are integrated into one structure. The main rod 201 is vertically threaded through the middle of the fixed pile 303. The main rod 201 is screwed into the fixed pile 303, and the connecting piles 202 are embedded in the four opposite corners of the bottom of the heat dissipation fins 103 to achieve the combined connection of the heat conduction component 1 and the support frame 3. The upper end of the support bolt 404 vertically installed at the opposite corner of the intelligent control base 401 is screwed into the bottom of the stabilizing plate 301.

[0027] In summary, as Figures 1 to 5 As shown, the heat dissipation mechanism of this intelligent temperature-controlled PCBA board, when in use, first installs the PCBA board on the surface of the thermal plate 101, which is coated with a protective layer 102. When the electronic components and equipment on the surface of the PCBA board are operating, the thermal elements (such as bimetallic strips and thermistors) inside the thermal plate 101 will sense the temperature change of the PCBA board in real time. When the temperature is abnormal, the circuit is triggered to open or close, or the operation of the fan component 4 is adjusted by the sensing line 5, such as controlling the speed of the cooling fan 403. At this time, under the operation of the cooling fan 403, the flowing air will quickly pass through the ventilation port 302 and blow onto the surface of the heat dissipation fins 103. The heat generated by the operation of the PCBA board is quickly conducted to the interior of the heat dissipation fins 103 by the thermal plate 101. With the control of the intelligent control base 401, the operation of the cooling fan 403 is used to quickly dissipate the heat on its surface.

[0028] During operation, the entire device utilizes the support 304 at the bottom of the stabilizing plate 301 and the use of bolts to stably fix and install the structural surface. The main rod 201, in conjunction with the limiting nut 203, is vertically installed in the fixing pile 303, thereby ensuring that the heat-conducting component 1 is stably supported directly above the support frame 3, thus ensuring the stable operation of the PCBA board.

[0029] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A heat dissipation mechanism for an intelligent temperature-controlled PCBA board, comprising a heat-conducting component (1) and a combined support rod (2), characterized in that: The heat-conducting component (1) has four vertically mounted combined support rods (2) at the bottom corners, and the bottom end of the combined support rods (2) is connected to a support frame (3). The bottom middle of the support frame (3) is equipped with a fan mechanism (4), and the fan mechanism (4) and the heat-conducting component (1) are symmetrically connected by sensing lines (5). The heat-conducting component (1) includes a thermal plate (101), a protective layer (102), and heat dissipation fins (103). The surface of the thermal plate (101) is coated with a protective layer (102), and heat dissipation fins (103) are installed at the bottom of the thermal plate (101).

2. The heat dissipation mechanism of an intelligent temperature-controlled PCBA board according to claim 1, characterized in that, The thermal plate (101) is equipped with a thermistor inside, and the heat dissipation fins (103) are tightly fixedly installed in the middle of the bottom of the thermal plate (101).

3. The heat dissipation mechanism of an intelligent temperature-controlled PCBA board according to claim 1, characterized in that, The combined support rod (2) includes a main rod body (201), a connecting pile (202), and a limiting nut (203). The upper end of the main rod body (201) is provided with a connecting pile (202), and the lower end of the main rod body (201) is provided with two sets of limiting nuts (203).

4. The heat dissipation mechanism of an intelligent temperature-controlled PCBA board according to claim 3, characterized in that, The bottom of the heat dissipation fins (103) is provided with grooves at the four opposite corners that match the top surface structure of the connecting pile (202), and the main rod (201) and the limiting nut (203) are connected by threads.

5. The heat dissipation mechanism of an intelligent temperature-controlled PCBA board according to claim 3, characterized in that, The support frame (3) includes a stabilizing plate (301), a vent (302), a fixing pile (303), and a bracket (304). The stabilizing plate (301) has a vent (302) in the middle, and a fixing pile (303) is provided at each of the four opposite corners of the stabilizing plate (301). The bottom of the stabilizing plate (301) is symmetrically equipped with brackets (304).

6. The heat dissipation mechanism of an intelligent temperature-controlled PCBA board according to claim 5, characterized in that, The stabilizing plate (301), the fixing pile (303) and the bracket (304) are integrated into one structure, and the main rod (201) is vertically threaded through the middle of the fixing pile (303).

7. The heat dissipation mechanism of an intelligent temperature-controlled PCBA board according to claim 5, characterized in that, The air conditioning component (4) includes an intelligent control base (401), a connecting end (402), a cooling fan (403), and a support bolt (404). The connecting end (402) is provided in the middle of the left and right sides of the intelligent control base (401), and the cooling fan (403) is installed in the middle of the top of the intelligent control base (401). The support bolt (404) is vertically installed at each of the four opposite corners of the intelligent control base (401).

8. The heat dissipation mechanism of an intelligent temperature-controlled PCBA board according to claim 7, characterized in that, The upper end of the support bolt (404) is threaded onto the bottom of the stabilizing plate (301), and the two ends of the sensing wire (5) are electrically connected to the side of the thermal plate (101) and one end of the connecting end (402) through a quick connector structure.

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