Heat dissipation pad

Abstract

This application discloses a heat dissipation patch, including a housing, a heat dissipation assembly, and a power supply. The housing includes an upper cover and a lower cover. The lower cover includes a curved bottom wall and a side wall extending upwards from the bottom wall. An installation opening is provided on the bottom wall. The bottom wall and side wall enclose a body cavity with an opening. A flow port is provided on the housing. The upper cover covers the opening of the body cavity and forms another flow port on one side of the housing. One flow port is for air intake, and the other flow port is for air exhaust. The body cavity has a heat exchange area and a flow area. The heat dissipation assembly includes heat exchange plates with silicone thermal paste on both ends. The heat dissipation assembly is located within the heat exchange area and electrically connected to the power supply. The heat exchange plates are fixedly installed in the installation opening. When the heat dissipation patch is opened / closed, the power supply powers / disconnects the heat dissipation assembly. The flow port for air exhaust is located in the flow area. This heat dissipation patch divides the body cavity into different areas to facilitate positioning during assembly and improve assembly efficiency.

Description

Technical Field

[0001] This application relates to the field of medical cooling, and in particular to a heat dissipation patch. Background Technology

[0002] The normal human body temperature is between 36°C and 37.2°C. A body temperature exceeding 37.2°C is considered a fever. Whether it is a low-grade fever or a high fever, it is necessary to lower the patient's temperature as soon as possible. Usually, physical cooling is preferred to avoid the use of drugs. However, in the case of a high fever, physical cooling combined with drugs will be used to lower the body temperature as quickly as possible.

[0003] Traditional physical cooling methods typically involve applying cold compresses to the forehead to lower body temperature. These methods include using a wet towel or wrapping ice cubes in a towel. However, these methods are not secure; the towel is simply placed on the forehead. As a result, patients must lie down or support the forehead with their hands. Furthermore, to improve cooling efficiency, the towel needs to be changed frequently to maintain a low temperature, making these methods extremely inconvenient.

[0004] Existing technologies include patent application number 202210911838.0, entitled "Forehead Cooler," which uses a thermoelectric cooler placed between an upper and lower cover, and a fan positioned above the thermoelectric cooler to dissipate heat from its hot surface, thereby continuously cooling the forehead through the cooling effect of the thermoelectric cooler. However, because this forehead cooler does not define its internal structure, it is extremely inconvenient to install.

[0005] The above content is only used to assist in understanding the technical solution of the utility model and does not represent an admission that the above content is prior art. Utility Model Content

[0006] In view of the above-mentioned inconvenience in installation, this utility model proposes a heat dissipation sticker, which aims to solve the above-mentioned technical problem of inconvenience in installation.

[0007] To achieve the above objectives, this utility model proposes a heat dissipation patch, comprising a shell, a heat dissipation assembly, and a power supply; wherein,

[0008] The housing includes an upper cover and a lower cover; the lower cover includes a curved bottom wall and a side wall extending upward from the bottom wall, the bottom wall has an installation opening, and the bottom wall and the side wall enclose a body cavity with an opening; the housing has a flow port, the upper cover covers the opening of the body cavity and forms another flow port on one side of the housing, one flow port is used for air intake and the other flow port is used for air exhaust.

[0009] The housing cavity has a heat exchange area and a circulation area; the heat dissipation component includes heat exchange plates with silicone thermal paste on both ends. The heat dissipation component is located in the heat exchange area and is electrically connected to the power supply. The heat exchange plates are fixed in the mounting port. When the heat dissipation pad is opened / closed, the power supply provides power to / offs the heat dissipation component; the air outlet is located in the circulation area.

[0010] In one embodiment, the body cavity further includes a power supply area, and the power supply area and the circulation area are located on both sides of the heat exchange area and are adjacent to the heat exchange area.

[0011] The power supply is located within the power supply area.

[0012] In one embodiment, brackets are provided in the regions adjacent to the heat exchange zone and the power supply zone, and in the regions adjacent to the heat exchange zone and the circulation zone, respectively, and the heat dissipation assembly is fixedly installed in the heat exchange zone by the brackets.

[0013] In one embodiment, lower partition plates are provided at both ends of the support in the area adjacent to the heat exchange zone and the flow zone, and the other end of the lower partition plate abuts against the side wall.

[0014] An upper partition plate is provided at the position of the upper cover corresponding to the lower partition plate. When the upper cover is closed to the opening, the flow area and the heat exchange area are not connected.

[0015] In one embodiment, the heat dissipation patch further includes a circuit board, and the heat dissipation component is electrically connected to a power source via the circuit board.

[0016] In one embodiment, a charging port and a control port are provided on the side wall, and the heat dissipation pad further includes a power supply socket disposed on the charging port and a controller disposed on the control port; wherein,

[0017] The power supply socket is electrically connected to the circuit board and supplies power through the circuit board.

[0018] The controller controls the connected circuit board to control the heat dissipation components.

[0019] In one embodiment, support frames are provided on the opposing wall surfaces of the two supports, and several buckles are provided on the free ends of the two supports respectively.

