A room temperature semiconductor resistive gas sensor

Abstract

This invention relates to a room-temperature semiconductor resistive gas sensor, comprising a main body, an upper space, and a lower space. The upper space is divided into a first chamber and a second chamber by a second baffle. The first chamber houses a development board, an ammeter, and a temperature and humidity sensor. The second chamber contains a gas integrated chip, and a sealing ring is fixed around the inner bottom of the second chamber. The lower space houses a power supply. The integrated chip contains multiple sensing chips. This invention integrates multiple specific sensing chips into a gas sensor. Each chip can specifically and accurately identify a specific toxic gas, and the multiple pathways formed by the multiple chips can obtain the concentrations of various toxic gases in the environment. Furthermore, embedding the sealing ring and a hydrophobic and breathable membrane inside the chamber containing the gas sensing chips reduces the impact of humidity on the accuracy of gas detection by the sensor.

Description

Technical Field

[0001] This utility model relates to the field of gas detection technology, and in particular to a room temperature semiconductor resistive gas sensor. Background Technology

[0002] A sensor is essentially an information conversion device that can sense the measured information and transform it into signals that can be understood by humans or other systems according to certain rules. A gas sensor is a device that converts information such as the composition and concentration of a gas into information that can be used by personnel, instruments, computers, etc.

[0003] Most gas sensors on the market are used for detecting only one type of gas, making it difficult to accurately identify multiple hazardous gases in the environment and provide their concentrations. In addition, room temperature gas sensing materials are greatly affected by ambient humidity, which can lead to misjudgments.

[0004] Therefore, it is urgent to solve the aforementioned problems. Utility Model Content

[0005] To overcome at least one of the defects described in the prior art, according to one aspect of the present invention, a room temperature semiconductor resistive gas sensor is provided, comprising a main body, the main body including a shell, the shell including an upper shell and a lower shell, the upper shell and the lower shell being separated by a first baffle, the upper surface of the upper shell having a first opening in the middle, a vent hole provided at the upper right corner of the upper surface of the upper shell, a second opening on the lower side of the upper surface of the upper shell, a plate having a vent hole and a composite sensitive material layer at the second opening, and a hydrophobic and breathable membrane coated on the inner surface of the plate having the vent hole and the composite sensitive material layer;

[0006] The main body includes an upper space and a lower space. The upper space is divided into a first chamber and a second chamber by a second baffle. The first chamber contains a development board, an ammeter, and a temperature and humidity sensor. The second chamber contains a gas integrated chip, and a sealing ring is fixed around the bottom inner side of the second chamber. The lower space is used to house a power supply. The integrated chip contains multiple sensor chips.

[0007] In one embodiment of this application, the outer shell is a rounded cuboid structure.

[0008] In one embodiment of this application, the lower outer shell and the first baffle are integrally formed, the upper outer shell and the second baffle are integrally formed, and the upper outer shell and the first baffle are detachably connected.

[0009] In one embodiment of this application, the upper outer shell and the first baffle are fixed and detachably connected by bolts and nuts or adhesive.

[0010] In one embodiment of this application, the integrated chip includes a sensor chip, an array substrate, metal clips, and a line interface. The sensor chip is fixed by two adjacent metal clips fixed on the array substrate, and each metal clip is connected to a line interface.

[0011] In one embodiment of this application, the serial port of the development board is connected to an ammeter and a temperature and humidity sensor. The ammeter is connected in series with the power supply and the line interface of the integrated chip through an external circuit. Each series circuit constitutes a gas response signal channel.

[0012] In one embodiment of this application, the first opening is adapted to the size of the development board's screen.

[0013] In one embodiment of this application, a vent is provided at the upper right corner of the upper surface of the upper outer shell.

[0014] In summary, the room temperature semiconductor resistive gas sensor provided by this utility model has the following technical effects:

[0015] I. This room temperature semiconductor resistive gas sensor significantly improves gas diffusion efficiency, selectivity, sensitivity, protection functions, and environmental adaptability by adding a composite sensitive layer and a breathable plate to the upper shell, thereby better meeting the multi-gas detection needs in complex environments.

[0016] II. This room temperature semiconductor resistive gas sensor achieves the effect of accurately identifying a variety of toxic gases and providing their concentration by using multiple specific sensing chips to construct an integrated chip.

