A portable Bluetooth communication module

Abstract

This utility model relates to the field of Bluetooth communication module technology, and discloses a portable Bluetooth communication module, including a base plate and a PCB board. The top of the base plate is provided with a waterproof mechanism for waterproofing. The top of the PCB board is provided with a Bluetooth communication mechanism for Bluetooth communication. The waterproof mechanism includes a buffer layer, the bottom of which is fixedly connected to the top of the base plate. A waterproof outer shell is provided on the top of the buffer layer, and a heat dissipation layer is fixedly connected to the inner wall of the waterproof outer shell. A connection hole is provided at each of the four corners of the top of the buffer layer. A connecting component is provided on the top of the base plate. In this utility model, the bottom of the buffer layer is fixed to the base plate, the connecting component passes through the connection hole in the buffer layer, and the sealing component fits against the bottom edge of the waterproof outer shell after installation. The waterproof component contacts the top of the base plate.

Description

Technical Field

[0001] This utility model relates to the field of Bluetooth communication module technology, and in particular to a portable Bluetooth communication module. Background Technology

[0002] A portable Bluetooth communication module is a modular electronic component that integrates Bluetooth wireless communication functionality and features portability and mobility. Its function is to enable short-range wireless data transmission between different devices, making it suitable for smart devices that require flexible deployment and use in mobile scenarios.

[0003] Existing devices directly solder the Bluetooth chip to the center of the PCB board, with RF circuitry and peripheral interfaces compactly arranged around it. The power management chip is adjacent to the battery interface to reduce power line losses. At the same time, a low-power wake-up circuit is integrated to ensure the module's current during standby. External devices send data to the module's Bluetooth chip through the interface. The Bluetooth chip encodes the data and converts it into a wireless signal. The RF circuit transmits the encoded signal through the antenna. If bidirectional communication is required, the antenna receives the signal, amplifies it through the RF circuit, decodes it through the Bluetooth chip, and then transmits it to the external device through the peripheral interface.

[0004] However, in pursuit of thinness, ease of installation, and quick relocation, existing devices lack adequate external protection and waterproofing. This means that during installation and relocation, collisions and liquid ingress can cause components to malfunction and even become damaged. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a portable Bluetooth communication module, which aims to improve the problem in the prior art where, in pursuit of thinness, ease of installation and quick movement, the device lacks corresponding external protection and waterproofing, resulting in the device being unable to receive Bluetooth signals properly or even being damaged due to collisions and liquid immersion during installation and movement.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a portable Bluetooth communication module, comprising a base plate and a PCB board, wherein a waterproof mechanism is provided on the top of the base plate for waterproofing, and a Bluetooth communication mechanism is provided on the top of the PCB board for Bluetooth communication.

[0007] The waterproof mechanism includes a buffer layer, the bottom of which is fixedly connected to the top of the base plate. A waterproof outer shell is provided on the top of the buffer layer. A heat dissipation layer is fixedly connected to the inner wall of the waterproof outer shell. A connection hole is provided at each of the four corners of the top of the buffer layer. A connecting component is provided on the top of the base plate. A sealing component is provided around the top of the base plate. A waterproof component is provided at the bottom of the waterproof outer shell. A fixing component is provided at the bottom of the base plate.

[0008] As a further description of the above technical solution:

[0009] The Bluetooth communication mechanism includes a Bluetooth chip, the bottom of which is fixedly connected to the top front side of the PCB board. A ceramic patch antenna is fixedly connected to the top left side of the PCB board, a power management chip is fixedly connected to the top right side of the PCB board, a communication pin is fixedly connected to the top right end of the PCB board, and connection holes are provided at the four corners of the top of the PCB board. An external component is provided on the right side of the PCB board, and a protective component is provided on the right side of the communication pin.

[0010] As a further description of the above technical solution:

[0011] The connecting assembly includes multiple magnetic bases, the bottoms of which are fixedly connected to the four corners of the top of the base plate, and magnetic blocks are slidably connected to the top of each of the multiple magnetic bases.

[0012] As a further description of the above technical solution:

[0013] The sealing assembly includes a rubber ring, the bottom of which is fixedly connected to the top periphery of the base plate, and a rubber groove is formed on the top of the rubber ring.

