Air blowing temperature control device

Abstract

This application relates to a blowing temperature control device. The blowing temperature control device includes a substrate, a test seat, an air inlet, and a heat insulation cover. The test seat is disposed on the substrate, and an airflow channel is formed inside the test seat. The air inlet is disposed on the substrate, and an air inlet channel is provided inside the air inlet, which communicates with the airflow channel to deliver temperature-controlled airflow into the airflow channel. The heat insulation cover is disposed on the outside of the test seat, forming a heat-insulating chamber to accommodate the test seat. The heat-insulating chamber communicates with the airflow channel, so that at least a portion of the temperature-controlled airflow flowing out of the airflow channel flows into the heat-insulating chamber, thereby keeping the test seat in a heat-insulating environment. The blowing temperature control device provided by this application can improve the heat utilization rate of the temperature-controlled airflow and improve temperature control performance.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a blowing temperature control device. Background Technology

[0002] In the field of semiconductor testing, semiconductor testing equipment often employs air-blowing temperature control devices to control the temperature of chips at different temperatures, thereby testing the chip's performance under varying conditions. One existing air-blowing temperature control device blows temperature-controlled airflow into the test socket through channels within an air-blowing block. The airflow then flows through the test probes within the test socket, preheating them. Heat transfer through the contact between the test probes and the chip results in more uniform temperature control of the chip. The airflow after passing through the test probes flows into channels within the air-blowing block and is then discharged into the equipment's cavity.

[0003] However, with this existing technology, on the one hand, the airflow is only briefly passed through the inside of the test socket before being discharged, so the heat of the airflow is not fully utilized, resulting in energy waste; on the other hand, since the test socket is directly exposed to the cavity environment of the equipment, the heat of the test socket will be quickly dissipated into the cavity environment, causing the temperature control of the test socket to fail to reach the target temperature, and the fluctuation of the cavity environment temperature will also affect the stability of the test socket temperature.

[0004] Therefore, it is necessary to propose a new technical solution to overcome the shortcomings of existing technologies. Utility Model Content

[0005] Based on this, this application provides an air blowing temperature control device that can improve the heat utilization rate of the temperature-controlled airflow and enhance the temperature control performance.

[0006] Therefore, this application adopts the following technical solution: a blowing temperature control device, comprising:

[0007] substrate;

[0008] A test stand is disposed on the substrate, and an airflow channel is provided inside the test stand;

[0009] An air intake component is disposed on the substrate, and an air intake channel is provided within the air intake component. The air intake channel communicates with the airflow channel to deliver a temperature-controlled airflow into the airflow channel; and

[0010] A heat insulation cover is installed on the outside of the test base, and the heat insulation cover forms a heat insulation chamber to accommodate the test base;

[0011] The heat-insulating chamber is connected to the airflow channel, so that at least part of the temperature-controlled airflow flowing out of the airflow channel flows into the heat-insulating chamber, thereby keeping the test seat in a heat-insulating environment.

[0012] In some embodiments, the air blowing temperature control device includes an air outlet component, which has an air outlet channel communicating with the airflow channel, and the airflow channel is connected to the heat preservation chamber through the air outlet channel.

[0013] In some embodiments, the air outlet channel has a first exhaust port and a second exhaust port, the first exhaust port being connected to the outside of the air blowing temperature control device, and the second exhaust port being connected to the heat preservation chamber.

[0014] In some embodiments, the first exhaust port and the second exhaust port are coaxially arranged in the vertical direction.

[0015] In some embodiments, the air blowing temperature control device includes at least two test seats, and the heat insulation cover is simultaneously placed over the outside of at least two test seats.

[0016] In some embodiments, the air intake includes an air blowing block and an air distribution block, and the air intake channel includes an air distribution channel disposed within the air distribution block, the air distribution channel distributing the temperature-controlled airflow to the at least two test seats.

[0017] In some embodiments, the air blowing temperature control device includes an air outlet component, which has an air outlet channel. The air outlet channel includes branch paths that are connected one-to-one with the airflow channels in at least two test seats, and a merging path that is connected to multiple branch paths simultaneously.

[0018] In some embodiments, the air outlet passage is connected to the insulation chamber at the confluence path.

