Power substrate and module, circuit board assembly, electrical control box assembly, and electrical device
By designing specific areas and pad layouts on the power substrate, the problems of area occupation and low integration caused by independent packaging of components in air conditioning control boards are solved, thereby improving the compatibility and compactness of the components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HISENSE HOME APPLIANCES GRP CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-06-26
AI Technical Summary
In existing technologies, the independent packaging of components such as rectifier bridge, PFC, compressor IPM and fan IPM in air conditioning control boards results in large footprint, low design compactness and integration. How to make compatible with components of different specifications is an urgent problem to be solved.
A power substrate is designed, comprising a first inverter region, a second inverter region, a PFC region, and a rectifier bridge region arranged along a first direction, with corresponding power pads provided, and the length of the PFC region is set in the range of 12 mm to 16 mm to accommodate devices of different specifications and improve compatibility.
It integrates multiple independent devices, improves the compatibility and compactness of the power substrate, reduces electromagnetic interference, and is compatible with chips of various current specifications.
Smart Images
Figure CN224418674U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, and in particular to a power substrate and module, circuit board assembly, electrical control box assembly and electrical equipment. Background Technology
[0002] Air conditioning control boards include components such as rectifier bridges, PFC (Power Factor Correction), compressor IPM (Intelligent Power Module), and fan IPM. The rectifier bridge, PFC, compressor IPM, and fan IPM are usually independently packaged components. These discrete components require independent packaging and arrangement, which occupies a large area of the control board, resulting in low design compactness and integration. If the rectifier bridge, PFC, compressor IPM, and fan IPM are integrated into a power board module, how to make the different specifications of the components in the power board module compatible is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0003] This utility model provides a power substrate and module, a circuit board assembly, an electrical control box assembly, and electrical equipment to solve the problem of how to ensure compatibility of devices of different specifications in a power module when integrating a rectifier bridge, PFC, compressor IPM, and fan IPM into a single power module.
[0004] In a first aspect, this utility model provides a power substrate, which is used in a power module, comprising:
[0005] The substrate body has a first inverter region, a second inverter region, a PFC region, and a rectifier bridge region arranged along a first direction. The first inverter region is provided with a first inverter power pad, the second inverter region is provided with a second inverter power pad, the PFC region is provided with a PFC power pad, and the rectifier bridge region is provided with a rectifier bridge diode pad. The length of the PFC region in the first direction is L1, where 12 mm ≤ L1 ≤ 16 mm.
[0006] In one possible implementation, the area of the rectifier bridge region is S1, the area of the PFC region is S2, and S1 and S2 satisfy: S1 > S2.
[0007] In one possible implementation, the length of the rectifier bridge region in the first direction is L2, where 14.5 mm ≤ L2 ≤ 17.5 mm.
[0008] In one possible implementation, the first inverter region is a fan inverter region, and the second inverter region is a compressor inverter region;
[0009] The area of the first inverter region is S3, and the area of the second inverter region is S4, wherein S3 and S4 satisfy: S3 < S4.
[0010] In one possible implementation, 325 mm² ≤ S1 ≤ 370 mm²; and / or
[0011] 295 square millimeters ≤ S2 ≤ 330 square millimeters; and / or
[0012] 430 square millimeters ≤ S3 ≤ 475 square millimeters; and / or
[0013] 600 square millimeters ≤ S4 ≤ 645 square millimeters.
[0014] In one possible implementation, the length of the first inverter region in the first direction is L3, where 20 mm ≤ L3 ≤ 23 mm;
[0015] The length of the second inverter region in the first direction is L4, where 25 mm ≤ L4 ≤ 31 mm.
[0016] In one possible implementation, the length of the substrate body in the first direction is L5, and L3, L4, and L5 satisfy: 52% ≤ (L3 + L4): L5 ≤ 65%.
