A memory chip reliability testing device
By designing a memory chip reliability testing device, the simultaneous feeding and collection of multiple memory chips was achieved, solving the problem of low efficiency in existing technologies, improving operational efficiency, and protecting the integrity of the chips.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN SXMICRO TECH CO LTD
- Filing Date
- 2025-06-10
- Publication Date
- 2026-06-30
AI Technical Summary
Existing memory chip testing equipment cannot process multiple memory chips simultaneously on large-scale production lines, resulting in low operational efficiency.
A memory chip reliability testing device was designed, comprising a testing platform, a testing mechanism, a material handling component, and a collection component. Multiple memory chips are simultaneously fed through a baffle plate, a pull rod, and a reset spring, and are collected centrally through a feeding channel and a collection component.
This improves the efficiency of chip retrieval, avoids individual chip retrieval processing, meets the needs of large-scale testing, and protects the integrity of the chips.
Smart Images
Figure CN224437190U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of memory chip testing technology, specifically a memory chip reliability testing device. Background Technology
[0002] Memory chips are indispensable key components in modern electronic devices, widely used in computers, smartphones, tablets, servers, IoT devices, and many other fields. They are responsible for storing various types of data, including operating systems, applications, user files, images, and videos. As technology continues to advance and electronic devices become increasingly powerful, the performance and capacity requirements for memory chips are also rising, while more stringent standards are being set for their reliability.
[0003] Meanwhile, application number CN221613535U, entitled "Testing Apparatus for Memory Chips," describes a testing apparatus for memory chips comprising a detection unit board, a memory unit board, and a connector. The detection unit board includes a first connection port; the memory unit board includes a second connection port and a memory chip mounting position, wherein the memory chip mounting position is used to mount the memory chip and is connected to the second connection port; one end of the connector is connected to the first connection port, and the other end is connected to the second connection port. This application, through the above method, eliminates the need for external devices, enabling both the detection of memory chip power consumption and the rapid replacement of memory chips, thus improving the versatility of the memory chip testing apparatus.
[0004] The above-mentioned technical solution requires operators to individually handle the removal of multiple chips placed inside the base plate after testing. This method is inefficient and cannot meet the needs of rapid testing of memory chips on large-scale production lines, nor can it handle the simultaneous unloading of multiple memory chips.
[0005] Therefore, a memory chip reliability testing device is proposed to address the above problems. Utility Model Content
[0006] To address the problems mentioned in the background art, this utility model provides a memory chip reliability testing device, which has the advantages of being able to simultaneously process multiple memory chips, avoiding the need for operators to handle each chip individually, further improving the efficiency of chip handling, and meeting the needs of large-scale memory chip testing.
[0007] To achieve the above objectives, this utility model provides the following technical solution: a memory chip reliability testing device, comprising a testing platform, a testing mechanism mounted on the surface of the testing platform, a testing plate mounted on the surface of the testing platform, and a material handling component mounted on the surface of the testing platform;
[0008] The material handling assembly includes a baffle plate, which is slidably connected to a cavity in the surface of the detection platform. An adjustment plate is mounted on the surface of the baffle plate. An adjustment groove adapted to the adjustment plate is formed on the surface of the detection platform. The adjustment plate and the baffle plate are slidably connected inside the adjustment groove. A pull rod is slidably connected to a through hole in the surface of the detection platform. One end of the pull rod passes through the detection platform and is connected to the adjustment plate. A collection assembly is mounted on the surface of the detection platform.
[0009] Preferably, a fixing plate is mounted on the surface of the pull rod, and a return spring is sleeved on the surface of the pull rod. One end of the return spring is connected to the fixing plate, and the other end of the return spring is installed in an adjustment groove opened on the surface of the testing table.
[0010] Preferably, the combined length of the two baffles is adapted to the detection plate, and the baffles are attached to the bottom of the detection plate.
[0011] Preferably, the testing station has an internal feeding channel for feeding materials.
[0012] Preferably, the other end of the pull rod passes through the testing platform and extends to the outside of the testing platform, and is connected to a handle located on the outside of the testing platform.
[0013] Preferably, the collection assembly includes a feeding plate, which is installed at the bottom of the testing platform. A feeding trough is opened at the bottom of the feeding plate, and a feeding pipe is connected to it. The discharge end of the feeding pipe is connected to a collection box, and a rubber pad is installed inside the collection box. The feeding plate is connected to a feeding channel opened inside the testing platform.