[0019] In some embodiments, the top surface of the substrate is provided with a mounting groove, the air inlet and air outlet are installed in the mounting groove, the test seat is installed on the bottom surface of the substrate, and the heat insulation cover is installed on the bottom surface of the substrate to jointly enclose the heat insulation chamber with the substrate.

[0020] In some embodiments, the test fixture includes a plurality of test probes, the test probes being partially exposed within the airflow channel.

[0021] The air-blowing temperature control device provided in this application is equipped with a heat-insulating cover covering the outside of the test seat. The heat-insulating cover forms a heat-insulating chamber that accommodates the test seat. The heat-insulating chamber is connected to the airflow channel inside the test seat. At least part of the temperature-controlled airflow flowing out of the airflow channel flows into the heat-insulating chamber so that the test seat is in a heat-insulating environment. This arrangement, on the one hand, keeps the test seat in a heat-insulating environment, and the heat of the test seat will not be lost quickly, which can improve the temperature stability of the test seat and improve the temperature control performance. On the other hand, the heat of the airflow is reused, reducing energy waste. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a perspective view of an embodiment of the air blowing temperature control device of this application.

[0024] Figure 2 This is a perspective view of another embodiment of the air blowing temperature control device of this application.

[0025] Figure 3 This is an exploded perspective view of an embodiment of the air blowing temperature control device of this application.

[0026] Figure 4 This is a three-dimensional exploded view of another embodiment of the air blowing temperature control device of this application.

[0027] Figure 5 This is a cross-sectional view along a plane parallel to the substrate of one embodiment of the air blowing temperature control device of this application.

[0028] Figure 6 For along Figure 1 A cross-sectional view along line AA in the middle.

[0029] Figure 7 For along Figure 1 A cross-sectional view along the BB line.

[0030] The components are labeled as follows: 100, air blowing temperature control device; 1, base plate; 11, mounting groove; 12, test groove; 2, air inlet; 20, air inlet channel; 202, air distribution channel; 21, air blowing block; 22, air distribution block; 3, air outlet; 30, air outlet channel; 301, branch path; 302, confluence path; 303, first exhaust port; 304, second exhaust port; 4, test base; 40, airflow channel; 41, test probe; 5, heat insulation cover; 50, heat insulation chamber. Detailed Implementation

[0031] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0036] The air-blowing temperature control device provided in this application is mainly used in the field of semiconductor testing technology, aiming to solve the problems of insufficient heat utilization of the temperature-controlled airflow and rapid heat loss and poor temperature stability of the test fixture in the prior art. The air-blowing temperature control device of this application will be described in detail below with reference to the accompanying drawings.

[0037] Please see Figures 1 to 7As shown, this application provides a blowing temperature control device 100, which includes a substrate 1, an air inlet 2, a test seat 4, and a heat insulation cover 5. The test seat 4 is disposed on the substrate 1, and an airflow channel 40 is formed inside the test seat 4. The air inlet 2 is disposed on the substrate 1, and an air inlet channel 20 is provided inside the air inlet 2. The air inlet channel 20 communicates with the airflow channel 40 to deliver temperature-controlled airflow into the airflow channel 40. The heat insulation cover 5 is disposed on the outside of the test seat 4, and the heat insulation cover 5 forms a heat insulation chamber 50 for accommodating the test seat 4. The heat insulation chamber 50 communicates with the airflow channel 40 so that at least a portion of the temperature-controlled airflow flowing out of the airflow channel 40 flows into the heat insulation chamber 50 to keep the test seat 4 in a heat-insulating environment.

[0038] The air-blowing temperature control device 100 provided in this application is provided with a heat insulation cover 5 covering the outside of the test seat 4. The heat insulation cover 5 forms a heat insulation chamber 50 that accommodates the test seat 4. The heat insulation chamber 50 is connected to the airflow channel 40 inside the test seat 4. At least part of the temperature-controlled airflow flowing out of the airflow channel 40 flows into the heat insulation chamber 50 so that the test seat 4 is in a heat-insulating environment. With this arrangement, on the one hand, the test seat 4 is in a heat-insulating environment, and the heat of the test seat 4 will not be lost quickly, which can improve the temperature stability of the test seat 4 and improve the temperature control performance. On the other hand, the heat of the temperature-controlled airflow flowing out of the airflow channel 40 is reused, reducing energy waste.

