Flip-chip LED chip packaging structure
By setting cutouts and soldering areas on a metal packaging substrate, the electrical connection and packaging of flip-chip LEDs are achieved, solving the problems of low power and high cost in LED packaging structures, and providing a low-cost, high-power packaging solution.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FOSHAN EVERCORE OPTOELECTRONICS TECH
- Filing Date
- 2025-07-10
- Publication Date
- 2026-06-26
AI Technical Summary
Existing LED packaging structures have low power, and ceramic eutectic packaging is costly and complex, making it difficult to achieve large-scale, low-cost production.
A metal packaging substrate is used, with a cutout and a soldering area on the substrate. The flip-chip LED is electrically connected to both sides of the cutout and coated with encapsulating glue to form a flip-chip LED packaging structure.
It achieves low-cost LED packaging with a simple process, significantly improves the power of packaged devices, and avoids the use of high-cost ceramic substrates.
Smart Images
Figure CN224419212U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED packaging technology, and in particular to a flip-chip LED chip packaging structure. Background Technology
[0002] LED packaging structures typically include a mounted LED chip, a package holder, and encapsulating adhesive. The package holder has an adhesive cup, and the mounted LED chip is placed within the cup and electrically connected to the functional area of the package holder via conductivity. The encapsulating adhesive surrounds and encapsulates the LED chip. After packaging, the chips are ejected into individual LED beads. However, LED packaging structures obtained through package holder encapsulation have relatively low power. Ceramic eutectic packaging can improve the power of LED packaging structures. LED beads such as 3535, 2525, 2016, and 1616 are usually made by eutectic packaging LED chips on a ceramic substrate. Ceramic eutectic packaging generally uses aluminum nitride ceramic substrates with high thermal conductivity. The substrate cost is high, and the manufacturing process is complex, making it difficult to achieve low-cost mass production of LED packaging structures. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide a flip-chip LED chip packaging structure with low packaging cost, simple process, and high power of the packaged device.
[0004] To solve the above-mentioned technical problems, this utility model provides a flip-chip LED chip packaging structure, including a metal packaging substrate, a flip-chip LED chip assembly, and a packaging adhesive layer;
[0005] The metal packaging substrate includes a front side and a back side disposed opposite to each other. The metal packaging substrate has a plurality of cutouts penetrating the front side and the back side of the metal packaging substrate. The plurality of cutouts are spaced apart along a first direction of the metal packaging substrate. Along the first direction of the metal packaging substrate, each cutout has a welding area on both sides.
[0006] The flip-chip LED chip assembly includes at least one flip-chip LED, which is disposed on the cutout portion, and the electrodes of the flip-chip LED are electrically connected to the soldering area.
[0007] The encapsulating adhesive layer at least covers the LED chipset.
[0008] As an improvement to the above solution, the width of the cutout portion along the first direction of the metal packaging substrate is 100μm to 500μm.
[0009] As an improvement to the above solution, the distance between adjacent cutout portions along the first direction of the metal packaging substrate is 1mm to 5mm.
[0010] As an improvement to the above solution, the cutout extends along the second direction of the metal packaging substrate, and the cutout is at a preset distance from the edge of the metal packaging substrate in the second direction of the metal packaging substrate; the preset distance is 0.5mm to 5mm.
[0011] As an improvement to the above solution, the flip-chip LED chips are spaced apart along the second direction of the metal package substrate.
[0012] As an improvement to the above solution, along the first direction of the metal packaging substrate, each of the hollow portions has a first welding area and a second welding area on both sides, the flip-chip is disposed on the hollow portion, and the positive and negative electrodes of the flip-chip are electrically connected to the first welding area and the second welding area, respectively.
[0013] As an improvement to the above solution, the metal packaging substrate is provided with a cutting portion, which includes a first cutting portion and a second cutting portion;
[0014] Along the first direction of the metal packaging substrate, the first cutting portion is at least disposed on one side of the hollow portion, and the first cutting portion is spaced apart along the second direction of the metal packaging substrate;
[0015] The second cutting portion is disposed at the edge of the metal packaging substrate, and the second cutting portion is spaced apart along the first direction of the metal packaging substrate;
[0016] The width of the first cutting portion is 50μm to 500μm; the width of the second cutting portion is 50μm to 500μm.
