An automatic silicon core testing device
By designing an automated silicon core testing device, automated testing of silicon cores has been achieved, solving the problems of low efficiency and poor accuracy of manual testing, improving testing efficiency and accuracy, avoiding production accidents caused by unqualified silicon cores, and reducing economic losses.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 四川永祥能源科技有限公司
- Filing Date
- 2025-07-09
- Publication Date
- 2026-06-30
AI Technical Summary
In existing technologies, silicon core testing mainly relies on manual sampling, which is inefficient, has a high rate of missed detection, and suffers from large human measurement errors. This leads to unqualified silicon cores entering the production process, causing serious accidents such as furnace collapse and silicon core detachment, resulting in economic losses.
An automated silicon core inspection device was designed, including positioning, size measurement, and resistivity measurement mechanisms. Automated inspection is achieved through an infrared scanner and resistivity measurement probes combined with a drive mechanism, ensuring the accuracy and completeness of the inspection results.
This improved the efficiency and accuracy of silicon core testing, reduced the false negative rate, prevented substandard silicon cores from entering the production process, reduced accidents, and lowered economic losses.
Smart Images
Figure CN224435472U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of polycrystalline silicon technology, and in particular to an automatic silicon core testing device. Background Technology
[0002] Polycrystalline silicon rods are an important basic material for the photovoltaic and semiconductor industries. The production of silicon rods uses the Siemens process: the silicon core, which serves as a carrier, is heated by electricity. After preheating, SiHCl3 and H2 undergo a reduction reaction on the high-temperature surface of the silicon core. The resulting silicon atoms are deposited on the silicon core and gradually grow into silicon rods. The silicon rods are then broken into the corresponding sizes according to customer requirements for sale.
[0003] As the core component in silicon rod production, the quality of silicon cores directly affects the performance and yield of the final product. Silicon cores that do not meet dimensional standards will have the following consequences:
[0004] ① Uneven growth of polycrystalline silicon: Inadequate diameter, length, or taper of the silicon core can lead to defects during crystal growth;
[0005] ② Non-uniform resistivity: Substandard silicon core size can affect the resistivity distribution of polycrystalline silicon;
[0006] ③ Product quality decline: Substandard silicon core dimensions can lead to cracks, voids or other defects inside the polycrystalline silicon rod;
[0007] ④ Furnace collapse accident: If the silicon core size is not up to standard (such as too small a diameter or too large a taper), the silicon core may not be able to withstand the weight of polycrystalline silicon under high temperature environment, resulting in breakage or deformation, which in turn leads to a "furnace collapse" accident.
[0008] ⑤ Affects equipment lifespan: Production accidents caused by non-compliant dimensions will accelerate equipment wear and tear;
[0009] ⑥ Mismatch between silicon core and crossbeam: If the taper dimension of the silicon core is smaller than the acceptance standard, it will cause the silicon core to be mismatched with the crossbeam / graphite base, resulting in the silicon core falling off due to insecure positioning and causing a "furnace collapse" accident during production. During the production preparation stage, the lower cone of the silicon core is vertically connected to the graphite base at the bottom of the reduction furnace, and the upper cone of the silicon core is connected to the crossbeam.
[0010] However, the current testing of silicon cores mainly relies on manual sampling, which has problems such as low efficiency, high missed detection rate, large human measurement error, and qualified samples being used but unqualified ones. This leads to unqualified silicon cores entering the production process and even causing serious accidents such as "furnace collapse" and "silicon core detachment", resulting in huge economic losses. Utility Model Content
[0011] In response to the above situation, this utility model provides an automatic silicon core testing device, which aims to solve the technical problem that the current silicon core testing mainly relies on manual sampling, which has problems such as low efficiency, high missed detection rate, large human measurement error, and qualified samples being used but unqualified. This leads to unqualified silicon cores entering the production process, and even causing serious accidents such as "furnace collapse" and "silicon core detachment", resulting in huge economic losses.