[0039] Please see Figures 1 to 4 As shown, the air blowing temperature control device 100 in one embodiment of this application includes a base plate 1, an air inlet 2, an air outlet 3, a test base 4, and a heat insulation cover 5.

[0040] The base plate 1 serves as the fundamental support component of the entire device, providing a mounting foundation for components such as the air inlet 2, air outlet 3, test seat 4, and insulation cover 5. Therefore, the base plate 1 is provided with structures such as mounting groove 11 and test groove 12. In this embodiment, the top surface of the base plate 1 has a mounting groove 11, within which the air inlet 2 and air outlet 3 are installed. The test seat 4 and insulation cover 5 are installed on the bottom surface of the base plate 1, and the insulation cover 5 and the base plate 1 together enclose the insulation chamber 50. The base plate 1 is the supporting component of the entire air blowing temperature control device 100. The mounting groove 11 on its top surface allows the air inlet 2 and air outlet 3 to be securely fixed to the base plate 1, ensuring smooth airflow. A test slot 12 is provided on the substrate 1, penetrating both the top and bottom surfaces. A test socket 4 is located below the test slot 12. During testing, the chip is inserted into the test slot 12 from above the substrate 1 and makes electrical contact with the test socket 4, allowing the test socket 4 to test the chip. In this embodiment, two test sockets 4 are provided on one substrate 1; in other embodiments, three, four, or more test sockets may be provided on one substrate 1 to enable testing of multiple chips at once, thereby improving testing efficiency.

[0041] Please see Figure 1 , Figure 3 and Figure 5 As shown, the air intake component 2 is disposed in the mounting groove 11 on the top surface of the substrate 1. An air intake channel 20 is provided inside the air intake component 2, which communicates with the airflow channel 40 to deliver temperature-controlled airflow into the airflow channel 40. In this embodiment, the air intake component 2 includes an air blowing block 21 and an air distribution block 22. The air intake channel 20 includes an air distribution channel 202 disposed within the air distribution block 22, which distributes the temperature-controlled airflow to at least two test seats 4. The function of the air intake component 2 is to introduce the temperature-controlled airflow into the airflow channel 40 of the test seat 4, and the air intake channel 20 disposed inside it communicates with the airflow channel 40. When the air blowing temperature control device 100 includes at least two test seats 4, the air intake component 2 includes an air blowing block 21 and an air distribution block 22, and the air intake channel 20 includes the air distribution channel 202 disposed within the air distribution block 22. The air distribution channel 202 can evenly distribute the temperature-controlled airflow into the airflow channels 40 of each test seat 4, ensuring that each test seat 4 can obtain sufficient temperature-controlled airflow, thereby achieving synchronous temperature control of multiple test seats 4. In this embodiment, the air blowing block 21 and the air distribution block 22 are separate components, and the two are connected by a sealed connection to achieve leak-free delivery of the temperature-controlled airflow; in other embodiments, the air blowing block 21 and the air distribution block 22 can also be an integrated design.

[0042] Please continue reading. Figure 1 , Figure 3 and Figure 5 As shown, the air outlet 3 is also mounted on the base plate 1, and it and the air inlet 2 are located on opposite sides of the test slot 12. The air outlet 3 has an air outlet channel 30 inside, which is connected to the airflow channel 40, for discharging the temperature-controlled airflow flowing through the test seat 4. In this embodiment, the air outlet 3 has an air outlet channel 30 communicating with the airflow channel 40, and the airflow channel 40 is connected to the insulation chamber 50 through the air outlet channel 30; that is, the insulation chamber 50 is directly connected to the air outlet channel 30, and the temperature-controlled airflow flowing out of the airflow channel 40 of the test seat 4 first flows into the air outlet channel 30 and then flows to the insulation chamber 50. In some other embodiments, the airflow channel 40 may also be directly connected to the insulation chamber 50.