[0020] The heat dissipation assembly also includes a heat dissipation body, one side of which abuts against each support frame, and each clip is engaged with the side of the heat dissipation body opposite to the support frame.

[0021] In one embodiment, the bottom wall is rectangular, and pin seats are provided on the side walls on both sides of the bottom wall along the flow direction, and the free end of the pin seat is provided with a pin hole.

[0022] When the top cover is closed in the opening, the surface of the top cover facing the body cavity has a pin head corresponding to the pin seat. The free end of the pin head is inserted into the pin hole, so that the pin head and the pin seat are engaged to fix the top cover to the bottom cover.

[0023] When the top cover is closed into the opening, the top cover and the bottom cover are separated.

[0024] In one embodiment, the angle between any side wall and the bottom wall is greater than or equal to 90°, and the pin seat is fixed on the wall surface of the lower cover facing the body cavity.

[0025] In one embodiment, at least two pin seats are provided on any side wall in the flow direction, and a strap opening is provided between the two pin seats; the heat dissipation patch also includes a strap, with the free ends of the straps respectively fixed in the strap openings on the side wall in the flow direction.

[0026] In one embodiment, a plurality of support columns are provided on the outer periphery of the surface of the upper cover facing the body cavity, and the length of the support columns is greater than the distance between the upper cover and the lower cover.

[0027] When the top cover is closed in the opening, any support column is inside the body cavity, and the side of any support column facing the side wall is tilted inward and abuts against the side wall.

[0028] This utility model discloses a heat dissipation patch by dividing the body cavity into two different areas. When assembling separately manufactured components into heat dissipation patches, the separately manufactured components can be quickly assembled into heat dissipation patches according to the divided areas, which improves the assembly efficiency compared to when the body cavity is not divided into areas; at the same time, the power supply and heat dissipation components are placed in different areas. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A schematic diagram of the heat dissipation patch structure is shown;

[0031] Figure 2 for Figure 1 An explosion diagram;

[0032] Figure 3 for Figure 1 A schematic diagram of the structure of the upper cover;

[0033] Figure 4 for Figure 1 A schematic diagram of the structure of the lower cover;

[0034] Figure 5 for Figure 1 A structural diagram showing the use of a portion of the space within the body cavity of the lower cover;

[0035] Figure 6 for Figure 1 A structural diagram showing the space used in the body cavity within the lower cover;

[0036] Figure 7 for Figure 6 A schematic diagram of the heat dissipation components in the diagram;

[0037] Figure 8 for Figure 1 Front view diagram of the heat dissipation pad;

[0038] Figure 9 For along Figure 8 A cross-sectional view of AA in the diagram;

[0039] Figure 10 For along Figure 9 A cross-sectional view of BB in the diagram;

[0040] Figure 11 for Figure 1 A top view of the heat dissipation pads;

[0041] Figure 12 for Figure 1 A left-side view of the heat dissipation pad;

[0042] Figure 13 for Figure 1 The first schematic diagram shows the usage status of the heat dissipation pad.

[0043] Figure 14 for Figure 1 The second diagram shows the usage status of the heat dissipation pad.

[0044] Explanation of icon numbers:

[0045]

[0046] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. In addition, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those of ordinary skill in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0048] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0049] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text is to include three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies both A and B.

[0050] This utility model proposes a heat dissipation patch 100, including a housing 1, a heat dissipation component 2, and a power supply 3; wherein...

[0051] The housing 1 includes an upper cover 11 and a lower cover 12. The lower cover 12 includes a curved bottom wall 121 and a side wall 123 extending upward from the bottom wall 121. The bottom wall has an installation port 122. The bottom wall 121 and the side wall 123 enclose a body cavity 13 with an opening. The housing 1 has a flow port. The upper cover 11 covers the opening of the body cavity 13 and forms another flow port on one side of the housing 1. One flow port is used for air intake, and the other flow port is used for air exhaust. The body cavity 13 has a heat exchange area 132 and a flow area 133. The heat dissipation assembly 2 includes heat exchange plates 21 with silicone thermal paste on both ends. The heat dissipation assembly 2 is located in the heat exchange area 21 and electrically connected to the power supply 3. The heat exchange plates 21 are fixed in the installation port 122. When the heat dissipation pad 100 is opened / closed, the power supply 3 supplies power to / offs power to the heat dissipation assembly 2. The flow port for air exhaust is located in the flow area 133.

[0052] Furthermore, the body cavity 13 also has a power supply area 131, and the power supply area 131 and the circulation area 133 are located on both sides of the heat exchange area 132 and are adjacent to the heat exchange area 132; the power supply 3 is located in the power supply area 131.

[0053] Furthermore, brackets 15 are provided in the areas adjacent to the heat exchange zone 132 and the power supply zone 131, and in the areas adjacent to the heat exchange zone 132 and the circulation zone 133, respectively, and the heat dissipation assembly 2 is fixedly installed in the heat exchange zone 132 through the brackets 15.

