A flexible electronic tag

Abstract

This utility model relates to the field of electronic tag technology and discloses a flexible electronic tag, including a flexible substrate, a conductive circuit layer, a chip mounting area, a protective layer, and an identification information carrying structure. The conductive circuit layer is disposed on top of the flexible substrate and is used to form an electrical connection with the chip. The protective layer covers the outside of the conductive circuit layer. The identification information carrying structure is disposed at one end of the flexible substrate. The flexible substrate is made of PET, PI, or polyolefin materials and has bendability. The conductive circuit layer is disposed on top of the flexible substrate by hot pressing and is made of silver paste or copper paste. In this utility model, by setting the conductive circuit layer and the chip mounting area on the flexible substrate, the chip and circuit are integrated and packaged, resulting in a compact structure and strong adaptability. The flexible substrate is made of materials such as PET and PI, which have good flexibility; the conductive circuit is hot-pressed to improve durability; and the protective layer enhances environmental adaptability and extends service life.

Description

Technical Field

[0001] This utility model relates to the field of electronic tag technology, and in particular to a flexible electronic tag. Background Technology

[0002] With the rapid development of the Internet of Things (IoT), logistics management, and intelligent identification technologies, electronic tags, as an important medium for information identification and data transmission, are widely used in scenarios such as commodity management, equipment identification, and asset tracking. Among them, flexible electronic tags, with their advantages of being able to adhere to irregular surfaces and having low manufacturing costs, have become an important development direction in the current electronic identification field. In order to meet the needs of data reading under complex working conditions and the long-term stable operation of tags, the development of a flexible electronic tag with a reasonable structure, high reliability, and wide adaptability has become a key direction for technological innovation in the industry.

[0003] Most existing flexible electronic tags are based on a structure combining flexible substrates with traditional circuits. This involves embedding electronic chips and conductive lines onto a thin-film substrate, followed by insulating encapsulation to achieve electrical connection and physical protection. These tags typically use spraying or printing to create the circuit pattern, and then fix the chip to a designated area using bonding or welding. The overall process is relatively mature and widely applicable to environments with minimal temperature and humidity variations. However, in high-humidity, high-dust, or long-term use conditions, the sealing performance and structural strength of the circuitry and chip still require improvement.

[0004] However, in the existing flexible electronic tag structure, the encapsulation tightness between the chip and the conductive circuit is poor, and the protective layer fails to effectively cover the key circuit area. This makes the chip and circuit susceptible to external factors such as moisture and dust, resulting in problems such as corrosion, short circuits or detachment, which seriously affect the stability and service life of the tag. Therefore, a flexible electronic tag is proposed to solve the above problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a flexible electronic tag, which aims to improve the existing technology where the protective layer fails to effectively cover the key circuit area, making the chip and circuit susceptible to external factors such as moisture and dust, resulting in problems such as corrosion, short circuit or detachment.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a flexible electronic tag, comprising: a flexible substrate, a conductive circuit layer, a chip mounting area, a protective layer, and an identification information carrying structure;

[0007] The conductive circuit layer is disposed above the flexible substrate and is used to form an electrical connection with the chip.

[0008] The protective layer covers the outside of the conductive circuit layer;

[0009] The identification information carrying structure is disposed at one end of the flexible substrate.

[0010] Furthermore, the flexible substrate is made of PET, PI, or polyolefin materials and has bendable properties.

[0011] Furthermore, the conductive circuit layer is deposited on the flexible substrate by hot pressing and is made of silver paste or copper paste.

[0012] Furthermore, a chip recess is provided in the center of the chip mounting area for placing electronic chips.

[0013] Furthermore, the protective layer is made of a transparent polyurethane film, which completely covers the chip mounting area and the surface of the conductive circuit layer.

[0014] Furthermore, the identification information carrying structure includes an identification layer and an embossing area, wherein a barcode or QR code is printed in the embossing area.

[0015] Furthermore, an insulating buffer layer is provided between the chip mounting area and the identification information carrying structure.

[0016] Furthermore, the flexible substrate has an adhesive layer at its bottom, which is a pressure-sensitive adhesive layer, and a release layer on the outside.

[0017] This utility model has the following beneficial effects:

[0018] 1. In this utility model, by setting a conductive circuit layer and a chip mounting area on a flexible substrate, the integrated packaging of electronic chips and circuits is achieved, which has the advantages of compact structure and strong adaptability. The flexible substrate is made of high-performance materials such as PET and PI, which have good bendability and flexibility, and can adapt to the attachment requirements of products with irregular curved surfaces or complex shapes. The conductive circuit layer is firmly bonded to the flexible substrate through a hot-pressing process, which improves the overall durability and peel resistance. The protective layer effectively improves the label's environmental adaptability, preventing external moisture and dust from corroding and damaging the chip and circuit layer, thereby extending the label's service life.

[0019] 2. In this utility model, by identifying the information-carrying structure, including the imprinted areas of barcodes and QR codes, it can be compatible with both electronic and optical information recognition methods, improving recognition efficiency and applicable scenarios. An insulating buffer layer is added between the chip mounting area and the recognition area to effectively absorb external impacts and prevent chip damage due to label bending. An adhesive layer and a peel-off layer are configured at the bottom, supporting rapid label deployment and on-site application, suitable for various application scenarios such as logistics, power equipment, and cold chain monitoring. The overall structure does not require complex control circuits to achieve information carrying and data acquisition functions, offering practical advantages such as simple processing technology, low cost, and wide applicability. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of a flexible electronic tag proposed in this utility model;

[0021] Figure 2 This is a schematic diagram of the peeling layer structure of a flexible electronic tag proposed in this utility model.