[0017] As an improvement to the above solution, the encapsulating adhesive layer is a fluorescent adhesive layer, which covers the flip-chip LED; or
[0018] The encapsulating adhesive layer comprises a white adhesive layer and a fluorescent adhesive layer. The white adhesive layer is disposed around the flip-chip, and its thickness is less than or equal to the height of the flip-chip. The fluorescent adhesive layer at least covers the upper surface of the flip-chip; or
[0019] The flip-chip LED is a CSP chip, and the encapsulating adhesive layer is a white wall adhesive layer. The white wall adhesive layer is disposed around the flip-chip LED, and the thickness of the white wall adhesive layer is less than or equal to the height of the flip-chip LED.
[0020] As an improvement to the above solution, the flip-chip LED chip assembly includes three flip-chip LEDs, which are arranged in a straight line; along the first direction of the metal packaging substrate, the three flip-chip LEDs are respectively disposed on different cutout portions.
[0021] As an improvement to the above solution, the flip-chip LED chip assembly includes four flip-chip LEDs, which are arranged in a grid pattern; along the first direction of the metal packaging substrate, the four flip-chip LEDs are respectively disposed on two different cutout portions.
[0022] The present invention has the following beneficial effects:
[0023] The flip-chip LED packaging structure provided by this utility model includes a metal packaging substrate, a flip-chip LED chip assembly, and an encapsulating adhesive layer. The metal packaging substrate has a cutout portion. By simply connecting the positive and negative terminals of the flip-chip LED to the welding areas on both sides of the cutout portion to form an electrical connection and applying encapsulating adhesive, multiple flip-chip LED chip assemblies can be packaged. The flip-chip LED packaging structure provided by this utility model does not require the use of a high-cost ceramic substrate, has a simple manufacturing process, low material cost, and the power of the final packaged device is significantly higher than that of the packaged device obtained by conventional bracket packaging. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the structure of a metal packaging substrate provided in an embodiment of the present invention;
[0025] Figure 2 This is a schematic diagram of the flip-chip LED chip packaging structure provided in one embodiment of the present invention;
[0026] Figure 3 This is a schematic diagram of the structure of a metal packaging substrate provided in an embodiment of the present invention;
[0027] Figure 4 This is a schematic diagram of the flip-chip LED chip packaging structure provided in one embodiment of the present invention;
[0028] Figure 5 This is a schematic diagram of the flip-chip LED chip packaging structure provided in one embodiment of the present invention;
[0029] Figure 6 This is a schematic diagram of a flip-chip LED chip packaging structure provided in one embodiment of the present invention. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the following will describe this utility model in further detail with reference to the accompanying drawings. It is hereby declared that the terms "up," "down," "left," "right," "front," "back," "inner," and "outer," etc., appearing or about to appear in this document, are based solely on the accompanying drawings and are not intended to specifically limit this utility model.
[0031] like Figure 1 and Figure 2 As shown, this utility model embodiment provides a flip-chip LED chip packaging structure, including a metal packaging substrate 1, a flip-chip LED chip group 2, and an encapsulating adhesive layer (not shown in the figure);
[0032] The metal packaging substrate 1 includes a front side and a back side disposed opposite to each other. The metal packaging substrate 1 is provided with a plurality of cutout portions 11 penetrating the front side and the back side of the metal packaging substrate 1. The plurality of cutout portions 11 are spaced apart along a first direction of the metal packaging substrate 1. Along the first direction of the metal packaging substrate 1, each cutout portion 11 has a welding area 12 on both sides.
[0033] The flip-chip LED chip assembly 2 includes at least one flip-chip LED chip, which is disposed on the cutout portion 11, and the electrodes of the flip-chip LED chip are electrically connected to the soldering area 12.
[0034] The encapsulating adhesive layer at least covers the LED chipset.
