An outer packaging structure for an optocoupler

Abstract

This utility model relates to an outer packaging structure for optocouplers, comprising an antistatic rigid plastic outer shell, a placement tray, and an antistatic foam layer. The antistatic rigid plastic outer shell consists of a lower shell and an upper shell, connected by a hinge and fastened with fixing slots and blocks to form a closed space. The placement tray is fixed inside the lower shell via a snap-fit ​​structure of mounting slots and mounting protrusions. Its upper surface has a placement groove structure to accommodate optocouplers of different specifications. The antistatic foam layer is fixed inside the placement frame, covering the placement groove structure and providing cushioning and antistatic protection. The placement tray includes type A, type B, and type C trays, each with a first, second, and third placement groove structure, respectively, to accommodate various optocoupler specifications. This utility model, through customized design, excellent antistatic and cushioning performance, stable fixing structure, and convenient operation, effectively prevents lead wire deformation and improves transportation and usage safety.

Description

Technical Field

[0001] This utility model relates to the field of electronic component packaging technology, specifically to an outer packaging structure for optocouplers. Background Technology

[0002] Optocouplers are precision components widely used in electronic devices. Their main function is to achieve isolated transmission of electrical signals through photoelectric conversion. They are widely used in communication equipment, industrial control, medical instruments, and consumer electronics. Due to the complex internal structure and delicate leads of optocouplers, they require extremely high protection from the external environment during production, transportation, storage, and use. Especially during transportation, vibration, shock, and electrostatic interference can cause deformation of the device leads, damage to the internal structure, or performance degradation. Therefore, the design of the packaging structure becomes a key factor in ensuring the quality of optocouplers.

[0003] Currently, the packaging of optocouplers on the market mainly uses anti-static foam material combined with simple plastic boxes or cardboard cartons. This packaging method provides basic anti-static protection and cushioning to a certain extent, but with the diversification of optocoupler models (such as DIP type, SOP type, and other customized specifications) and the market's higher requirements for device reliability, the limitations of traditional packaging methods are becoming increasingly apparent. Firstly, traditional anti-static foam packaging usually adopts a generic design, lacking customized structures for different specifications of optocouplers. This non-customized design results in insufficient fit between the packaging and the device, especially when accommodating devices of different sizes and lead layouts. Gaps within the packaging can easily cause displacement or collisions during transportation, leading to problems such as lead bending or breakage. Statistics show that lead deformation caused by improper packaging during transportation accounts for more than 30% of device defects, seriously affecting the product's appearance and electrical performance.

[0004] Secondly, traditional packaging has limited cushioning performance. While antistatic foam materials possess a certain degree of elasticity, their deformation capacity is insufficient to completely absorb external forces when faced with high-intensity vibrations or impacts. Especially during long-distance transportation or in complex logistics environments, packaging materials may lose elasticity due to repeated stress, further reducing their cushioning effect. Furthermore, the antistatic coating of some foam materials may experience performance degradation after prolonged use, making it difficult to continuously provide stable electrostatic protection. This poses a significant risk to electrostatic-sensitive optocouplers.

[0005] Furthermore, traditional packaging has a rudimentary fixing structure, typically relying on the friction of foam material or simple slots for securing the components, lacking robust mechanical connections. This design makes it prone to components detaching from their fixed positions during frequent handling or transportation, further increasing the risk of lead wire deformation. Simultaneously, existing packaging involves complex assembly and disassembly operations, lacking user-friendly designs, increasing efficiency losses in production and usage. For example, on the production line, workers need to spend extra time removing components from the packaging or manually adjusting their positions during packaging, which not only reduces production efficiency but may also cause secondary damage to the components due to improper handling.

[0006] Finally, the universal design of traditional packaging struggles to meet the diverse needs of the optocoupler market. As the electronics industry moves towards miniaturization and high integration, the specifications and packaging forms of optocouplers are constantly being updated, and the single structure of traditional packaging is ill-suited to the demands of new device specifications. For example, the lead layout of SOP-type optocouplers differs significantly from that of DIP-type, and existing packaging cannot simultaneously accommodate both specifications. This forces companies to prepare multiple packaging options for different device models during production and transportation, increasing costs and management complexity.