[0054] Furthermore, the heat dissipation patch 100 also includes a circuit board 4, and the heat dissipation component 2 is electrically connected to the power supply 3 through the circuit board 4.

[0055] In this embodiment of the utility model, please refer to Figures 1 to 6 , Figures 8 to 10 As shown, the heat dissipation patch 100 includes an outer housing 1, a heat dissipation component 2 for cooling / heating, a power supply 3 for providing electrical energy, and a circuit board 4, including but not limited to those used for control, electrical transmission, etc. Details are as follows.

[0056] The housing 1 includes an upper cover 11 and a lower cover 12. The lower cover 12 includes a curved bottom wall 121 and a side wall 123 extending upward from the bottom wall 121. The curvature of the bottom wall 121 roughly matches the curvature of the human forehead; specific numerical descriptions are not provided here. When the side wall 123 extends upward from the bottom wall 121, the angle between the side wall 123 and the bottom wall 121 includes, but is not limited to, less than, equal to, or greater than 90°. When the angle between the side wall 123 and the bottom wall 121 is less than 90°, the side wall 123 is inclined inward and extends upward. When the angle between the side wall 123 and the bottom wall 121 is equal to 90°, the side wall 123 extends vertically upward from the bottom wall 121. When the angle between the side wall 123 and the bottom wall 121 is greater than 90°, the side wall 123 is inclined outward and extends upward. It should be noted that in this embodiment, the angle between the side wall 123 and the bottom wall 121 is greater than 90°. The bottom wall 121 has a mounting opening 122, which includes, but is not limited to, being located in the middle of the bottom wall 121. It should be noted that side walls 123 extend upwards around the bottom wall 121, and each side wall 123 and the bottom wall 121 enclose a body cavity 13 with an opening. The upper cover 11 has a flow port, which in this embodiment is used for air intake, i.e., an air inlet 111, and a grille strip is provided on the air inlet 111. The upper cover 11 covers the opening of the body cavity 13 of the lower cover 12, and another flow port is formed on one side of the housing 1, which in this embodiment is used for air outlet, i.e., an air outlet 14. Figure 9 An air outlet 14 is formed on the right side of the housing 1.

[0057] Supports 15 are provided on the left and right sides of the mounting port 122, dividing the housing cavity 13 into a power supply area 131, a heat exchange area 132, and a circulation area 133. The power supply 3 is located in the power supply area 131 on the left side of the housing cavity 13. The heat dissipation assembly 2 includes heat exchange plates 21, a heat dissipation body 22, and a heat dissipation fan 23 stacked sequentially. The heat dissipation assembly 2 is located in the heat exchange area 132, and the heat exchange plates 21 are located in the mounting port 122. The heat dissipation body 22 of the heat dissipation assembly 2 does not contact the bottom wall 121; that is, the heat dissipation body 22 is suspended in the heat exchange cavity by being supported by the two supports 15. The heat exchange plates 21 are fixedly installed on the lower wall surface of the heat dissipation body 22. When the heat dissipation body 22 is fixed on the support 15, the heat exchange plates 21 below the heat dissipation body 22 are embedded in the mounting port 122. The circuit board 4 is located on either side of the heat exchange area 132 and is parallel to the heat dissipation assembly 2. In this embodiment, the circuit board 4 is located on the front side of the heat dissipation assembly 2. It should be noted that the heat exchange plate 21 is a semiconductor plate, including heating and cooling surfaces on both sides. In this embodiment, when the cooling surface of the heat exchange plate 21 faces downwards, the heat dissipation component 2 provided in this embodiment is used for cooling; conversely, when the heating surface of the heat exchange plate 21 faces downwards, the heat dissipation component 2 provided in this embodiment is used for heating. In this embodiment, the description and implementation mainly focus on the cooling surface of the heat exchange plate 21 facing downwards for cooling. The air outlet 14 is located in the circulation area 133, that is, the air outlet 14 is on the right side of the body cavity 13.

[0058] It should be noted that the working principle of the heat dissipation pad 100 provided in the above embodiment is as follows: when the heat dissipation pad 100 is activated by the circuit board 4, the circuit board 4 controls the power supply 3 to supply power to the cooling fan 23 and heat exchange plate 21 of the heat dissipation component 2. After being powered on, the heat exchange plate 21 achieves the effect of cooling on one side and heating on the other side through thermoelectricity. When the heating side of the heat exchange plate 21 is pressed tightly against the heat dissipation body 22, the heat dissipation body 22 will absorb the heat from the heating side of the heat exchange plate 21, and the heat dissipation body 22 will conduct the absorbed heat to the air in the heat exchange zone 132. The cooling fan 23 then quickly exhausts the hot air in the heat exchange zone 132 through the air outlet 14 to the body cavity 13, thereby circulating the air. It should be noted that the heat dissipation body 22 can be made of aluminum, copper, or iron, but in this embodiment, the heat dissipation body 22 is mainly made of aluminum. Since the thermal conductivity of aluminum is greater than that of copper and iron, its heat dissipation efficiency is higher.

