Display device

Abstract

A display device includes a substrate; a first electrode disposed on the substrate; a pixel definition layer having a pixel opening defined on the first electrode; an emission layer disposed in the pixel opening; a second electrode disposed on the emission layer; an encapsulation layer disposed on the second electrode; a sensing electrode portion and a reflective layer disposed on the encapsulation layer; a first light blocking layer overlapping the sensing electrode portion; and a second light blocking layer overlapping the reflective layer, wherein the reflective layer includes a plurality of recessed portions disposed in an area overlapping the second light blocking layer.

Description

Technical Field

[0001] This disclosure relates to a display device, and more specifically, to a display device having improved light efficiency. Background Technology

[0002] Display devices are devices that display images, and include liquid crystal displays (“LCDs”) and organic light-emitting diode (“OLEDs”) displays. These display devices are used in a variety of electronic devices such as mobile phones, navigation devices, digital cameras, e-books, portable game consoles, and various terminals. Utility Model Content

[0003] The embodiments are intended to provide a display device that has improved display quality by improving light efficiency.

[0004] The display device in the embodiment includes: a substrate; a first electrode disposed on the substrate; a pixel defining layer, in which a pixel opening is defined on the first electrode; a light-emitting layer disposed in the pixel opening; a second electrode disposed on the light-emitting layer; an encapsulation layer disposed on the second electrode; a sensing electrode portion and a reflective layer disposed on the encapsulation layer; a first light-blocking layer overlapping the sensing electrode portion; and a second light-blocking layer overlapping the reflective layer, wherein the reflective layer includes a plurality of recessed portions disposed in the region overlapping with the second light-blocking layer.

[0005] In an embodiment, the display device may further include: a sensing insulating layer disposed between the reflective layer and the encapsulation layer, and the sensing insulating layer may include a plurality of recessed regions corresponding to a plurality of recessed portions.

[0006] In one embodiment, the reflective layer may contact the upper surface of the sensing insulating layer.

[0007] In an embodiment, the sensing electrode portion may include a first electrode layer and a second electrode layer disposed in different conductive layers, and a sensing insulating layer may be disposed between the first electrode layer and the second electrode layer.

[0008] In an embodiment, at least some of the recessed portions may have a circular shape in a plan view.

[0009] In an embodiment, at least some of the recessed portions may have an elliptical shape with a major axis in a plan view.

[0010] In one embodiment, the long axes of at least some of the recessed portions may be oriented in the same direction as each other.

[0011] In an embodiment, the orientations of the long axes of at least two or more of the plurality of recessed portions may be different from each other.

[0012] In an embodiment, at least some of the recessed portions may have a polygonal shape in a plan view.

[0013] In an embodiment, the distance between the centers of adjacent recesses among a plurality of recesses can be constant.

[0014] In an embodiment, for at least some of the plurality of recessed portions, the distance between the centers of adjacent recessed portions may not be constant.

[0015] In one embodiment, at least some of the recessed portions may be disposed in the outer region of the reflective layer.

[0016] In one embodiment, at least some of the recessed portions may be disposed in the inner region of the reflective layer.

[0017] In an embodiment, one of the recessed portions may have a curved surface in a cross-sectional view.

[0018] The display device in the embodiment includes: a substrate; a first electrode disposed on the substrate; a pixel defining layer defining a pixel opening overlapping the first electrode; a light-emitting layer disposed in the pixel opening; a second electrode disposed above the light-emitting layer; an encapsulation layer disposed above the second electrode; a sensing electrode portion and a reflective layer disposed above the encapsulation layer; a first blocking layer overlapping the sensing electrode portion; and a second blocking layer overlapping the reflective layer, wherein the reflective layer includes an uneven portion and a flat portion in the region overlapping with the second blocking layer.

[0019] In an embodiment, the uneven portion may include multiple recessed portions.

[0020] In one embodiment, the uneven portion may be located in the outer region of the reflective layer.

[0021] In this embodiment, the uneven portion can be more prominently located in the inner region of the reflective layer.

[0022] In an embodiment, the planar shape of the plurality of recessed portions may be at least one of a circular shape, an elliptical shape, a triangular shape, a square shape, and a pentagonal shape with a center.

[0023] In an embodiment, the distance between the centers of adjacent recesses among a plurality of recesses can be constant.

[0024] Through these embodiments, a display device with improved display quality by increasing light efficiency can be provided. Attached Figure Description

[0025] The above and other exemplary embodiments, advantages and features of this disclosure will become more apparent from the further detailed description of exemplary embodiments of this disclosure with reference to the accompanying drawings.

[0026] Figure 1 This is a schematic perspective view illustrating an embodiment of the display device in use.

[0027] Figure 2 This is an exploded perspective view of an embodiment of the display device.

[0028] Figure 3 This is a block diagram of an embodiment of the display device.

[0029] Figure 4 This is a schematic plan view of an embodiment of a sensing electrode in a display panel.

[0030] Figure 5 This is a schematic plan view illustrating an embodiment of multiple pixels in a display panel.

[0031] Figure 6 It is shown in the diagram along Figure 5 A cross-sectional view of an embodiment of a portion of the display area in the display panel, taken by lines A1-A2.

[0032] Figure 7 It is along Figure 8 The line segment B1-B2 is shown. Figure 6 A partial cross-sectional view.

[0033] Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 This is a plan view showing an embodiment of a portion of the pixels. Detailed Implementation

[0034] In the following, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, enabling those skilled in the art to readily implement the present disclosure. The present disclosure may be implemented in many different forms and is not limited to the embodiments described herein.

[0035] For clarity of this disclosure, parts not related to this description have been omitted, and throughout the specification, the same or similar parts are given the same reference numerals.

[0036] Furthermore, for ease of explanation, the dimensions and thicknesses of each component shown in the accompanying drawings are arbitrarily depicted, and therefore this disclosure is not necessarily limited to what is shown. In the drawings, thicknesses are enlarged to clearly represent the various layers and regions. And in the drawings, the thicknesses of some layers and regions are exaggerated for ease of explanation.

[0037] Furthermore, when a portion of a layer, film, region, or plate is referred to as being "above" or "on" another portion, this includes not only the case where the portion is "directly above" the other portion, but also the case where there is another portion between the two portions. Conversely, when an element is referred to as being "directly above" another element, there is no intervening element. Additionally, being "above" or "on" a reference portion means being positioned above or below the reference portion, and does not necessarily mean being positioned "above" or "on" the reference portion in the direction opposite to gravity.

[0038] Furthermore, throughout the specification, when a section is referred to as "including" a certain component, it means that the section may further include other components, rather than exclude other components, unless specifically stated otherwise.

[0039] Furthermore, throughout the instruction manual, when "in a plan view" is mentioned, it means when the target part is viewed from above, and when "in a cross section" is mentioned, it means when the target part is cut vertically and viewed from the side.

[0040] Given the measurements discussed and the errors associated with the measurement of a specific quantity (i.e., limitations of the measurement system), the terms “about” or “approximately” as used herein include stated values ​​and mean within an acceptable deviation of the specific value as determined by one of ordinary skill in the art. Terms such as “about” can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0041] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms such as those defined in common dictionaries shall be interpreted as having meanings consistent with their meanings in the relevant art and in the context of this disclosure, and shall not be interpreted in an idealized or overly formal sense unless specifically limited herein. Embodiments of the display device can be applied to various electronic devices. Embodiments of the electronic device may include a display device, and may further include modules or devices with additional functionality in addition to a display device.