[0017] In one possible implementation, the length of the substrate body in the first direction is L5, where 76 mm ≤ L5 ≤ 86 mm;
[0018] The length of the substrate body in the second direction is L6, where 20 mm ≤ L6 ≤ 25 mm, and the first direction and the second direction are perpendicular to each other.
[0019] In one possible implementation, the length of the substrate body in the first direction is L5, and the length of the substrate body in the second direction is L6, wherein L5 and L6 satisfy: 3≤L5:L6≤4, and the first direction and the second direction are perpendicular to each other.
[0020] Secondly, this utility model also provides a power module, comprising:
[0021] Power substrate as described in any of the first aspects;
[0022] The frame includes a drive-side frame and a power-side frame, which are disposed on opposite sides of the power substrate in a second direction. The drive-side frame includes drive pads and drive pins, and a drive chip is mounted on the drive pads. The power-side frame includes power pins.
[0023] A package encapsulates the power substrate and the frame. On opposite sides of the package in the second direction, the side closer to the drive-side frame is designated as the drive side, and the side closer to the power-side frame is designated as the power side. The drive pin extends out of the package from the drive side along the second direction, and the power pin extends out of the package from the power side along the second direction.
[0024] In one possible implementation, the package further includes two screw holes formed at both ends of the package along a first direction, the centers of the two screw holes being a and b respectively, both of which coincide with the centerline of the package in the second direction, the first direction and the second direction being perpendicular to each other.
[0025] In one possible implementation, for each of the two screw holes:
[0026] The radius of the screw hole is r, which satisfies: 1.55 mm ≤ r ≤ 1.75 mm; and / or
[0027] In the first direction, the distance between the center of the screw hole and a side near the substrate body is L7, wherein L7 satisfies: 2.45 mm ≤ L7 ≤ 2.55 mm.
[0028] Thirdly, the present invention also provides a circuit board assembly, the circuit board assembly including the power module as described in any of the second aspects.
[0029] Fourthly, the present invention also provides an electrical control box assembly, the electrical control box assembly including the power module as described in any of the second aspects.
[0030] Fifthly, the present invention also provides an electrical device, the electrical device comprising a power module as described in any of the second aspects.
[0031] The beneficial effects of this utility model are as follows:
[0032] This utility model provides a power substrate and module, circuit board assembly, electrical control box assembly, and electrical equipment. The power substrate is used in a power module. The power substrate includes a substrate body, and the substrate body has a first inverter region, a second inverter region, a PFC region, and a rectifier bridge region arranged along a first direction. The first inverter region is provided with a first inverter power pad, the second inverter region is provided with a second inverter power pad, the PFC region is provided with a PFC power pad, and the rectifier bridge region is provided with a rectifier diode pad. The length of the PFC region in the first direction is L1, where 12 mm ≤ L1 ≤ 16 mm. Because the substrate body has a first inverter region, a second inverter region, a PFC region, and a rectifier bridge region, multiple independent devices can be integrated onto a single power substrate. Furthermore, by setting the length of the PFC region in the first direction to between 12 mm and 16 mm, the PFC region can be compatible with power devices of different specifications, thus improving the compatibility of the power substrate. Attached Figure Description
[0033] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0034] Figure 1 A schematic diagram of the structure of a power substrate provided in an embodiment of this utility model;
[0035] Figure 2 This is a schematic diagram of another power substrate provided in an embodiment of the present invention;
[0036] Figure 3 This is a schematic diagram of another power substrate provided in an embodiment of the present invention;
[0037] Figure 4 This is a schematic diagram of another power substrate provided in an embodiment of the present invention;
[0038] Figure 5 This is a schematic diagram of another power substrate provided in an embodiment of the present invention;
[0039] Figure 6 A schematic diagram of the structure of a power module provided in an embodiment of this utility model;
[0040] Figure 7 This is a schematic diagram of the appearance of a power module provided in an embodiment of the present utility model.