[0014] As a further description of the above technical solution:

[0015] The waterproof component includes a sealing ring, the outer wall of which is fixedly connected to the inside of the right side of the waterproof housing, and rubber protrusions are fixedly connected to the bottom perimeter of the waterproof housing.

[0016] As a further description of the above technical solution:

[0017] The fixing component includes multiple screws, the outer walls of which are threaded to the four corners of the bottom of the base plate, and screw holes are provided at the four corners of the bottom of the waterproof shell.

[0018] As a further description of the above technical solution:

[0019] The external component includes an external device, the left side of which is fixedly connected to the right side of the communication pin, and the right side of which is fixedly connected to an external interface.

[0020] As a further description of the above technical solution:

[0021] The protective component includes an external cap, the interior of which is slidably connected to the outer wall of the external interface, and an elastic layer is fixedly connected to the interior of the external cap.

[0022] This utility model has the following beneficial effects:

[0023] 1. In this utility model, the bottom of the buffer layer is fixed to the base plate, the connecting component passes through the connecting hole one of the buffer layer, the sealing component is attached to the bottom edge of the waterproof shell after the waterproof shell is installed, the waterproof component is in contact with the top of the base plate, the heat dissipation layer is attached to the inner wall of the waterproof shell and in contact with the internal components, and the fixing component is installed at the bottom of the base plate, thus realizing double waterproof protection for the module, effectively blocking the infiltration of external liquids, while providing buffer protection and reducing damage to the internal components caused by movement or collision.

[0024] 2. In this utility model, the Bluetooth chip is fixed to the top of the PCB board, the ceramic patch antenna is connected to the Bluetooth chip through the internal circuitry of the PCB board, the power management chip supplies power to the Bluetooth chip, ceramic patch antenna and communication pin through the circuitry of the PCB board, the communication pin is connected to the external component, the protective component covers the right side of the communication pin, and the PCB board is fixed by the second connection hole, thus realizing stable Bluetooth wireless communication, which can efficiently transmit and receive wireless signals, and meets the diverse data transmission needs of the module as a whole, improving the reliability of use. Attached Figure Description

[0025] Figure 1 This is a perspective view of a portable Bluetooth communication module proposed in this utility model.

[0026] Figure 2 This is a front view of a portable Bluetooth communication module proposed in this utility model;

[0027] Figure 3 This is an exploded view of the waterproof mechanism in a portable Bluetooth communication module proposed in this utility model;

[0028] Figure 4 This is a split view of the Bluetooth communication mechanism in a portable Bluetooth communication module proposed in this utility model;

[0029] Figure 5 This is an exploded view of the fixed component in a portable Bluetooth communication module proposed in this utility model.

[0030] Legend:

[0031] 1. Base plate; 2. PCB board; 3. Waterproof mechanism; 31. Buffer layer; 32. Waterproof shell; 33. Heat dissipation layer; 34. Connection hole one; 35. Connection component; 351. Magnetic base; 352. Magnetic block; 36. Sealing component; 361. Rubber ring; 362. Rubber groove; 37. Waterproof component; 371. Sealing ring; 372. Rubber protrusion; 38. Fixing component; 381. Screw; 382. Screw hole; 4. Bluetooth communication mechanism; 41. Bluetooth chip; 42. Ceramic patch antenna; 43. Power management chip; 44. Communication pin; 45. Connection hole two; 46. External component; 461. External device; 462. External interface; 47. Protective component; 471. External cap; 472. Elastic layer. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Reference Figure 1 , Figure 3 and Figure 5 The present invention provides an embodiment of a portable Bluetooth communication module, comprising a base plate 1 and a PCB board 2. A waterproof mechanism 3 is provided on the top of the base plate 1 for waterproofing, and a Bluetooth communication mechanism 4 is provided on the top of the PCB board 2 for Bluetooth communication.

[0034] The waterproof mechanism 3 includes a buffer layer 31, the bottom of which is fixedly connected to the top of the base plate 1. A waterproof outer shell 32 is provided on the top of the buffer layer 31. A heat dissipation layer 33 is fixedly connected to the inner wall of the waterproof outer shell 32. Connection holes 34 are provided at the four corners of the top of the buffer layer 31. A connecting component 35 is provided on the top of the base plate 1. A sealing component 36 is provided around the top of the base plate 1. A waterproof component 37 is provided at the bottom of the waterproof outer shell 32. A fixing component 38 is provided at the bottom of the base plate 1.