[0007] In summary, existing optocoupler packaging technologies have significant shortcomings in terms of adaptability, cushioning performance, anti-static effect, fixation stability, and ease of operation, making it difficult to meet the modern electronics industry's demands for high-reliability and high-efficiency packaging. Therefore, there is an urgent need for a new packaging structure that can adapt to various optocoupler specifications, provide excellent anti-static and cushioning protection, and possess high stability and ease of operation, in order to solve the aforementioned problems and improve the safety of optocoupler transportation and use. Utility Model Content

[0008] In view of this, the purpose of this utility model is to solve the above problems and provide an outer packaging structure for optocouplers.

[0009] To achieve the above objectives, this utility model provides the following technical solution:

[0010] An outer packaging structure for an optocoupler includes an antistatic rigid plastic outer shell, a placement tray, and an antistatic foam layer;

[0011] The antistatic hard plastic housing includes a lower housing and an upper housing. One side of the upper housing is hinged to one side of the lower housing. The lower housing has multiple fixing slots on the side away from the hinge. The upper housing has multiple fixing blocks on the side away from the hinge. Each fixing block matches one fixing slot to achieve the fastening of the upper housing and the lower housing, forming a closed space for protecting the optocoupler.

[0012] The placement tray is fixedly installed inside the lower housing by a snap-fit ​​structure. The upper surface of the placement tray is provided with multiple placement slots for placing optocouplers. The antistatic foam layer is placed on the upper surface of the placement tray, covering all the placement slots to provide cushioning and antistatic protection.

[0013] Furthermore, the lower housing has multiple mounting protrusions on both sides, and the placement tray has multiple mounting slots on both sides. Each mounting slot matches one mounting protrusion to form a snap-fit ​​structure, ensuring that the placement tray is securely fixed inside the lower housing.

[0014] Furthermore, the two ends of the placement tray are provided with detachable grooves to facilitate the installation and removal of the placement tray.

[0015] Furthermore, the upper surface of the placement tray is provided with a placement frame, and the antistatic foam layer is fixedly disposed inside the placement frame to enhance the fit between the antistatic foam layer and the placement tray.

[0016] Optionally, the placement tray is an A-type tray, and the placement slot structure is a first placement slot structure, which includes:

[0017] A first groove, and an array of the first grooves are arranged on the A-type tray;

[0018] Two first dividing protrusions are arranged vertically symmetrically inside each of the first grooves;

[0019] A first connecting protrusion is disposed between the middle portions of the two first separating protrusions;

[0020] Each of the first dividing protrusions has a first groove in the middle, and the bottom of the first groove is flush with the top of the first connecting protrusion to adapt to the specifications of the optocoupler.

[0021] Optionally, the placement tray is a type B tray, and the placement slot structure is a second placement slot structure, the second placement slot structure comprising:

[0022] The second groove, and an array of the second grooves are arranged on the B-type tray;

[0023] Four second dividing protrusions are arranged in a vertical array inside each of the second grooves;

[0024] The second connecting protrusion is disposed between the middle portions of the four second separating protrusions;

[0025] Each of the second dividing protrusions has a second groove in the middle, and the bottom of the second groove is flush with the top of the second connecting protrusion to adapt to the specifications of the optocoupler.

[0026] Optionally, the placement tray is a C-shaped tray, and the placement slot structure is a third placement slot structure, the third placement slot structure comprising:

[0027] The third groove, and an array of the third grooves are arranged on the C-shaped tray;

[0028] Two third dividing protrusions are arranged in a cross-shaped structure inside each of the third grooves;

[0029] Each of the third dividing protrusions has a third groove in the middle to accommodate the specifications of the optocoupler.

[0030] The beneficial effects of this utility model are as follows:

[0031] Firstly, this invention employs a combination design of an antistatic rigid plastic outer shell and an antistatic foam layer, significantly enhancing the antistatic and cushioning performance of the packaging. The antistatic rigid plastic outer shell is made of high-strength antistatic material, possessing stable antistatic properties and capable of resisting electrostatic interference for extended periods, protecting the optocoupler from electrostatic damage. The antistatic foam layer is fixed to the upper surface of the tray via placement frames, covering all placement slot structures and providing a uniform cushioning effect. Even under high-intensity vibration or impact, it effectively absorbs external forces, reducing the risk of device damage. Compared to the performance degradation issues of traditional foam packaging, the material combination of this invention maintains stable antistatic and cushioning performance even after multiple uses, ensuring long-term reliability.

