Electroplating fixtures, electroplating fixture assemblies and electroplating fixture systems

Abstract

This application provides an electroplating fixture, an electroplating fixture assembly, and an electroplating fixture system. The electroplating fixture includes a connecting rod, the proximal end of which is connected to the main unit of the electroplating apparatus; and a contact pin, which includes a tip portion. In a side view, the tip of the contact pin is fixedly connected to the distal end of the connecting rod, and the tip portion is located at the bottom end of the contact pin. The bottom side of the tip portion forms an angle with the horizontal direction, the angle ranging from 25° to 50°. The contact pin contacts the upper surface of the encapsulation structure. The advantages of this application are: it reduces the contact area of ​​the fixture on the encapsulation structure, and simultaneously reduces the area occupied by the sealing component. While ensuring stable power supply, it expands the usable area of ​​the encapsulation structure, which helps to reduce production costs.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging processes, and more specifically, to an electroplating fixture, an electroplating fixture assembly, and an electroplating fixture system. Background Technology

[0002] Panel-level fan-out packaging (PLP) is an advanced semiconductor packaging technology that improves production efficiency and reduces costs by directly packaging multiple chips onto a larger panel (such as a rectangular substrate), rather than a traditional single circular wafer (WLFO). The cost of panel-level fan-out packaging is related to the size of its usable area (effective area); the larger the usable area, the greater the cost advantage of panel-level fan-out packaging.

[0003] The design of the electroplating fixture assembly is directly related to the usable area of ​​the panel-level fan-out package. The smaller the area occupied by the electroplating fixture assembly, the larger the usable area of ​​the panel-level fan-out package. Figure 1 A schematic diagram of a prior art electroplating fixture system is shown. Figure 1 As shown, the prior art electroplating fixture system includes an electroplating fixture assembly 901 and an encapsulation structure 902. The electroplating fixture assembly 901 includes an electroplating fixture 901a and a sealing assembly 901b. The encapsulation structure 902 includes a substrate 902a, a seed layer 902b, and a dielectric layer 902c arranged sequentially from bottom to top. The seed layer 902b is exposed from below the dielectric layer 902c near the edge of the substrate 902a. A groove 902d is provided on the dielectric layer 902c, and the seed layer 902b is exposed from the bottom of the groove 902d. During electroplating, metal is deposited on the seed layer 902b at the bottom of the groove 902d to form a circuit. The electroplating fixture 901a contacts the seed layer 902b via surface contact, and the sealing component 901b contacts the dielectric layer 902c. The distance between the contact point of the sealing component 901b and the dielectric layer 902c and the edge of the substrate 902a is greater than the distance between the contact point of the electroplating fixture 901a and the seed layer 902b and the edge of the substrate 902a. Since the electroplating fixture 901a needs to apply downward pressure during electroplating, it will slide horizontally to some extent when applying force. To prevent the electroplating fixture 901a from sliding... a contacts the sealing component 901b. In existing electroplating fixtures 901, the distance between the electroplating fixture 901a and the sealing component 901b is generally about 4.5 mm. The distance between the inner edge of the contact surface of the electroplating fixture 901a and the seed layer 902b and the edge of the substrate 902a is about 1.5 mm to 2 mm. The width of the sealing component 901b is generally between 5.5 mm and 7 mm. The distance between the inner edge of the sealing component 901b and the edge of the substrate 902a is about 5.5 mm to 7.5 mm. Figure 2 It shows the use of, as Figure 1 The diagram shows the effective area of ​​the encapsulation structure of an electroplating fixture using existing technology. (See attached diagram.) Figure 2 As shown, the sealing component 901b is a rounded rectangle in the top view. The rounded corners will create an unusable area 903 with a width of about 2mm on the four sides of the encapsulation structure. Combined with the distance occupied by the electroplating fixture component 901 above, for a 600mm*600mm encapsulation structure, the actual usable area is only about 581mm*581mm (i.e., 600mm-(7.5mm+2mm)*2).

[0004] In summary, there is a need in the art to provide an electroplating fixture, an electroplating fixture assembly, and an electroplating fixture system that can overcome the deficiencies of the prior art. Utility Model Content

[0005] This application provides an electroplating fixture, an electroplating fixture assembly, and an electroplating fixture system, which can solve the problems of the prior art. The objective of this application is achieved through the following technical solutions.