[0042] In the following text, it will be through Figures 1 to 3 Describe a schematic structure of the display device. Figure 1 This is a schematic perspective view illustrating an embodiment of the display device in use. Figure 2 This is an exploded perspective view of an embodiment of the display device, and Figure 3 This is a block diagram of an embodiment of the display device.

[0043] refer to Figure 1 The display device 1000 in the embodiments is a device for displaying video or still images, and can be used as a display screen for various products such as mobile phones, smartphones, tablet personal computers (“PCs”), mobile communication terminals, electronic notebooks, e-books, portable multimedia players, navigation systems, ultra-mobile PCs, and displays for televisions, laptops, monitors, billboards, and Internet of Things (“IoT”) devices. Furthermore, the display device 1000 in the embodiments can be used in wearable devices such as smartwatches, watch phones, glasses-type displays, and head-mounted displays (“HMDs”). Additionally, the display device 1000 in the embodiments can be used as a car dashboard, a central information display (“CID”) mounted on the central dashboard or instrument panel of a car, an in-vehicle rearview mirror display replacing the car's rearview mirror, and a display placed on the back of the front seats in a car for rear-seat entertainment. For ease of explanation, Figure 1 The display device 1000 is shown and is used as a tablet PC.

[0044] The display device 1000 can display an image on a third direction DR3 on a display surface parallel to each of the first direction DR1 and the second direction DR2. The display surface on which the image is displayed can correspond to the front surface of the display device 1000 and the front surface of the cover window WU. The image can include static images and dynamic images.

[0045] In this embodiment, the front (or top) surface and the rear (or bottom) surface of each component are defined based on the orientation of the displayed image. The front and rear surfaces are opposite to each other in the third direction DR3, and the normal direction of each of the front and rear surfaces may be parallel to the third direction DR3. The separation distance between the front and rear surfaces in the third direction DR3 may correspond to the thickness of the display panel DP in the third direction DR3.

[0046] The display device 1000 in the embodiment can detect user input applied from the outside (see reference). Figure 1(The user's input can include various types of external input, such as a part of the user's body, light, heat, or pressure. In this embodiment, the user's input is shown as a user's hand applied to the front of the display device 1000. However, this disclosure is not limited thereto. User input can be provided in various forms. Furthermore, depending on the structure of the display device 1000, the display device 1000 can detect user input applied to the side or back of the display device 1000.)

[0047] refer to Figure 1 and Figure 2 The display device 1000 may include a cover window WU, a housing HM, a display panel DP, and optical elements ES. In an embodiment, the cover window WU and the housing HM may be combined to form the appearance of the display device 1000.

[0048] The cover window WU may include an insulating panel. In embodiments, the cover window WU may include glass, plastic, or any combination thereof, or may be composed of glass, plastic, or any combination thereof.

[0049] The front of the cover window WU can define the front of the display device 1000. The transmissive area TA can be an optically transparent area. In an embodiment, the transmissive area TA can be an area with a visible light transmittance of about 90% or higher.

[0050] The blocking region BA can define the shape of the transmissive region TA. The blocking region BA is adjacent to (near) the transmissive region TA and can surround the transmissive region TA. Compared to the transmissive region TA, the blocking region BA can be a region with relatively low light transmittance. The blocking region BA can include an opaque material that blocks light. The blocking region BA can have a predetermined color. The blocking region BA can be defined by a border layer provided separately from the transparent substrate defining the transmissive region (hereinafter also referred to as the transmissive area) TA, or it can be defined by an ink layer formed by adding or coloring the transparent substrate.

[0051] The display panel DP may include a front surface comprising a display area DA and a non-display area PA. The display area DA may be the area in which pixels PX operate and emit light according to electrical signals. The non-display area PA of the display panel DP may include a driver 50.

[0052] In an embodiment, the display area DA is an area that includes the pixel PX and displays an image. At the same time, the display area DA can be an area that senses external input by placing a touch sensor on the third-party DR3 above the pixel PX.

[0053] The transmissive region TA of the overlay window WU may at least partially overlap with the display region DA of the display panel DP. In embodiments, for example, the transmissive region TA may overlap entirely with the display region DA, or it may overlap with at least a portion of the display region DA. Accordingly, a user can view an image through the transmissive region TA or provide external input based on the image. However, this disclosure is not limited thereto. In embodiments, for example, within the display region DA, the area for displaying the image and the area for detecting external input may be separate from each other.

[0054] The non-display area PA of the display panel DP may at least partially overlap with the blocking area BA of the covering window WU. The non-display area PA may be the area covered by the blocking area BA. The non-display area PA is adjacent to (near) the display area DA and may surround the display area DA. No image is displayed in the non-display area PA, and the drive circuitry or drive wiring for driving the display area DA may be configured. The non-display area PA may include a first peripheral area PA1 disposed outside the display area DA and a second peripheral area PA2 including the driver 50, connecting wiring, and a bending area. Figure 2 In one embodiment, the first peripheral region PA1 is disposed on three sides of the display region DA, and the second peripheral region PA2 is disposed on the remaining side of the display region DA.

[0055] In this embodiment, the display panel DP can be assembled in a flat state, with the display area DA and the non-display area PA facing the cover window WU. However, this disclosure is not limited thereto. A portion of the non-display area PA of the display panel DP can be bent. In this case, a portion of the non-display area PA faces the back of the display device 1000, such that the obstruction area BA visible from the front of the display device 1000 can be reduced, and... Figure 2 In this process, the second peripheral region PA2 can be bent and placed behind the display region DA and then assembled.

[0056] Furthermore, the display panel DP may include component areas EA, and specifically, a first component area EA1 and a second component area EA2. The first component area EA1 and the second component area EA2 may be at least partially surrounded by the display area DA. The first component area EA1 and the second component area EA2 are shown as spaced apart from each other, but are not limited thereto, and may be at least partially connected. The first component area EA1 and the second component area EA2 may be areas beneath which components using infrared light, visible light, or sound are placed.

[0057] The display area DA is formed by multiple light-emitting diodes (LEDs) and multiple pixel circuit units that generate light current and transmit the light current to each of the LEDs. Here, an LED and a pixel circuit unit are referred to as a pixel PX. In the display area DA, a pixel circuit unit and an LED are arranged in a one-to-one correspondence.

[0058] The first component region EA1 may include a transmissive portion through which light and / or sound can be transmitted and / or conducted, and a display portion comprising a plurality of pixels PX. The transmissive portions are disposed between adjacent pixels PX and consist of layers through which light and / or sound can be transmitted and / or conducted. The transmissive portions may be disposed between adjacent pixels PX, and depending on the embodiment, a light-blocking layer (such as a light-blocking layer) may overlap with the first component region EA1. The number of pixels per unit area (also referred to as resolution) of the pixels PX (referred to as normal pixels) included in the display region DA may be the same as the number of pixels per unit area of ​​the pixels PX (referred to as first component pixels) included in the first component region EA1.