[0032] Secondly, this invention utilizes customized placement slot structures for Type A, Type B, and Type C trays to precisely adapt to different specifications of optocouplers (such as DIP, SOP, and other customized models). The first placement slot structure employs a design with two first separating protrusions and a first connecting protrusion, combined with a first groove, to ensure effective support and fixation of the device leads, making it particularly suitable for standard DIP optocouplers. The second placement slot structure, through an array layout of four second separating protrusions combined with second grooves, adapts to more complex lead arrangements and is suitable for high-pin-count SOP devices. The third placement slot structure, with two third separating protrusions arranged in a cross shape and a third groove, provides multi-directional fixation, suitable for special packaging forms. These customized designs significantly improve the fit between the packaging and the device, eliminate the risk of displacement caused by gaps in traditional general packaging, and effectively prevent lead deformation or breakage during transportation and handling. According to tests, this invention can reduce the lead deformation defect rate to below 5%, significantly improving the appearance integrity and electrical performance stability of the device.

[0033] Furthermore, the interlocking structure of the mounting slots and protrusions, along with the design of the placement frame, further enhances the stability and practicality of the packaging. The precise matching of the mounting slots and protrusions ensures the pallet is securely fixed inside the lower housing, preventing shaking or detachment during transport. The placement frame ensures a tight fit between the anti-static foam layer and the pallet, enhancing the overall structure's shock resistance. The installation and removal grooves significantly improve the efficiency of pallet installation and removal, facilitating operation by workers on the production line and reducing the risk of device damage due to improper handling. In practical applications, installation and removal time can be reduced by more than 30%, significantly improving production efficiency.

[0034] Finally, the hinged and snap-fit ​​design of the anti-static hard plastic outer shell optimizes the ease of operation of the packaging. The upper and lower shells are connected by a hinge, and the locking structure of the fixing slots and blocks allows for quick opening and closing, ensuring the airtightness of the enclosed space while facilitating multiple uses. Compared with the complex operation of traditional packaging, this design significantly improves the efficiency of production and transportation while reducing packaging costs.

[0035] Overall, this invention provides comprehensive protection for optocouplers through customized design, excellent anti-static and cushioning performance, stable fixing structure, and convenient operation, significantly improving safety and reliability during transportation and use. It is suitable for diverse optocoupler packaging needs and has broad market application prospects.

[0036] Other advantages, objectives, and features of this invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination and study, or may be learned from practice of this invention. The objectives and other advantages of this invention can be realized and obtained through the following description. Attached Figure Description

[0037] To make the objectives, technical solutions, and advantages of this utility model clearer, the preferred embodiments of this utility model will be described in detail below with reference to the accompanying drawings, wherein:

[0038] Figure 1 This is an overall schematic diagram of the outer packaging structure for the optocoupler in this utility model, wherein the tray is a C-shaped tray.

[0039] Figure 2 for Figure 1 A magnified view of the local structure at point A.

[0040] Figure 3 This is a structural schematic diagram of the A-type tray provided in this utility model.

[0041] Figure 4 for Figure 3A magnified view of the local structure at point B.

[0042] Figure 5 This is a structural schematic diagram of the B-type tray provided in this utility model.

[0043] Figure 6 for Figure 5 A magnified view of the local structure at point C.

[0044] Reference numerals: 101-Antistatic foam layer; 102-Type A tray; 103-Type B tray; 104-Type C tray; 105-Mounting slot; 106-Mounting protrusion; 107-Disassembly groove; 108-Placement frame; 109-First groove; 110-First dividing protrusion; 111-First connecting protrusion; 112-First groove; 113-Second groove; 114-Second dividing protrusion; 115-Second connecting protrusion; 116-Second groove; 117-Third groove; 118-Third dividing protrusion; 119-Third groove; 120-Lower shell; 121-Upper shell; 122-Fixing slot; 123-Fixing block. Detailed Implementation

[0045] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this utility model. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0046] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual pictures. They should not be construed as limiting the present invention. To better illustrate the embodiments of the present invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual product dimensions. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0047] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," "right," "front," and "rear" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this utility model. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0048] Example 1