[0059] In this embodiment, the housing cavity 13 is divided into three different areas by two supports 15. When assembling the individually manufactured components into the heat dissipation patch 100, the components can be quickly assembled into the heat dissipation patch 100 according to the divided areas, which improves the assembly efficiency compared to when the housing cavity 13 is not divided into areas. At the same time, the power supply 3 and the heat dissipation component 2 are placed in different areas. Since they are isolated by the supports 15, the heat generated by the power supply 3 and the heat dissipation component 2 does not affect each other during use. This prevents the heat generated by the heat dissipation component 2 from being conducted to the power supply 3 when the heat dissipation patch 100 is used, which could cause the power supply 3 to overheat and explode. This improves the safety of the heat dissipation patch 100. It also prevents the heat from the power supply 3 from being conducted to the heat dissipation component 2 when the heat dissipation patch 100 is used, thus preventing the heat dissipation efficiency of the heat dissipation component 2 from being reduced. This improves the heat dissipation efficiency of the heat dissipation patch 100.

[0060] Furthermore, lower partition plates 124 are provided at both ends of the support 15 in the area adjacent to the heat exchange zone 132 and the circulation zone 133, and the other end of the lower partition plate 124 abuts against the side wall 123; an upper partition plate 112 is provided at the position of the upper cover 11 corresponding to the lower partition plate 124, and when the upper cover 11 is closed to the opening, the circulation zone 133 and the heat exchange zone 132 are not connected.

[0061] In this embodiment, refer to Figure 3 , Figure 4 As shown, the circulation zone 133 is described in detail. Lower partition plates 124 are provided at both ends of the bracket 15 adjacent to the air outlet 14. That is, lower partition plates 124 are provided at the front and rear ends of the right side bracket 15, and the other ends of the two lower partition plates 124 abut against the front and rear side walls 123 of the lower cover 12, respectively. An upper partition plate 112 is provided at the position of the upper cover 11 corresponding to the lower partition plates 124. When the upper cover 11 is closed to the opening of the body cavity 13, the upper partition plate 112 abuts against the lower partition plate 124, so that the circulation zone 133 is not connected to the heat exchange zone 132, so as to prevent the hot air in the circulation zone 133 from flowing back into the heat exchange zone 132. In this embodiment, by completely separating the circulation area 133 and the heat exchange area 132 through the lower partition plates 124 on both sides of the bracket 15 and the upper partition plate 112 on the upper cover 11, compared with the case where the circulation area 133 is the area where the air outlet 14 is located, when the air outlet 14's air output efficiency is less than the air intake efficiency of the cooling fan 23 to the circulation area 133, hot air will accumulate in the circulation area 133. When the hot air accumulated in the circulation area 133 reaches a threshold, it will flow back to the heat exchange area 132, thereby reducing the cooling efficiency of the heat dissipation component 2. By separating the circulation area 133 and the heat exchange area 132, hot air is prevented from flowing back to the heat exchange area 132, thus improving the cooling efficiency of the heat dissipation component 2.

[0062] It should be noted that a guide plate 17 is provided in the circulation area 133. One end of the guide plate 17 abuts against the heat dissipation body 22, and the other end abuts against the side wall 123 on the right side of the lower cover 12. The end of the guide plate 17 abutting against the heat dissipation body 22 is higher than the end abutting against the side wall 123, so that the guide plate 17 is tilted upward on the side wall 123. The tilt angle of the guide plate 17 is 10° to 30°.

[0063] Furthermore, the side wall 123 is provided with a charging port 126 and a control port 127. The heat dissipation pad 100 also includes a power supply base 5 provided on the charging port 126 and a controller 6 provided on the control port 127. The power supply base 5 is electrically connected to the circuit board 4 and supplies power to the power supply 3 through the circuit board 4. The controller 6 controls the circuit board 4 to control the heat dissipation component 2 through the circuit board 4.

[0064] In this embodiment, refer to Figure 4 , Figure 10 As shown, at least two support arms 125 are provided on the front sidewall 123 of the heat exchange zone 132. The two support arms 125 extend into the heat exchange zone 132 from the sidewall 123 and are spaced apart along the flow direction, i.e., the two support arms 125 are arranged one on the left and one on the right of the sidewall 123. The aforementioned circuit board 4 is disposed on the support arms 125. The end of the circuit board 4 adjacent to the power supply zone 131 is connected to the power supply 3, i.e., the left solder joint of the circuit board 4 is connected to the power supply 3. It should be noted that when the circuit board 4 is disposed on the two support arms 125, it is fixed by means of bonding, welding, screws, snap-fitting, etc. In this embodiment, bonding is described and implemented. In this embodiment, when the circuit board 4 is disposed on the sidewall 123 of the heat exchange zone 132, since one end of the circuit board 4 is close to the power supply zone 131, it is easier to connect to the power supply 3. The circuit board 4 is arranged side by side with the heat dissipation component 2, not overlapping it, so as to reduce the thickness of the heat dissipation component 2 and improve the aesthetics of the heat dissipation component 2.