[0059] The second component region EA2 includes a region consisting of a transparent layer that allows light to pass through, wherein neither a conductive layer nor a semiconductor layer is disposed (also referred to as a light-transmitting region). This light-transmitting region can have a structure that does not block light by defining holes in a layer having a light-shielding material (e.g., a pixel defining layer and / or a light-blocking layer) that overlap with the position corresponding to the second component region EA2. The number of pixels per unit area of ​​the pixels PX included in the second component region EA2 (also referred to as second component pixels hereinafter) can be less than the number of pixels per unit area of ​​the normal pixels included in the display region DA. As a result, the resolution of the second component pixels can be lower than the resolution of the normal pixels.

[0060] refer to Figure 1 , Figure 2 and Figure 3 The display panel DP may include display pixels (e.g., Figure 2 The display panel DP includes a display area DA (pixels PX) and a touch sensor TS. The display panel DP includes display pixels that generate an image, which can be seen from the outside by a user through a transmissive area TA. Furthermore, the touch sensor TS can be positioned on top of the display pixels and can detect external input applied from the outside. The touch sensor TS can detect external input provided to the overlay window WU.

[0061] Return to reference Figure 2The second peripheral region PA2 may include a bent portion. The display region DA and the first peripheral region PA1 may have a flat state substantially parallel to the plane defined by the first direction DR1 and the second direction DR2, and one side of the second peripheral region PA2 may extend from the flat state, pass through the bent portion, and then return to a flat state. At least a portion of the second peripheral region PA2 may be bent and assembled to be disposed on the back side of the display region DA. When at least a portion of the second peripheral region PA2 is assembled, it overlaps with the display region DA in a plan view, thus reducing the obstruction area BA of the display device 1000. However, this disclosure is not limited thereto. In embodiments, for example, the second peripheral region PA2 may not be bent.

[0062] The driver 50 can be disposed (e.g., mounted) in the second peripheral region PA2, on the bend, or disposed on one side of the opposite side of the bend. The driver 50 can be provided in the form of a chip.

[0063] Driver 50 is electrically connected to display area DA and can transmit electrical signals to display area DA. In an embodiment, for example, driver 50 can provide data signals to pixels PX arranged in display area DA. In an alternative embodiment, driver 50 may include touch driving circuitry and can be electrically connected to touch sensor TS disposed in display area DA. Driver 50 may include various circuits other than those described above, or may be designed to provide various electrical signals to display area DA.

[0064] The display device 1000 may have a pad portion disposed at the end of the second peripheral region PA2, and this pad portion may be electrically connected to a flexible printed circuit board (“FPCB”) including a driver chip. Here, the driver chip disposed on the flexible printed circuit board may include various drive circuits for driving the display device 1000 or connectors for power supply. Depending on the embodiment, a rigid printed circuit board (“PCB”) may be used instead of a flexible printed circuit board.

[0065] The optical element ES can be disposed below the display panel DP. The optical element ES may include a first optical element ES1 that overlaps with the first component region EA1 and a second optical element ES2 that overlaps with the second component region EA2.

[0066] The first optical element ES1 can be an electronic component that uses light or sound. In embodiments, for example, the first optical element ES1 can be a sensor that receives and uses light (such as an infrared sensor), a sensor that outputs and detects light or sound to measure distance or identify fingerprints, a relatively small light-emitting lamp, or a speaker that outputs sound. In the case of an electronic component that uses light, it goes without saying that light from various wavelength bands, such as visible light, infrared light, and ultraviolet light, can be used.

[0067] The second optical element ES2 can be at least one of a camera, an infrared camera (IR camera), a dot projector, an infrared illuminator, and a time-of-flight (“ToF”) sensor.

[0068] refer to Figure 3 The display device 1000 may include a display panel DP, a power module PM, a first electronic module EM1, and a second electronic module EM2. The display panel DP, the power module PM, the first electronic module EM1, and the second electronic module EM2 may be electrically connected to each other. Figure 3 The diagram shows the display pixels and touch sensor TS set in the display area DA of the display panel DP configuration.

[0069] The power module PM supplies the power required for the overall operation of the display device 1000. The power module PM may include a conventional battery module.

[0070] The first electronic module EM1 and the second electronic module EM2 may include various functional modules for operating the display device 1000. The first electronic module EM1 may be directly disposed (e.g., mounted) on a motherboard electrically connected to the display panel DP, or it may be disposed (e.g., mounted) on a separate board and electrically connected to the motherboard via a connector (not shown).

[0071] The first electronic module EM1 may include a control module CM, a wireless communication module TM, an image input module IIM, an audio input module AIM, a memory MM, and an external interface IF. Some of these modules may not be mounted on the motherboard, but may be electrically connected to the motherboard via a flexible printed circuit board.

[0072] The control module CM can control the overall operation of the display device 1000. The control module CM can be a microprocessor. In an embodiment, for example, the control module CM activates or disables the display panel DP. The control module CM can control other modules, such as the image input module IIM or the audio input module AIM, based on touch signals received from the display panel DP.

[0073] The wireless communication module™ can transmit or receive wireless signals from other terminals using Bluetooth or Wi-Fi lines. The wireless communication module™ can also transmit / receive voice signals using common communication lines. The wireless communication module™ includes a transmitter TM1 that modulates and transmits the signal to be transmitted, and a receiver TM2 that demodulates the received signal.

[0074] The Image Input Module (IIM) processes video signals and converts them into video data that can be displayed on the Display Panel (DP). The Audio Input Module (AIM), also known as the Acoustic Input Module, receives external acoustic signals via a microphone in recording mode, speech recognition mode, etc., and converts the acoustic signals into electronic voice data.

[0075] The external interface IF can be used as an interface to connect to external chargers, wired / wireless data ports, card (e.g., memory cards, customer identification module / user identification module (“SIM / UIM”) card) slots, etc.

[0076] The second electronic module EM2 may include an acoustic output module AOM, a light-emitting module LM, a light-receiving module LRM, and a camera module CMM, etc., wherein at least some of them may be disposed on the back of the display panel DP together with the optical element ES, such as Figure 2 As shown in the image.

[0077] The optical element ES may include a light-emitting module LM, a light-receiving module LRM, and a camera module CMM. Furthermore, the second electronic module EM2 may be directly mounted (e.g., installed) on the motherboard, mounted (e.g., installed) on a separate board, and electrically connected to the display panel DP via a connector (not shown), or electrically connected to the first electronic module EM1.

[0078] The Acoustic Output Module (also known as the Audio Output Module) AOM can convert audio data received from the Wireless Communication Module TM or stored in the Memory MM, and output the audio data to the outside.

[0079] A light-emitting module (LM) can generate and output light. The LM can output infrared light. In an embodiment, the LM may include an LED device. In an embodiment, for example, a light-receiving module (LRM) can detect infrared light. For example, the LRM can be activated when infrared light above a predetermined level is detected. The LRM may include a complementary metal-oxide-semiconductor (“CMOS”) sensor. When the infrared light generated in the LM is output, it is reflected by an external object (e.g., a user’s finger or face), and the reflected infrared light can be incident on the LRM. A camera module (CMM) can capture external images.