[0012] To achieve the above objectives, this utility model provides the following technical solution:
[0013] This utility model provides an automatic silicon core testing device, comprising:
[0014] A positioning mechanism for positioning at least one silicon core;
[0015] A dimensional measuring mechanism used to measure the dimensions of silicon cores;
[0016] A resistivity measuring mechanism used to measure the resistivity distribution of silicon cores;
[0017] A drive mechanism is used to bring the resistivity measuring mechanism into contact with or separate it from the silicon core.
[0018] The silicon core is arranged horizontally or vertically and can rotate around its own axis.
[0019] In some embodiments of this utility model, the size measuring mechanism, positioning mechanism, resistivity measuring mechanism and driving mechanism are arranged sequentially from top to bottom; the silicon core is arranged laterally.
[0020] In some embodiments of this utility model, the positioning mechanism includes:
[0021] The first positioning block has at least one first positioning notch that matches the lower cone of the silicon core.
[0022] The second positioning block has at least one second positioning notch that matches the upper cone of the silicon core.
[0023] In some embodiments of this invention, the dimensional measuring mechanism includes an infrared scanner.
[0024] In some embodiments of this invention, the dimensional measuring mechanism further includes a moving component for moving the infrared scanner.
[0025] In some embodiments of this invention, the drive mechanism includes a cylinder.
[0026] In some embodiments of this utility model, the resistivity measuring mechanism includes:
[0027] Multiple resistivity measurement probes achieve resistivity measurement by contacting the silicon core;
[0028] The support is used to fix the resistivity measurement probe, and the drive mechanism is used to move the support.
[0029] In some embodiments of this invention, 6 to 8 resistivity measurement probes are arranged at intervals along the axial direction of the silicon core.
[0030] In some embodiments of this utility model, the bracket includes a first support member, a sponge pad, and a second support member connected in sequence; the first support member is used to fix the resistivity measuring probe; and the second support member is used to connect with the drive mechanism.
[0031] In some embodiments of this utility model, the bracket further includes:
[0032] The guide rod is connected at one end to the second support member and slidably connected to the base at the other end.
[0033] A spring is positioned between the bracket and the base;
[0034] The base connects to the drive mechanism.
[0035] The embodiments of this utility model have at least the following advantages or beneficial effects:
[0036] The automated silicon core testing equipment solves the technical problem that the current silicon core testing mainly relies on manual sampling, which has problems such as low efficiency, high missed detection rate, large human measurement error, and qualified samples being used but not qualified. This leads to unqualified silicon cores entering the production process and even causing serious accidents such as "furnace collapse" and "silicon core detachment", resulting in huge economic losses.
[0037] Other features and advantages of this invention will be set forth in the following description. Attached Figure Description
[0038] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0039] Figure 1 This is a schematic diagram of the structure of an automated silicon core testing equipment;
[0040] Figure 2 for Figure 1 The left view.
[0041] icon:
[0042] 1-Positioning mechanism, 11-First positioning block, 111-First positioning notch, 12-Second positioning block.
[0043] 2-Dimensional measuring mechanism, 21-Infrared scanner, 22-Moving component,
[0044] 3-Resistivity measuring mechanism, 31-Resistivity measuring probe, 321-First support member, 322-Sponge pad, 323-Second support member, 324-Guide rod, 325-Spring, 326-Base.
[0045] 4-Drive mechanism, 41-Cylinder,
[0046] 5-Silicon core. Detailed Implementation
[0047] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the present invention.
[0048] In the description of the embodiments of this utility model, it should be understood that the terms "lateral", "upper", "lower", "horizontal", "bottom", "axial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.
[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0050] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.
[0051] The embodiments of this utility model will be described in detail below.
[0052] See Figures 1-2This embodiment provides an automatic inspection device for silicon core 5, including a positioning mechanism 1, a size measuring mechanism 2, a resistivity measuring mechanism 3, and a driving mechanism 4.
[0053] The positioning mechanism 1 is used to position at least one silicon core 5, which is arranged laterally (e.g., horizontally) or vertically (e.g., vertically) and is capable of rotating about its own axis.
[0054] The size measuring mechanism 2 is used to measure the size of the silicon core 5.
[0055] The resistivity measuring mechanism 3 is used to measure the resistivity distribution of the silicon core 5.
