A dustproof housing for microcapacitors

By designing a microcapacitor dustproof housing and combining passive and active heat dissipation, the problem of poor capacitor heat dissipation was solved, achieving efficient heat dissipation and dustproof effects, and extending service life.

CN224437406UActive Publication Date: 2026-06-30FUJIAN FUHUA INTELLIGENT TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
FUJIAN FUHUA INTELLIGENT TECH CO LTD
Filing Date
2025-06-21
Publication Date
2026-06-30

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Abstract

This utility model discloses a dustproof housing for a microcapacitor, belonging to the field of capacitor technology. It includes a mounting base, a microcapacitor protection component, and a microcapacitor heat dissipation component. The inner wall of the mounting base has internal threads, and the outer surface of the mounting base is fitted with annularly arranged mounting plates. These plates connect to the external threads of the microcapacitor protection housing via the internal threads, allowing for easy installation and maintenance of the microcapacitor. The annular mounting plates and mounting holes, along with screws, ensure a more stable housing. Heat dissipation fins on the outside of the microcapacitor protection housing increase the heat dissipation area. Heat dissipation windows, combined with dustproof mesh, utilize air convection for heat dissipation while preventing dust from entering and ensuring internal cleanliness. A positioning clip, along with a protective pad, secures the cooling fan, enabling active cooling to accelerate air circulation and improve heat dissipation efficiency. This design combines passive and active cooling, allowing the microcapacitor to operate in a dustproof and well-ventilated environment, effectively preventing dust accumulation from affecting performance. Simultaneously, it offers structural stability and convenient installation.
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Description

Technical Field

[0001] This utility model relates to the field of capacitor technology, specifically a dustproof housing for a microcapacitor. Background Technology

[0002] Two conductors placed close together with a non-conductive insulating medium in between constitute a capacitor. When a voltage is applied between the two plates of a capacitor, the capacitor stores charge. The capacitance of a capacitor is numerically equal to the ratio of the charge on one plate to the voltage between the two plates. The basic unit of capacitance is the farad. In circuit diagrams, the capacitor element is usually represented by the letter C. Capacitors are commonly used electronic components.

[0003] The materials used to wrap the outside of existing capacitors are not conducive to heat dissipation, which affects their use. Furthermore, prolonged use at high temperatures may cause explosions, posing certain safety hazards. Therefore, those skilled in the art have provided a dustproof housing for microcapacitors to solve the problems mentioned in the background art. Utility Model Content

[0004] The purpose of this invention is to provide a dustproof housing for a microcapacitor to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A dustproof housing for a microcapacitor includes a mounting base, a microcapacitor protection component, and a microcapacitor heat dissipation component. The inner wall of the mounting base has internal threads, and the outer surface of the mounting base is fitted with annularly arranged mounting plates. Each mounting plate has a mounting hole on its upper surface, and the inner bottom wall of the mounting base is fitted with a vibration damping pad.

[0007] As a further embodiment of this utility model: the microcapacitor protection component includes a microcapacitor protection shell, and the outer surface of the microcapacitor protection shell is equipped with annularly arranged heat dissipation fins.

[0008] As a further improvement of this utility model: the outer surface of the microcapacitor protective shell is provided with a ring of heat dissipation windows, and the inner wall of each heat dissipation window is equipped with a dustproof mesh.

[0009] As a further improvement of this utility model: the microcapacitor heat dissipation component includes two vertical beams, and the upper surfaces of the two vertical beams are connected to the microcapacitor protective shell.

[0010] As a further improvement of this utility model: a crossbeam is installed on the upper surface of both vertical beams, and a positioning clamp is installed on the side of the two crossbeams that are close to each other.

[0011] As a further improvement of this utility model: protective pads are installed on the sides of the two positioning clips that are close to each other, and cooling fans are installed on the two positioning clips together by two sets of screws.

[0012] As a further improvement of this utility model: inclined plates are installed on the sides of the two vertical beams that are close to each other, and the upper surfaces of the two inclined plates are connected to the horizontal beam.

[0013] As a further improvement of this utility model: each of the mounting holes has an mounting screw installed on its inner wall, and the internal thread is compatible with the external thread.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] The dustproof housing of this microcapacitor is connected to the external thread of the microcapacitor protective shell via internal threads. The detachable design facilitates the installation and maintenance of the microcapacitor. The annular mounting plate and mounting holes, along with screws, make the housing more secure. The heat dissipation fins on the outside of the microcapacitor protective shell increase the heat dissipation area. The heat dissipation window, combined with a dustproof mesh, can utilize air convection for heat dissipation while preventing dust from entering and ensuring internal cleanliness. The positioning clip, along with the protective pad, secures the cooling fan. Active cooling can accelerate air circulation and improve heat dissipation efficiency. This design combines passive and active cooling, allowing the microcapacitor to operate in a dustproof and well-ventilated environment. It effectively prevents dust accumulation from affecting performance, extends service life, and also provides structural stability and convenient installation. Attached Figure Description

[0016] Figure 1 A three-dimensional structural diagram of a dustproof housing for a microcapacitor;

[0017] Figure 2 A side view of a dustproof housing for a microcapacitor;

[0018] Figure 3 A top view of a dustproof housing for a microcapacitor;

[0019] Figure 4 A bottom view of a dustproof housing for a microcapacitor;

[0020] Figure 5 This is a side sectional view of a microcapacitor protective shell within a dustproof housing for a microcapacitor.