[0017] Third, this room temperature semiconductor resistive gas sensor achieves the effect of completely isolating the external moisture of the second chamber by coating the inner surface of the composite sensitive layer breathable plate with a hydrophobic and breathable membrane and fixing a sealing ring around the inner side of the bottom of the second chamber, thereby improving the sensor's humidity resistance performance.

[0018] Fourth, this room-temperature semiconductor resistive gas sensor, through optimized sensor design and materials, enables it to operate at room temperature without the need for additional heating elements, achieving low-energy operation and improving system sustainability. Attached Figure Description

[0019] Figure 1 This is a front view of the structure of this utility model;

[0020] Figure 2 This is a front sectional view of the outer shell of the present invention.

[0021] Figure 3 This is a side sectional view of the outer shell of the present invention;

[0022] Figure 4 This is a diagram showing the internal connections of the structure of this utility model.

[0023] Figure 1: Main body; 2: Outer shell; 3: First opening; 4: Ventilation hole; 5: Plate with vents and composite sensitive material layer; 6: Hydrophobic and breathable membrane; 7: Upper space; 8: Lower space; 9: Upper outer shell; 10: Lower outer shell; 11: First baffle; 12: Sealing ring; 13: Second baffle; 14: First chamber; 15: Second chamber; 16: Development board; 17: Ammeter; 18: Temperature and humidity sensor; 19: Integrated chip; 20: Power supply; 21: Sensor chip; 22: Array substrate; 23: Metal clip; 24: Line interface; 25: Serial port; 26: External circuit; 27: Screen. Detailed Implementation

[0024] To better understand and implement this invention, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.

[0025] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0027] Please see Figures 1-4 This utility model discloses a room-temperature semiconductor resistive gas sensor, specifically a gas sensor that uses semiconductor technology to excite resistive gas detection within the device at room temperature, belonging to the field of gas detection technology. This sensor, through innovative design, overcomes the shortcomings of traditional gas sensors in terms of energy consumption, multi-gas detection, and environmental adaptability.

[0028] In some embodiments, the room temperature semiconductor resistive gas sensor includes a body 1, the body 1 includes a housing 2, the housing 2 includes an upper housing 9 and a lower housing 10, the upper housing 9 and the lower housing 10 are separated by a first baffle 11, the upper surface of the upper housing 9 has a first opening 3 in the middle, the upper right corner of the upper surface of the upper housing 9 is provided with a venting hole 4, the lower side of the upper surface of the upper housing 9 has a second opening, the second opening has a venting hole and a plate 5 with a composite sensitive material layer, and the inner surface of the plate 5 with the venting hole and the composite sensitive material layer is coated with a hydrophobic and breathable membrane 6.

[0029] The main body 1 includes an upper space 7 and a lower space 8. The upper space 7 is divided into a first chamber 14 and a second chamber 15 by a second baffle 13. The first chamber 14 houses a development board 16, an ammeter 17, and a temperature and humidity sensor 18. The second chamber 15 houses a gas integrated chip 19, and a sealing ring 12 is fixed around the inner bottom of the second chamber 15. The lower space 8 houses a power supply 20. The integrated chip 19 contains multiple sensor chips 21. It should be noted that gas passes through the second opening of the main body 1 to the plate 5, which has vent holes and a composite sensitive material layer, and is then sensed by the sensor chips 21 in the gas integrated chip 19. It should also be noted that the number of sensor chips 21 that can be fixed to the integrated chip 19 is not limited, to meet the requirements for the identification and detection of various gases.

[0030] Since most gas sensors on the market are currently used for detecting only one gas, it is difficult to accurately identify and provide the concentration of multiple hazardous gases in the environment. By connecting multiple specialized sensing chips 21 to the gas sensor, each chip can specifically and accurately identify one toxic gas. The multiple channels formed by multiple chips can obtain the concentration of multiple toxic gases in the environment. In addition, room temperature gas sensing materials are greatly affected by ambient humidity. By embedding the sealing ring 12 and the hydrophobic and breathable membrane 6 inside the chamber where the gas sensing chip 21 is located, the impact of humidity on the accuracy of gas detection by the sensor can be reduced, which helps to improve the sensor's resistance to humidity and reduce the probability of false detection.