[0041] In the picture:
[0042] 1-Substrate body; 11-First inverter region; 111-First inverter power pad; 112-First inverter power chip; 12-Second inverter region; 121-Second inverter power pad; 122-Second inverter power chip; 13-PFC region; 131-PFC power chip pad; 132-PFC diode pad; 115-PFC power chip; 116-PFC diode; 117-Temperature sensor; 133-Temperature sensor pad; 4-Rectifier bridge area; 141-Rectifier diode pad; 100-Power substrate; 200-Driver side frame; 210-First inverter driver frame; 211-First inverter driver chip; 220-Second inverter driver frame; 221-Second inverter driver chip; 230-PFC driver frame; 231-PFC driver chip; 240-Rectifier bridge pin frame; 300-Power side frame; 400-Package; 401-Screw hole; 402-Screw hole. Detailed Implementation
[0043] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0044] In related technologies, air conditioning control boards typically include a rectifier bridge, PFC, compressor IPM, and fan IPM, all of which are independent components. These independent components not only occupy a large area of the control board but also result in low design compactness and integration, requiring multiple insertions during production, wasting time. Integrating the rectifier bridge, PFC, compressor IPM, and fan IPM into a single power module necessitates consideration of how to ensure compatibility with components of different specifications.
[0045] To address the aforementioned problems, this utility model provides a power substrate that is applied to a power module, such as... Figure 1 The diagram shown is a schematic diagram of a power substrate provided in an embodiment of the present invention. The power substrate includes a substrate body 1.
[0046] The substrate body 1 has a first inverter region 11, a second inverter region 12, a PFC region 13 and a rectifier bridge region 14 arranged along a first direction. The first inverter region 11 is provided with a first inverter power pad 111, the second inverter region 12 is provided with a second inverter power pad 121, the PFC region 13 is provided with a PFC power pad, and the rectifier bridge region 14 is provided with a rectifier diode pad 141. The length of the PFC region 13 in the first direction is L1, and 12 mm ≤ L1 ≤ 16 mm.
[0047] In this embodiment of the utility model, such as Figure 1 As shown, the PFC power pads include PFC power chip pads 131 and PFC diode pads 132.
[0048] In this embodiment of the invention, a first inverter power chip is disposed on a first inverter power pad, a second inverter power chip is disposed on a second inverter power pad, a PFC power chip is disposed on a PFC power chip pad, a PFC diode is disposed on a PFC diode pad, and a rectifier diode is disposed on a rectifier diode pad, so as to integrate multiple independent devices onto a power substrate. Furthermore, the length of the PFC region in the first direction is set to a range of 12 mm to 16 mm, thereby enabling the PFC region to be compatible with power devices of different specifications and improving the compatibility of the power substrate.
[0049] It should be noted that the power chip in this utility model can also be called a power switch chip.
[0050] In one embodiment, the area of the rectifier bridge region 14 is S1, and the area of the PFC region 13 is S2, where S1 and S2 satisfy: S1 > S2.
[0051] Specifically, the area S1 of the rectifier bridge region 14 can satisfy: 325 square millimeters ≤ S1 ≤ 370 square millimeters, and the area S2 of the PFC region 13 can satisfy: 295 square millimeters ≤ S2 ≤ 330 square millimeters.
[0052] It should be noted that the area of rectifier bridge region 14 is the area of the region formed by the outermost boundaries of the rectifier diode pads in the first direction and the second direction in the rectifier bridge region, and the area of PFC region 13 is the area of the region formed by the outermost boundaries of the PFC power pads in the first direction and the second direction in the PFC region.
[0053] In practical implementation, since the area occupied by the PFC power chip is smaller than that occupied by the rectifier bridge chip, meaning the rectifier bridge chip occupies a larger area, and since there are many specifications of rectifier bridge chips, in order to enable the production of power modules of various specifications within the same package, the area S1 of the rectifier bridge region 14 in this embodiment of the present invention is set to be larger than the area S2 of the PFC region 13. This allows for compatibility with various rectifier bridge chips of different specifications within the same package, thereby improving the compatibility of the power module.