[0049] Please see Figures 1-4 This embodiment provides an outer packaging structure for an optocoupler, including an antistatic rigid plastic outer shell, an A-type tray 102, and an antistatic foam layer 101. The antistatic rigid plastic outer shell consists of a lower shell 120 and an upper shell 121. One side of the upper shell 121 is connected to one side of the top of the lower shell 120 via a hinge. The other side of the top of the lower shell 120 is provided with multiple fixing slots 122. The side of the upper shell 121 away from the hinge is provided with multiple fixing blocks 123. Each fixing block 123 matches one fixing slot 122 to form a fastening structure, ensuring a stable closed space to protect the optocoupler.

[0050] The A-type pallet 102 is fixed inside the lower housing 120 via a snap-fit ​​structure. Multiple mounting protrusions 106 are provided on both sides of the interior of the lower housing 120, and multiple mounting slots 105 are provided on both sides of the A-type pallet 102. Each mounting slot 105 matches one mounting protrusion 106, ensuring that the A-type pallet 102 does not shift during transportation. Removal grooves 107 are provided at both ends of the A-type pallet 102 for easy installation and removal. A placement frame 108 is provided on the upper surface of the A-type pallet 102, and an anti-static foam layer 101 is fixed inside the placement frame 108, covering the placement slot structure on the pallet and providing cushioning and anti-static protection.

[0051] like Figure 3 and Figure 4As shown, the placement slot structure of the A-type tray 102 is a first placement slot structure, including a first slot body 109, two first separating protrusions 110, and a first connecting protrusion 111. Multiple first slot bodies 109 are arranged in an array on the A-type tray 102. The two first separating protrusions 110 are vertically symmetrically arranged inside each first slot body 109, and the first connecting protrusion 111 is located between the middle of the two first separating protrusions 110. Each first separating protrusion 110 has a first groove 112 in its middle. The bottom of the first groove 112 is flush with the top of the first connecting protrusion 111, used to accommodate optocouplers of specific specifications (such as DIP type), ensuring the device is stable during transportation and handling, and preventing lead deformation.

[0052] Example 2

[0053] Please see Figure 1 , Figure 2 , Figure 5 and Figure 6 This embodiment provides an outer packaging structure for an optocoupler, whose basic structure is the same as that of Embodiment 1, including an antistatic hard plastic outer shell, a type B tray 103, and an antistatic foam layer 101. The antistatic hard plastic outer shell consists of a lower shell 120 and an upper shell 121, which are connected by a hinge and form a closed space through the engagement of a fixing slot 122 and a fixing block 123 to protect the optocoupler. The type B tray 103 is fixed to the inside of the lower shell 120 by a snap-fit ​​structure (installation slot 105 and installation protrusion 106), and has disassembly grooves 107 at both ends for easy installation and disassembly. A placement frame 108 is provided on the upper surface of the type B tray 103, and the antistatic foam layer 101 is fixed inside the placement frame 108, covering the placement slot structure and providing cushioning and antistatic protection.

[0054] like Figure 5 and Figure 6 As shown, the placement slot structure of the B-type tray 103 is a second placement slot structure, including a second slot body 113, four second partition protrusions 114, and a second connecting protrusion 115. Multiple second slot bodies 113 are arranged in an array on the B-type tray 103, and the four second partition protrusions 114 are vertically arrayed inside each second slot body 113. The second connecting protrusion 115 is located between the middle portions of the four second partition protrusions 114. Each second partition protrusion 114 has a second groove 116 in its middle portion. The bottom of the second groove 116 is flush with the top of the second connecting protrusion 115, used to accommodate optocouplers of specific specifications (such as SOP type), ensuring device stability and preventing lead deformation.

[0055] Example 3

[0056] Please see Figure 1 , Figure 2This embodiment provides an outer packaging structure for an optocoupler, whose basic structure is the same as that of Embodiment 1, including an antistatic hard plastic outer shell, a C-shaped tray 104, and an antistatic foam layer 101. The antistatic hard plastic outer shell consists of a lower shell 120 and an upper shell 121, which are connected by a hinge and form a closed space through the engagement of a fixing slot 122 and a fixing block 123 to protect the optocoupler. The C-shaped tray 104 is fixed to the inside of the lower shell 120 by a snap-fit ​​structure (installation slot 105 and installation protrusion 106), and has disassembly grooves 107 at both ends for easy installation and disassembly. A placement frame 108 is provided on the upper surface of the C-shaped tray 104, and the antistatic foam layer 101 is fixed inside the placement frame 108, covering the placement slot structure and providing cushioning and antistatic protection.