[0035] Specifically, during the module assembly and waterproofing implementation phase, the bottom of the buffer layer 31 is fixedly connected to the top of the base plate 1. Connecting components 35 pass through the connecting holes 34 at the four corners of the top of the buffer layer 31 to prevent displacement or detachment of the module due to movement. Simultaneously, the structural characteristics of the buffer layer 31 provide cushioning protection for the internal components of the waterproof outer shell 32. After the waterproof outer shell 32 is installed, the sealing components 36 around the top of the base plate 1 fit tightly against the bottom edge of the waterproof outer shell 32. Through the structural design of the sealing components 36, external liquids are prevented from seeping into the module through the edge gaps between the base plate 1 and the waterproof outer shell 32, achieving initial sealing protection. The waterproof component 37 at the bottom of the waterproof outer shell 32 is in direct contact with the top surface of the base plate 1. The waterproof component 37 and the sealing component 36 further block the liquid entry path from the bottom contact surface between the base plate 1 and the waterproof shell 32, achieving a double waterproof effect for the module. The heat dissipation layer 33, which is fixedly connected to the inner wall of the waterproof shell 32, conducts heat generated by the PCB board 2 and the Bluetooth communication mechanism 4 to the waterproof shell 32 during the operation of the module through the heat dissipation layer 33 in contact with the PCB board 2 and the Bluetooth communication mechanism 4. The waterproof shell 32 then dissipates the heat to the external environment. Through the action of the heat dissipation layer 33 and the waterproof shell 32, the heat dissipation function inside the module is realized, preventing heat accumulation from affecting the operation of the component. The fixing component 38 at the bottom of the base plate 1 realizes the fixed connection between the buffer layer 31 and the waterproof shell 32.

[0036] Reference Figure 1 , Figure 2 and Figure 4 The Bluetooth communication mechanism 4 includes a Bluetooth chip 41. The bottom of the Bluetooth chip 41 is fixedly connected to the top front side of the PCB board 2. A ceramic patch antenna 42 is fixedly connected to the top left side of the PCB board 2. A power management chip 43 is fixedly connected to the top right side of the PCB board 2. A communication pin 44 is fixedly connected to the top right end of the PCB board 2. Connection holes 45 are provided at the four corners of the top of the PCB board 2. An external component 46 is provided on the right side of the PCB board 2. A protective component 47 is provided on the right side of the communication pin 44.

[0037] Specifically, during the assembly and functional implementation phase of the Bluetooth communication mechanism 4, the bottom of the Bluetooth chip 41 is fixedly connected to the top front side of the PCB board 2. The connection holes 45 at the four corners of the top of the PCB board 2 can be fixed by the connecting component 35 and the base plate 1, achieving stable installation of the PCB board 2 inside the module and preventing the PCB board 2 from shifting position in moving scenarios. The ceramic patch antenna 42 on the top left side of the PCB board 2 is connected to the Bluetooth chip 41 through the internal circuitry of the PCB board 2. When the Bluetooth chip 41 needs to send a wireless signal, the Bluetooth chip 41 transmits the processed electrical signal. The ceramic patch antenna 42 converts electrical signals into wireless signals and transmits them outwards. When it is necessary to receive external wireless signals, the ceramic patch antenna 42 receives the external wireless signals, converts them back into electrical signals, and then transmits them to the Bluetooth chip 41. Through the signal conversion between the ceramic patch antenna 42 and the Bluetooth chip 41, wireless signal transmission and reception are achieved. The power management chip 43 on the top right side of the PCB board 2 is connected to the Bluetooth chip 41, the ceramic patch antenna 42, and the communication pin 44 through the circuitry of the PCB board 2. After receiving external power, the power management chip 43 regulates and... The power supply is distributed to the Bluetooth chip 41, ceramic patch antenna 42, and communication pin 44 respectively. Through the power management chip 43 and the power transmission between the chip and each component, a stable power supply is ensured for each component. The communication pin 44 on the top right of the PCB board 2 is connected to the Bluetooth chip 41 via a circuit. A protective component 47 is installed on the right side of the communication pin 44, covering the right side of the pin. The design of the protective component 47 prevents external impurities or forces from directly impacting the communication pin 44, thus protecting it. The right side of the PCB board 2 is... An external component 46 is provided, which is connected to a communication pin 44. When the module needs to perform wired data interaction with an external device, the external component 46 interfaces with the external device, and the data from the external device is transmitted to the communication pin 44 through the external component 46. The communication pin 44 then transmits the data to the Bluetooth chip 41. The data to be transmitted after being processed by the Bluetooth chip 41 is transmitted to the external component 46 through the communication pin 44, and the external component 46 then transmits the data to the external device, realizing wired data interaction between the module and the external device, supplementing the Bluetooth wireless communication function, and expanding the module's data interaction methods.