[0054] In one embodiment, such as Figure 2 As shown, the length of the rectifier bridge region 14 in the first direction is L2, 14.5 mm ≤ L2 ≤ 17.5 mm.
[0055] In this embodiment of the invention, the length L2 of the rectifier bridge region 14 in the first direction is set to be between 14.5 mm and 17.5 mm, thereby enabling the rectifier bridge region to be compatible with rectifier bridge chips of different specifications and improving the compatibility of the power substrate.
[0056] The power substrate provided in this embodiment of the utility model has a first inverter region 11 that can be a compressor inverter region and a second inverter region 12 that can be a fan inverter region. Alternatively, the first inverter region 11 can be a fan inverter region and the second inverter region 12 can be a compressor inverter region. When the first inverter region 11 is a fan inverter region and the second inverter region 12 is a compressor inverter region, the area S3 of the first inverter region 11 is smaller than the area S4 of the second inverter region 12.
[0057] Specifically, the area S3 of the first inverter region 11 can satisfy: 430 square millimeters ≤ S3 ≤ 475 square millimeters, and the area S4 of the second inverter region 12 can satisfy: 600 square millimeters ≤ S4 ≤ 645 square millimeters.
[0058] It should be noted that the area of the first inverter region 11 is the area of the region formed by the outermost boundaries of the first inverter power pad in the first inverter region in the first direction and the second direction, and the area of the second inverter region 12 is the area of the region formed by the outermost boundaries of the second inverter pad in the second inverter region in the first direction and the second direction.
[0059] In this embodiment of the present invention, since the heat generated by the power chip of the compressor inverter is greater than the heat generated by the power chip of the fan inverter, the area S4 of the compressor inverter region is set to be greater than the area of the fan inverter region S3. That is, the area occupied by the power chip of the compressor inverter is greater than the area occupied by the power chip of the fan inverter, thereby improving the heat dissipation of the power chip of the compressor inverter.
[0060] In practical implementation, when the first inverter region 11 is the fan inverter region and the second inverter region 12 is the compressor inverter region, such as Figure 3 As shown, the length of the first inverter region 11 in the first direction is L3, 20 mm ≤ L3 ≤ 23 mm, and the length of the second inverter region 12 in the first direction is L4, 25 mm ≤ L4 ≤ 31 mm.
[0061] In this embodiment of the invention, the length L3 of the first inverter region 11 in the first direction is set to 20 mm to 23 mm, which makes the first inverter region compatible with first inverter power chips of different specifications. The length L4 of the second inverter region 12 in the first direction is set to 25 mm to 31 mm, which makes the second inverter region compatible with second inverter power chips of different specifications, thereby improving the compatibility of the power substrate.
[0062] In one embodiment, such as Figure 4 As shown, the length of the substrate body 1 in the first direction is L5, and L3, L4, and L5 satisfy: 52% ≤ (L3 + L4): L5 ≤ 65%.
[0063] The power module in this embodiment includes a frame, comprising a drive-side frame and a power-side frame. The drive-side frame, power substrate, and power-side frame are spaced apart along a second direction, with the first and second directions perpendicular to each other. Setting the ratio of the sum of the length L3 of the compressor inverter region and the length L4 of the fan inverter region in the first direction to the length L5 of the substrate body in the first direction to 52%–65% satisfies the design rules for the wiring between the drive chip on the drive-side frame and the devices (power chip and rectifier bridge) on the power substrate, as well as the design rules for the wiring between the devices on the power substrate and the power-side frame. Furthermore, it allows for the installation of power chips of suitable specifications for the compressor inverter and fan inverter, meets the heat dissipation requirements of the power chips in the compressor inverter and fan inverter, satisfies the heat dissipation requirements of the PFC power chip and rectifier bridge chip, and increases the design freedom of the chip dimensions on the power substrate.
