A multi-functional microphone

Abstract

This application proposes a multifunctional microphone, including a base plate, a cavity plate, and a cover plate. The base plate, the cavity plate, and the cover plate enclose a first cavity and a second cavity. A pressure sensor is disposed on the base plate in the first cavity, and a microphone sensor is disposed on the base plate in the second cavity. A first acoustic hole corresponding to the position of the microphone sensor is provided on the base plate, and a second acoustic hole communicating with the first acoustic hole and the first cavity is also provided within the base plate. This application achieves integrated packaging of the microphone sensor and the pressure sensor, which can reduce the packaging volume and effectively avoid interference between the microphone sensor and the pressure sensor during operation.

Description

Technical Field

[0001] This application relates to the field of microphone technology, and more specifically to a waterproof multifunctional microphone. Background Technology

[0002] Currently, with rapid social development and the continuous improvement of human material needs, electronic products (such as mobile phones, computers, learning machines, smart bracelets, smartwatches, VR devices, smart headphones, etc.) are becoming increasingly integrated, and the requirements for product size are becoming increasingly stringent. To meet this demand, pressure sensors, accelerometers, and microphones used in electronic products are typically packaged using Micro-electromechanical Systems (MEMS) technology, and the packaging structures and assembly processes of these sensors have a high degree of similarity.

[0003] However, existing electronic products use microphones, pressure sensors, accelerometers, and other components that are all independent devices. Each component is manufactured through similar processes, wasting materials and manpower, and increasing costs. Furthermore, each component needs to be mounted separately, occupying free space and increasing the product size. In addition, different sensors may interfere with each other during operation, affecting the performance and stability of the device.

[0004] Based on the above problems, there is an urgent need to develop a technology that can effectively reduce the space occupied by multiple sensors, while avoiding mutual interference between different sensors during operation. Utility Model Content

[0005] The main technical problem addressed by this application is to provide a multifunctional microphone for integrating multiple sensors, including a microphone sensor and a pressure sensor, into a single package, and to avoid interference caused by the operation of different sensors.

[0006] This application discloses a multifunctional microphone, which includes a base plate, a cavity plate, and a cover plate. The base plate, the cavity plate, and the cover plate form a first cavity and a second cavity. The first cavity has a pressure sensor disposed on the base plate, and the second cavity has a microphone sensor disposed on the base plate. The base plate has a first sound hole corresponding to the position of the microphone sensor, and the base plate also has a second sound hole communicating with the first sound hole and the first cavity.

[0007] In some alternative embodiments, the microphone sensor includes a microphone MEMS chip and a microphone ASIC chip arranged on the substrate by an adhesive, and the pressure sensor includes a pressure sensor MEMS chip and a pressure sensor ASIC chip stacked on the substrate by an adhesive.

[0008] In some alternative implementations, the pressure sensor MEMS chip is mounted on a pressure sensor ASIC chip, which is mounted on the base plate.

[0009] In some alternative implementations, the microphone MEMS chip, the microphone ASIC chip, and the base plate are electrically connected via bonding wires, and the pressure sensor MEMS chip, the pressure sensor ASIC chip, and the base plate are electrically connected via bonding wires.

[0010] In some alternative implementations, the first sound hole is connected to the microphone MEMS chip.

[0011] In some alternative embodiments, a waterproof and breathable membrane is provided at the first acoustic hole.

[0012] In some alternative embodiments, the second acoustic hole includes a vertical section and a horizontal section, the vertical section communicating with the first cavity and not penetrating the base plate, the horizontal section being embedded in the base plate, one end of the horizontal section communicating with the vertical section, and the other end of the horizontal section communicating with the first acoustic hole.

[0013] In some alternative embodiments, the base plate, the cavity plate, and the cover plate are all circuit boards.

[0014] In some alternative embodiments, the outer surface of the base plate has pads for electrical connection to external devices.

[0015] In some alternative embodiments, the base plate, the cavity plate, and the cover plate are sealed together.

[0016] As described above, this application proposes a multi-functional microphone. By adopting the above technical solution, this application has the following advantages: The multi-functional microphone of this application realizes the integrated packaging of microphone sensor and pressure sensor, which can reduce the space occupied by multiple sensors and reduce the packaging volume of the product; at the same time, since the first shell and the second shell are used for isolation, interference generated when the microphone sensor and the pressure sensor are working can be effectively avoided. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments and the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1This is a cross-sectional structural diagram of a multi-functional microphone proposed in an embodiment of this application. Detailed Implementation

[0019] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present application.

[0020] The terms "first," "second," "third," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0021] The following detailed descriptions will be provided through specific embodiments.

[0022] refer to Figure 1 This application proposes a multifunctional microphone, which includes a base plate 2, a cavity plate 1, and a cover plate 6. The base plate 2, cavity plate 1, and cover plate 6 form a first cavity 71 and a second cavity 72. The first cavity 71 has a pressure sensor disposed on the base plate 2, and the second cavity 72 has a microphone sensor disposed on the base plate 2. The base plate 2 is provided with a first sound hole 31 whose position corresponds to the microphone sensor, and the base plate 2 is also provided with a second sound hole 32 that connects the first sound hole 31 and the first cavity 71.