[0065] In this embodiment, refer to Figure 3As shown, when the upper cover 11 is closed at the opening, two abutment posts 113 are arranged at intervals along the flow direction corresponding to the position of the circuit board 4 on the upper cover 11. That is, abutment posts 113 are provided on the upper cover 11 at the left and right ends corresponding to the circuit board 4, and when the upper cover 11 is closed at the opening, the free end of each abutment post 113 abuts against the circuit board 4. It should be noted that in this embodiment, two abutment posts 113 are described and implemented. In another embodiment, at least one abutment post 113 can be provided to abut and limit the circuit board 4. At the same time, multiple abutment posts 113 can be provided to abut and limit the circuit board 4. In this embodiment, the abutment post 113 provided on the upper cover 11 limits the circuit board 4 provided on the support arm 125. Compared with the case where it is not provided, since the circuit board 4 is glued to the support arm 125, and the heat dissipation component 2 generates a lot of heat when working, there is a risk of the glue falling off. However, after the abutment post 113 is provided, even if the glue falls off, the circuit board 4 is not easy to fall off because the abutment post 113 holds the circuit board 4 against the support arm 125, thus reducing the damage rate of the heat dissipation component 2.

[0066] In this embodiment, refer to Figure 3 , Figure 4 , Figure 10As shown, the relative positional relationship between the two support arms 125 and the two abutment posts 113 will be described in detail again. The two support arms 125 on the front sidewall 123 of the lower cover 12 are distributed left and right, and both support arms 125 are within the heat exchange zone 132. When the upper cover 11 is closed in the opening, the distance between the two support arms 125 is greater than the distance between the two abutment posts 113, and the two abutment posts 113 are respectively located between the two support arms 125. When the circuit board 4 is bonded to the two support arms 125, the two support arms 125 are respectively located at the left and right ends of the circuit board 4. When the upper cover 11 is closed in the opening, the two abutment posts 113 are respectively located near the middle of the circuit board 4, so that the two support arms 125 and the two abutment posts 113 clamp and limit the circuit board 4. In this embodiment, the abutment posts 113 provided on the upper cover 11 limit the circuit board 4 mounted on the support arm 125. Compared to the absence of these posts, where the circuit board 4 is glued to the support arm 125, and the heat dissipation component 2 generates a large amount of heat during operation, there is a risk of the glue coming off. However, with the abutment posts 113, even if the glue comes off, the circuit board 4 is held in place by the abutment posts 113, thus reducing the risk of it falling off and lowering the damage rate of the heat dissipation component 2. Furthermore, since the working environment of the circuit board 4 generates a large amount of heat, it can deform. The two support arms 125 are located at the left and right ends of the circuit board 4. The two abutment posts 113 are located near the middle of the circuit board 4. Compared to when the two abutment posts 113 are located opposite the support arm 125 or on the outside of the two support arms 125 respectively, when the two abutment posts 113 are located near the middle of the circuit board 4, the two abutment posts 113 can prevent the middle of the circuit board 4 from bending upward. However, when the two abutment posts 113 are located opposite the support arm 125 or on the outside of the two support arms 125 respectively, they cannot prevent the middle of the circuit board 4 from bending upward. Therefore, thermal deformation of the circuit board 4 is prevented, thereby improving the service life of the circuit board 4 and indirectly improving the service life of the heat dissipation pad 100.

[0067] In this embodiment, refer to Figures 4 to 6 As shown, the lower cover 12 will be described in detail again. A charging port 126 and a control port 127 are provided on the side wall 123 on the front side of the lower cover 12. That is, the charging port 126 and the control port 127 are provided on the side wall 123 where the circuit board 4 is located, and as shown... Figure 5As shown, the charging port 126 and the control port 127 are arranged on the side wall 123 in an overlapping manner. A power supply socket 5 is provided on the charging port 126, which is connected to the circuit board 4. When power is needed to the power supply 3, the power supply 3 is powered by connecting the charger through the power supply socket 5. A controller 6 is provided on the control port 127, which is connected to the circuit board 4 to control the opening and closing of the heat dissipation pad 100. When the controller 6 controls the heat dissipation pad 100 to open through the circuit board 4, the circuit board 4 supplies power to the cooling fan 23 and heat exchange plate 21 of the heat dissipation pad 100 through the power supply 3, so that the heat dissipation pad 100 works. When the controller 6 controls the heat dissipation pad 100 to close through the circuit board 4, the circuit board 4 turns off the power supply to the cooling fan 23 and heat exchange plate 21, so that the heat dissipation pad 100 stops working. In this embodiment, by setting the power supply socket 5 and controller 6 on the side wall 123 where the circuit board 4 is located, compared to setting the power supply socket 5 and controller 6 in other positions, the connection distance between the power supply socket 5, controller 6 and circuit board 4 is reduced because they are closer to the circuit board 4. The greater the connection distance between the power supply socket 5, controller 6 and circuit board 4, the lower the reliability of the connection. Therefore, the reliability between the power supply socket 5, controller 6 and circuit board 4 is improved. At the same time, because the connection distance is closer, fewer connection cables are required, thereby saving costs.