[0014] Preferably, guide plates are symmetrically installed between the feeding plate and the testing station.
[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0016] 1. This utility model, by setting up a material handling component, enables the simultaneous feeding of multiple memory chips, avoiding the need for operators to handle each chip individually, further improving the material handling efficiency and meeting the needs of large-scale memory chip testing.
[0017] 2. This utility model, by setting up a collection component, can collect and process the storage chips after they have been fed, preventing the chips from scattering randomly, facilitating centralized management and subsequent processing of the chips, ensuring a smooth feeding process, improving the success rate of collection, reducing the possibility of damage caused by collisions between the chips and the collection box, and protecting the integrity of the chips. Attached Figure Description
[0018] Figure 1This is a schematic diagram of the overall structure of this utility model;
[0019] Figure 2 This is a schematic diagram of the structure of the barrier plate and the detection table of this utility model;
[0020] Figure 3 This is a schematic diagram of the structure of the blocking plate and adjusting plate of this utility model;
[0021] Figure 4 This is a schematic diagram of the structure of the collection component of this utility model.
[0022] In the diagram: 1. Inspection table; 12. Inspection mechanism; 13. Inspection plate; 2. Material handling assembly; 21. Baffle plate; 22. Adjustment plate; 23. Pull rod; 24. Fixing plate; 25. Return spring; 26. Handle; 3. Collection assembly; 31. Feeding plate; 32. Feeding pipe; 33. Collection box; 34. Rubber pad; 35. Guide plate. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] like Figures 1 to 4 As shown, this utility model provides a memory chip reliability testing device, including a testing platform 1, a testing mechanism 12 mounted on the surface of the testing platform 1, a testing plate 13 mounted on the surface of the testing platform 1, and a material handling component 2 mounted on the surface of the testing platform 1.
[0025] The material handling assembly 2 includes a baffle plate 21. The baffle plate 21 is slidably connected to a cavity opened on the surface of the inspection table 1. An adjustment plate 22 is installed on the surface of the baffle plate 21. An adjustment groove adapted to the adjustment plate 22 is opened on the surface of the inspection table 1. The adjustment plate 22 and the baffle plate 21 are slidably connected inside the adjustment groove. A pull rod 23 is slidably connected to a through hole opened on the surface of the inspection table 1. One end of the pull rod 23 passes through the inspection table 1 and is connected to the adjustment plate 22. A collection assembly 3 is installed on the surface of the inspection table 1. This assembly has the advantages of being able to simultaneously process multiple memory chips, avoiding the need for operators to handle each chip individually, further improving material handling efficiency, and meeting the needs of large-scale memory chip testing.
[0026] Specifically, a fixed plate 24 is mounted on the surface of the pull rod 23, and a return spring 25 is sleeved on the surface of the pull rod 23. One end of the return spring 25 is connected to the fixed plate 24, and the other end of the return spring 25 is installed in the adjustment groove opened on the surface of the detection table 1, so that repeated operation can be performed, which is convenient for operators to use.
[0027] like Figures 1 to 4 As shown, the combined length of the two baffles 21 is adapted to the detection plate 13, and the baffles 21 are attached to the bottom of the detection plate 13, so that the detection plate 13 can be blocked.
[0028] Furthermore, the testing station 1 has an internal feeding channel for feeding materials, which facilitates the feeding of storage chips.
[0029] It is worth noting that the other end of the lever 23 passes through the testing table 1 and extends to the outside of the testing table 1, and is connected to the handle 26 set on the outside of the testing table 1, so as to facilitate the use of the operator.
[0030] like Figures 1 to 4 As shown, the collection component 3 includes a feeding plate 31. The feeding plate 31 is installed at the bottom of the detection platform 1. A feeding trough is opened at the bottom of the feeding plate 31, and a feeding pipe 32 is connected to it. The discharge end of the feeding pipe 32 is connected to a collection box 33. A rubber pad 34 is installed inside the collection box 33. The feeding plate 31 is connected to the feeding channel opened inside the detection platform 1, so that the storage chips after feeding can be collected and processed, avoiding the chips from falling randomly. This facilitates centralized management and subsequent processing of the chips, ensures the smoothness of the feeding process, improves the success rate of collection, reduces the possibility of chip collision with the collection box 33 and damage, and protects the integrity of the chips.
[0031] It is worth emphasizing that a guide plate 35 is symmetrically installed between the unloading plate 31 and the detection stage 1, which can guide the chip to accurately enter the unloading slot of the unloading plate 31 and prevent the chip from deviating during the falling process.
