A waterproof multi-functional microphone
By integrating the multi-functional microphone into a single package, the problems of material waste and mutual interference caused by independent sensor components are solved. This achieves integrated packaging of the sensor, reduces space occupation, and provides waterproof, dustproof, and corrosion-resistant functions, thereby improving the performance and stability of the device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN RUIQIN ELECTRONICS CO LTD
- Filing Date
- 2025-04-17
- Publication Date
- 2026-06-30
AI Technical Summary
Existing devices such as microphones, pressure sensors, and accelerometers are independent components, which leads to material waste, increased costs, large space occupation, and potential mutual interference. Furthermore, their waterproof, dustproof, and corrosion-resistant properties are insufficient in different application scenarios.
The integrated packaging structure of the multi-functional microphone includes a circuit board, a microphone sensor, a pressure sensor, a first housing, and a second housing. It utilizes a waterproof and breathable membrane and a vent design to achieve integrated packaging of the microphone sensor and the pressure sensor, avoiding mutual interference and providing waterproof, dustproof, and corrosion-resistant functions.
It achieves integrated packaging of multiple sensors, reducing space occupation, avoiding mutual interference, and also has waterproof, dustproof and corrosion-resistant properties, improving the performance and stability of the equipment.
Smart Images

Figure CN224439179U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of microphone technology, and more specifically to a waterproof multifunctional microphone. Background Technology
[0002] Currently, with rapid social development and the continuous improvement of human material needs, electronic products (such as mobile phones, computers, learning machines, smart bracelets, smartwatches, VR devices, smart headphones, etc.) are becoming increasingly integrated, and the requirements for product size are becoming increasingly stringent. To meet this demand, pressure sensors, accelerometers, and microphones used in electronic products are typically packaged using Micro-electromechanical Systems (MEMS) technology, and the packaging structures and assembly processes of these sensors have a high degree of similarity.
[0003] However, existing electronic products use microphones, pressure sensors, accelerometers, and other components that are all independent devices. Each component is manufactured through similar processes, wasting materials and manpower, and increasing costs. Furthermore, each component needs to be mounted separately, occupying free space and increasing the product size. In addition, different sensors may interfere with each other during operation, affecting the performance and stability of the device.
[0004] Based on the aforementioned problems, there is an urgent need to develop a technology that can effectively reduce the space occupied by multiple sensors while avoiding mutual interference between different sensors during operation. Furthermore, considering the widespread use of sensors such as microphones and barometers in various application scenarios, their waterproof, dustproof, and corrosion-resistant properties are also particularly important. Therefore, it is necessary to propose a solution that can meet these requirements. Utility Model Content
[0005] The main technical problem addressed by this application is to provide a waterproof multifunctional microphone for integrating multiple sensors, including a microphone sensor and a pressure sensor, into a single package. This helps to avoid interference caused by different sensors during operation, reduces the space occupied by multiple sensors, and provides waterproof, dustproof, and corrosion-resistant functions.
[0006] This application discloses a waterproof multifunctional microphone, which includes a circuit board. The circuit board is provided with a microphone sensor, a pressure sensor, a first housing, and a second housing. The first housing and the circuit board form a first cavity for accommodating the pressure sensor, and the second housing and the circuit board form a second cavity for accommodating the first housing and the microphone sensor. The circuit board is provided with a sound inlet corresponding to the position of the microphone sensor, and a waterproof and breathable membrane is provided at the sound inlet. The first housing is provided with a vent hole connecting the second cavity and the first cavity.
[0007] In some alternative embodiments, the microphone sensor includes a microphone MEMS chip and a microphone ASIC chip arranged on the circuit board by an adhesive, and the pressure sensor includes a pressure sensor MEMS chip and a pressure sensor ASIC chip stacked on the circuit board by an adhesive.
[0008] In some alternative implementations, the pressure sensor MEMS chip is mounted on a pressure sensor ASIC chip, which is mounted on the circuit board.
[0009] In some alternative implementations, the microphone MEMS chip, the microphone ASIC chip, and the circuit board are electrically connected via bonding wires, and the pressure sensor MEMS chip, the pressure sensor ASIC chip, and the circuit board are electrically connected via bonding wires.
[0010] In some alternative embodiments, the waterproof and breathable membrane is disposed between the inner surface of the circuit board and the microphone MEMS chip.
[0011] In some alternative embodiments, the first cavity is filled with breathable and heat-insulating adhesive.
[0012] In some alternative embodiments, the breathable and heat-insulating adhesive is a silicone gel.
[0013] In some alternative implementations, both the first housing and the second housing are metal housings.
[0014] In some alternative implementations, the circuit board and the first housing, as well as the circuit board and the second housing, are bonded by solder paste.
[0015] In some alternative embodiments, the vent is located on the top of the first housing.
[0016] As described above, this application proposes a waterproof multi-functional microphone. By adopting the above technical solution, this application has the following advantages: The multi-functional microphone of this application realizes the integrated packaging of microphone sensor and pressure sensor, which can reduce the space occupied by multiple sensors and reduce the packaging volume of the product; at the same time, since the first shell and the second shell are used for isolation, interference generated when the microphone sensor and the pressure sensor are working can be effectively avoided; in addition, it also has waterproof, dustproof and corrosion-resistant functions. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments and the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a cross-sectional structural diagram of a waterproof multi-functional microphone proposed in an embodiment of this application. Detailed Implementation
[0019] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present application.
