Butt splice for superconducting tapes and methods of producing the same

The diagonal butt splice with copper laps addresses the mechanical and electrical challenges of joining HTS tapes by maintaining stability and reducing resistance, allowing for longer continuous lengths of HTS tapes.

WO2026126126A1 Publication Date: 2026-06-18VEIR INC

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
VEIR INC
Filing Date
2025-12-10
Publication Date
2026-06-18

AI Technical Summary

Technical Problem

Existing methods for joining high-temperature superconducting (HTS) tapes, such as soldering and ultrasonic welding, are unsuitable for applications involving mechanical stresses, leading to potential damage and degradation of the superconducting portion, especially when tapes are wound under tension around a former.

Method used

A diagonal butt splice technique using copper laps is employed, where diagonal cuts on the ends of HTS tapes are aligned and soldered with copper laps to cover the junction, enhancing mechanical stability and reducing electrical resistance.

🎯Benefits of technology

The diagonal butt splice maintains mechanical integrity and superconducting properties under high tension and tight bending radii, reducing power losses and local degradation, enabling longer continuous lengths of HTS tapes.

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Abstract

According to an embodiment, an apparatus includes a first HTS tape and a second HTS tape, each having at least one axial end with a diagonal cut. The diagonal cut of the axial end of the first HTS tape is abutting the diagonal cut of the axial end of the second HTS tape at a junction. A first copper lap is disposed on a first outside surface of the first HTS tape and a first outside surface of the second HTS tape, covering the junction. A second copper lap is disposed on a second outside surface of the first HTS tape and a second outside surface of the second HTS tape, opposite to the first outside surface, also covering the junction.
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