[0068] Furthermore, support frames 151 are provided on the opposite wall surfaces of the two supports 15, and several buckles 154 are provided on the free ends of the two supports 15.

[0069] The heat dissipation assembly 2 also includes a heat dissipation body 22, one side of which abuts against each support frame 151, and each clip 154 ​​is snapped onto the side of the heat dissipation body 22 facing away from the support frame 151.

[0070] In this embodiment, refer to Figures 4 to 6 Figure 9As shown, the bracket 15 will be described in detail again. Support frames 151 are respectively provided on the opposing walls of the two brackets 15. It should be noted that support frames 151 are provided at the front and rear ends of the two brackets 15, and several buckles 154 are provided on each section of the two brackets 15. The lower wall of the heat dissipation body 22 of the heat dissipation assembly 2 abuts against each support frame 151, and the buckles 154 on the bracket 15 are engaged with the side of the heat dissipation body 22 facing away from the support frame 151, that is, the buckles 154 on the bracket 15 are engaged with the upper wall of the heat dissipation body 22. In this embodiment, when the heat dissipation assembly 2 is supported by the support frames 151 of the bracket 15, the heat dissipation body 22 is prevented from directly contacting the bottom wall 121 to prevent the heat absorbed by the heat dissipation body 22 from being conducted to the bottom wall 121. Since the bottom wall 121 is in direct contact with the forehead, the cooling efficiency is improved. At the same time, the buckles 154 secure the heat dissipation body 22, facilitating the installation and removal of the heat dissipation assembly 2.

[0071] It should be noted that the support frame 151 includes auxiliary support plates 152 and main support plates 153. The auxiliary support plates 152 are arranged along the flow direction at the front, rear, and both ends of the bracket 15, with each auxiliary support plate 152 facing the heat exchange zone 132. The main support plates 153 are located at the other end of the auxiliary support plates 152, and are arranged opposite to each other at both ends of the same bracket 15. That is, the front end of the main support plate 153 on the same bracket 15 faces the rear end of the bracket 15, and the rear end of the main support plate 153 on the same bracket 15 faces the front end of the bracket 15. It should also be noted that the auxiliary support plates 152 are higher than the main support plates 153. When the heat dissipation body 22 is mounted on the support frame 151, the lower wall of the heat dissipation body 22 abuts against each main support plate 153, the front and rear sides of the heat dissipation body 22 abut against each auxiliary support plate 152, and the left and right sides of the heat dissipation body 22 abut against the bracket 15. In this embodiment, the heat dissipation body 22 is supported by the main support plate 153, and the heat dissipation body 22 is limited at the front and rear by the auxiliary support plate 152. The heat dissipation body 22 is limited at the left and right by the two brackets 15, making the position of the heat dissipation body 22 more stable. It should also be noted that each buckle 154 is provided with a guide surface, and each guide surface is inclined towards the heat exchange area 132, so that when the heat dissipation body 22 is installed on the bracket 15, the guide surface plays a guiding role, thereby facilitating the installation.

[0072] Furthermore, the bottom wall 121 is rectangular, and the side walls 123 on both sides of the bottom wall 121 along the flow direction are respectively provided with pin seats 128, and the free end of the pin seat 128 is provided with a pin hole 129; when the upper cover 11 is closed in the opening, the surface of the upper cover 11 facing the body cavity 13 is provided with a pin head 114 corresponding to the pin seat 128, and the free end of the pin head 114 is inserted into the pin hole 129, so that the pin head 114 and the pin seat 128 are engaged to fix the upper cover 11 on the lower cover 12; when the upper cover 11 is closed in the opening, the upper cover 11 and the lower cover 12 are separated.

[0073] In this embodiment, refer to Figure 1 , Figures 9 to 13 The connection relationship between the lower cover 12 and the upper cover 11 will be described in detail. In this embodiment, the bottom wall 121 is rectangular, and the side walls 123 on both sides of the bottom wall 121 along the flow direction are respectively provided with pin seats 128, that is, pin seats 128 are respectively provided on the left and right side walls 123 of the bottom wall 121. When the upper cover 11 is closed to the opening, the surface of the upper cover 11 facing the body cavity 13 is provided with a pin head 114 corresponding to each pin seat 128. A pin hole 129 is provided on the free end of the pin seat 128. When the upper cover 11 is closed to the opening, the free end of the pin head 114 is inserted into the pin hole 129. It should be noted that in some embodiments, the pin seat 128 can be provided on the upper cover 11, and the pin head 114 can be provided on the lower cover 12. It should be noted that when the upper cover 11 is closed in the opening, the upper cover 11 and the lower cover 12 are separated, that is, the length of the pin head 114 is greater than the depth of the pin hole 129, so that the upper cover 11 and the lower cover 12 do not contact each other, forming a gap. In this embodiment, when the upper cover 11 and the lower cover 12 are fixed by the pin seat 128 and the pin head 114, compared with the fixing by adhesive, screws or other methods, the position of the upper cover 11 and the lower cover 12 can be corrected by the pin seat 128, so that the relationship between the upper cover 11 and the lower cover 12 is more accurate when the upper cover 11 is closed in the opening. At the same time, the cooperation between the pin seat 128 and the pin head 114 makes it easier to install the upper cover 11. The gap between the upper cover 11 and the lower cover 12 can play a certain role in ventilation and heat dissipation, thereby improving the heat dissipation efficiency of the heat dissipation patch 100 compared with the upper cover 11 and the lower cover 12 being in complete contact.