[0043] Please see Figure 1 as well as Figures 5 to 7As shown, in this embodiment, the air outlet 3 is a T-shaped air outlet block, and the air outlet channel 30 is Y-shaped. Specifically, the air outlet channel 30 includes branch paths 301 that are connected one-to-one with the airflow channels 40 in at least two test seats 4, and a confluence path 302 that is simultaneously connected to multiple branch paths 301. The air outlet channel 30 has a first exhaust port 303 and a second exhaust port 304. The first exhaust port 303 is connected to the outside of the blowing temperature control device 100, and the second exhaust port 304 is connected to the heat preservation chamber 50. The first exhaust port 303 and the second exhaust port 304 are coaxially arranged in the vertical direction, and the air outlet channel 30 is connected to the heat preservation chamber 50 at the confluence path 302. This configuration causes the temperature-controlled airflow to split at the two outlets of the confluence path 302. Part of the airflow exits directly through the first exhaust port 303, while the other part enters the insulation chamber 50 directly through the second exhaust port 304. This ensures smoother airflow discharge and injection into the insulation chamber 50. The airflow direction from the exhaust channel 30 is as follows: Figure 7 As indicated by the middle arrow.

[0044] Please see Figure 4 , Figure 6 and Figure 7 As shown, in this embodiment, the test holder 4 is disposed on the bottom surface of the substrate 1, and an airflow channel 40 is provided inside the test holder 4 to guide the flow of temperature-controlled airflow. The flow direction of the temperature-controlled airflow through the test holder 4 is as follows: Figure 6 As indicated by the middle arrow, the test socket 4 includes several test probes 41, some of which are exposed within the airflow channel 40. These test probes 41 are partially exposed within the airflow channel 40, and when the temperature-controlled airflow flows through the airflow channel 40, it exchanges heat with the test probes 41, preheating them. Since the test probes 41 need to contact the chip, the preheated test probes 41 enable more uniform temperature control of the chip, thereby improving the accuracy of the test.

[0045] Please see Figures 2 to 4 as well as Figure 6 and Figure 7 As shown, the heat insulation cover 5 is installed on the outside of the test seat 4, forming a heat insulation chamber 50 to accommodate the test seat 4. The heat insulation chamber 50 is connected to the airflow channel 40, so that at least part of the temperature-controlled airflow flowing out of the airflow channel 40 flows into the heat insulation chamber 50, thereby keeping the test seat 4 in a heat-insulating environment. This design keeps the test seat 4 in a relatively closed heat-insulating environment, effectively reducing the heat loss of the test seat 4 to the external environment. In this embodiment, the heat insulation cover 5 has a rectangular box-shaped structure, which can be injection molded from plastic. In some embodiments, it can be made of heat-insulating material or have a heat-insulating layer.

[0046] In practical applications, the working environment of semiconductor testing equipment is quite complex, and fluctuations in the external ambient temperature may affect the temperature of the test socket 4. The insulation chamber 50 formed by the insulation cover 5 can isolate the influence of the external environment to a certain extent, maintaining the temperature stability around the test socket 4. At the same time, the airflow flowing into the insulation chamber 50 further enhances the insulation effect, allowing the temperature of the test socket 4 to remain within the target temperature range for a longer period of time, thereby improving temperature control performance and ensuring the accuracy and reliability of chip testing.

[0047] When the air-blowing temperature control device 100 provided in this application is working, the temperature-controlled airflow first enters the airflow channel 40 of the test socket 4 through the air inlet channel 20 of the air inlet component 2. Within the airflow channel 40, the temperature-controlled airflow exchanges heat with the test probe 41, preheating the test probe 41. The preheated test probe 41, upon contact with the chip, ensures more uniform temperature control of the chip, which is beneficial for accurately testing the chip's performance at different temperatures. The airflow after passing through the test probe 41 flows out of the airflow channel 40 and into the air outlet channel 30 of the air outlet component 3. Part of the airflow is directly discharged to the outside of the device through the first exhaust port 303 of the air outlet channel 30, while the other part flows into the insulation chamber 50 through the second exhaust port 304 of the air outlet channel 30. The airflow flowing into the insulation chamber 50 forms a certain airflow circulation within the insulation chamber 50, further maintaining the temperature stability around the test socket 4. Due to the isolation effect of the insulation cover 5, the heat of the test socket 4 will not be rapidly dissipated into the external environment, thereby improving the temperature stability of the test socket 4 and enhancing temperature control performance.