[0057] The C-type tray 104 has a third placement slot structure, including a third slot body 117 and two third dividing protrusions 118. Multiple third slot bodies 117 are arranged in an array on the C-type tray 104, and the two third dividing protrusions 118 are arranged in a cross structure inside each third slot body 117. Each third dividing protrusion 118 has a third groove 119 in the center, used to accommodate optocouplers of specific specifications (such as special packaging forms), ensuring device stability and preventing lead deformation.

[0058] This utility model features customized A-type, B-type, and C-type tray placement slot structures to accommodate optocouplers of different specifications, effectively preventing lead wire deformation; the anti-static hard plastic shell and anti-static foam layer provide excellent anti-static and cushioning performance; the snap-fit ​​structure, placement frame, and hinged fastening design enhance the stability of the structure and ease of operation, providing reliable protection for the optocoupler.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of this technical solution, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. An outer packaging structure for an optocoupler, characterized in that: Includes an antistatic hard plastic outer shell, a placement tray, and an antistatic foam layer; The antistatic hard plastic housing includes a lower housing and an upper housing. One side of the upper housing is hinged to one side of the lower housing. The lower housing has multiple fixing slots on the side away from the hinge. The upper housing has multiple fixing blocks on the side away from the hinge. Each fixing block matches one fixing slot to achieve the fastening of the upper housing and the lower housing, forming a closed space for protecting the optocoupler. The placement tray is fixedly installed inside the lower housing by a snap-fit ​​structure. The upper surface of the placement tray is provided with multiple placement slots for placing optocouplers. The antistatic foam layer is placed on the upper surface of the placement tray, covering all the placement slots to provide cushioning and antistatic protection.

2. The outer packaging structure for an optocoupler according to claim 1, characterized in that: The lower housing has multiple mounting protrusions on both sides inside, and the placement tray has multiple mounting slots on both sides. Each mounting slot matches one mounting protrusion to form a snap-fit ​​structure.

3. The outer packaging structure for an optocoupler according to claim 1, characterized in that: The placement tray has detachable grooves at both ends to facilitate its installation and removal.

4. The outer packaging structure for an optocoupler according to claim 1, characterized in that: The upper surface of the placement tray is provided with a placement frame, and the antistatic foam layer is fixedly disposed inside the placement frame to enhance the fit between the antistatic foam layer and the placement tray.

5. The outer packaging structure for an optocoupler according to claim 1, characterized in that, The placement tray is an A-type tray, and the placement slot structure is a first placement slot structure, which includes: A first groove, and an array of the first grooves are arranged on the A-type tray; Two first dividing protrusions are arranged vertically symmetrically inside each of the first grooves; A first connecting protrusion is disposed between the middle portions of the two first separating protrusions; Each of the first dividing protrusions has a first groove in the middle, and the bottom of the first groove is flush with the top of the first connecting protrusion to adapt to the specifications of the optocoupler.

6. The outer packaging structure for an optocoupler according to claim 1, characterized in that, The placement tray is a type B tray, and the placement slot structure is a second placement slot structure, which includes: The second groove, and an array of the second grooves are arranged on the B-type tray; Four second dividing protrusions are arranged in a vertical array inside each of the second grooves; The second connecting protrusion is disposed between the middle portions of the four second separating protrusions; Each of the second dividing protrusions has a second groove in the middle, and the bottom of the second groove is flush with the top of the second connecting protrusion to adapt to the specifications of the optocoupler.

7. The outer packaging structure for an optocoupler according to claim 1, characterized in that, The placement tray is a C-shaped tray, and the placement slot structure is a third placement slot structure, which includes: The third groove, and an array of the third grooves are arranged on the C-shaped tray; Two third dividing protrusions are arranged in a cross-shaped structure inside each of the third grooves; Each of the third dividing protrusions has a third groove in the middle to accommodate the specifications of the optocoupler.

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