[0056] The drive mechanism 4 is used to make the resistivity measuring mechanism 3 contact or separate from the silicon core 5.
[0057] In this embodiment, the size measuring mechanism 2, positioning mechanism 1, resistivity measuring mechanism 3, and driving mechanism 4 are arranged sequentially from top to bottom, with the silicon core 5 arranged laterally. In use, the silicon core 5 is first positioned by the positioning mechanism 1, then the size of the silicon core 5 is measured by the size measuring mechanism 2, and the resistivity distribution of the silicon core 5 is measured by the driving mechanism 4 and the resistivity measuring mechanism 3. That is, by detecting the external dimensions and the uniformity of the resistivity distribution of the silicon core 5, it is determined whether the silicon core 5 is qualified. Since a silicon core 5 with unqualified dimensions will result in an uneven resistivity distribution, the results of detecting the external dimensions of the silicon core 5 and the results of detecting the uniformity of the resistivity distribution can corroborate each other to ensure the accuracy of the detection results.
[0058] As can be seen from the foregoing, the aforementioned automatic silicon core 5 testing equipment solves the technical problem that the current silicon core 5 testing mainly relies on manual sampling, which has problems such as low efficiency, high missed detection rate, large human measurement error, and qualified samples being used but unqualified. This leads to unqualified silicon core 5 entering the production process, and even causing serious accidents such as "furnace collapse" and "silicon core 5 falling off", resulting in huge economic losses.
[0059] It should be noted that the measurement of the silicon core 5's dimensions by the size measuring mechanism 2 and the measurement of the resistivity distribution of the silicon core 5 by the driving mechanism 4 and the resistivity measuring mechanism 3 are not sequential. Furthermore, the silicon core 5 can be rotated synchronously during the testing process to improve the accuracy of the dimensional measurement of the silicon core 5 and increase the number of circumferential resistivity measurement points. This embodiment does not limit the method of rotating the silicon core 5 around its own axis (e.g., clamping one end of the silicon core 5 with an external device before rotating it).
[0060] The positioning mechanism 1 includes a first positioning block 11 and a second positioning block 12 arranged in parallel. The first positioning block 11 has at least one first positioning notch 111 that matches the lower cone of the silicon core 5. The second positioning block 12 has at least one second positioning notch that matches the upper cone of the silicon core 5. By placing the upper cone of the silicon core 5 in the first positioning notch 111 and the lower cone of the silicon core 5 in the second positioning notch, the silicon core 5 can be supported and positioned.
[0061] The dimensional measuring mechanism 2 includes an infrared scanner 21 and a moving component 22, which moves the infrared scanner 21 to expand the scanning range. The moving component 22 may include, for example, a conventional slider / conveyor belt. The infrared scanner 21 scans the contour of the silicon core 5 to obtain its dimensions. The moving component 22 expands the scanning range by moving the infrared scanner 21, adapting to scenarios with multiple silicon cores 5 to be inspected.
[0062] The resistivity measuring mechanism 3 includes a resistivity measuring probe 31 and a support.
[0063] The resistivity measurement probe 31 achieves resistivity measurement by contacting the silicon core 5.
[0064] The bracket is used to fix the resistivity measuring probe 31, and the drive mechanism 4 is used to move the bracket.
[0065] The resistivity measuring probe 31 can be brought into contact with or separated from the silicon core 5 by moving the support through the drive mechanism 4; when the resistivity measuring probe 31 is in contact with the silicon core 5, the resistivity can be measured.
[0066] In a specific implementation scenario, the positioning mechanism 1 has five silicon cores 5, and each silicon core 5 has 6-8 resistivity measuring probes 31 positioned below it. These 6-8 resistivity measuring probes 31 are arranged at intervals along the axial direction of the silicon core 5, that is, 6-8 points are measured in the axial direction of the silicon core 5 (6 is preferred for cost considerations). During the rotation of the silicon core 5 around its own axis, 10 points are measured in the circumferential direction of the silicon core 5. In this way, the uniformity of the resistivity distribution of the silicon core 5 can be detected more accurately.