[0035] The flip-chip LED packaging structure provided by this utility model includes a metal packaging substrate 1, a flip-chip LED chip assembly 2, and an encapsulating adhesive layer. The metal packaging substrate 1 has a cutout portion 11. By simply connecting the positive and negative terminals of the flip-chip LED to the welding areas 12 on both sides of the cutout portion 11 to form an electrical connection and applying encapsulating adhesive, multiple packaging units can be packaged. The flip-chip LED packaging structure provided by this utility model does not require the use of a high-cost ceramic substrate, has a simple manufacturing process, low material cost, and the power of the final packaged device is significantly higher than that of the packaged device obtained by conventional bracket packaging.
[0036] In one embodiment, the first direction and the second direction of the metal packaging substrate 1 are arranged perpendicularly to each other on the same horizontal plane. It can be understood that the first direction of the metal packaging substrate 1 can be the length direction of the metal packaging substrate 1, and correspondingly, the second direction of the metal packaging substrate 1 can be the width direction of the metal packaging substrate 1.
[0037] It is understood that, along the first direction of the metal packaging substrate 1, each of the cutout portions 11 has a first welding area 12a and a second welding area 12b on both sides, respectively. The flip-chip is disposed on the cutout portion 11, and the positive and negative electrodes of the flip-chip are electrically connected to the first welding area 12a and the second welding area 12b, respectively. The cutout portion 11 on the metal packaging substrate 1 is equivalent to an isolation groove that isolates the first welding area 12a and the second welding area 12b, so that the welding areas 12 on both sides of each cutout portion 11 on the metal packaging substrate 1 are not conductive.
[0038] In one embodiment, the width s1 of the cutout portion 11 along the first direction of the metal packaging substrate 1 is 100μm to 500μm. If the width of the cutout portion 11 is too large, the effective area of the welding area 12 will be reduced accordingly, increasing the difficulty of subsequent welding; if the width of the cutout portion 11 is too small, during the welding process, the welding material may cause the welding areas 12 located on both sides of the cutout portion 11 to conduct, thereby causing a short circuit in the internal circuit of the packaged device, resulting in an increased defect rate of the device.
[0039] In one embodiment, along the first direction of the metal packaging substrate 1, the distance s2 between adjacent cutout portions 11 is 1mm to 5mm. Controlling the distance between adjacent cutout portions 11 can provide sufficient area for the arrangement of multiple flip-chip LED chips 2 and improve the material utilization rate of the metal packaging substrate 1. Preferably, the distance between adjacent cutout portions 11 is 1.5mm to 3mm.
[0040] In a preferred embodiment, the cutout portion 11 extends along the second direction of the metal packaging substrate 1, and the cutout portion 11 and the edge of the metal packaging substrate 1 are at a predetermined distance s3 along the second direction of the metal packaging substrate 1; the predetermined distance is 0.5mm to 5mm. The predetermined distance between the cutout portion 11 and the edge of the metal packaging substrate 1 along the second direction of the metal packaging substrate 1 ensures the integrity of the metal packaging substrate 1. After subsequent cutting operations, the welding area 12 can be maximized, while preventing the welding areas 12 on both sides of the cutout portion 11 from becoming connected.
[0041] In a preferred embodiment, the flip-chip LED chipset 2 is spaced apart along the second direction of the metal packaging substrate 1, making the overall packaging structure more compact and simple, and facilitating subsequent cutting into individual packaging units.
[0042] To facilitate the subsequent splitting of flip-chip LED chipset 2, such as Figure 3 and Figure 4 As shown, the metal packaging substrate is provided with a cutting portion 13, which includes a first cutting portion 13a and a second cutting portion 13b.
[0043] Along the first direction of the metal packaging substrate 1, the first cutting portion 13a is at least disposed on one side of the hollow portion 11, and the first cutting portions 13a are spaced apart along the second direction of the metal packaging substrate 1. That is, the first cutting portion 13a can be disposed on one side of the hollow portion 11 for simple processing, or it can be disposed on both sides of the hollow portion 11 to further improve positioning accuracy. It is understood that, in the first direction, the distance between two adjacent first cutting portions 13a is greater than the size of the flip-chip LED chip assembly 2.