[0080] In this embodiment, the optical element ES may additionally include a light detection sensor or a thermal detection sensor. The optical element ES can detect external objects received from the front, or provide sound signals, such as speech, to the outside from the front. Furthermore, the optical element ES may include multiple components and is not limited to this specific embodiment.

[0081] Refer again Figure 2 The housing HM can be combined with the cover window WU. The cover window WU can be positioned on the front of the housing HM. The housing HM can be combined with the cover window WU to provide a predetermined receiving space. The display panel DP and optical components ES can be accommodated in the predetermined receiving space provided between the housing HM and the cover window WU.

[0082] The housing HM may comprise a material with relatively high rigidity. In embodiments, for example, the housing HM may comprise multiple frames and / or plates comprising glass, plastic, metal, or any combination thereof, or composed of glass, plastic, metal, or any combination thereof. The housing HM can stably protect the components of the display device 1000 housed within the housing space from external impacts.

[0083] In the following text, reference will be made to Figure 4 The sensing electrodes in the embodiments are described. Figure 4 This is a schematic plan view of an embodiment of a sensing electrode in a display panel.

[0084] refer to Figure 4 The sensing area TCA, including multiple sensing electrodes 520 and 540, can be set in the display area DA (see...). Figure 2 The sensor is positioned above the LED to detect touch. The sensing area TCA can be a region where a touch sensor TS is arranged (see above). Figure 3 (area).

[0085] In the non-display area PA, signal lines or voltage lines (e.g., drive voltage lines, low drive voltage lines, etc.) that deliver signals or voltages to the pixels formed in the display area DA can be provided, and pad portions connected to the signal lines or voltage lines can be provided. Furthermore, multiple sensing traces 512 and 522 can be further provided in the non-display area PA. The multiple sensing traces 512 and 522 can be connected to multiple sensing electrodes 520 and 540.

[0086] The sensing region TCA may include multiple sensing electrodes 520 and 540. The multiple sensing electrodes 520 and 540 may include multiple electrically separated first sensing electrodes 520 and multiple second sensing electrodes 540.

[0087] Depending on the embodiment, the plurality of first sensing electrodes 520 may be sensing input electrodes, and the plurality of second sensing electrodes 540 may be sensing output electrodes. However, this disclosure is not limited thereto, and the plurality of first sensing electrodes 520 may be sensing output electrodes, and the plurality of second sensing electrodes 540 may be sensing input electrodes.

[0088] Multiple first sensing electrodes 520 and multiple second sensing electrodes 540 may be distributed and arranged in a grid shape so as not to overlap each other in the sensing region TCA. The multiple first sensing electrodes 520 are arranged along one of the column direction and the row direction (see reference). Figure 4 The first sensing electrodes 520 are arranged in a second direction (DR2), and the plurality of first sensing electrodes 520 are electrically connected to each other via a first sensing electrode connection portion 521 (also referred to as a bridge). The plurality of second sensing electrodes 540 are arranged in the remaining (additional) direction of the column direction and the row direction (see reference). Figure 4 The first direction DR1) is arranged, and a plurality of second sensing electrodes 540 are electrically connected to each other through a second sensing electrode connection portion 541.

[0089] Multiple first sensing electrodes 520 and multiple second sensing electrodes 540 can be disposed in the same conductive layer. Depending on the embodiment, the multiple first sensing electrodes 520 and multiple second sensing electrodes 540 can be disposed in different conductive layers. Figure 4 The first sensing electrode 520 and the second sensing electrode 540 may have a rhomboid shape, but are not limited thereto, and depending on the embodiment, may have a polygonal shape such as a square or hexagon, a circular shape or an elliptical shape.

[0090] Multiple first sensing electrodes (also referred to as first detection electrodes) 520 and multiple second sensing electrodes 540 are shown as an integral rhomboid structure, but in practice, each rhomboid structure defines an opening, and the linear structure can have a grid-like arrangement. In this case, the opening can correspond to the area where the light-emitting diode emits light upwards. Furthermore, depending on the embodiment, the opening can have a shape that further includes an extension to improve the sensitivity of the touch sensor TS.

[0091] The first sensing electrode 520 and the second sensing electrode 540 may include, or be composed of, transparent or opaque conductors. In embodiments, the first sensing electrode 520 and the second sensing electrode 540 may include a transparent conductive oxide (“TCO”), and for example, the TCO may include at least one of indium tin oxide (“ITO”), indium zinc oxide (“IZO”), zinc oxide (ZnO), carbon nanotubes (“CNT”), and graphene. Furthermore, a plurality of openings may be defined in the first sensing electrode 520 and the second sensing electrode 540. The openings defined in the sensing electrodes 520 and 540 are used to allow light emitted from the light-emitting diode to be emitted undisturbed to the front side.

[0092] When the first sensing electrode 520 and the second sensing electrode 540 are disposed in the same layer, one of the first sensing electrode connection portion 521 and the second sensing electrode connection portion 541 can be disposed in the same layer as the first sensing electrode 520 and the second sensing electrode 540, and the remaining (additional) one can be disposed in a different layer from the first sensing electrode 520 and the second sensing electrode 550. As a result, the plurality of first sensing electrodes 520 and the plurality of second sensing electrodes 540 can be electrically separated. The sensor electrode connection portions disposed in different layers can be disposed on the upper or lower layer of the first sensing electrode 520 and the second sensing electrode 540, and in the embodiments described below, the sensor electrode connection portions are disposed on the lower layer (that is, the layer closer to the substrate), which will be the focus of this description.

[0093] Multiple sensing wires 512 and 522, respectively connected to multiple first sensing electrodes 520 and multiple second sensing electrodes 540, are disposed in the non-display area PA. The multiple first sensing wires 512 can be connected to multiple second sensing electrodes (also referred to as second detection electrodes) 540 arranged in the first direction DR1, and the multiple second sensing wires 522 can be connected to multiple first sensing electrodes 520 arranged in the second direction DR2.

[0094] Figure 4 The diagram illustrates a mutual capacitance type sensing unit that uses two sensing electrodes 520 and 540 to detect touch. However, depending on the embodiment, the sensing unit can be configured as a self-capacitance type sensing unit that uses only one sensing electrode to detect touch.

[0095] In the following text, see references Figure 5 The description of the embodiment will focus on the display area DA (see Figure 2 The shapes of pixels PX1, PX2 and PX3 and light-blocking layers BM1 and BM2 formed in the process. Figure 5 It is a schematic planar diagram showing multiple pixels.

[0096] exist Figure 5In the image, the first pixel PX1, the second pixel PX2, the third pixel PX3, the first light-blocking layer BM1, and the second light-blocking layer BM2 are shown.

[0097] The display area DA in this embodiment may include a first pixel PX1 that emits red light, a second pixel PX2 that emits green light, and a third pixel PX3 that emits blue light. In this embodiment, as... Figure 5 As shown, in one column, the first pixel PX1 and the second pixel PX2 are arranged alternately along the second direction DR2, and in another column adjacent to (near) this column, the third pixel PX3 may be arranged repeatedly. However, the arrangement of pixels is not limited to this arrangement, and the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be arranged in various forms.