[0038] Reference Figure 1 , Figure 2 and Figure 3The connecting component 35 includes multiple magnetic bases 351, the bottoms of which are fixedly connected to the four corners of the top of the base plate 1. Magnetic blocks 352 are slidably connected to the top of each of the multiple magnetic bases 351. The sealing component 36 includes a rubber ring 361, the bottom of which is fixedly connected to the top periphery of the base plate 1. A rubber groove 362 is provided on the top of the rubber ring 361. The waterproof component 37 includes a sealing ring 371, the outer wall of which is fixedly connected to the inside right side of the waterproof outer shell 32. Rubber protrusions 372 are fixedly connected to the bottom periphery of the waterproof outer shell 32.

[0039] Specifically, during the module assembly and waterproof sealing phase, the bottoms of multiple magnetic bases 351 in the connecting component 35 are fixedly connected to the four corners of the top of the base plate 1. Each magnetic base 351 has a slidably connected magnetic block 352. When the PCB board 2 needs to be connected to the base plate 1, the bottom of the PCB board 2 is pressed down to the position corresponding to the magnetic block 352. The magnetic block 352 slides on the top of the magnetic base 351 and generates a magnetic attraction force with it. Through the magnetic attraction between the magnetic base 351 and the magnetic block 352, the PCB board 2 is fixed to the base plate 1, preventing the PCB board 2 from shifting during assembly. The bottom of the rubber ring 361 in the sealing component 36 is fixedly connected to the top perimeter of the base plate 1. The top of the rubber ring 361 has a rubber groove 362. Rubber protrusions 372 are fixedly connected to the bottom perimeter of the waterproof outer shell 32 in the waterproof component 37. During the fixing of the waterproof outer shell 32 to the base plate 1, the waterproof outer shell 37 provides waterproof sealing. The rubber protrusion 372 at the bottom of the waterproof housing 32 gradually embeds into the rubber groove 362 at the top of the rubber ring 361. The rubber protrusion 372 and the rubber groove 362 fit tightly together. Through the interlocking action of the rubber protrusion 372 and the rubber groove 362, external liquid is prevented from seeping into the gap between the bottom plate 1 and the bottom edge of the waterproof housing 32, thus achieving the first layer of sealing protection for the module. The outer wall of the sealing ring 371 in the waterproof component 37 is fixedly connected to the inside of the right side of the waterproof housing 32. When the waterproof housing 32 is completely fastened to the top of the bottom plate 1, the inner wall of the sealing ring 371 is in close contact with the right side surface of the PCB board 2. The sealing ring 371 fills the gap between the inside of the right side of the waterproof housing 32 and the PCB board 2. Through the fitting action of the sealing ring 371 and the PCB board 2, external liquid is prevented from seeping into the contact point between the right side of the waterproof housing 32 and the PCB board 2, thus achieving the second layer of sealing protection for the module. This achieves both stable assembly of the various components of the module and a double waterproof sealing effect for the module.

[0040] Reference Figure 1 , Figure 4 and Figure 5The fixing component 38 includes multiple screws 381, the outer walls of which are threaded to the four corners of the bottom of the base plate 1. The waterproof housing 32 has screw holes 382 at the four corners of the bottom. The external component 46 includes an external device 461, the left side of which is fixedly connected to the right side of the communication pin 44. The right side of the external device 461 is fixedly connected to an external interface 462. The protective component 47 includes an external cap 471, the inside of which is slidably connected to the outer wall of the external interface 462. An elastic layer 472 is fixedly connected inside the external cap 471.