[0032] The structures such as the testing mechanism 12, the testing station 1, and the testing plate 13 are existing technologies and have the same working principle as the "testing device for memory chips" in the prior art, application number CN221613535U. For specific operation, please refer to the prior art.
[0033] Working principle and process: The testing mechanism 12 is activated to perform reliability testing on the memory chips on the testing board 13. The testing mechanism 12 uses specific testing methods to test various performance indicators of the chips to determine whether the chips are qualified.
[0034] After the test is completed, if it is necessary to remove the chip from the test board 13, first pull the lever 23 by the handle 26. Since the lever 23 is connected to the adjustment plate 22, and the adjustment plate 22 is connected to the blocking plate 21, pulling the lever 23 will cause the adjustment plate 22 to slide in the adjustment groove, which in turn will cause the blocking plate 21 to slide in the cavity and the adjustment groove on the surface of the test stage 1. At this time, the blocking plate 21 will move out from the bottom of the test board 13, and the memory chip will be unobstructed, allowing it to detach from the test board 13.
[0035] The memory chips falling from the detection board 13 fall through the feeding channel inside the detection station 1. After passing through the feeding channel, the falling chips reach the feeding plate 31, then enter the feeding tube 32 through the feeding groove at the bottom of the feeding plate 31, and finally enter the collection box 33 through the feeding tube 32. Because the collection box 33 is equipped with a rubber pad 34, it can play a cushioning role to prevent the chips from being damaged during collection. The guide plate 35 helps to guide the chips smoothly into the feeding plate 31 and prevents the chips from shifting or getting stuck during the fall.
[0036] After the material is picked up, the pull rod 23 is released. Since the pull rod 23 is fitted with a return spring 25, one end of the return spring 25 is connected to the fixed plate 24 and the other end is installed in the adjustment groove opened on the surface of the detection table 1. The return spring 25 will push the fixed plate 24, so that the pull rod 23 drives the adjustment plate 22 and the blocking plate 21 to reset and return to the initial position, so as to carry out the next material picking operation.
[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A memory chip reliability testing device, comprising a testing station (1), characterized in that: The surface of the testing station (1) is equipped with a testing mechanism (12), a testing plate (13) is installed on the surface of the testing station (1), and a material handling component (2) is installed on the surface of the testing station (1). The material handling component (2) includes a baffle plate (21). The baffle plate (21) is slidably connected in a cavity opened on the surface of the detection platform (1). An adjustment plate (22) is installed on the surface of the baffle plate (21). An adjustment groove adapted to the adjustment plate (22) is opened on the surface of the detection platform (1). The adjustment plate (22) and the baffle plate (21) are slidably connected inside the adjustment groove. A pull rod (23) is slidably connected in a through hole opened on the surface of the detection platform (1). One end of the pull rod (23) passes through the detection platform (1) and is connected to the adjustment plate (22). A collection component (3) is installed on the surface of the detection platform (1).
2. The memory chip reliability testing device according to claim 1, characterized in that: A fixing plate (24) is installed on the surface of the pull rod (23), and a return spring (25) is sleeved on the surface of the pull rod (23). One end of the return spring (25) is connected to the fixing plate (24), and the other end of the return spring (25) is installed in the adjustment groove opened on the surface of the detection table (1).
3. The memory chip reliability testing device according to claim 2, characterized in that: The combined length of the two baffles (21) is adapted to the detection plate (13), and the baffles (21) are attached to the bottom of the detection plate (13).
4. The memory chip reliability testing device according to claim 3, characterized in that: The testing station (1) has a material feeding channel inside for feeding materials.
5. The memory chip reliability testing device according to claim 4, characterized in that: The other end of the pull rod (23) passes through the testing table (1) and extends to the outside of the testing table (1), and is connected to the handle (26) located outside the testing table (1).
6. The memory chip reliability testing device according to claim 1, characterized in that: The collection component (3) includes a feeding plate (31). The feeding plate (31) is installed at the bottom of the detection platform (1). A feeding trough is opened at the bottom of the feeding plate (31) and a feeding pipe (32) is connected to it. The discharge end of the feeding pipe (32) is connected to a collection box (33). A rubber pad (34) is installed inside the collection box (33). The feeding plate (31) is connected to the feeding channel opened inside the detection platform (1).
7. A memory chip reliability testing device according to claim 6, characterized in that: A guide plate (35) is symmetrically installed between the feeding plate (31) and the testing table (1).