[0098] The light-blocking layers BM1 and BM2 in the embodiment may include a first light-blocking layer BM1 and a second light-blocking layer BM2. The first light-blocking layer BM1 may be disposed between the first pixel PX1, the second pixel PX2, and the third pixel PX3. The second light-blocking layer BM2 may overlap with the first pixel PX1, the second pixel PX2, or the third pixel PX3. The second light-blocking layer BM2 may be disposed within the boundary of the light-emitting area of ​​the first pixel PX1, the second pixel PX2, or the third pixel PX3. The second light-blocking layer BM2 may have a circular, elliptical, or polygonal shape in a planar view. The second light-blocking layer BM2 can absorb external light incident on the light-emitting area and reduce external light reflection.

[0099] In the following text, see references Figure 6 The display device in the embodiment will be described by focusing on a cross-sectional view of the display area DA. Figure 6 It is a cross-sectional view of a portion of the display area in the illustrated display panel.

[0100] refer to Figure 6 The substrate SUB may include materials with rigid properties (such as glass) or flexible materials that can be bent (such as plastic or polyimide).

[0101] A buffer layer (BF) can be disposed on the substrate (SUB) to planarize the surface of the substrate (SUB) and block the penetration of impurity elements. The buffer layer (BF) may include, for example, inorganic insulating materials (such as silicon nitride (SiN)). x ), silicon dioxide (SiO) x ) or silicon oxynitride (SiO) x N y Inorganic materials. Depending on the embodiment, the buffer layer BF may have a single-layer or multi-layer structure comprising one or more inorganic insulating materials.

[0102] An isolation layer (not shown) may be further disposed on the substrate SUB. In this case, the isolation layer may be disposed between the substrate SUB and the buffer layer BF. The isolation layer may include, for example, silicon nitride (SiN). x ), silicon dioxide (SiO) x ) or silicon oxynitride (SiO) x N y The inorganic insulating material. The insulating layer (not shown) may have a single-layer or multi-layer structure comprising one or more inorganic insulating materials or composed of one or more inorganic insulating materials.

[0103] A semiconductor layer ACT can be disposed on a substrate SUB. The semiconductor layer ACT can include any of amorphous silicon, polycrystalline silicon, and oxide semiconductors. In embodiments, for example, the semiconductor layer ACT can include low-temperature polycrystalline silicon (“LTPS”) or an oxide semiconductor comprising at least one of zinc (Zn), indium (In), gallium (Ga), tin (Sn), and combinations thereof. In embodiments, for example, the semiconductor layer ACT can include indium gallium zinc oxide (“IGZO”). The semiconductor layer ACT can include a channel region C, a source region S, and a drain region D, defined depending on whether the semiconductor layer ACT is doped with impurities. The source region S and the drain region D can have conductivity characteristics corresponding to conductors.

[0104] The first gate insulating layer GI1 may cover the semiconductor layer ACT and the substrate SUB. The first gate insulating layer GI1 may include materials such as silicon nitride (SiN). x ), silicon dioxide (SiO) x ) or silicon oxynitride (SiO) x N y The first gate insulating layer GI1 may have a single-layer or multi-layer structure comprising one or more inorganic insulating materials or composed of one or more inorganic insulating materials.

[0105] The gate electrode GE1 can be disposed on the first gate insulating layer GI1. The gate electrode GE1 can comprise a metal (such as copper (Cu), molybdenum (Mo), aluminum (Al), silver (Ag), chromium (Cr), tantalum (Ta), and titanium (Ti)) or a metal alloy, or be composed of a metal (such as copper (Cu), molybdenum (Mo), aluminum (Al), silver (Ag), chromium (Cr), tantalum (Ta), and titanium (Ti)) or a metal alloy. The gate electrode GE1 can be composed of a single layer or multiple layers. The region of the semiconductor layer ACT that overlaps with the gate electrode GE in the planar view can be the channel region C.

[0106] A second gate insulating layer GI2 is disposed on the gate electrode GE1. The second gate insulating layer GI2 may include, for example, silicon nitride (SiN). x ), silicon dioxide (SiO) x ) or silicon oxynitride (SiO)x N y The second gate insulating layer GI2 may have a single-layer or multi-layer structure comprising one or more inorganic insulating materials.

[0107] The capacitor electrode GE2 can be disposed on the second gate insulating layer GI2. The capacitor electrode GE2 can overlap with the gate electrode GE1 to form a capacitor.

[0108] A first insulating layer IL1 is disposed on the capacitor electrode GE2. The first insulating layer IL1 may include, for example, silicon nitride (SiN). x ), silicon dioxide (SiO) x ) or silicon oxynitride (SiO) x N y The first insulating layer IL1 may have a single-layer or multi-layer structure comprising one or more inorganic insulating materials.

[0109] The source electrode SE and drain electrode DE can be disposed on the first insulating layer IL1. The source electrode SE and drain electrode DE are connected to the source region S and drain region D of the semiconductor layer ACT, respectively, through openings defined in the first insulating layer IL1, the second gate insulating layer GI2, and the first gate insulating layer GI1. Accordingly, the semiconductor layer ACT, the gate electrode GE, the source electrode SE, and the drain electrode DE described above form a transistor TFT. Depending on the embodiment, the transistor TFT may include only the source region S and drain region D of the semiconductor layer ACT, excluding the source electrode SE and drain electrode DE.

[0110] The source electrode SE and drain electrode DE can comprise metals or metal alloys such as aluminum (Al), copper (Cu), silver (Ag), gold (Au), platinum (Pt), palladium (Pd), nickel (Ni), molybdenum (Mo), tungsten (W), titanium (Ti), chromium (Cr), and tantalum (Ta). The source electrode SE and drain electrode DE can consist of a single layer or multiple layers. In another embodiment, the source electrode SE and drain electrode DE can consist of three layers: an upper layer, a middle layer, and a lower layer. The upper and lower layers can comprise titanium (Ti) or be composed of titanium (Ti), and the middle layer can comprise aluminum (Al) or be composed of aluminum (Al).

[0111] The second insulating layer IL2 may be disposed on the source electrode SE and the drain electrode DE. The second insulating layer IL2 covers the source electrode SE and the drain electrode DE. The second insulating layer IL2 is used to planarize the surface of the substrate SUB equipped with the transistor TFT. The second insulating layer IL2 may be an organic insulating layer and may include one or more materials selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene and phenolic resin.

[0112] The first electrode E1 can be disposed on the second insulating layer IL2. The first electrode E1 is also referred to as the anode electrode, and can consist of a single layer comprising a transparent conductive oxide layer or a metallic material, or a multilayer comprising a transparent conductive oxide layer or a metallic material, or a multilayer comprising a transparent conductive oxide layer or a metallic material, or a multilayer comprising a transparent conductive oxide layer or a metallic material, or a multilayer comprising a transparent conductive oxide layer. The transparent conductive oxide layer can include ITO, polycrystalline ITO, IZO, IGZO, and indium tin zinc oxide (“ITZO”). The metallic material can include silver (Ag), molybdenum (Mo), copper (Cu), gold (Au), and aluminum (Al).