[0074] Furthermore, if the angle between any side wall 123 and the bottom wall 121 is greater than 90°, the pin seat 128 is fixed on the wall surface of the side wall 123 facing the body cavity 13.

[0075] In this embodiment, the relationship between the bottom wall 121 and the side walls 123 in the lower cover 12 will be described in detail. When the side walls 123 extend upward on the bottom wall 121, each side wall 123 is inclined outward, so that the area of ​​the bottom of the body cavity 13 is smaller than the area of ​​the top of the body cavity 13. When the pin seat 128 is provided on the side walls 123 at the left and right ends of the bottom wall 121, the pin seat 128 is fixed to the wall surface of the left and right side walls 123 facing the body cavity 13. In this embodiment, when the side walls 123 are inclined, the area of ​​the bottom of the heat dissipation sticker 100 is smaller than the area of ​​the top of the heat dissipation sticker 100. Compared with setting them to the same size, the heat dissipation sticker 100 is more in line with aesthetic requirements, thereby improving the appearance of the heat dissipation sticker 100.

[0076] Furthermore, at least two pin seats 128 are provided on any side wall 123 in the flow direction, and a strap opening 120 is provided between the two pin seats 128; the heat dissipation patch 100 also includes a strap 7, the free ends of the strap 7 are respectively fixed in the strap opening 120 on the side wall 123 in the flow direction.

[0077] In this embodiment, refer to Figures 4 to 6 As shown, the lower cover 12 will be described in detail again. Two pin seats 128 are provided side-by-side on the left and right sidewalls 123 of the bottom wall 121, and a strap opening 120 is provided between the two pin seats 128. The heat dissipation patch 100 also includes a strap 7 for fixing the heat dissipation patch 100 to the forehead, with both ends of the strap 7 fixed in the strap opening 120. It should also be noted that two pin seats 128 are also provided on the opposite sidewall 123 of the sidewall 123 where the circuit board 4 is located, that is, two pin seats 128 are provided on the rear sidewall 123 of the lower cover 12. Corresponding to the pin seats 128, pin heads 114 are also provided on the upper cover 11 to reinforce the connection between the upper cover 11 and the lower cover 12 when the upper cover 11 is closed in the opening. It should be noted that the strap 7 is divided into two sub-stripes. Each sub-stripe has a snap-fit ​​strip at one end and a Velcro strap at the other end. The Velcro-strap ends of the two sub-stripes pass through the strap opening 120 and are snapped onto the strap opening 120 by the snap-fit ​​strip. In this embodiment, by providing straps 7 on both the left and right sides of the heat dissipation patch 100, the heat dissipation patch 100 is fixed to the forehead, and the heat dissipation patch 100 is secured by Velcro, making it more convenient to use. The tightness of the straps 7 can be adjusted according to different users.

[0078] Furthermore, a plurality of support columns 115 are spaced around the outer periphery of the surface of the upper cover 11 facing the body cavity 13, and the length of the support column 115 is greater than the distance between the upper cover 11 and the lower cover 12; when the upper cover 11 is closed in the opening, any support column 115 is inside the body cavity 13, and any support column 115 is inclined inward toward the side wall 123 to form an abutment surface 116 and abut against the side wall.

[0079] In this embodiment, refer to Figure 2 , Figure 3 , Figure 10 , Figure 12 As shown, the upper cover 11 will be described again. The outer periphery of the surface of the upper cover 11 facing the body cavity 13 is provided with a number of support columns 115 at intervals. The length of the support columns 115 is greater than the distance between the upper cover 11 and the lower cover 12. When the upper cover 11 is closed on the opening, each support column 115 is inside the body cavity 13, and each light-blocking outer side is inclined inward to form a contact surface 116. When the upper cover 11 is closed on the opening, the contact surface 116 stabilizes the upper cover 11. When the upper cover 11 is closed on the opening, since there is a gap between the upper cover 11 and the lower cover 12, the internal structure can be seen directly through the gap. The structure inside the body cavity 13 is blocked by the spaced support columns 115, making the overall appearance of the heat dissipation sticker 100 cleaner and improving the visual effect of the heat dissipation sticker 100 for the user.