[0064] If the ratio of the sum of the lengths L3 and L4 of the compressor inverter region in the first direction to the length L5 of the substrate body in the first direction is set to less than 52%, that is, if the sum of the lengths L3 and L4 of the compressor inverter region in the first direction is too small, it may not meet the design rules for the wiring between the drive chip on the drive side frame and the devices on the power substrate, and it may also fail to meet the heat dissipation requirements of the power chips in the compressor inverter and the fan inverter. It may also be impossible to install power chips of appropriate specifications in the compressor inverter and the fan inverter.
[0065] If the ratio of the sum of the lengths L3 and L4 of the compressor inverter region in the first direction to the length L5 of the substrate body in the first direction is set to be greater than 65%, that is, if the sum of the lengths L3 and L4 of the compressor inverter region in the first direction is too large, it will affect the heat dissipation of the PFC power chip and the rectifier bridge chip, and will also affect the freedom of design for the size of each chip on the power substrate.
[0066] In one embodiment, such as Figure 5As shown, the length of the substrate body 1 in the first direction is L5, 76 mm ≤ L5 ≤ 86 mm; the length of the substrate body 1 in the second direction is L6, 20 mm ≤ L6 ≤ 25 mm, and the first direction and the second direction are perpendicular to each other.
[0067] In the above-described embodiment of the utility model, the length L3 of the first inverter region in the first direction is set to 20 mm to 23 mm, the length L4 of the second inverter region in the first direction is set to 25 mm to 31 mm, the length L1 of the PFC region in the first direction is set to 12 mm to 16 mm, the length L2 of the rectifier bridge region in the first direction is set to 14.5 mm to 17.5 mm, the length L5 of the substrate body in the first direction is set to 76 mm to 86 mm, and the length L6 of the substrate body in the second direction is set to 20 mm to 25 mm. This reduces electromagnetic interference between devices in different regions of the power module and also allows for compatibility with chips of different current specifications.
[0068] In one embodiment, the ratio of the length L5 of the substrate body 1 in the first direction to the length L6 of the substrate body 1 in the second direction is in the range of 3 to 4, that is, L5 and L6 satisfy: 3≤L5:L6≤4.
[0069] In this embodiment of the present invention, the length L5 of the substrate body 1 in the first direction is greater than the length L6 of the substrate body 1 in the second direction. This is beneficial for increasing the distance between devices in each region of the power module, reducing electromagnetic interference between devices in each region of the power module, and making it compatible with chips of various current specifications.
[0070] In practical applications, the first direction can be understood as the length direction of the substrate body 1, and the second direction can be understood as the width direction of the substrate body 1.
[0071] Based on the same concept, this utility model embodiment also provides a power module. The principle of the power module in solving the technical problem is similar to that of the power substrate disclosed in the above embodiments in solving the technical problem, and the repeated parts will not be described again.
[0072] like Figure 6 As shown, a power module is provided in an embodiment of this utility model. The power module includes:
[0073] The power substrate 100 described above;
[0074] The frame includes a drive-side frame 200 and a power-side frame 300, which are disposed on opposite sides of the power substrate 100 in a second direction. The drive-side frame 200 includes drive pads and drive pins, and a drive chip is mounted on the drive pads. The power-side frame 300 includes power pins.
[0075] Package 400 encapsulates power substrate 100 and frame. Package 400 has two opposite sides in a second direction. The side closer to the drive side frame 200 is designated as the drive side, and the side closer to the power side frame 300 is designated as the power side. Drive pins extend out of package 400 from the drive side in the second direction, and power pins extend out of package 400 from the power side in the second direction.
[0076] like Figure 7 The diagram shown is an external schematic of a power module provided in an embodiment of this utility model.
[0077] Reference Figure 6 The drive-side frame 200 may include a first inverter drive frame 210, a second inverter drive frame 220, a PFC drive frame 230 and a rectifier bridge pin frame 240, which are spaced apart along a first direction. The first inverter drive frame 210, the second inverter drive frame 220, the PFC drive frame 230 and the rectifier bridge pin frame 240 are arranged sequentially along the first direction.