[0113] The first electrode E1 can be physically and electrically connected to the drain electrode DE through an opening in the second insulating layer IL2. Accordingly, the first electrode E1 can receive the output current to be transmitted from the drain electrode DE to the light-emitting layer EML.

[0114] A pixel defining layer (PDL) and a spacer (SPC) can be disposed on the first electrode E1 and the second insulating layer IL2. A pixel opening OP1, overlapping at least a portion of the first electrode E1, can be defined in the pixel defining layer (PDL). In this case, the pixel opening OP1 can overlap with the center of the first electrode E1, but may not overlap with the edge of the first electrode E1. Accordingly, the size of the pixel opening OP1 can be smaller than the size of the first electrode E1. The pixel defining layer (PDL) can define the formation location of the light-emitting layer (EML), such that the light-emitting layer EML can be disposed on the exposed portion of the upper surface of the first electrode E1. The pixel opening OP1 can define the light-emitting area of ​​each pixel.

[0115] The pixel defining layer (PDL) and the spacer (SPC) may each be an organic insulating layer comprising one or more materials selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin. In an embodiment, the pixel defining layer (PDL) may be formed as a black pixel defining layer (BPDL) comprising black pigment or composed of black pigment.

[0116] The emissive layer EML can be disposed within pixel openings OP1 separated by pixel-defining layers PDL. The emissive layer EML can include, or be composed of, organic materials that emit light such as red, green, and blue light. The emissive layer EML emitting red, green, and blue light can include, or be composed of, low-molecular-weight organic materials or high-molecular-weight organic materials. Figure 6 In this diagram, the light-emitting layer (EML) is shown as a single layer. However, auxiliary layers such as an electron injection layer, an electron transport layer, a hole transport layer, and a hole injection layer can also be included above and below the EML. The hole injection layer and the hole transport layer can be disposed at the bottom of the EML, and the electron transport layer and the electron injection layer can be disposed at the top of the EML.

[0117] The second electrode E2 can be disposed on the pixel-defining layer (PDL) and the light-emitting layer (EML). The second electrode E2 is also referred to as the cathode electrode and can be formed as a transparent conductive layer comprising materials such as ITO, IZO, IGZO, and ITZO. Furthermore, the second electrode E2 can have semi-transparent properties, and in this case, the second electrode E2 can form a microcavity together with the first electrode E1. Depending on this microcavity structure, the distance and characteristics between the two electrodes E1 and E2 allow light of a predetermined wavelength to be emitted upwards, resulting in the display of red, green, or blue light.

[0118] The first electrode E1, the light-emitting layer EML, and the second electrode E2 can form a light-emitting diode ED.

[0119] An encapsulation layer ENC can be disposed on the second electrode E2. The encapsulation layer ENC may include at least one inorganic layer and at least one organic layer. In this embodiment, the encapsulation layer ENC may include a first inorganic encapsulation layer EIL1, an organic encapsulation layer EOL, and a second inorganic encapsulation layer EIL2. However, this is only an exemplary embodiment, and the number of inorganic and organic films constituting the encapsulation layer ENC can be varied in various ways.

[0120] The lower sensing electrode portion MTL1 (or the first electrode layer) and the upper sensing electrode portion MTL2 (or the second electrode layer) can be disposed on the encapsulation layer ENC. This specification defines a configuration in which the lower sensing electrode portion MTL1 is disposed directly above the encapsulation layer ENC, but is not limited thereto, and a lower sensing insulating layer (not shown) can be disposed between the encapsulation layer ENC and the lower sensing electrode portion MTL1.

[0121] The lower sensing electrode portion MTL1 may include at least one of the plurality of sensing electrodes 520 and 540 described above, the first sensing electrode connection portion 521, and the second sensing electrode connection portion 541. The upper sensing electrode portion MTL2 may include the remaining portions of the plurality of sensing electrodes 520 and 540 described above, the first sensing electrode connection portion 521, and the second sensing electrode connection portion 541. In an embodiment, the lower sensing electrode portion MTL1 includes the plurality of sensing electrodes 520 and 540 and the first sensing electrode connection portion 521, and the upper sensing electrode portion MTL2 includes the second sensing electrode connection portion 541. In an alternative embodiment, the lower sensing electrode portion MTL1 includes the second sensing electrode connection portion 541, and the upper sensing electrode portion MTL2 includes the plurality of sensing electrodes 520 and 540 and the first sensing electrode connection portion 521. This is not limited to this and can be modified to various embodiments. This specification describes an embodiment in which the lower sensing electrode portion MTL1 includes a sensing electrode connection portion.

[0122] The first sensing insulating layer TL1 may be disposed on the encapsulation layer ENC and the lower sensing electrode portion MTL1. The first sensing insulating layer TL1 may include an inorganic insulating material or an organic insulating material. The inorganic insulating material may include at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride. The organic insulating material may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, and perylene resin.

[0123] The upper sensing electrode portion MTL2 may be disposed on the first sensing insulating layer TL1. As described above, the upper sensing electrode portion MTL2 may include at least one of a plurality of sensing electrodes 520 and 540, a first sensing electrode connection portion 521, and a second sensing electrode connection portion 541. In the embodiment, the upper sensing electrode portion MTL2 may include a plurality of sensing electrodes 520 and 540 and a first sensing electrode connection portion 521.

[0124] The upper sensing electrode portion MTL2 can be electrically connected to the lower sensing electrode portion MTL1 through a contact hole defined in the first sensing insulating layer TL1.

[0125] The display device in the embodiment may further include a reflective layer MTL3 disposed in the same layer as at least one of the lower sensing electrode portion MTL1 and the upper sensing electrode portion MTL2. Figure 6 An embodiment is shown in which the reflective layer MTL3 and the upper sensing electrode portion MTL2 are disposed in the same layer. In this case, the reflective layer MTL3 and the upper sensing electrode portion MTL2 can be formed using the same process and can include the same material as each other. The reflective layer MTL3 can be disposed on the first sensing insulating layer TL1. The reflective layer MTL3 can overlap with the light-emitting layer EML. Specifically, the reflective layer MTL3 can overlap with the light-emitting area of ​​the corresponding pixel (i.e., the area of ​​the pixel opening OP1). One reflective layer MTL3 can be disposed in one light-emitting area of ​​each pixel, but this disclosure is not limited thereto.

[0126] The reflective layer MTL3 may comprise metals or metal alloys such as copper (Cu), molybdenum (Mo), aluminum (Al), silver (Ag), chromium (Cr), tantalum (Ta), and titanium (Ti). The reflective layer MTL3 may consist of a single layer or multiple layers.

[0127] An etching process can be performed on the first sensing insulating layer TL1 to define a contact hole CNT for electrically connecting the lower sensing electrode portion MTL1 and the upper sensing electrode portion MTL2. During the etching process, a recessed region RC can be defined in the area overlapping with the reflective layer MTL3. The recessed region RC can have a recessed shape extending from the flat upper surface of the first sensing insulating layer TL1 toward the substrate SUB. The recessed region RC can be recessed from the upper surface of the first sensing insulating layer TL1 to a height equal to the height of the contact hole CNT. Depending on the embodiment, the depth of the recessed region RC in the third direction DR3 can be adjusted by using a halftone mask to expose the location where the recessed region RC is to be formed. In an embodiment, the depth of the recessed region RC in the third direction DR3 can be the same as the thickness of the first sensing insulating layer TL1, such that the recessed region RC can be formed to reach the upper surface of the encapsulation layer ENC or the upper surface of the lower sensing insulating layer.