[0080] It should be noted that, for reference Figure 2 A heat-conducting plate 8 is provided on the lower end face of the bottom wall 121. The heat-conducting plate 8 is made of a metal material, including but not limited to aluminum, copper, iron, etc. In this embodiment, the heat-conducting plate 8 is made of aluminum for description and implementation. The upper end face of the heat-conducting plate 8 is connected to the heat exchange plate 21. The lower end face of the heat-conducting plate 8 is provided with several protrusions. When the heat dissipation patch 100 is used, the several protrusions on the lower end face of the heat-conducting plate 8 form sweat channels to facilitate the user's perspiration, while preventing the heat-conducting plate 8 from being completely pressed against the user's forehead to prevent excessive cooling.

[0081] It should be noted that, as Figure 5 , Figure 6 As shown, an isolation plate 16 is provided on the left support 15. One side of the isolation plate 16 is bonded to the left support 15, and its lower end abuts against the bottom wall 121. The other end extends upward to a height higher than the heat dissipation body 22. It should be noted that the isolation plate is not limited to being made of thermal insulation cotton, and the power supply area 131 and the heat exchange area 132 are placed on both sides of the isolation plate to prevent the temperature of the heat dissipation component 2 and the power supply 3 from affecting each other.

[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation patch, characterized in that, Includes housing, heat dissipation components, and power supply; among which, The housing includes an upper cover and a lower cover; the lower cover includes a curved bottom wall and a side wall extending upward from the bottom wall, the bottom wall has an installation opening, and the bottom wall and the side wall enclose a body cavity with an opening; the housing has a flow port, the upper cover covers the opening of the body cavity and forms another flow port on one side of the housing, wherein one of the flow ports is used for air intake and the other flow port is used for air exhaust; The body cavity has a heat exchange area and a flow area; the heat dissipation component includes heat exchange plates with silicone thermal paste on both ends, the heat dissipation component is located in the heat exchange area and is electrically connected to the power supply, and the heat exchange plates are fixedly located in the mounting port. When the heat dissipation pad is opened / closed, the power supply supplies power to / off the heat dissipation component; one of the flow ports is located in the flow area.

2. The heat dissipation patch of claim 1, wherein, The body cavity also has a power supply area, and the power supply area and the circulation area are respectively on both sides of the heat exchange area and are adjacent to the heat exchange area; The power source is located within the power source area.

3. The heat dissipation patch of claim 2, wherein, Supports are provided in the areas adjacent to the heat exchange zone and the power supply zone, and in the areas adjacent to the heat exchange zone and the circulation zone, respectively, and the heat dissipation assembly is fixedly installed in the heat exchange zone by the supports.

4. The heat dissipation patch of claim 3, wherein, The bracket in the area adjacent to the heat exchange zone and the flow zone is provided with lower partition plates at both ends, and the other end of the lower partition plate abuts against the side wall; An upper partition plate is provided at the position of the upper cover corresponding to the lower partition plate. When the upper cover is closed to the opening, the flow area and the heat exchange area are not connected.

5. The heat dissipation patch of claim 1, wherein, The heat dissipation pad also includes a circuit board, and the heat dissipation component is electrically connected to the power supply through the circuit board.

6. The heat dissipation patch of claim 5, wherein, The side wall is provided with a charging port and a control port. The heat dissipation pad also includes a power supply socket on the charging port and a controller on the control port; wherein... The power supply socket is electrically connected to the circuit board and supplies power to the power source through the circuit board; The controller is connected to the circuit board to control the heat dissipation component.

7. The heat dissipation patch of claim 3, wherein, Support frames are provided on the opposing wall surfaces of the two brackets, and several buckles are provided on the free ends of the two brackets respectively; The heat dissipation assembly further includes a heat dissipation body, one side of which abuts against each of the support frames, and each of the snap fasteners is engaged with the side of the heat dissipation body opposite to the support frame.

8. The heat dissipation patch of claim 1, wherein, The bottom wall is rectangular, and pin seats are provided on the side walls on both sides of the bottom wall along the flow direction, and the free end of the pin seat is provided with a pin hole. When the upper cover is closed on the opening, a pin head is provided on the surface of the upper cover facing the body cavity corresponding to the pin seat. The free end of the pin head is inserted into the pin hole, so that the pin head and the pin seat are engaged to fix the upper cover to the lower cover. When the upper cover is closed on the opening, the upper cover is separated from the lower cover.

9. The heat dissipation patch of claim 8, wherein, The angle between any of the side walls and the bottom wall is greater than or equal to 90°, and the pin seat is fixed on the wall surface of the lower cover facing the body cavity.

10. The heat dissipation patch of claim 9, wherein, At least two pin seats are provided on any of the side walls in the flow direction, and a strap opening is provided between the two pin seats; the heat dissipation patch also includes a strap, and the free ends of the strap are respectively fixed in the strap opening on the side wall in the flow direction.

11. The heat dissipation patch of claim 1, wherein, The outer periphery of the surface of the upper cover facing the body cavity is provided with a plurality of support columns spaced apart, and the length of the support columns is greater than the distance between the upper cover and the lower cover; When the top cover is closed on the opening, any of the support columns are inside the body cavity, and the face of any of the support columns facing the side wall is inclined inward to form an abutment surface and abuts against the side wall.

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