[0006] In a first aspect, one embodiment of this application provides an electroplating fixture, which includes a connecting rod, the proximal end of which is connected to the main body of the electroplating apparatus; a contact pin, the contact pin including a tip portion, the top end of which is fixedly connected to the distal end of the connecting rod in a side view direction, the tip portion being located at the bottom end of the contact pin, and the bottom side of the tip portion forming an angle with the horizontal direction, the angle ranging from 25° to 50°; wherein the contact pin contacts the upper surface of the encapsulation structure.

[0007] In some alternative embodiments, the electroplating fixture provided according to one embodiment of this application has a maximum width of the contact pin between 0.2 mm and 0.5 mm.

[0008] In some alternative embodiments, the electroplating fixture provided according to one embodiment of this application above has a right angle between the connecting rod and the contact pin.

[0009] Secondly, one embodiment of this application provides an electroplating fixture assembly, which includes: an electroplating fixture; a sealing assembly connected to a host, the sealing assembly being located at the distal end of a connecting rod, and a gap space between the sealing assembly and the electroplating fixture.

[0010] In some alternative embodiments, the electroplating fixture assembly provided according to one embodiment of the present application includes multiple sets of electroplating fixtures, which are disposed around the packaging structure and respectively contact the upper surface of the packaging structure.

[0011] In some alternative embodiments, the electroplating fixture assembly provided according to one embodiment of the present application has a distance between the sealing component and the electroplating fixture between 1 mm and 2 mm.

[0012] Thirdly, one embodiment of this application provides an electroplating fixture system, which includes: an electroplating fixture assembly; a packaging structure, wherein the electroplating fixture and a sealing assembly respectively contact the upper surface of the packaging structure, and the distance between the contact position of the sealing assembly and the edge of the packaging structure is greater than the distance between the contact point of the tip and the edge of the packaging structure.

[0013] In some alternative embodiments, the electroplating fixture system provided according to one embodiment of the present application has a distance of 1 mm to 2 mm from the edge of the packaging structure to the contact point between the tip and the packaging structure.

[0014] In some alternative embodiments, the electroplating fixture system provided according to one embodiment of this application has a distance of 4.5 mm to 5.5 mm between the side of the sealing assembly away from the edge of the encapsulation structure and the edge of the encapsulation structure.

[0015] In some alternative embodiments, the electroplating fixture system provided according to one embodiment of the present application includes an encapsulation structure comprising a substrate, a seed layer and a dielectric layer, wherein the seed layer is disposed on the upper surface of the substrate, the dielectric layer is disposed on the upper surface of the seed layer, the electroplating fixture is in contact with and electrically connected to the seed layer, and the sealing assembly is in contact with the dielectric layer.

[0016] In some alternative embodiments, the electroplating fixture system provided according to one embodiment of this application has an encapsulation structure with dimensions of 600 mm by 600 mm.

[0017] The advantages of the electroplating fixture, electroplating fixture assembly, and electroplating fixture system according to the embodiments of this application are: the contact area of ​​the fixture on the packaging structure is reduced, and the area occupied by the sealing assembly is also reduced. While ensuring stable power supply, the usable area of ​​the packaging structure is expanded, which helps to reduce production costs. Attached Figure Description

[0018] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings.

[0019] Figure 1 A schematic diagram of a prior art electroplating fixture system is shown;

[0020] Figure 2 It shows the use of, as Figure 1The diagram shows the effective area of ​​the encapsulation structure of an electroplating fixture using existing technology.

[0021] Figure 3 A schematic diagram of an electroplating fixture assembly according to one embodiment of this application is shown;

[0022] Figure 4 A schematic diagram of an electroplating fixture system according to an embodiment of this application is shown;

[0023] Figure 5 As shown Figure 4 The diagram shown is an enlarged view of part A in an electroplating fixture system according to an embodiment of this application;

[0024] Figure 6 As shown Figure 4 The diagram shown is a schematic diagram of the effective area of ​​the packaging structure of an electroplating fixture system according to an embodiment of this application.