[0021] In the diagram: 1. Mounting base; 2. Microcapacitor protection assembly; 201. Microcapacitor protective shell; 202. Heat dissipation window; 203. Dustproof mesh; 204. External thread; 205. Heat dissipation fins; 3. Microcapacitor heat dissipation assembly; 301. Vertical beam; 302. Horizontal beam; 303. Positioning clip; 304. Protective pad; 305. Cooling fan; 306. Sloping plate; 4. Mounting plate; 5. Mounting hole; 6. Mounting screw; 7. Internal thread; 8. Vibration damping pad. Detailed Implementation

[0022] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] Please see Figures 1-5 In this embodiment of the present invention, a dustproof housing for a microcapacitor includes a mounting base 1, a microcapacitor protection component 2, and a microcapacitor heat dissipation component 3. The inner wall of the mounting base 1 is provided with an internal thread 7, and the outer surface of the mounting base 1 is provided with a ring of mounting plates 4. Each mounting plate 4 has a mounting hole 5 on its upper surface. The inner bottom wall of the mounting base 1 is provided with a vibration damping pad 8. Active heat dissipation can accelerate air circulation and improve heat dissipation efficiency. This design combines passive heat dissipation with active heat dissipation, enabling the microcapacitor to operate in a dustproof and heat-dissipating environment. This solves the problem mentioned in the background art that the material wrapped around the outside of the existing capacitor is not conducive to heat dissipation, affecting its use, and that prolonged high-temperature use may cause explosion, posing certain safety hazards.

[0025] The microcapacitor protection component 2 includes a microcapacitor protective shell 201. The outer surface of the microcapacitor protective shell 201 is equipped with annularly arranged heat dissipation fins 205. The outer surface of the microcapacitor protective shell 201 has annularly arranged heat dissipation windows 202. Each heat dissipation window 202 has a dustproof mesh 203 installed on its inner wall. The microcapacitor heat dissipation component 3 includes two vertical beams 301. The upper surfaces of the two vertical beams 301 are connected to the microcapacitor protective shell 201. A horizontal beam 302 is installed on the upper surfaces of both vertical beams 301. Positioning clips 303 are installed on the sides of the two horizontal beams 302 that are close to each other. This not only prevents external dust from affecting the normal operation of the microcapacitor but also improves the heat dissipation effect of the equipment on the microcapacitor.

[0026] Protective pads 304 are installed on the side of the two positioning clips 303 that are close to each other. The cooling fan 305 is installed on the two positioning clips 303 together by two sets of screws. Inclined plates 306 are installed on the side of the two vertical beams 301 that are close to each other. The upper surfaces of the two inclined plates 306 are connected to the horizontal beam 302. The inner wall of each mounting hole 5 is equipped with mounting screws 6. The internal threads 7 are compatible with the external threads 204. This not only protects the cooling fan 305, but also greatly increases the stability of the cooling fan 305.

[0027] The working principle of this utility model is as follows: First, the mounting base 1 and the microcapacitor protective shell 201 are installed through the internal thread 7 and the external thread 204. The heat dissipation fins 205 on the outside of the microcapacitor protective shell 201 increase the heat dissipation area. The heat dissipation window 202, together with the dustproof net 203, can not only allow air circulation to remove the working heat of the microcapacitor, but also prevent dust from entering the interior of the microcapacitor protective shell 201. The positioning clip 303 fixes the cooling fan 305 with screws. The protective pad 304 prevents damage to the cooling fan 305 during installation. The inclined plate 306 connects the vertical beam 301 and the horizontal beam 302 to enhance the structural stability. When the cooling fan 305 is working, it forces air to flow in from the heat dissipation window 202 and blows air onto the heat dissipation fins 205. After removing heat around the microcapacitor, the air is discharged, accelerating the air circulation and improving the heat dissipation efficiency.

[0028] The above description is merely a preferred embodiment of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalent elements of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A dustproof housing for a microcapacitor, comprising a mounting base (1), a microcapacitor protection assembly (2), and a microcapacitor heat dissipation assembly (3), characterized in that, The inner wall of the mounting base (1) is provided with an internal thread (7), and the outer surface of the mounting base (1) is provided with a ring of mounting plates (4). Each mounting plate (4) has a mounting hole (5) on its upper surface, and the inner bottom wall of the mounting base (1) is provided with a vibration damping pad (8).

2. The dustproof housing for a microcapacitor according to claim 1, characterized in that, The microcapacitor protection component (2) includes a microcapacitor protection shell (201), and the outer surface of the microcapacitor protection shell (201) is equipped with annularly arranged heat dissipation fins (205).

3. The dustproof housing for a microcapacitor according to claim 2, characterized in that, The outer surface of the microcapacitor protective shell (201) is provided with a ring of heat dissipation windows (202), and each heat dissipation window (202) is equipped with a dustproof mesh (203) on its inner wall.

4. The dustproof housing for a microcapacitor according to claim 1, characterized in that, The microcapacitor heat dissipation assembly (3) includes two vertical beams (301), the upper surfaces of which are connected to the microcapacitor protective shell (201).

5. The dustproof housing for a microcapacitor according to claim 4, characterized in that, A crossbeam (302) is installed on the upper surface of each of the two vertical beams (301), and a positioning clip (303) is installed on the side of each of the two crossbeams (302) that are close to each other.

6. The dustproof housing for a microcapacitor according to claim 5, characterized in that, Protective pads (304) are installed on the side of the two positioning clips (303) that are close to each other, and cooling fans (305) are installed on the two positioning clips (303) together by two sets of screws.

7. The dustproof housing for a microcapacitor according to claim 4, characterized in that, An inclined plate (306) is installed on one side of each of the two vertical beams (301) that are close to each other, and the upper surface of the two inclined plates (306) is connected to the horizontal beam (302).

8. The dustproof housing for a microcapacitor according to claim 1, characterized in that, Each of the mounting holes (5) has a mounting screw (6) installed on its inner wall, and the internal thread (7) is adapted to the external thread (204).