Butt splice for superconducting tapes and methods of producing the same
The diagonal butt splice with copper laps addresses the mechanical and electrical challenges of joining HTS tapes by maintaining stability and reducing resistance, allowing for longer continuous lengths of HTS tapes.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- VEIR INC
- Filing Date
- 2025-12-10
- Publication Date
- 2026-06-18
AI Technical Summary
Existing methods for joining high-temperature superconducting (HTS) tapes, such as soldering and ultrasonic welding, are unsuitable for applications involving mechanical stresses, leading to potential damage and degradation of the superconducting portion, especially when tapes are wound under tension around a former.
A diagonal butt splice technique using copper laps is employed, where diagonal cuts on the ends of HTS tapes are aligned and soldered with copper laps to cover the junction, enhancing mechanical stability and reducing electrical resistance.
The diagonal butt splice maintains mechanical integrity and superconducting properties under high tension and tight bending radii, reducing power losses and local degradation, enabling longer continuous lengths of HTS tapes.
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