[0067] The support includes a first support member 321, a sponge pad 322, and a second support member 323 connected in sequence. The first support member 321 is used to fix the resistivity measuring probe 31; the second support member 323 is used to connect with the drive mechanism 4; the sponge pad 322 serves two purposes: firstly, it buffers the contact between the resistivity measuring probe 31 and the silicon core 5, preventing the resistivity measuring probe 31 from being damaged by impact (the resistivity measuring probe 31 is relatively thin); secondly, it ensures that each resistivity measuring probe 31 is in contact with the silicon core 5 (the diameter of the silicon core 5 is different along the axial direction).
[0068] The bracket also includes a guide rod 324, a spring 325, and a base 326.
[0069] One end of the guide rod 324 is connected to the second support member 323, and the other end is slidably connected to the base 326.
[0070] Spring 325 is disposed between bracket and base 326, and spring 325 is sleeved on guide rod 324.
[0071] The base 326 is connected to the drive mechanism 4, and the base 326 can move the entire support.
[0072] The drive mechanism 4 includes a cylinder 41, the movable end of which is connected to the base 326.
[0073] When cylinder 41 actuates, it moves the bracket closer to or away from silicon core 5, thereby causing resistivity measuring probe 31 to contact or separate from silicon core 5. Spring 325 cooperates with sponge pad 322 to further protect resistivity measuring probe 31 and ensure contact between resistivity measuring probe 31 and silicon core 5. The guide rod 324 effectively guides the movement of resistivity measuring probe 31.
[0074] Finally, it should be noted that the above are merely preferred embodiments of this application and are not intended to limit this application. For those skilled in the art, this application can have various modifications and variations. Without conflict, the embodiments and features described in the embodiments of this application can be arbitrarily combined with each other. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A silicon core automatic detection apparatus characterized by comprising: include: A positioning mechanism for positioning at least one silicon core; A dimensional measuring mechanism used to measure the dimensions of silicon cores; A resistivity measuring mechanism used to measure the resistivity distribution of silicon cores; A drive mechanism for contacting or separating the resistivity measuring mechanism from the silicon core; The size measuring mechanism and the resistivity measuring mechanism are located on opposite sides of the positioning mechanism; the silicon core is arranged horizontally or vertically and can rotate around its own axis.
2. The silicon core automatic detection apparatus according to claim 1, wherein The size measuring mechanism, positioning mechanism, resistivity measuring mechanism, and driving mechanism are arranged sequentially from top to bottom; the silicon core is arranged laterally.
3. The automatic silicon core testing equipment according to claim 1, characterized in that, The positioning mechanism includes: The first positioning block has at least one first positioning notch that matches the lower cone of the silicon core. The second positioning block has at least one second positioning notch that matches the upper cone of the silicon core.
4. The automatic silicon core testing equipment according to claim 1, characterized in that, The dimensional measuring mechanism includes an infrared scanner.
5. The automatic silicon core testing equipment according to claim 4, characterized in that, The dimensional measuring mechanism also includes a moving component for moving the infrared scanner.
6. The automatic silicon core testing equipment according to claim 1, characterized in that, The drive mechanism includes a cylinder.
7. The automatic silicon core testing equipment according to any one of claims 1 to 6, characterized in that, The resistivity measuring mechanism includes: Multiple resistivity measurement probes achieve resistivity measurement by contacting the silicon core; A bracket is used to fix the resistivity measuring probe, and a drive mechanism is used to move the bracket.
8. The automatic silicon core testing equipment according to claim 7, characterized in that, Six to eight resistivity measurement probes are arranged at intervals along the axial direction of the silicon core.
9. The automatic silicon core testing equipment according to claim 7, characterized in that, The bracket includes a first support member, a sponge pad, and a second support member connected in sequence; the first support member is used to fix the resistivity measurement probe; the second support member is used to connect to the drive mechanism.
10. The automatic silicon core testing equipment according to claim 9, characterized in that, The support also includes: The guide rod is connected at one end to the second support member and slidably connected to the base at the other end. A spring is disposed between the bracket and the base; The base is connected to the drive mechanism.