[0023] Here, the microphone sensor may include a microphone MEMS (Micro-Electro-Mechanical System) chip 8 and a microphone ASIC (Application Specific Integrated Circuit) chip 10 arranged on the base plate 1 by an adhesive. The pressure sensor includes a pressure sensor MEMS chip 5 and a pressure sensor ASIC chip 4 stacked on the base plate 1 by an adhesive. The adhesives used include, but are not limited to, silicone and epoxy.

[0024] In some alternative implementations, the pressure sensor MEMS chip 5 is disposed on the pressure sensor ASIC chip 4, and the pressure sensor ASIC chip 5 is disposed on the base plate 2.

[0025] In some alternative implementations, the microphone MEMS chip 8, the microphone ASIC chip 10, and the base plate 2 are electrically connected via bonding wires 9, and the pressure sensor MEMS chip 5, the pressure sensor ASIC chip 4, and the base plate 2 are electrically connected via bonding wires 9. The bonding wires 9 are, for example, metal wires such as gold, silver, or copper wires.

[0026] In some alternative implementations, the pressure sensor is, for example, a gas pressure sensor that detects air pressure.

[0027] In some alternative implementations, the first sound hole 31 is connected to the microphone MEMS chip 8 for inputting external sound signals to the microphone MEMS chip 8.

[0028] In some alternative embodiments, a waterproof and breathable membrane is also provided at the first sound hole 31.

[0029] In some alternative embodiments, the second acoustic hole 32 includes a vertical section and a horizontal section. The vertical section connects to the first cavity and does not penetrate the base plate 2. One end of the horizontal section connects to the vertical section and is embedded in the base plate. The other end of the horizontal section connects to the first acoustic hole 31. Overall, the first acoustic hole 31 and the second acoustic hole 31 are connected to the outside through only one opening.

[0030] In some alternative embodiments, the base plate 2, cavity plate 1, and cover plate 6 are all circuit boards, and they are sealed together. The connection methods include, but are not limited to, welding and gluing.

[0031] In some alternative embodiments, the outer surface of the base plate 2 (the surface facing away from the microphone sensor and pressure sensor) is provided with solder pads, which are positioned to connect to external devices, such as the motherboard of an electronic device.

[0032] In this application, the microphone sensor detects sound signals through the first sound hole 31 and converts them into electrical signals; the pressure sensor detects air pressure signals through the second sound hole 32 and converts them into electrical signals.

[0033] The technical solution of this application has been described in detail above through specific embodiments. In the above embodiments, the descriptions of each embodiment have their own emphasis, and for parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0034] It should be understood that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and protection scope of the technical solutions of the embodiments of this application.

Claims

1. A multi-functional microphone, characterized by, The device includes a base plate, a cavity plate, and a cover plate. The base plate, the cavity plate, and the cover plate form a first cavity and a second cavity. The first cavity has a pressure sensor disposed on the base plate, and the second cavity has a microphone sensor disposed on the base plate. The base plate has a first sound hole positioned corresponding to the microphone sensor, and the base plate also has a second sound hole connecting the first sound hole and the first cavity.

2. The multi-functional microphone according to claim 1, characterized by, The microphone sensor includes a microphone MEMS chip and a microphone ASIC chip arranged on the base plate by an adhesive, and the pressure sensor includes a pressure sensor MEMS chip and a pressure sensor ASIC chip stacked on the base plate by an adhesive.

3. The multi-functional microphone according to claim 2, characterized by, The pressure sensor MEMS chip is mounted on the pressure sensor ASIC chip, and the pressure sensor ASIC chip is mounted on the base plate.

4. The multi-functional microphone according to claim 2, characterized by, The microphone MEMS chip, the microphone ASIC chip, and the base plate are electrically connected by bonding wires. The pressure sensor MEMS chip, the pressure sensor ASIC chip, and the base plate are also electrically connected by bonding wires.

5. The multi-functional microphone according to claim 2, wherein The first sound hole is connected to the microphone MEMS chip.

6. The multi-functional microphone according to claim 1, characterized in that, A waterproof and breathable membrane is provided at the first sound hole.

7. The multi-functional microphone according to claim 1, wherein The second acoustic hole includes a vertical section and a horizontal section. The vertical section connects to the first cavity and does not penetrate the bottom plate. The horizontal section is embedded in the bottom plate. One end of the horizontal section connects to the vertical section, and the other end of the horizontal section connects to the first acoustic hole.

8. The multi-functional microphone according to claim 1, characterized by, The base plate, the cavity plate, and the cover plate are all circuit boards.

9. The multi-functional microphone according to claim 8, characterized by, The outer surface of the base plate has pads for electrical connection to external devices.

10. The multi-functional microphone according to claim 1, characterized by, The base plate, the cavity plate, and the cover plate are connected in a sealed manner.

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