A positioning device for lead frame stamping die

Abstract

This utility model discloses a positioning device for a lead frame stamping die, comprising a base, a support frame fixedly connected to the upper end of the base, an electric push rod fixedly connected to the upper end of the support frame, a lower pressure plate fixedly connected to the output end of the electric push rod, an upper die fixedly connected to the lower end of the lower pressure plate, a positioning rod fixedly connected to the lower end of the upper die, a plurality of first guide rods fixedly connected to the support frame, the lower pressure plate slidably connected to the plurality of first guide rods, a fixing block fixedly connected to the upper end of the base, a lower die slidably connected to the fixing block, a fixing device provided inside the fixing block, and a positioning mechanism provided at the upper end of the lower die. Through the above structure, the lower die can be stably fixed, preventing displacement or shaking during the stamping process, ensuring the stability of the stamping process, and achieving precise alignment between the upper and lower dies, ensuring the positional accuracy of the lead frame stamping, and improving product quality.

Description

Technical Field

[0001] This utility model relates to the field of lead frame stamping die technology, specifically a lead frame stamping die positioning device. Background Technology

[0002] Leadframes are a crucial basic material in semiconductor packaging. As a chip carrier, they enable electrical connections and signal transmission between the chip and external circuits through internal leads. Therefore, the quality of product stamping is particularly important. During the leadframe stamping die processing, it is necessary to accurately determine the position of the leadframe material to ensure consistency and accuracy in each stamping, and avoid quality problems such as dimensional deviations and lead deformation caused by positional errors.

[0003] However, some existing positioning devices have simple structures and may only rely on simple pins or slots for positioning. Under long-term use or when subjected to large impacts, positioning deviations are prone to occur, resulting in low dimensional accuracy of the stamped lead frame, which affects the assembly and performance of subsequent electronic components. Furthermore, the lower die may loosen or shift due to vibration and other factors during the stamping process, which not only affects product quality but may also cause safety accidents. In addition, frequent machine stops are required for adjustment and fixation, reducing production efficiency. Summary of the Invention

[0004] This utility model provides a positioning device for lead frame stamping die, which can stably fix the lower die to prevent displacement or shaking during the stamping process, ensure the stability of the stamping process, and achieve precise alignment between the upper and lower dies, ensuring the positional accuracy of lead frame stamping and improving product quality.

[0005] To achieve the above objectives, a positioning device for a lead frame stamping die is provided, comprising a base, a support frame fixedly connected to the upper end of the base, an electric push rod fixedly connected to the upper end of the support frame, a lower pressure plate fixedly connected to the output end of the electric push rod, an upper die fixedly connected to the lower end of the lower pressure plate, a positioning rod fixedly connected to the lower end of the upper die, a plurality of first guide rods fixedly connected to the support frame, the lower pressure plate being slidably connected to the plurality of first guide rods, a fixing block fixedly connected to the upper end of the base, a lower die slidably connected to the fixing block, a fixing device being provided inside the fixing block, a positioning mechanism being provided at the upper end of the lower die, and a second guide rod fixedly connected to the lower end of the lower die, the second guide rod being slidably connected to the base. The support frame is provided for convenient support; the electric push rod is provided for convenient movement of the upper mold; the lower pressure plate is provided for convenient movement; the upper mold is provided for convenient stamping and forming; the positioning rod is provided for convenient positioning; the first guide rod is provided for convenient determination of the movement trajectory of the lower pressure plate; the fixing block is provided for convenient fixing; the lower mold is provided for convenient stamping and forming; the fixing device is provided for convenient fixing of the lower mold; the positioning mechanism is provided for convenient positioning of the upper mold; and the second guide rod is provided for convenient determination of the movement trajectory of the lower mold.

[0006] According to the aforementioned positioning device for a lead frame stamping die, the fixing device includes a first wedge, a second wedge, a third wedge, and a third guide rod, and the base is provided with a fixing groove. The first, second, and third wedges are provided to facilitate the movement and fixing of the lower die; the third guide rod is provided to facilitate the determination of the movement trajectory of the second wedge; and the fixing groove is provided to facilitate the movement of the third wedge.

[0007] According to the aforementioned lead frame stamping die positioning device, the inclined surface of the first wedge is in contact with the inclined surface of the second wedge, and the inclined surface of the second wedge away from the first wedge is in contact with the inclined surface of the third wedge.

[0008] According to the aforementioned lead frame stamping die positioning device, the fixing groove is slidably connected to the third wedge, and the inclined surface of the first wedge away from the second wedge is located below the lower die.