[0048] As can be seen from the above description of the specific embodiments, the air-blowing temperature control device 100 provided in this application has significant technical effects in improving heat utilization and temperature control performance. On the one hand, by setting up the heat insulation cover 5 to form a heat insulation chamber 50, the test socket 4 is placed in a heat-insulating environment, which effectively reduces heat loss, improves the temperature stability of the test socket 4, and can more accurately control the test temperature of the chip, thereby improving the accuracy and reliability of semiconductor testing. On the other hand, the heat of the airflow is reused, and part of the temperature-controlled airflow is introduced into the heat insulation chamber 50, reducing energy waste and lowering the operating cost of the equipment. In addition, when the air-blowing temperature control device 100 includes multiple test sockets 4, the design of the air distribution channel 202 of the air inlet 2 and the branch path 301 and confluence path 302 of the air outlet 3 enables synchronous temperature control of multiple test sockets 4, improving testing efficiency and meeting the needs of large-scale semiconductor testing.

[0049] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A blowing temperature control device, characterized in that, The air blowing temperature control device (100) includes: substrate(1); Test base (4) is provided on the substrate (1), and airflow channel (40) is provided inside the test base (4). An air intake component (2) is disposed on the substrate (1), and an air intake channel (20) is provided inside the air intake component (2). The air intake channel (20) is connected to the airflow channel (40) to deliver a temperature-controlled airflow into the airflow channel (40); and A heat insulation cover (5) is placed on the outside of the test seat (4), and the heat insulation cover (5) forms a heat insulation chamber (50) that accommodates the test seat (4). The heat-insulating chamber (50) is connected to the airflow channel (40) so that at least part of the temperature-controlled airflow flowing out of the airflow channel (40) flows into the heat-insulating chamber (50) so that the test seat (4) is in a heat-insulating environment.

2. The air blowing temperature control device as described in claim 1, characterized in that, The air blowing temperature control device (100) includes an air outlet (3), and the air outlet (3) is provided with an air outlet channel (30) that communicates with the airflow channel (40). The airflow channel (40) is connected to the heat preservation chamber (50) through the air outlet channel (30).

3. The air blowing temperature control device as described in claim 2, characterized in that, The air outlet channel (30) has a first exhaust port (303) and a second exhaust port (304). The first exhaust port (303) is connected to the outside of the air blowing temperature control device (100), and the second exhaust port (304) is connected to the heat preservation chamber (50).

4. The air blowing temperature control device as described in claim 3, characterized in that, The first exhaust port (303) and the second exhaust port (304) are coaxially arranged in the vertical direction.

5. The air blowing temperature control device as described in claim 1, characterized in that, The blowing temperature control device (100) includes at least two test seats (4), and the heat insulation cover (5) is simultaneously placed on the outside of at least two test seats (4).

6. The air blowing temperature control device as described in claim 5, characterized in that, The air intake component (2) includes an air blowing block (21) and an air distribution block (22). The air intake channel (20) includes an air distribution channel (202) disposed in the air distribution block (22). The air distribution channel (202) distributes the temperature-controlled airflow to the at least two test seats (4).

7. The air blowing temperature control device as described in claim 5, characterized in that, The blowing temperature control device (100) includes an air outlet (3), and an air outlet channel (30) is provided in the air outlet (3). The air outlet channel (30) includes a branch path (301) that is connected one-to-one with the airflow channel (40) in at least two test seats (4), and a confluence path (302) that is connected to multiple branch paths (301) at the same time.

8. The air blowing temperature control device as described in claim 7, characterized in that, The air outlet channel (30) is connected to the heat preservation chamber (50) at the confluence channel (302).

9. The air blowing temperature control device as described in claim 2, characterized in that, The top surface of the substrate (1) is provided with a mounting groove (11), the air inlet (2) and the air outlet (3) are installed in the mounting groove (11), the test seat (4) is installed on the bottom surface of the substrate (1), and the heat insulation cover (5) is installed on the bottom surface of the substrate (1) to form the heat insulation chamber (50) together with the substrate (1).

10. The air blowing temperature control device as described in claim 1, characterized in that, The test stand (4) includes a plurality of test probes (41), which are partially exposed within the airflow channel (40).

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