[0041] Specifically, during the module fixing and installation phase, the outer walls of multiple screws 381 in the fixing component 38 are threaded to the four corners of the bottom of the base plate 1. Each of the four corners of the bottom of the waterproof housing 32 has a screw hole 382. The screws 381 are passed through the base plate 1 and aligned with the screw holes 382 on the bottom of the waterproof housing 32. Rotating the screws 381 causes the outer wall of the screw 381 to engage with the inner thread of the screw hole 382. Through the action of the screws 381 and the screw holes 382, ​​the connection between the waterproof housing 32 and the base plate 1 is reinforced, preventing damage to the waterproof housing due to vibration during module movement. The outer casing 32 is separated from the base plate 1. During the external data interaction phase of the module, the left side of the external device 461 in the external component 46 is fixedly connected to the right side of the communication pin 44. The right side of the external device 461 is fixedly connected to the external interface 462. When the module needs to perform wired data transmission with an external device, the connection cable of the external device is inserted into the external interface 462. The data of the external device is transmitted to the external device 461 through the external interface 462. The external device 461 transmits the data to the communication pin 44, and the communication pin 44 then transmits the data to the Bluetooth chip 41. The data to be transmitted after processing by chip 41 is transmitted to external device 461 through communication pin 44. External device 461 sends the data to external devices via external interface 462, realizing wired data interaction between the module and external devices, supplementing the Bluetooth wireless communication function. During the interface protection phase, the outer cover 471 in the protection component 47 is slidably connected to the outer wall of the external interface 462. An elastic layer 472 is fixedly connected inside the outer cover 471. When the module does not need external data interaction, the outer cover 471 is pushed to cover the external interface 462 with its outer wall. The elastic layer 472 is tightly fitted inside the outer cap 471 and the outer wall of the outer interface 462. Through the fit between the elastic layer 472 and the outer interface 462, external dust and liquid are prevented from entering the outer interface 462. When the outer interface 462 needs to be used, the outer cap 471 is pulled to slide along the outer wall of the outer interface 462, exposing the outer interface 462 so that the external connection cable can be inserted. Through the cooperation between the outer cap 471 and the elastic layer 472, the outer interface 462 is protected when not in use, ensuring the long-term stable use of the external component 46.

[0042] Working Principle: During the module assembly startup phase, the basic structure is first built. The bottom of the buffer layer 31 is fixedly connected to the top of the base plate 1. The connecting component 35 passes through the connecting holes 34 at the four corners of the top of the buffer layer 31. Through the cooperation of the connecting component 35 and the connecting holes 34, the buffer layer 31 is fixedly connected to the PCB board 2. At the same time, the structural characteristics of the buffer layer 31 can form a buffer protection for the internal components of the waterproof shell 32, preventing damage to the module due to collisions during subsequent movement or assembly. The outer walls of multiple screws 381 in the fixing component 38 are threaded to the four corners of the bottom of the base plate 1. Each of the four corners of the bottom of the waterproof shell 32 has a screw hole 382. The screw 381 is passed through the base plate 1 and aligned with the screw hole 382 at the bottom of the waterproof shell 32. The screw 381 is rotated so that the outer wall of the screw 381 engages with the inner wall of the screw hole 382. Through the action of the screw 381 and the screw hole 382, ​​the waterproof shell 32 is prevented from being damaged by vibration during the movement of the module. The shell 32 is separated from the base plate 1 to ensure the module maintains structural stability in mobile scenarios and prevent the module from shifting or falling off due to movement. Then, the PCB board 2 is installed. The bottom of the Bluetooth chip 41 in the Bluetooth communication mechanism 4 is fixedly connected to the top front side of the PCB board 2. The connection holes 45 at the four corners of the top of the PCB board 2 are fixed to the base plate 1 through the connecting component 35. The bottoms of multiple magnetic bases 351 in the connecting component 35 are fixedly connected to the four corners of the top of the base plate 1 respectively. The tops of multiple magnetic bases 351 are slidably connected to magnetic blocks 352. When the bottom of the PCB board 2 is pressed down to the position corresponding to the magnetic block 352, the magnetic block 352 slides on the top of the magnetic base 351 and generates a magnetic attraction force with the magnetic base 351. Through the magnetic attraction between the magnetic base 351 and the magnetic block 352, the PCB board 2 is fixed to the base plate 1 to prevent the PCB board 2 from shifting during the assembly process. Finally, the stable installation of the PCB board 2 inside the module is completed.