[0009] According to the aforementioned positioning device for a lead frame stamping die, the third guide rod is fixedly connected to the base, and the third guide rod is slidably connected to the second wedge block.

[0010] According to the aforementioned positioning device for a lead frame stamping die, the positioning mechanism includes positioning holes, an expansion port, a buffer plate, and a spring. Multiple positioning holes are disposed at the upper end of the lower die. The positioning holes facilitate the connection of the positioning rod, the expansion port facilitates the entry of the positioning rod into the positioning hole, and the buffer plate and spring relieve pressure on the positioning rod.

[0011] According to the aforementioned lead frame stamping die positioning device, the expansion port is located at the upper end of the positioning hole, and one end of the spring is fixedly connected to the bottom of the positioning hole.

[0012] According to the aforementioned lead frame stamping die positioning device, the end of the spring furthest from the positioning hole is fixedly connected to the buffer plate.

[0013] The beneficial effects of this utility model are: it can firmly fix the lower mold to prevent it from shifting or shaking during the stamping process, ensuring the stability of the stamping process, and achieving precise alignment between the upper and lower molds, ensuring the positional accuracy of the lead frame stamping, and improving product quality.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0016] Figure 1 This is a three-dimensional structural diagram of a positioning device for a lead frame stamping die according to the present invention;

[0017] Figure 2 This is a front view of the internal structure of a positioning device for a lead wire frame stamping die according to the present invention;

[0018] Figure 3 This is a schematic diagram of the fixing device of the positioning device for the lead frame stamping die of this utility model;

[0019] Figure 4 This utility model Figure 1 A magnified structural diagram of A in the middle;

[0020] Figure 5 This utility model Figure 2 A magnified structural diagram of B in the diagram.

[0021] Legend:

[0022] 1. Base; 2. Support frame; 3. Electric push rod; 4. Lower pressure plate; 5. Upper mold; 6. Positioning rod; 7. First guide rod; 8. Fixing block; 9. Lower mold; 10. Fixing device; 1001. First wedge; 1002. Second wedge; 1003. Third wedge; 1004. Third guide rod; 11. Positioning mechanism; 1101. Positioning hole; 1102. Expansion port; 1103. Buffer plate; 1104. Spring; 12. Second guide rod; 13. Fixing groove. Detailed Implementation

[0023] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0024] Reference Figures 1 to 5 This utility model discloses a positioning device for a lead frame stamping die, comprising a base 1, a support frame 2 fixedly connected to the upper end of the base 1, an electric push rod 3 fixedly connected to the upper end of the support frame 2, a lower pressure plate 4 fixedly connected to the output end of the electric push rod 3, an upper die 5 fixedly connected to the lower end of the lower pressure plate 4, a positioning rod 6 fixedly connected to the lower end of the upper die 5, a plurality of first guide rods 7 fixedly connected to the support frame 2, the lower pressure plate 4 slidably connected to the plurality of first guide rods 7, a fixing block 8 fixedly connected to the upper end of the base 1, a lower die 9 slidably connected to the fixing block 8, a fixing device 10 provided inside the fixing block 8, a positioning mechanism 11 provided at the upper end of the lower die 9, a second guide rod 12 fixedly connected to the lower end of the lower die 9, and the second guide rod 12 slidably connected to the base 1.

[0025] The fixing device 10 includes a first wedge 1001, a second wedge 1002, a third wedge 1003, and a third guide rod 1004. The base 1 is provided with a fixing groove 13. The inclined surface of the first wedge 1001 contacts the inclined surface of the second wedge 1002, and the inclined surface of the second wedge 1002 away from the first wedge 1001 contacts the inclined surface of the third wedge 1003. Utilizing the principle of the inclined surfaces of the wedges, when a certain force is applied to the first wedge 1001, the force can be transmitted through the inclined surfaces, causing the second wedge 1002 and the third wedge 1003 to produce corresponding displacements, thereby achieving the clamping and fixing of the lower mold 9.

[0026] The fixed groove 13 is slidably connected to the third wedge 1003. The inclined surface of the first wedge 1001 away from the second wedge 1002 is located below the lower mold 9. The third guide rod 1004 is fixedly connected to the base 1 and slidably connected to the second wedge 1002.

[0027] The positioning mechanism 11 includes a positioning hole 1101, an expansion port 1102, a buffer plate 1103, and a spring 1104. Multiple positioning holes 1101 are set at the upper end of the lower mold 9. The expansion port 1102 at the upper end of the positioning hole 1101 is trumpet-shaped, which facilitates the smooth insertion of the positioning rod 6 into the positioning hole 1101, plays a guiding role, reduces the resistance and deviation when the positioning rod 6 is inserted, and improves the efficiency and accuracy of positioning.