[0025] Labels and component names: 1-Electroplating fixture assembly, 11-Electroplating fixture, 111-Connecting rod, 112-Contact pin, 112a-Tip, 12-Sealing assembly, 13-First connector, 14-Main unit, 141-Telescopic rod, 142-Second connector, 143-Drive component, 2-Encapsulation structure, 21-Substrate, 22-Seed layer, 23-Dielectric layer, 24-Groove, 901-Electroplating fixture assembly, 901a-Electroplating fixture, 901b-Sealing assembly, 902-Encapsulation structure, 902a-Substrate, 902b-Seed layer, 902c-Dielectric layer, 902d-Groove, 903-Ineffective area. Detailed Implementation

[0026] The specific embodiments of this application are described below with reference to the accompanying drawings and examples. Through the content described in this specification, those skilled in the art can clearly and completely understand the technical solution, the technical problem solved, and the resulting technical effects of this application. It is understood that the specific embodiments described herein are only for explaining this application and not for limiting it. Furthermore, for ease of description, only the parts related to this application are shown in the accompanying drawings.

[0027] It should be readily understood that the meanings of “on,” “above,” and “on top of” in this application should be interpreted in the broadest sense, such that “on” means not only “directly on something,” but also “on something” including intermediate components or layers existing between the two.

[0028] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship of one element or component to another element or component shown in the accompanying drawings. In addition to the orientations described in the figures, spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90° or otherwise), and the spatial relative descriptive terms used herein may be interpreted accordingly.

[0029] It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and to facilitate understanding and reading of the contents described in the specification. They are not intended to limit the scope of this application and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives of this application, should still fall within the scope of the technical content disclosed in this application. Furthermore, terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0030] As used herein, the term "layer" refers to a portion of material comprising a region of a certain thickness. A layer may extend over the entirety of an underlying or upper layer structure, or may have a extent smaller than that of the underlying or upper layer structure. Furthermore, a layer may be a region of a homogeneous or heterogeneous continuous structure with a thickness less than that of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure, or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically, and / or along a tapered surface. A layer may be a single layer, which may include one or more layers, and / or may have one or more layers on, above, and / or below it. A single layer may include multiple layers. For example, a semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.

[0031] The terms “dielectric layer,” “dielectric material,” or “dielectric material” as used herein may include organic and / or inorganic materials. Organic materials may include, for example, polyamide (PA), polyimide (PI), epoxy resin, poly-p-phenylene benzobisoxazole (PBO) fiber, FR-4 epoxy glass cloth laminate, PP (PrePreg, also known as prepreg or semi-cured resin, semi-cured sheet), ABF (Ajinomoto Build-up Film), etc. Inorganic materials may include, for example, silicon (Si), glass, ceramic, silicon oxide, silicon nitride, tantalum oxide, etc.

[0032] Furthermore, where there is no conflict, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0033] Figure 3 A schematic diagram of an electroplating fixture assembly according to one embodiment of this application is shown. Figure 4 A schematic diagram of an electroplating fixture system according to an embodiment of this application is shown. Figure 5 As shown Figure 4 The diagram shown is an enlarged view of portion A, according to an embodiment of the electroplating fixture system of this application. It should be noted that, for ease of drawing, Figure 4 The complete electroplating fixture assembly is not shown in the drawing. Figure 4 Used to display the positional relationship between electroplating fixture components and encapsulation structures in an electroplating fixture system. For example... Figures 3 to 5 As shown, the electroplating fixture assembly 1 includes: an electroplating fixture 11; a sealing assembly 12, which is connected to the host 14 and is located at the far end of the connecting rod 111. There is a gap between the sealing assembly 12 and the electroplating fixture 11.

[0034] In some optional embodiments, the electroplating fixture assembly 1 provided according to one embodiment of the present application further includes a first connector 13, and the main unit 14 further includes a telescopic rod 141, a second connector 142 and a driving component 143. The electroplating fixture 11 is fixedly connected to the second connector 142, and the sealing assembly 12 is fixedly connected to the second connector 142 through the first connector 13. The second connector 142 is connected to the driving component 143 through the telescopic rod 141. The driving component 143 includes, but is not limited to, a cylinder.