[0043] After the PCB board 2 is installed, the waterproof sealing function is implemented. The sealing components 36 around the top of the base plate 1 are tightly fitted to the bottom edge of the waterproof housing 32 after the waterproof housing 32 is installed. The bottom of the rubber ring 361 in the sealing component 36 is fixedly connected to the top periphery of the base plate 1. A rubber groove 362 is provided on the top of the rubber ring 361. Rubber protrusions 372 are fixedly connected to the bottom periphery of the waterproof housing 32 in the waterproof component 37. During the fixing of the waterproof housing 32 to the base plate 1, the rubber protrusions 372 at the bottom of the waterproof housing 32 gradually embed into the rubber grooves 362 at the top of the rubber ring 361. The rubber protrusions 372 and the rubber grooves 362 fit tightly together. Through the interlocking action of the rubber protrusions 372 and the rubber grooves 362, external liquid is prevented from seeping into the module from the gap between the bottom edge of the base plate 1 and the waterproof housing 32, achieving the first layer of sealing protection for the module. The outer wall of the sealing ring 371 in the waterproof component 37 is fixedly connected to the inside right side of the waterproof housing 32. When the waterproof housing 32 is completely sealed... After being fully fastened to the top of the base plate 1, the inner wall of the sealing ring 371 is in close contact with the right side surface of the PCB board 2. The sealing ring 371 fills the gap between the inside of the right side of the waterproof shell 32 and the PCB board 2. Through the adhesion between the sealing ring 371 and the PCB board 2, external liquid is prevented from seeping in from the contact point between the right side of the waterproof shell 32 and the PCB board 2, thus achieving the second layer of sealing protection for the module. The bottom contact surface between the base plate 1 and the waterproof shell 32 further blocks the liquid entry path, achieving a double waterproof sealing effect for the module. At the same time, the heat dissipation layer 33, which is fixedly connected to the inner wall of the waterproof shell 32, begins to play its role. During the subsequent operation of the module, the heat generated by the operation of the PCB board 2 and the Bluetooth communication mechanism 4 is conducted to the waterproof shell 32 through the heat conduction contact between the heat dissipation layer 33 and the PCB board 2 and the Bluetooth communication mechanism 4. The heat is then dissipated to the external environment by the waterproof shell 32. Through the action of the heat dissipation layer 33 and the waterproof shell 32, the heat dissipation function inside the module is achieved, avoiding heat accumulation that may affect the operation of the components.

[0044] The Bluetooth communication function is then implemented. The ceramic patch antenna 42 on the top left of PCB 2 is connected to the Bluetooth chip 41 through the internal circuitry of PCB 2. When the Bluetooth chip 41 needs to send a wireless signal, it transmits the processed electrical signal to the ceramic patch antenna 42, which converts the electrical signal into a wireless signal and transmits it outward. When it needs to receive an external wireless signal, the ceramic patch antenna 42 receives the external wireless signal, converts it into an electrical signal, and then transmits it to the Bluetooth chip 41. Through the signal conversion cooperation between the ceramic patch antenna 42 and the Bluetooth chip 41, the transmission and reception of wireless signals are realized. During this process, the power management chip 43 on the top right of PCB 2 is connected to the Bluetooth chip 41, the ceramic patch antenna 42, and the communication pin 44 through the circuitry of PCB 2. After receiving external power, the power management chip 43 regulates and distributes the power, providing appropriate power to the Bluetooth chip 41, the ceramic patch antenna 42, and the communication pin 44. Through the cooperation of the power management chip 43 and the power transmission of each power-consuming component, the stable power supply of each component is ensured, providing power support for the continuous implementation of the Bluetooth communication function.

[0045] While the Bluetooth communication function is implemented, the module's external data interaction function is also ready. An external component 46 is set on the right side of the PCB board 2. The external component 46 is connected to the communication pin 44. The left side of the external device 461 in the external component 46 is fixedly connected to the right side of the communication pin 44. An external interface 462 is fixedly connected to the right side of the external device 461. When the module needs to perform wired data interaction with an external device, the connection cable of the external device is inserted into the external interface 462. The data of the external device is transmitted to the external device 461 through the external interface 462. The external device 461 transmits the data to the communication pin 44. The communication pin 44 then transmits the data to the Bluetooth chip 41. The data to be transmitted after being processed by the Bluetooth chip 41 is transmitted to the external device 461 through the communication pin 44. The external device 461 sends the data to the external device through the external interface 462, realizing wired data interaction between the module and the external device, supplementing the Bluetooth wireless communication function, and expanding the module's data interaction methods.