[0128] Depending on the embodiment, the recessed region RC may be recessed from the upper surface of the first sensing insulating layer TL1 toward the substrate SUB deeper than the height of the contact hole CNT. The encapsulation layer ENC may include the recessed region RC. An etching process may be additionally performed to form the recessed region RC. Depending on the embodiment, the recessed region RC and the contact hole CNT may be formed by separate processes.

[0129] Multiple recessed regions RC can be formed in the first sensing insulating layer TL1 of the light-emitting area (corresponding to the area of ​​each light-emitting diode ED of each pixel). The multiple recessed regions RC disposed in each light-emitting area can have different heights from the top surface of the first sensing insulating layer TL1, or they can have similar or the same height.

[0130] The reflective layer MTL3 may have a shape corresponding to the shape of the first sensing insulating layer TL1 that contacts the reflective layer MTL3. Each reflective layer MTL3 may have multiple recessed portions CP recessed along the recessed region RC of the first sensing insulating layer TL1 in a cross-sectional view. The recessed portions CP may have curved surfaces in the cross-sectional view. Furthermore, the lower surface of the reflective layer MTL3 may have an uneven shape in the cross-sectional view.

[0131] External light L2 incident on the light-emitting area can be reflected by a structure beneath the reflective layer MTL3 (e.g., the first electrode E1 or the second electrode E2). External light L2 reflected by the structure beneath the reflective layer MTL3 can be reflected from the lower surface of the reflective layer MTL3 towards the structure beneath it. External light L2 reflected by the structure beneath the reflective layer MTL3 can also be reflected back to the outside of the display device by the structure beneath the reflective layer MTL3. In other words, the reflective layer MTL3 can reduce external light reflection by allowing external light L2 reflected by the structure beneath the reflective layer MTL3 to be reflected again. External light L2 reflected from the structure beneath the reflective layer MTL3 can be reflected several times by the reflective layer MTL3.

[0132] Light L3 emitted from the emissive layer EML can be reflected from the lower surface of the reflective layer MTL3 towards the structure beneath the reflective layer MTL3 (e.g., the first electrode E1 or the second electrode E2). The light L3 reflected by the structure beneath the reflective layer MTL3 can be reflected back to the outside of the display device by the structure beneath the reflective layer MTL3. Accordingly, the recovery efficiency of light L3 emitted from the emissive layer EML can be improved. That is, the light efficiency can be improved. While light L3 emitted from the emissive layer EML can be reflected several times by the reflective layer MTL3, according to this embodiment, the lower surface of the reflective layer MTL3 has an uneven structure, thus reducing the number of reflections compared to a flat surface, and reducing light loss due to reflection.

[0133] The second sensing insulating layer TL2 can be disposed on the upper sensing electrode portion MTL2 and the reflective layer MTL3. The second sensing insulating layer TL2 can include inorganic insulating materials or organic insulating materials. Inorganic insulating materials can include at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride. Organic insulating materials can include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, and perylene resin.

[0134] The light-blocking layers BM1 and BM2, as well as the color filter CF, can be disposed on the second sensing insulating layer TL2.

[0135] In the embodiment, the light-blocking layers BM1 and BM2 may include a first light-blocking layer BM1 and a second light-blocking layer BM2. The first light-blocking layer BM1 may be configured to overlap with the lower sensing electrode portion MTL1 and the upper sensing electrode portion MTL2, and may be spaced apart from the first electrode E1 without overlapping. This is to ensure that the first electrode E1, which is capable of displaying images, and the light-emitting layer EML are not blocked by the first light-blocking layer BM1, the lower sensing electrode portion MTL1, and the upper sensing electrode portion MTL2.

[0136] The second light-blocking layer BM2 can overlap with the reflective layer MTL3. The second light-blocking layer BM2 can have a shape that completely covers the reflective layer MTL3. The second light-blocking layer BM2 can overlap with the first electrode E1 and the light-emitting layer EML. The second light-blocking layer BM2 can absorb external light L1 incident on the light-emitting area and reduce external light reflection.

[0137] Color filters CF can be disposed on light-blocking layers BM1 and BM2 and the second sensing insulating layer TL2. Color filters CF include a red color filter that transmits red light, a green color filter that transmits green light, and a blue color filter that transmits blue light.

[0138] Each color filter CF can be configured to overlap with the first electrode E1 of the light-emitting diode ED in a planar diagram. Since light emitted from the emissive layer EML can change color as it passes through the color filter CF, all light emitted from the emissive layer EML can have the same color. However, the emissive layer EML can emit different colors of light, and the displayed color can be enhanced by passing it through color filters of the same color.

[0139] A first light-blocking layer BM1 may be disposed between each color filter CF. Depending on the embodiment, the color filters CF may be replaced by a color conversion layer, or may further include a color conversion layer. The color conversion layer may include quantum dots.

[0140] A planarization layer TL3 covering the color filter CF is disposed on the color filter CF. The planarization layer TL3 is used to planarize the upper surface of the display panel and may be a transparent organic insulating layer comprising one or more materials selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene and phenolic resin, or composed thereof.

[0141] Depending on the embodiment, a relatively low refractive index layer and an additional planarization layer may be further disposed on the planarization layer TL3 to improve the front visibility and light output efficiency of the display panel. Light can be refracted by the additional planarization layer with relatively high refractive properties and the relatively low refractive index layer and emitted towards the front. In this case, depending on the embodiment, the planarization layer TL3 may be omitted, and the relatively low refractive index layer and the additional planarization layer may be disposed directly above the color filter CF.

[0142] In this embodiment, a polarizer is not included on top of the planarization layer TL3. When external light visible to the user is incident and reflected by the sidewalls of the first electrode E1 or the pixel opening OP1 of the pixel defining layer PDL, the polarizer prevents display quality degradation. However, the polarizer has the disadvantage of consuming more power to display a predetermined brightness by reducing not only the reflection of external light but also the light emitted from the emissive layer EML. To reduce power consumption, the display device in this embodiment may omit the polarizer. Furthermore, the weight and / or thickness of the display device can be reduced.

[0143] Below, for reference Figure 7 This will describe the path of light L3 emitted from the emissive layer EML. Figure 7 It is shown Figure 6 A schematic cross-sectional view of a portion of it.

[0144] refer to Figure 7 Light L3 emitted from the light-emitting layer EML can be reflected from the lower surface of the reflective layer MTL3 toward the structure below the reflective layer MTL3 (e.g., the first electrode E1 or the second electrode E2).

[0145] Light L3 reflected by the structure beneath the reflective layer MTL3 can be reflected back to the outside of the display device by the structure beneath the reflective layer MTL3.