[0031] Furthermore, during use, the gas passes through the plate 5 with vents and a composite sensitive material layer and is sensed by the sensor chip 21 in the gas integrated chip 19, enabling real-time monitoring and compensation of the ambient temperature. Multiple specific sensor chips 21 are integrated to form a sensor with multiple channels. The response-concentration gradient fitting equation for each specific chip is edited into the development board 16, allowing for the identification and concentration output of various toxic gases. Simultaneously, a temperature and humidity sensor 18 is connected to the development board 16, displaying the ambient temperature and humidity values ​​on the screen 27. The use of a hydrophobic and breathable membrane 6 and a sealing ring 12 within the second chamber 15 effectively prevents the influence of ambient moisture on the sensor chip 21, improving the sensor's humidity resistance.

[0032] In summary, this sensor, by integrating multiple specialized sensing chips 21, achieves accurate identification and concentration detection of various toxic gases. The addition of the composite sensitive layer breathable plate significantly improves gas diffusion efficiency and selectivity, while also enhancing the sensor's sensitivity and environmental adaptability. The use of the hydrophobic breathable membrane 6 and the sealing ring 12 effectively reduces the impact of humidity on sensor detection accuracy and enhances humidity resistance. Furthermore, this sensor can operate at room temperature without additional heating elements, achieving low-energy operation and improving system sustainability. Overall, this invention provides a highly efficient, accurate, low-energy-consumption, and environmentally adaptable gas sensor suitable for gas detection needs in various complex environments.

[0033] In some embodiments, the second opening is rectangular. Alternatively, in other embodiments, it may be circular, square, or oval, etc., and may be adjusted according to the actual situation.

[0034] In some embodiments, the outer shell 2 is a rounded cuboid structure. Alternatively, in other embodiments, it may be a rounded cube structure, a hexagonal prism structure, etc., and can be adjusted according to the actual situation.

[0035] In some embodiments, a vent 4 is provided at the upper right corner of the upper surface of the upper housing 9. The vent 4, located at the upper right corner of the upper housing 9, promotes gas flow after gas enters the main body 1. It provides a discharge channel for the gas, allowing the detected gas to be promptly discharged from the main body 1 after being sensed by the sensor chip 21 in the gas integrated chip 19. This prevents gas accumulation inside the sensor, accelerates gas turnover, and thus improves the sensor's response speed and detection efficiency for different gases.

[0036] In some embodiments, the lower outer shell 10 and the first baffle 11 are integrally formed, and the upper outer shell 9 and the second baffle 13 are integrally formed, with the upper outer shell 9 and the first baffle 11 being detachably connected. This configuration can significantly enhance the structural stability of the main body 1.

[0037] In some embodiments, the upper outer shell 9 and the first baffle 11 are fixed and detachably connected by bolts, nuts or adhesives.

[0038] In some embodiments, the integrated chip 19 includes a sensor chip 21, an array substrate 22, metal clips 23, and a line interface 24. The sensor chip 21 is fixed by two adjacent metal clips 23 fixed on the array substrate 22, and each metal clip 23 is connected to a line interface 24. It should be noted that the sensor chip 21 is in an independent state in the integrated chip 19, and the number of sensor chips 21 that can be fixed in the integrated chip 19 is not limited, so as to meet the identification and detection of various gases.

[0039] Furthermore, the sensor chip 21 is specifically a semiconductor resistive sensor chip 21, which has advantages such as high sensitivity, small size, good dynamic response, strong temperature compensation capability, wide measurement range, and low cost. The greatest advantage of using the semiconductor resistive sensor chip 21 lies in its high sensitivity, fast dynamic response, small size, and ease of integration. This sensor chip 21 can quickly and accurately detect minute changes in physical quantities, making it outstanding in applications requiring rapid detection and high-precision measurement. It is very suitable for modern electronic devices and systems, and can be easily embedded into various complex application environments to achieve intelligent and miniaturized detection functions.

[0040] In some embodiments, the serial port 25 of the development board 16 is connected to the ammeter 17 and the temperature and humidity sensor 18. The ammeter 17 is connected in series with the power supply 20 and the line interface 24 of the integrated chip 19 through an external circuit 26. Each series circuit constitutes a gas response signal channel. It should be noted that the temperature and humidity sensor 18 is a widely used device in environmental monitoring, capable of accurately measuring and converting temperature and humidity data in the environment; for example, the DHT11 temperature and humidity sensor. It should also be noted that the number of ammeters 17 and external circuits 26 is not limited and can be adjusted according to actual conditions.