[0028] An expansion port 1102 is located at the upper end of the positioning hole 1101. One end of the spring 1104 is fixedly connected to the bottom of the positioning hole 1101, and the other end of the spring 1104 away from the positioning hole 1101 is fixedly connected to the buffer plate 1103. When the positioning rod 6 is inserted into the positioning hole 1101, the buffer plate 1103 and the spring 1104 can absorb and buffer the impact force, reduce the direct impact on the mold during stamping, and reduce the wear and damage of the mold.

[0029] Working principle: During use, adjust the position of the lower die 9 on the fixed block 8 according to the specifications of the lead frame to be stamped, so that it is in a suitable stamping position. The lower die 9 presses down and squeezes the first wedge 1001 and squeezes the second wedge 1002 to slide along the third guide rod 1004. The second wedge 1002 squeezes the third wedge 1003 and moves to tightly press against the lower die 9, so as to achieve a stable clamping and fixing of the lower die. Then, the lead frame material is placed on the lower die 9. The electric push rod 3 outputs power to drive the lower pressure plate 4 to slide down along the first guide rod 7, which drives the upper die 5 and the positioning rod 6 to move down together. The positioning rod 6 gradually approaches the positioning mechanism 11 on the lower die 9. Under the guidance of the expansion port 1102, the positioning rod 6 smoothly inserts into the positioning hole 1101, so as to achieve precise alignment between the upper die 5 and the lower die 9. As the upper die 5 continues to move down, the stamping of the lead frame material begins. During the stamping process, the positioning rod 6 is inserted into the positioning hole 1101 to ensure the relative position of the mold is accurate and to guarantee the accuracy of the stamping position. At the same time, the buffer plate 1103 and the spring 1104 in the positioning mechanism 11 will buffer the impact force generated during stamping. The spring 1104 is compressed to absorb part of the impact force, reduce damage to the mold, and make the stamping process more stable.

[0030] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A lead frame stamping die positioning apparatus, characterized by, The system includes a base (1), a support frame (2) fixedly connected to the upper end of the base (1), an electric push rod (3) fixedly connected to the upper end of the support frame (2), a lower pressure plate (4) fixedly connected to the output end of the electric push rod (3), an upper mold (5) fixedly connected to the lower end of the lower pressure plate (4), a positioning rod (6) fixedly connected to the lower end of the upper mold (5), a plurality of first guide rods (7) fixedly connected to the support frame (2), the lower pressure plate (4) and the plurality of first guide rods (7) being slidably connected, a fixing block (8) fixedly connected to the upper end of the base (1), a lower mold (9) slidably connected to the fixing block (8), a fixing device (10) being provided inside the fixing block (8), a positioning mechanism (11) being provided at the upper end of the lower mold (9), a second guide rod (12) fixedly connected to the lower end of the lower mold (9), and the second guide rod (12) being slidably connected to the base (1).

2. A lead frame stamping die positioning apparatus according to claim 1, wherein, The fixing device (10) includes a first wedge (1001), a second wedge (1002), a third wedge (1003) and a third guide rod (1004), and the base (1) is provided with a fixing groove (13).

3. A lead frame stamping die positioning apparatus according to claim 2, wherein, The inclined surface of the first wedge (1001) is in contact with the inclined surface of the second wedge (1002), and the inclined surface of the second wedge (1002) away from the first wedge (1001) is in contact with the inclined surface of the third wedge (1003).

4. The lead frame stamping die positioning apparatus of claim 3, wherein, The fixing groove (13) is slidably connected to the third wedge (1003), and the inclined surface of the first wedge (1001) away from the second wedge (1002) is located below the lower mold (9).

5. A lead frame stamping die positioning apparatus according to claim 4, wherein, The third guide rod (1004) is fixedly connected to the base (1), and the third guide rod (1004) is slidably connected to the second wedge (1002).

6. The positioning device for a lead frame stamping die according to claim 1, characterized in that, The positioning mechanism (11) includes a positioning hole (1101), an expansion port (1102), a buffer plate (1103), and a spring (1104), with multiple positioning holes (1101) disposed at the upper end of the lower mold (9).

7. The positioning device for a lead frame stamping die according to claim 6, characterized in that, The expansion port (1102) is located at the upper end of the positioning hole (1101), and one end of the spring (1104) is fixedly connected to the bottom of the positioning hole (1101).

8. The positioning device for a lead frame stamping die according to claim 7, characterized in that, The end of the spring (1104) away from the positioning hole (1101) is fixedly connected to the buffer plate (1103).

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