[0078] The first inverter drive frame 210 is equipped with a first inverter drive chip 211, which is electrically connected to the first inverter power chip 112. The second inverter drive frame 220 is equipped with a second inverter drive chip 221, which is electrically connected to the second inverter power chip 122. The PFC drive frame 230 is equipped with a PFC drive chip 231.
[0079] Furthermore, the first inverter drive frame 210 corresponds at least partially to the first inverter power pad 111 in the second direction, the second inverter drive frame 220 corresponds at least partially to the second inverter power pad 121 in the second direction, the PFC drive frame 230 corresponds at least partially to the PFC power pad in the second direction, and the rectifier bridge pin frame 240 corresponds at least partially to the rectifier diode pad 141 in the second direction. This design allows each power pad to be designed separately without needing to be aligned with its corresponding drive frame in the second direction. This allows the area occupied by each power pad on the power substrate 100 to be adjusted according to requirements, thus facilitating a more rational layout of the power substrate 100 space.
[0080] It is worth mentioning that the first inverter power pad 111, the second inverter power pad 121, the PFC power pad, and the rectifier diode pad 141 can be arranged from left to right or from right to left.
[0081] In practical implementation, the first inverter power chip 112 can be a compressor inverter power chip, and the second inverter power chip 122 can be a fan inverter power chip. Alternatively, if the first inverter power chip 112 can be a fan inverter power chip, then the second inverter power chip 122 can be a compressor inverter power chip. The arrangement of the first inverter power chip 112 and the second inverter power chip 122 can be designed according to actual needs and is not limited here.
[0082] A PFC power chip 115 is mounted on the PFC power chip pad 131, and the PFC driver chip 231 can be electrically connected to the PFC power chip 115. A PFC diode 116 is mounted on the PFC diode pad 132, and the PFC diode 116 can be electrically connected to the PFC power chip pad 131. Since the PFC area generates the most heat during power module operation, resulting in a high temperature in the PFC area, the temperature sensor pad 133 and temperature sensor 117 are provided. The temperature sensor 117 can be used to detect the temperature of the PFC power chip 115, allowing for real-time acquisition of the operating temperature of the PFC power chip 115. This prevents damage to internal components of the power module due to overheating of the PFC power chip 115, thus ensuring the reliability of the power module operation.
[0083] like Figure 6 As shown, the package 400 also includes two screw holes, screw hole 401 and screw hole 402, which are formed at both ends of the package 400 along the first direction. The centers of the two screw holes are a and b, respectively. Both a and b coincide with the center line of the package 400 in the second direction. The first direction and the second direction are perpendicular to each other.
[0084] In practical implementation, for each of the two screw holes 401 and 402:
[0085] The radius of the screw hole is r, which satisfies: 1.55 mm ≤ r ≤ 1.75 mm; and / or
[0086] In the first direction, the distance between the center of the screw hole and a side near the substrate body is L7, and L7 satisfies: 2.45 mm ≤ L7 ≤ 2.55 mm.
[0087] It should be noted that the power substrate in this embodiment of the invention may be composed of different structures. In one implementation, the power substrate may include pads and an insulating heat dissipation layer disposed below the pads. The insulating heat dissipation layer is mainly formed by sequentially stacking an insulating resin sheet and a copper layer, or by sequentially stacking an insulating resin sheet and an aluminum layer. The main material of the pads is copper or aluminum. In this case, most of the power substrate is enclosed by the package, and the outer surface of the copper layer or the outer surface of the aluminum layer in the insulating heat dissipation layer of the power substrate is exposed from the surface of the package.