[0046] In the protective component 47, the outer cap 471 is internally slidably connected to the outer wall of the outer interface 462. An elastic layer 472 is fixedly connected inside the outer cap 471. When the module does not require external data interaction, the outer cap 471 is pushed so that its outer wall covers the outer interface 462. The elastic layer 472 fits tightly against the outer wall of the outer interface 462 inside the outer cap 471. Through the fit between the elastic layer 472 and the outer interface 462, external dust and liquid are prevented from entering the outer interface 462. When the outer interface 462 needs to be used, the outer cap 471 is pulled so that it slides along the outer wall of the outer interface 462, exposing the outer interface 462 so that an external connection cable can be inserted. Through the cooperation between the outer cap 471 and the elastic layer 472, the outer interface 462 is protected in the non-use state, ensuring the long-term stable use of the external component 46 until the module completes all preset work tasks, and the entire workflow ends.

[0047] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A mobile Bluetooth communication module, comprising a bottom plate (1) and a PCB plate (2), characterized in that: The top of the base plate (1) is provided with a waterproof mechanism (3), which is used for waterproofing. The top of the PCB board (2) is provided with a Bluetooth communication mechanism (4), which is used for Bluetooth communication. The waterproof mechanism (3) includes a buffer layer (31), the bottom of which is fixedly connected to the top of the base plate (1). A waterproof shell (32) is provided on the top of the buffer layer (31). A heat dissipation layer (33) is fixedly connected to the inner wall of the waterproof shell (32). A connection hole (34) is provided at each of the four corners of the top of the buffer layer (31). A connection component (35) is provided on the top of the base plate (1). A sealing component (36) is provided around the top of the base plate (1). A waterproof component (37) is provided at the bottom of the waterproof shell (32). A fixing component (38) is provided at the bottom of the base plate (1).

2. The mobile Bluetooth communication module of claim 1, wherein: The Bluetooth communication mechanism (4) includes a Bluetooth chip (41). The bottom of the Bluetooth chip (41) is fixedly connected to the top front side of the PCB board (2). A ceramic patch antenna (42) is fixedly connected to the top left side of the PCB board (2). A power management chip (43) is fixedly connected to the top right side of the PCB board (2). A communication pin (44) is fixedly connected to the top right end of the PCB board (2). A connection hole (45) is provided at each of the four corners of the top of the PCB board (2). An external component (46) is provided on the right side of the PCB board (2). A protective component (47) is provided on the right side of the communication pin (44).

3. The mobile Bluetooth communication module of claim 1, wherein: The connecting component (35) includes multiple magnetic bases (351), the bottoms of which are fixedly connected to the four corners of the top of the base plate (1), and magnetic blocks (352) are slidably connected to the tops of the multiple magnetic bases (351).

4. The mobile Bluetooth communication module of claim 1, wherein: The sealing assembly (36) includes a rubber ring (361), the bottom of which is fixedly connected to the top periphery of the base plate (1), and a rubber groove (362) is provided on the top of the rubber ring (361).

5. The mobile Bluetooth communication module of claim 1, wherein: The waterproof component (37) includes a sealing ring (371), the outer wall of which is fixedly connected to the inside of the right side of the waterproof housing (32), and rubber protrusions (372) are fixedly connected around the bottom of the waterproof housing (32).

6. The mobile Bluetooth communication module of claim 1, wherein: The fixing component (38) includes a plurality of screws (381), the outer walls of which are threaded to the four corners of the bottom of the base plate (1), and screw holes (382) are provided at the four corners of the bottom of the waterproof outer shell (32).

7. The mobile Bluetooth communication module of claim 2, wherein: The external component (46) includes an external device (461), the left side of which is fixedly connected to the right side of the communication pin (44), and the right side of which is fixedly connected to an external interface (462).

8. The mobile Bluetooth communication module of claim 7, wherein: The protection assembly (47) comprises an outer cap (471), an inner part of the outer cap (471) is slidingly connected to an outer wall of the outer port (462), and an elastic layer (472) is fixedly connected to the inner part of the outer cap (471).

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