[0035] In some optional embodiments, the electroplating fixture assembly 1 provided according to one embodiment of this application includes an electroplating fixture 11 comprising a connecting rod 111, the proximal end of which is connected to the main body 14 of the electroplating apparatus; a contact pin 112, the contact pin 112 including a tip 112a, the tip of which is fixedly connected to the distal end of the connecting rod 111 in a side view, the tip 112a being located at the bottom end of the contact pin 112, and the bottom side of the tip 112a forming an angle B with the horizontal direction, the angle B being between 25° and 50°; wherein the contact pin 112 contacts the upper surface of the encapsulation structure 2. The distal end of the connecting rod 111 refers to the end of the connecting rod 111 located inside the edge of the encapsulation structure 2 during electroplating and overlapping with the encapsulation structure 2 in a top view; the distal end of the connecting rod 111 refers to the end of the connecting rod 111 located outside the edge of the encapsulation structure 2 during electroplating and not overlapping with the encapsulation structure 2 in a top view.

[0036] In some alternative embodiments, the electroplating fixture 11 provided according to one of the above embodiments of this application has a maximum width of contact pin 112 between 0.2 mm and 0.5 mm, a width of sealing component 12 between 3.21 mm and 4.59 mm, and a distance of electroplating fixture 11 from the edge of the encapsulation structure 2 on the upper surface of the encapsulation structure 2 between 1.01 mm and 1.79 mm.

[0037] In some alternative embodiments, the electroplating fixture 11 provided according to one embodiment of the present application has a right angle between the connecting rod 111 and the contact pin 112.

[0038] In some alternative embodiments, the electroplating fixture assembly 1 provided according to one embodiment of the present application includes multiple sets of electroplating fixtures 11, which are disposed around the encapsulation structure 2 and respectively contact the upper surface of the encapsulation structure 2.

[0039] In some alternative embodiments, the electroplating fixture assembly 1 provided according to one embodiment of the present application has a distance between the sealing assembly 12 and the electroplating fixture 11 between 1 mm and 2 mm.

[0040] like Figure 4 As shown, one embodiment of this application provides an electroplating fixture system, which includes: an electroplating fixture assembly 1; an encapsulation structure 2, wherein the electroplating fixture 11 and the sealing assembly 12 are respectively in contact with the upper surface of the encapsulation structure 2, and the distance between the contact position of the sealing assembly 12 and the edge of the encapsulation structure 2 is greater than the distance between the contact point of the tip 112a and the encapsulation structure 2 and the edge of the encapsulation structure 2.

[0041] In some alternative embodiments, the electroplating fixture system provided according to one embodiment of the present application has a distance of 1 mm to 2 mm from the edge of the packaging structure 2 at the contact point between the tip 112a and the packaging structure 2.

[0042] In some alternative embodiments, the electroplating fixture system provided according to one embodiment of the present application has a distance of 4.5 mm to 5.5 mm between the side of the sealing component 12 away from the edge of the encapsulation structure 2 and the edge of the encapsulation structure 2.

[0043] In some optional embodiments, the electroplating fixture system provided according to one embodiment of this application includes a packaging structure 2 comprising a substrate 21, a seed layer 22, and a dielectric layer 23. The seed layer 22 is disposed on the upper surface of the substrate 21, the dielectric layer 23 is disposed on the upper surface of the seed layer 22, the electroplating fixture 11 is in contact with and electrically connected to the seed layer 22, and the sealing assembly 12 is in contact with the dielectric layer 23. The seed layer 22 may be titanium (Ti), tungsten (W), or nickel (Ni).

[0044] In some alternative embodiments, the electroplating fixture system provided according to one embodiment of the present application has a groove 24 on the dielectric layer 23, and a seed layer 22 exposed from the bottom of the groove 24. During electroplating, metal is deposited on the seed layer 22 at the bottom of the groove 24 to form a circuit.

[0045] In some alternative embodiments, the electroplating fixture system provided according to one embodiment of the present application, wherein the packaging structure 2 is a panel-level fan-out package, and the electroplating fixture assembly 1 can be used for panel-level fan-out packages of various sizes, preferably, the size of the packaging structure 2 is 600 mm by 600 mm.