[0088] Alternatively, as another implementation, the power substrate may include pads, an insulating layer, and a heat dissipation layer stacked sequentially. The pads are primarily made of copper or aluminum, the insulating layer is primarily made of ALN, AL2O3, Si3N4, or a combination of these materials, and the heat dissipation layer is primarily made of copper or aluminum. In this case, the power substrate is mostly enclosed by the package, and the outer surface of the heat dissipation layer is exposed from the outer surface of the package.
[0089] Alternatively, as another implementation, the power substrate may include pads and an insulating layer disposed beneath the pads. The insulating layer may be an ALN ceramic insulating layer, an AL2O3 ceramic insulating layer, or a Si3N4 ceramic insulating layer. In this case, most of the power substrate is enclosed by the package, and the outer surface of the insulating layer of the substrate is exposed from the outer surface of the package.
[0090] Alternatively, as another implementation, the power substrate can be formed solely of pads, in which case the power substrate is disposed within the package, and the package completely encloses the substrate.
[0091] In practice, the structure of the power substrate can be adjusted according to the specific requirements of the power module and the application environment, and no limitation is made here.
[0092] Furthermore, the power module in this embodiment can be formed from a single integral substrate, or the power module can be spliced together from multiple substrates arranged along the second direction. When the power module is spliced together from multiple substrates, the power module may include, for example, three substrates, one substrate for setting a first inverter power pad, one substrate for setting a second inverter power pad, and another substrate for setting a PFC power pad and a rectifier diode power pad.
[0093] Furthermore, in this embodiment of the present invention, the rectifier bridge circuit in the rectifier bridge area can be composed of multiple rectifier diodes, for example, by combining four spaced rectifier diodes. The rectifier bridge composed of four rectifier diodes converts the input AC power into DC power and outputs it.
[0094] As mentioned earlier, the PFC power pad contains a PFC power chip and a PFC diode. These components form part of the PFC circuit, which adjusts the power factor of the DC current and outputs the adjusted DC power. The PFC power chip can be composed of an insulated-gate bipolar transistor (IGBT) and a freewheeling diode (FRD), or it can be a metal-oxide-semiconductor field-effect transistor (MOS), or it can be an RC-IGBT (a reverse-conducting IGBT that integrates the IGBT and freewheeling diode onto a single chip).
[0095] An inverter circuit is composed of multiple inverter power chips; for example, a three-phase inverter bridge circuit can be composed of six inverter power chips. The three-phase inverter bridge circuit includes three upper-arm inverter power chips and three lower-arm inverter power chips. The inverter power chips can be composed of insulated-gate bipolar transistors (IGBTs) and freewheeling diodes (FRDs), or they can be metal-oxide-semiconductor field-effect transistors (MOS transistors), or they can be RC-IGBTs (reverse-conducting IGBTs that integrate the IGBT and freewheeling diode onto a single chip).
[0096] The drive-side frame 200 can be completely spaced apart from the power substrate 100 in the second direction, thereby reducing the impact of heat transferred from the substrate on the drive chip; the drive-side frame 200 can also be partially protruding in the second direction to form a connecting rod and connect with the power substrate 100, thereby improving the stability of the substrate. At the same time, most of the drive-side frame 200 is spaced apart from the power substrate 100 in the second direction, thereby balancing the improvement of substrate stability and the reduction of the impact of heat transferred from the substrate on the drive chip.
[0097] It should be noted that, Figure 6 The pins located outside the plastic package 400 do not represent the actual length; they are merely a schematic representation of the pins.
[0098] Based on the same concept, this utility model embodiment can also provide a circuit board assembly, which may include the power module in the above embodiment.
[0099] Based on the same concept, this utility model embodiment can also provide an electrical control box assembly, which may include the power module in the above embodiment.
[0100] Based on the same concept, embodiments of this utility model can also provide an electrical device, which may include the power module in the above embodiments. The electrical device may be, for example, an air conditioner.
[0101] Those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.