[0041] In some embodiments, the first opening 3 is adapted to the size of the screen 27 of the development board 16 to facilitate the display of gas-related signals.

[0042] In some embodiments, the second chamber 15 is a completely sealed structure that allows gas to pass through but not moisture, thereby reducing the interference of moisture on the sensing chip 21 and further improving the sensor's resistance to humidity.

[0043] In summary, to address the shortcomings of existing technologies, this utility model provides a room-temperature semiconductor resistive gas sensor:

[0044] (1) By integrating a temperature sensor and a temperature compensation algorithm, this utility model can monitor the ambient temperature in real time and perform compensation, thereby improving the accuracy and stability of the measurement;

[0045] (2) High-performance semiconductor sensitive materials were used to optimize the structural design of the sensor, improve the detection sensitivity to low concentration gases, and reduce the detection limit.

[0046] (3) By connecting multiple specific chips to the sensor, multiple gases can be accurately identified and the concentration of each gas can be given;

[0047] (4) The sealing ring 12 and the hydrophobic and breathable membrane 6 are implanted into the second part of the chamber 15 where the integrated chip 19 is located to reduce the impact of humidity on the sensor;

[0048] (5) Each channel is equipped with a different sensitive material, which can detect multiple gases simultaneously, improving the applicability of the sensor in complex environments. It should be noted that the different sensitive materials can be graphene, MXenes and their composites, conductive metal oxides, etc., such as tin oxide, indium oxide, zinc oxide, etc.

[0049] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A room-temperature semiconductor resistive gas sensor, characterized in that, The main body (1) includes a shell (2), which includes an upper shell (9) and a lower shell (10). The upper shell (9) and the lower shell (10) are separated by a first baffle (11). The upper shell (9) has a first opening (3) in the middle of its upper surface. The upper shell (9) has a ventilation hole (4) at the upper right corner of its upper surface. The upper shell (9) has a second opening on its lower side. The second opening has a plate (5) with a vent and a composite sensitive material layer. The inner surface of the plate (5) with the vent and the composite sensitive material layer is coated with a hydrophobic and breathable membrane (6). The main body (1) includes an upper space (7) and a lower space (8). The upper space (7) is divided into a first chamber (14) and a second chamber (15) by a second baffle (13). The first chamber (14) contains a development board (16), an ammeter (17) and a temperature and humidity sensor (18). The second chamber (15) contains a gas integrated chip (19) and a sealing ring (12) is fixed around the bottom inner side of the second chamber. The lower space (8) is used to place a power supply (20). The integrated chip (19) contains multiple sensor chips (21).

2. The room temperature semiconductor resistive gas sensor according to claim 1, characterized in that, The outer shell (2) is a rounded cuboid structure.

3. The room temperature semiconductor resistive gas sensor according to claim 1, characterized in that, The lower outer shell (10) and the first baffle (11) are integrally formed, the upper outer shell (9) and the second baffle (13) are integrally formed, and the upper outer shell (9) and the first baffle (11) are detachably connected.

4. A room temperature semiconductor resistive gas sensor according to claim 3, characterized in that, The upper outer shell (9) and the first baffle (11) are fixed and detachably connected by bolts and nuts or adhesive.

5. A room-temperature semiconductor resistive gas sensor according to claim 1, characterized in that, The integrated chip (19) includes a sensor chip (21), an array substrate (22), metal clips (23) and a line interface (24). The sensor chip (21) is fixed by two adjacent metal clips (23) fixed on the array substrate (22), and each metal clip (23) is connected to a line interface (24).

6. A room-temperature semiconductor resistive gas sensor according to claim 1, characterized in that, The serial port (25) of the development board (16) is connected to the ammeter (17) and the temperature and humidity sensor (18). The ammeter (17) is connected in series with the power supply (20) and the line interface (24) of the integrated chip (19) through the external circuit (26). Each series circuit constitutes a gas response signal channel.

7. A room-temperature semiconductor resistive gas sensor according to claim 1, characterized in that, The first opening (3) is adapted to the size of the screen (27) of the development board.

8. A room-temperature semiconductor resistive gas sensor according to claim 1, characterized in that, An air vent (4) is provided at the upper right corner of the upper surface of the upper outer shell (9).

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