[0146] In this embodiment, light L3 emitted from the emissive layer EML is reflected on the lower surface of the reflective layer MTL3, which has an uneven structure including multiple recessed portions CP, thereby changing the reflection angle. In this case, light L3 can be diffusely reflected on the lower surface of the reflective layer MTL3. Accordingly, when light L3 is reflected from the lower surface of the reflective layer MTL3, the number of reflections can be less compared to when light L3 is reflected from a flat surface. Since the number of reflections of light L3 is reduced, the decrease in intensity of light L3 leaving the display device can be reduced. Consequently, the light recovery efficiency can be improved, thereby improving the light efficiency of the display device.

[0147] In the following text, see references Figure 8 The second light-blocking layer BM2, the reflective layer MTL3, and the recessed portion CP in the embodiment will be described in conjunction with the previously described figures. Figure 8 This is a schematic plan view showing a portion AA of a pixel.

[0148] refer to Figure 8The second light-blocking layer BM2 may overlap with the reflective layer MTL3, and the reflective layer MTL3 may be disposed within the edge of the second light-blocking layer BM2. The reflective layer MTL3 may overlap with multiple recessed regions RC of the first sensing insulating layer TL1, and may include a recessed portion CP corresponding to each recessed region RC. The second light-blocking layer BM2 may have a circular, elliptical, or polygonal shape in a planar view. Similarly, the reflective layer MTL3 may have a circular, elliptical, or polygonal shape in a planar view.

[0149] The planar shape of the recessed area RC or the recessed portion CP can be a circular shape with a center. (Reference) Figure 8 The distance between the centers of adjacent concave regions RC or the distance between the centers of adjacent concave portions CP can be constant.

[0150] In the following text, see references Figure 9 and Figure 10 The second light-blocking layer BM2, the reflective layer MTL3, and the recessed portion CP in the embodiment will be described. Figure 9 and Figure 10 This is a schematic plan view showing a portion AA of a pixel.

[0151] refer to Figure 9 and Figure 10 The reflective layer MTL3 may include an uneven portion UA ​​and a flat portion FA in a planar view. The uneven portion UA ​​may include multiple recessed portions CP, and the flat portion FA may not include the recessed portions CP.

[0152] refer to Figure 9 Multiple recessed portions CP can be positioned close to the edge of the reflective layer MTL3. Uneven portions UA can be positioned closer to the edge of the reflective layer MTL3 than the flat portions FA. Uneven portions UA can be located in the outer region of the reflective layer MTL3. Here, in a planar view, the outer region of the reflective layer MTL3 can be a region closer to the edge than the center of the reflective layer MTL3.

[0153] refer to Figure 10 Multiple recessed portions CP can be located within the inner region of the reflective layer MTL3. Uneven portions UA of the reflective layer MTL3 can also be located within the inner region of the reflective layer MTL3. In this case, in a planar view, the inner region of the reflective layer MTL3 can be a region closer to the center than the edge of the reflective layer MTL3.

[0154] In the following text, see references Figure 11 and Figure 12 The second light-blocking layer BM2, the reflective layer MTL3, and the recessed portion CP in the embodiment will be described. Figure 11 and Figure 12This is a schematic plan view showing a portion AA of a pixel.

[0155] refer to Figure 11 and Figure 12 The recessed portion CP can be an ellipse with a major axis in a planar diagram. (See reference) Figure 11 The orientation of the major axis of the multiple recessed portions CP included in each reflective layer MTL3 can be constant. (Reference) Figure 12 The orientation of the two or more major axes of the multiple recessed portions CP included in each reflective layer MTL3 may not be constant.

[0156] Furthermore, the distance between the plurality of recessed portions CP included in each reflective layer MTL3 can be constant. Depending on the embodiment, the distance between the plurality of recessed portions CP included in each reflective layer MTL3 may not be constant for at least some of the recessed portions CP.

[0157] In the following text, see references Figure 13 and Figure 14 The second light-blocking layer BM2, the reflective layer MTL3, and the recessed portion CP in the embodiment will be described. Figure 13 and Figure 14 This is a schematic plan view showing a portion AA of a pixel.

[0158] refer to Figure 13 In the embodiment, the recessed portion CP can be triangular in shape in the plan view. (See reference...) Figure 14 In the embodiment, the recessed portion CP can be square in shape in the plan view.

[0159] Not limited to this, the recessed portion CP in the plan view can be a polygonal shape with a centroid. Hereinafter, "centroid" may also be referred to as "center". The distance between the centers of the plurality of recessed portions CP included in each reflective layer MTL3 can be constant. Depending on the embodiment, the distance between the centers of the plurality of recessed portions CP included in each reflective layer MTL3 may not be constant.

[0160] Figure 15 This is a plan view showing an embodiment of a portion of the pixels.

[0161] refer to Figure 15 As shown in the previously described figures, for at least some of the multiple recessed portions CP of each reflective layer MTL3, the distance between the centers of adjacent recessed portions CP can be different. Figure 15An example is shown where the planar shape of the recessed portion CP is circular, but it is not limited to this, and even when the planar shape of the recessed portion CP is a variety of shapes such as elliptical shapes and various polygonal shapes, the distance between the centers of adjacent recessed portions CP or the distance between adjacent recessed portions CP may not be constant.

[0162] Depending on the embodiment, the plurality of recessed portions CP included in each reflective layer MTL3 may include at least two or more recessed portions CP having different shapes and / or areas in a plan view.

[0163] Although embodiments of the present disclosure have been described in detail above, the scope of the present disclosure is not limited thereto, and various modifications and improvements can be made by those skilled in the art using the basic concepts of the present disclosure as defined in the claims.

Claims

1. A display device, comprising: substrate; A first electrode is disposed on the substrate; A pixel defining layer, wherein a pixel opening is defined on the first electrode; A light-emitting layer is disposed in the pixel opening; The second electrode is disposed on the light-emitting layer; An encapsulation layer is disposed on the second electrode; The sensing electrode portion and the reflective layer are disposed on the encapsulation layer; The first light-blocking layer partially overlaps with the sensing electrode. as well as The second light-blocking layer overlaps with the reflective layer. The reflective layer includes a plurality of recessed portions disposed in the region overlapping with the second light-blocking layer.

2. The display device according to claim 1, further comprising: A sensing insulating layer is disposed between the reflective layer and the encapsulation layer. The sensing insulating layer includes a plurality of recessed regions corresponding to the plurality of recessed portions.

3. The display device according to claim 2, wherein, The reflective layer contacts the upper surface of the sensing insulating layer.

4. The display device according to claim 2, wherein, The sensing electrode portion includes a first electrode layer and a second electrode layer disposed in different conductive layers, and The sensing insulating layer is disposed between the first electrode layer and the second electrode layer.

5. The display device according to claim 1, wherein, At least some of the plurality of recessed portions have a circular shape in the plan view.

6. The display device according to claim 1, wherein, At least some of the recessed portions have an elliptical shape with a major axis in the plan view.

7. The display device according to claim 6, wherein, The long axes of at least some of the plurality of recessed portions are oriented in the same direction as each other.

8. The display device according to claim 6, wherein, The directions of the long axes of at least two or more of the plurality of recessed portions are different from each other.

9. The display device according to claim 1, wherein, At least some of the plurality of recessed portions have a polygonal shape in the plan view.

10. The display device according to any one of claims 1 to 9, wherein, The distance between the centers of adjacent recesses among the plurality of recesses is constant.

Images