[0044] The second cutting portion 13b is disposed at the edge of the metal packaging substrate 1, and the second cutting portions 13b are spaced apart along a first direction of the metal packaging substrate 1. It can be understood that, in the second direction, the distance between two adjacent second cutting portions 13b is greater than the size of the flip-chip LED chip assembly.
[0045] To improve production efficiency, the first cutting portion 13a and the second cutting portion 13b can be formed together with the hollowed-out portion 11 by etching. The cutting portion 13 provides positioning for cutting and also improves the positioning accuracy of the flip-chip LED chip assembly 2. When setting up the flip-chip LED chip assembly 2, it is only necessary to place the flip-chip LED chip assembly 2 between adjacent cutting portions 13, resulting in rapid and accurate positioning. In a preferred embodiment, the width of the first cutting portion is 50μm to 500μm; the width of the second cutting portion is 50μm to 500μm. If the width of the cutting portion 13 is too large, it will reduce the number of flip-chip LED chip assemblies 2, resulting in a decrease in material utilization; if the width of the cutting portion 13 is too small, it will cause certain cutting damage during the cutting process, adversely affecting the flip-chip LED chip and ultimately reducing the reliability of the flip-chip LED chip.
[0046] In one embodiment, a dam is provided around the front side of the metal packaging substrate 1. The dam prevents the encapsulating adhesive from overflowing during subsequent encapsulation. At the same time, the presence of the dam also enables the encapsulating adhesive to form a plane of uniform thickness, ensuring that the light-emitting effect of each flip-chip LED chip group 2 in the packaging unit is consistent.
[0047] It is understood that the flip-chip LED packaging structure provided in this embodiment can be used in different packaging models. In one embodiment, such as... Figure 5 As shown, the flip-chip LED packaging structure provided in this embodiment of the present invention can be used for packaging 1860 type LED beads. The flip-chip LED chip group 2 includes three flip-chip LED chips 21, which are arranged in a straight line. Along the first direction of the metal packaging substrate 1, the three flip-chip LED chips 21 are respectively disposed on different hollow portions 11.
[0048] In one implementation, such as Figure 6 As shown, the flip-chip LED packaging structure provided in this embodiment of the present invention can be used for packaging 5050 model LED beads. The flip-chip LED chip group 2 includes four flip-chip LED chips 21, which are arranged in a grid pattern. Along the first direction of the metal packaging substrate 1, the four flip-chip LED chips 21 are respectively disposed on two different hollow portions 11.
[0049] In use, flip-chip LEDs are first spaced apart on each cutout 11 along the second direction of the metal encapsulation substrate 1. Die bonding is then performed to electrically connect the positive and negative electrodes of the flip-chip LEDs to the first bonding area 12a and the second bonding area 12b, respectively. Subsequently, an encapsulating adhesive layer is formed on the flip-chip LEDs to prevent moisture and impurities from entering the chip and affecting light emission, while providing a specific emission color and / or color temperature. Then, an encapsulation unit including at least one flip-chip LED 2 is cut along the cutting portion 13 to obtain the encapsulation structure.
[0050] In one embodiment, the encapsulating adhesive layer is a fluorescent adhesive layer, which covers the flip-chip LED. Directly covering the flip-chip LED with the fluorescent adhesive layer simplifies the fabrication process.
[0051] In one embodiment, the encapsulating adhesive layer comprises a white adhesive layer and a fluorescent adhesive layer. The white adhesive layer is disposed around the flip-chip, and its thickness is less than or equal to the height of the flip-chip. The fluorescent adhesive layer at least covers the upper surface of the flip-chip. It is understood that the upper surface of the flip-chip is the light-emitting surface, and the lower surface is the electrode surface. The white adhesive layers disposed on the sides and bottom of the flip-chip can act as reflective layers, reflecting light leaking from the sides and bottom, so that light mainly exits from the upper surface of the flip-chip. Combined with the fluorescent adhesive layer disposed on the upper surface of the flip-chip, this significantly improves luminous efficiency.