[0020] The terms "first," "second," "third," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.
[0021] The following detailed descriptions will be provided through specific embodiments.
[0022] refer to Figure 1 This application provides a waterproof multi-functional microphone, which includes a circuit board 1, on which a microphone sensor, a pressure sensor, a first housing 62, and a second housing 61 are disposed.
[0023] For example, the microphone sensor includes a microphone MEMS (Micro-Electro-Mechanical System) chip 8 and a microphone ASIC (Application Specific Integrated Circuit) chip 10 arranged on the circuit board 1 by an adhesive, and the pressure sensor includes a pressure sensor MEMS chip 5 and a pressure sensor ASIC chip 4 stacked on the circuit board 1 by an adhesive. The adhesives used include, but are not limited to, silicone and epoxy.
[0024] Here, the first housing 62 and the circuit board 1 form a first cavity 71 for accommodating the pressure sensor, and the second housing 61 and the circuit board 1 form a second cavity 72 for accommodating the first housing 62 and the microphone sensor. The circuit board 1 is provided with a sound inlet 31 whose position corresponds to the microphone sensor. A waterproof and breathable membrane 2 is provided at the sound inlet 31. The first housing 62 is provided with a vent 32 that connects the second cavity 72 and the first cavity 71.
[0025] In some alternative implementations, the pressure sensor MEMS chip 5 is disposed on the pressure sensor ASIC chip 4, and the pressure sensor ASIC chip 5 is disposed on the circuit board 1.
[0026] In some alternative implementations, the microphone MEMS chip 8, the microphone ASIC chip 10, and the circuit board 1 are electrically connected via bonding wires 9, and the pressure sensor MEMS chip 5, the pressure sensor ASIC chip 4, and the circuit board 1 are electrically connected via bonding wires 9. The bonding wires 9 are, for example, metal wires such as gold, silver, or copper wires.
[0027] In some alternative implementations, a waterproof and breathable membrane 2 is disposed between the inner surface of the circuit board 1 and the microphone MEMS chip 8, which can be used for waterproofing and dustproofing.
[0028] In some alternative embodiments, the first cavity 71 is filled with a breathable and heat-insulating adhesive, which is both breathable, allowing the air pressure signal to pass through, and heat-insulating, preventing the heat generated by the pressure sensor during operation from dissipating outward and affecting the microphone sensor, thus ensuring the normal operation of the microphone sensor. For example, the breathable and heat-insulating adhesive can be a silicone gel.
[0029] In some alternative embodiments, both the first outer casing 62 and the second outer casing 61 are metal casings.
[0030] In some alternative embodiments, the circuit board 1 and the first housing 62, as well as the circuit board 1 and the second housing 61, can be joined by soldering with solder paste to achieve a sealed connection and ensure airtightness.
[0031] In some alternative implementations, the vent 62 is located on the top of the first housing 62 to avoid direct contact with the microphone sensor and reduce interference between them.
[0032] In this application, the microphone sensor detects external sound signals through the sound inlet 31 and converts them into electrical signals; the air pressure sensor detects air pressure signals through the vent 32 and converts them into electrical signals.
[0033] The technical solution of this application has been described in detail above through specific embodiments. In the above embodiments, the descriptions of each embodiment have their own emphasis, and for parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.
[0034] It should be understood that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and protection scope of the technical solutions of the embodiments of this application.
Claims
1. A waterproof multifunctional microphone, characterized in that, Includes a circuit board, on which a microphone sensor, a pressure sensor, a first housing, and a second housing are disposed; The first housing and the circuit board together form a first cavity for accommodating the pressure sensor, and the second housing and the circuit board together form a second cavity for accommodating the first housing and the microphone sensor. The circuit board is provided with a sound inlet corresponding to the position of the microphone sensor, and a waterproof and breathable membrane is provided at the sound inlet. The first housing is provided with a vent hole connecting the second cavity and the first cavity.
2. The multi-functional microphone according to claim 1, characterized by, The microphone sensor includes a microphone MEMS chip and a microphone ASIC chip arranged on the circuit board by an adhesive, and the pressure sensor includes a pressure sensor MEMS chip and a pressure sensor ASIC chip stacked on the circuit board by an adhesive.
3. The multi-functional microphone according to claim 2, characterized in that, The pressure sensor MEMS chip is mounted on the pressure sensor ASIC chip, and the pressure sensor ASIC chip is mounted on the circuit board.
4. The multi-functional microphone according to claim 2, characterized in that, The microphone MEMS chip, the microphone ASIC chip, and the circuit board are electrically connected by bonding wires, and the pressure sensor MEMS chip, the pressure sensor ASIC chip, and the circuit board are electrically connected by bonding wires.
5. The multi-functional microphone according to claim 2, characterized in that, The waterproof and breathable membrane is disposed between the inner surface of the circuit board and the microphone MEMS chip.
6. The multi-functional microphone according to claim 1, characterized in that, The first cavity is filled with breathable and heat-insulating adhesive.
7. The multi-functional microphone according to claim 6, characterized in that, The breathable and heat-insulating adhesive is a silicone gel.
8. The multi-functional microphone according to claim 1, characterized in that, Both the first outer shell and the second outer shell are metal shells.
9. The multi-functional microphone according to claim 8, characterized in that, The circuit board and the first housing, as well as the circuit board and the second housing, are bonded together by solder paste.
10. The multi-functional microphone according to claim 1, characterized in that, The ventilation holes are located on the top of the first outer casing.