[0022] Figure 3 This is a schematic diagram of the electronic chip structure of a flexible electronic tag proposed in this utility model.

[0023] Figure 4 This is a schematic diagram of the conductive circuit layer structure of a flexible electronic tag proposed in this utility model.

[0024] Legend:

[0025] 1. Flexible substrate; 2. Conductive circuit layer; 3. Chip mounting area; 4. Protective layer; 5. Identification information carrying structure; 6. Chip recess; 7. Electronic chip; 8. Identification layer; 9. Imprinting area; 10. Insulating buffer layer; 11. Adhesive layer; 12. Release layer. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Reference Figures 1-4This utility model provides an embodiment of a flexible electronic tag, comprising: a flexible substrate 1, a conductive circuit layer 2, a chip mounting area 3, a protective layer 4, and an identification information carrying structure 5; the conductive circuit layer 2 is disposed above the flexible substrate 1 for forming an electrical connection with the chip, thereby realizing data input and output transmission; the protective layer 4 covers the outside of the conductive circuit layer 2 to prevent damage to the conductive circuit caused by environmental humidity, dust, and external forces; the identification information carrying structure 5 is disposed at one end of the flexible substrate 1 for convenient display of identity information and scanning; the flexible substrate 1 is made of PET, PI, or polyolefin materials, and has bendability, thereby being able to adhere to the surface of irregular or curved objects, expanding the applicability of the tag; the conductive circuit layer 2 is disposed above the flexible substrate 1 by hot pressing, improving adhesion, and the conductive circuit layer 2 is made of silver paste or copper paste, effectively improving conductivity and corrosion resistance; the chip... The mounting area 3 has a chip recess 6 in the middle for placing the electronic chip 7. The design of the chip recess 6 ensures that the chip is stably positioned and prevents connection abnormalities caused by movement. The protective layer 4 is made of transparent polyurethane film, which covers the entire surface of the chip mounting area 3 and the conductive circuit layer 2, taking into account both protection and visual recognition. The identification information carrying structure 5 includes an identification layer 8 and an imprinting area 9. The imprinting area 9 is printed with a barcode or QR code, which allows users to quickly identify product information by scanning. An insulating buffer layer 10 is set between the chip mounting area 3 and the identification information carrying structure 5 to reduce the mechanical stress transmitted to the chip and improve the durability and service life of the label's overall structure. The bottom of the flexible substrate 1 has an adhesive layer 11, which is a pressure-sensitive adhesive layer to ensure that the label can be firmly adhered to the product surface. A release layer 12 is set on the outside of the adhesive layer 11 to keep the adhesive layer clean before use and enhance the convenience of on-site construction.

[0028] Specifically, through the combined design and functional coordination of the above structures, the flexible electronic tags achieve stable adhesion, electronic information transmission, and barcode recognition on products of different shapes, and effectively improve the environmental adaptability, flexibility, reliability, and service life of the tag structure, thereby enhancing the practicality and economy of this utility model in logistics, warehousing, asset management and other scenarios.

[0029] Working principle: When the label is needed, the user peels off the release layer 12, exposing the pressure-sensitive adhesive layer 11, and then attaches the label to the surface of the target object. The flexible substrate 1 has good bending performance and can tightly fit the shell of irregular objects. The chip mounting area 3 has a chip recess 6 for embedding the electronic chip 7. The electronic chip 7 communicates with external sensing devices through the conductive circuit layer 2 to achieve data reading and identification. The protective layer 4 covers the chip mounting area 3 and the conductive circuit layer 2, forming a physical isolation layer to prevent interference from external environmental factors such as friction and moisture to the circuit. The identification information carrying structure 5 includes an identification layer 8 and an imprinted area 9, providing a visual identification method for the label through a barcode or QR code. The insulating buffer layer 10 set between the chip mounting area 3 and the identification information carrying structure 5 can relieve structural stress and ensure that the electronic chip 7 can still operate stably under bending conditions.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A flexible electronic tag, characterized by include: Flexible substrate (1), conductive circuit layer (2), chip mounting area (3), protective layer (4), and identification information carrying structure (5); The conductive circuit layer (2) is disposed above the flexible substrate (1) and is used to form an electrical connection with the chip; The protective layer (4) covers the outside of the conductive circuit layer (2); The identification information carrying structure (5) is disposed at one end of the flexible substrate (1).

2. A flexible electronic tag according to claim 1, characterised in that: The flexible substrate (1) is made of PET, PI or polyolefin materials and has bendable properties.

3. The flexible electronic tag of claim 1, wherein: The conductive line layer (2) is applied to the flexible substrate (1) by hot pressing and is made of silver paste or copper paste.

4. A flexible electronic tag according to claim 1, characterized in that: The chip mounting area (3) has a chip recess (6) in the middle for placing electronic chips (7).

5. The flexible electronic tag of claim 1, wherein: The protective layer (4) is made of transparent polyurethane film and covers the entire surface of the chip mounting area (3) and the conductive circuit layer (2).

6. The flexible electronic label of claim 1, wherein: The identification information carrying structure (5) includes an identification layer (8) and an embossing area (9), in which a barcode or QR code is printed.

7. The flexible electronic label of claim 1, wherein: An insulating buffer layer (10) is provided between the chip mounting area (3) and the identification information carrying structure (5).

8. The flexible electronic tag of claim 1, wherein: The flexible substrate (1) has an adhesive layer (11) at the bottom, which is a pressure-sensitive adhesive layer, and a release layer (12) on the outside.

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