[0052] In one embodiment, the flip-chip LED is a CSP chip, and the encapsulating adhesive layer is a white-wall adhesive layer disposed around the flip-chip LED, with the thickness of the white-wall adhesive layer being less than or equal to the height of the flip-chip LED. Using a CSP chip for encapsulation can significantly reduce the package volume, thereby reducing the size of each package unit, making it suitable for miniaturized, high-heat-dissipation, and high-frequency driving applications.
[0053] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.
Claims
1. A flip-chip LED package structure, characterized in that, Includes metal packaging substrate, flip-chip LED chipset and encapsulating adhesive layer; The metal packaging substrate includes a front side and a back side disposed opposite to each other. The metal packaging substrate has a plurality of cutouts penetrating the front side and the back side of the metal packaging substrate. The plurality of cutouts are spaced apart along a first direction of the metal packaging substrate. Along the first direction of the metal packaging substrate, each cutout has a welding area on both sides. The flip-chip LED chip assembly includes at least one flip-chip LED, which is disposed on the cutout portion, and the electrodes of the flip-chip LED are electrically connected to the soldering area. The encapsulating adhesive layer at least covers the LED chipset.
2. The flip-chip LED packaging structure as described in claim 1, characterized in that, Along the first direction of the metal packaging substrate, the width of the cutout portion is 100μm to 500μm.
3. The flip-chip LED packaging structure as described in claim 1, characterized in that, Along the first direction of the metal packaging substrate, the distance between adjacent cutout portions is 1mm to 5mm.
4. The flip-chip LED packaging structure as described in claim 1, characterized in that, The cutout extends along the second direction of the metal packaging substrate, and the cutout is at a preset distance from the edge of the metal packaging substrate in the second direction of the metal packaging substrate; the preset distance is 0.5mm to 5mm.
5. The flip-chip LED packaging structure as described in claim 1, characterized in that, The flip-chip LED chips are spaced apart along the second direction of the metal package substrate.
6. The flip-chip LED packaging structure as described in claim 1, characterized in that, Along the first direction of the metal packaging substrate, each of the hollow portions has a first welding area and a second welding area on both sides, the flip-chip is disposed on the hollow portion, and the positive and negative electrodes of the flip-chip are electrically connected to the first welding area and the second welding area, respectively.
7. The flip-chip LED packaging structure as described in claim 1, characterized in that, The metal packaging substrate is provided with a cutting portion, which includes a first cutting portion and a second cutting portion; Along the first direction of the metal packaging substrate, the first cutting portion is at least disposed on one side of the hollow portion, and the first cutting portion is spaced apart along the second direction of the metal packaging substrate; The second cutting portion is disposed at the edge of the metal packaging substrate, and the second cutting portion is spaced apart along the first direction of the metal packaging substrate; The width of the first cutting portion is 50μm to 500μm; the width of the second cutting portion is 50μm to 500μm.
8. The flip-chip LED package structure as described in claim 1, characterized in that, The encapsulating adhesive layer is a fluorescent adhesive layer, which covers the flip-chip LED; or The encapsulating adhesive layer comprises a white adhesive layer and a fluorescent adhesive layer. The white adhesive layer is disposed around the flip-chip, and its thickness is less than or equal to the height of the flip-chip. The fluorescent adhesive layer at least covers the upper surface of the flip-chip; or The flip-chip LED is a CSP chip, and the encapsulating adhesive layer is a white wall adhesive layer. The white wall adhesive layer is disposed around the flip-chip LED, and the thickness of the white wall adhesive layer is less than or equal to the height of the flip-chip LED.
9. The flip-chip LED packaging structure as described in claim 1, characterized in that, The flip-chip LED chip assembly includes three flip-chip LEDs, which are arranged in a straight line. Along the first direction of the metal packaging substrate, the three flip-chip LEDs are respectively disposed on different cutout portions.
10. The flip-chip LED packaging structure as described in claim 1, characterized in that, The flip-chip LED chip assembly includes four flip-chip LEDs, which are arranged in a grid pattern. Along the first direction of the metal packaging substrate, the four flip-chip LEDs are respectively disposed on two different cutout portions.