[0046] Figure 6 As shown Figure 4 The diagram shown illustrates the effective area of ​​the encapsulation structure of an electroplating fixture system according to an embodiment of this application. Figure 6 As shown, since the electroplating fixture 11 and the packaging structure 2 are in point contact, the sealing component 12 only needs to be provided around the contact point between the contact pin 112 and the packaging structure 2, instead of providing the sealing component 12 around the entire circumference of the packaging structure 2. Therefore, no ineffective area is generated due to the curved corner structure. In one embodiment, the usable area of ​​the packaging structure 2 with dimensions of 600 mm by 600 mm can reach 590 mm by 590 mm.

[0047] The advantages of the electroplating fixture, electroplating fixture assembly, and electroplating fixture system according to the embodiments of this application are: the contact area of ​​the fixture on the packaging structure is reduced, and the area occupied by the sealing assembly is also reduced. While ensuring stable power supply, the usable area of ​​the packaging structure is expanded, which helps to reduce production costs.

[0048] Although this application has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not intended to limit the application. It will be readily understood by those skilled in the art that various changes can be made and equivalent elements can be substituted within embodiments without departing from the scope of protection of this application as defined by the claims. Differences may exist between the technical representation in this application and actual equipment due to variables in the manufacturing process, etc. Other embodiments of this application may exist that are not specifically described. The specification and illustrations should be considered illustrative rather than restrictive, and modifications can be made to suit the purpose and spirit of this application, all of which are within the scope of the claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations can be rearranged, subdivided, or arranged to form equivalent methods without departing from the teachings of this application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit the application.

Claims

1. An electroplating fixture, characterized by, include: A connecting rod, the proximal end of which is connected to the main unit of the electroplating apparatus; A contact needle, the contact needle including a tip portion, the top end of the contact needle being fixedly connected to the distal end of the connecting rod in a side view direction, the tip portion being located at the bottom end of the contact needle, and the bottom side of the tip portion forming an angle with the horizontal direction, the angle ranging from 25° to 50°; The contact pin contacts the upper surface of the packaging structure.

2. The electroplating fixture according to claim 1, characterized in that, The maximum width of the contact pin is between 0.2 mm and 0.5 mm.

3. The electroplating fixture according to claim 1, characterized in that, The angle between the connecting rod and the contact needle is a right angle.

4. An electroplating fixture assembly, characterized in that, include: Electroplating fixture as described in any one of claims 1 to 3; A sealing assembly is connected to the main unit and is located at the distal end of the connecting rod. There is a gap between the sealing assembly and the electroplating fixture.

5. The electroplating fixture assembly according to claim 4, characterized in that, The electroplating fixture assembly includes multiple sets of electroplating fixtures, which are arranged around the packaging structure and respectively contact the upper surface of the packaging structure.

6. An electroplating fixture system, characterized in that, include: The electroplating fixture assembly as described in claim 5; The encapsulation structure has an electroplating fixture and a sealing assembly that are in contact with the upper surface of the encapsulation structure. The distance between the contact point of the sealing assembly with the encapsulation structure and the edge of the encapsulation structure is greater than the distance between the contact point of the tip with the encapsulation structure and the edge of the encapsulation structure.

7. The electroplating fixture system according to claim 6, characterized in that, The distance between the contact point between the tip and the packaging structure and the edge of the packaging structure is between 1 mm and 2 mm.

8. The electroplating fixture system according to claim 6, characterized in that, The distance between the side of the sealing assembly away from the edge of the encapsulation structure and the edge of the encapsulation structure is between 4.5 mm and 5.5 mm.

9. The electroplating fixture system according to claim 6, characterized in that, The packaging structure includes a substrate, a seed layer, and a dielectric layer. The seed layer is disposed on the upper surface of the substrate, the dielectric layer is disposed on the upper surface of the seed layer, the electroplating fixture is in contact with and electrically connected to the seed layer, and the sealing assembly is in contact with the dielectric layer.

10. The electroplating fixture system according to claim 9, characterized in that, The package structure measures 600 mm by 600 mm.

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