Claims
1. A power substrate, characterized in that, Applied to power modules, including: The substrate body has a first inverter region, a second inverter region, a PFC region, and a rectifier bridge region arranged along a first direction. The first inverter region is provided with a first inverter power pad, the second inverter region is provided with a second inverter power pad, the PFC region is provided with a PFC power pad, and the rectifier bridge region is provided with a rectifier diode pad. The length of the PFC region in the first direction is L1, where 12 mm ≤ L1 ≤ 16 mm.
2. The power substrate as described in claim 1, characterized in that, The area of the rectifier bridge region is S1, and the area of the PFC region is S2. S1 and S2 satisfy: S1 > S2.
3. The power substrate as described in claim 2, characterized in that, The length of the rectifier bridge region in the first direction is L2, 14.5 mm ≤ L2 ≤ 17.5 mm.
4. The power substrate as described in claim 1, characterized in that, The first inverter region is the fan inverter region, and the second inverter region is the compressor inverter region; The area of the first inverter region is S3, and the area of the second inverter region is S4, wherein S3 and S4 satisfy: S3 < S4.
5. The power substrate as described in claim 4, characterized in that, 325 square millimeters ≤ S1 ≤ 370 square millimeters; and / or 295 square millimeters ≤ S2 ≤ 330 square millimeters; and / or 430 square millimeters ≤ S3 ≤ 475 square millimeters; and / or 600 square millimeters ≤ S4 ≤ 645 square millimeters.
6. The power substrate as described in claim 4, characterized in that, The length of the first inverter region in the first direction is L3, where 20 mm ≤ L3 ≤ 23 mm; The length of the second inverter region in the first direction is L4, where 25 mm ≤ L4 ≤ 31 mm.
7. The power substrate as described in claim 6, characterized in that, The length of the substrate body in the first direction is L5, and L3, L4, and L5 satisfy: 52% ≤ (L3 + L4): L5 ≤ 65%.
8. The power substrate as described in any one of claims 1 to 7, characterized in that, The length of the substrate body in the first direction is L5, where 76 mm ≤ L5 ≤ 86 mm; The length of the substrate body in the second direction is L6, where 20 mm ≤ L6 ≤ 25 mm, and the first direction and the second direction are perpendicular to each other.
9. The power substrate as described in any one of claims 1 to 7, characterized in that, The substrate body has a length of L5 in the first direction and a length of L6 in the second direction, wherein L5 and L6 satisfy: 3≤L5:L6≤4, and the first direction and the second direction are perpendicular to each other.
10. A power module, characterized in that, include: The power substrate as described in any one of claims 1 to 9; The frame includes a drive-side frame and a power-side frame, which are disposed on opposite sides of the power substrate in a second direction. The drive-side frame includes drive pads and drive pins, and a drive chip is mounted on the drive pads. The power-side frame includes power pins. A package encapsulates the power substrate and the frame. On opposite sides of the package in the second direction, the side closer to the drive-side frame is designated as the drive side, and the side closer to the power-side frame is designated as the power side. The drive pin extends out of the package from the drive side along the second direction, and the power pin extends out of the package from the power side along the second direction.
11. The power module as described in claim 10, characterized in that, The package further includes two screw holes, which are formed at both ends of the package along a first direction. The centers of the two screw holes are a and b, respectively. Both a and b coincide with the center line of the package in the second direction. The first direction and the second direction are perpendicular to each other.
12. The power module as described in claim 11, characterized in that, For each of the two screw holes: The radius of the screw hole is r, which satisfies: 1.55 mm ≤ r ≤ 1.75 mm; and / or In the first direction, the distance between the center of the screw hole and a side near the substrate body is L7, wherein L7 satisfies: 2.45 mm ≤ L7 ≤ 2.55 mm.
13. A circuit board assembly, characterized in that, Includes the power module as described in any one of claims 10 to 12.
14. An electrical control box assembly, characterized in that, Includes the power module as described in any one of claims 10 to 12.
15. An electrical device, characterized in that, Includes the power module as described in any one of claims 10 to 12.