wafer heater

Abstract

This invention provides a wafer heater, including a support, a heating assembly, and a heating stage at the top of the support. The support has a mounting cavity. The heating assembly includes a heating part embedded within the heating stage and a heat dissipation part passing through the mounting cavity. The heating part and the heat dissipation part are fixedly connected. The heating part extends outward in a spiral manner from its center point, forming a spiral structure within the same plane. Compared with existing technologies, this invention, by employing a spiral heating part, increases the surface area by 30%-50% compared to a straight heating wire, thus improving heating efficiency. Secondly, the heating part extends outward in a spiral manner from its center point, forming a radial heat flow path, effectively improving the surface temperature uniformity of the heating stage to meet the stringent requirements of semiconductor processes. Finally, the spiral structure within the same plane ensures that the heating distance between the heat source and the wafer remains consistent, improving heating uniformity.

Description

Technical Field

[0001] This utility model relates to the field of heater equipment technology, and in particular to a wafer heater. Background Technology

[0002] A wafer is a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers, thus creating integrated circuit products with specific electrical functions. During the fabrication process, the wafer sometimes needs to be heated by a heater. For example, in thin film deposition processes, the wafer needs to be uniformly heated to ensure high-precision reactions and thin film formation on the substrate surface.

[0003] Traditional heaters generally use a linear heating wire structure, which has many drawbacks. On the one hand, the surface area of ​​a linear heating wire is limited, and the heat conduction path is singular, resulting in consistently low thermal efficiency and significant energy waste. On the other hand, due to its uneven heat distribution, localized overheating or heating blind spots are prone to occur during the heating process, which not only affects the heating quality but may also damage the heated object (wafer).

[0004] In view of this, it is indeed necessary to propose a wafer heater to solve the above problems. Utility Model Content

[0005] To achieve the above objectives, the present invention aims to provide a wafer heater capable of uniform heating.

[0006] Therefore, the present invention provides a wafer heater, comprising:

[0007] The support section has an internal mounting cavity;

[0008] A heating platform is located at the top of the support section;

[0009] The heating assembly includes a heating part embedded inside the heating platform and a heat dissipation part passing through the mounting cavity. The heating part and the heat dissipation part are fixedly connected. The heating part extends outward in a spiral manner, starting from its center point, forming a spiral structure located in the same plane.

[0010] Optionally, the heating table includes a heating seat on the side away from the support. The surface of the heating seat facing the support is provided with a mounting groove for mounting the heating part. The shape of the mounting groove matches the heating part. The shape of the mounting groove is formed by continuously spiraling outwards in a direction away from the center of the heating seat, starting from the center.

[0011] Optionally, one end of the heat dissipation part is connected to the center point of the heating part, the heat dissipation part extends from the heating part to the support part, the heat dissipation part is at least partially installed in the mounting cavity, and the other end of the heat dissipation part away from the heating part has a cold end exposed in the mounting cavity.

[0012] Optionally, the heat dissipation section includes a first straight section, a connecting section, and a second straight section connected in sequence. The first straight section is connected to the center point of the heating section, and the connecting section extends from the first straight section to the second straight section.

[0013] Optionally, a thermocouple is provided inside the mounting cavity, with one end of the thermocouple located inside the heating platform. The connecting part is spirally wound around the outside of the thermocouple, and a gap space is formed between the connecting part and the outer surface of the thermocouple.

[0014] Optionally, the support includes a sleeve and a lifting platform. The sleeve is fixedly connected to the heating platform, one end of the lifting platform is fixed to the end of the sleeve away from the heating platform, and the other end of the lifting platform is installed on the elevator.

[0015] Optionally, the support also includes a protective tube, which is fixed to the end of the lifting platform away from the sleeve, and an installation cavity is formed between the sleeve, the lifting platform and the protective tube.

[0016] Optionally, the heating table also includes a fixed base and a connector. The fixed base is fixedly connected to the heating table through the connector, and the side of the fixed base away from the connector is fixedly connected to the support. The connector is a brazed preform, and the shape of the connector matches the shape of the fixed base.

[0017] Optionally, the support includes a sleeve fixedly connected to the heating table, and the connecting part is a three-dimensional spiral heating wire, wherein the ratio of the screw diameter of the connecting part to the inner diameter of the sleeve is ≥0.9.

[0018] Optionally, the connecting part is a cylindrical spiral heating wire with equal pitch, and the connecting part includes 2 to 10 spiral sub-coils, where 2 ≤ the ratio of the pitch of the connecting part to the diameter of the connecting part ≤ 5.

[0019] Compared with the prior art, the technical solution of the embodiments of this utility model has the following beneficial effects:

[0020] This invention relates to a wafer heater that utilizes a spiral heating element. With a length equal to that of a straight heating wire, the total surface area is increased by 30%-50%, thereby increasing the heating area and improving heating power and efficiency. Secondly, the heating element extends outwards from its center point in a spiral pattern, forming a radial heat flow path that effectively improves the temperature uniformity of the heating stage surface, meeting the stringent requirements of semiconductor processes. Thirdly, the continuous heat conduction path of the spiral structure results in a lower heat flux density than a straight structure at the same temperature difference, reducing thermal stress damage to the wafer caused by thermal gradients. Finally, the spiral structure, formed within the same plane, ensures a consistent heating distance between the heat source and the wafer, further enhancing heating uniformity. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a wafer heater conforming to a preferred embodiment of the present invention;

[0022] Figure 2 yes Figure 1 A schematic diagram of the structure of the wafer heater from another angle;

[0023] Figure 3 yes Figure 2 Cross-sectional view of the wafer heater;

[0024] Figure 4 yes Figure 1 Exploded view of the installation of the wafer heater;

[0025] Figure 5 yes Figure 1 Schematic diagram of the structure of the central heating stage;

[0026] Figure 6 yes Figure 5 Exploded view of the installation of the central heating platform;

[0027] Figure 7 yes Figure 6 A structural diagram from another angle;

[0028] Figure 8 This is a schematic diagram of the sleeve structure conforming to the preferred embodiment of this utility model;

[0029] Figure 9 yes Figure 8 A schematic diagram of the casing from another angle;

[0030] Figure 10 This is a structural schematic diagram of the lifting platform conforming to a preferred embodiment of the present utility model;

[0031] Figure 11 This is a schematic diagram of the heating assembly conforming to a preferred embodiment of the present utility model.

[0032] The components in the attached diagram are labeled as follows:

[0033] Support part 1, mounting cavity 11, sleeve 12, welding part 121, second anti-fool hole 1211, main body part 122, step part 123, third anti-fool hole 1231, lifting platform 13, fourth anti-fool hole 131, protective tube 14, pre-tightening part 141, grounding wire 142, gasket 143.

[0034] Heating platform 2, heating base 21, mounting groove 211, first guide hole 212, connector 22, fixing base 23, first anti-fool hole 231, second guide hole 232;

[0035] Heating component 3, heating part 31, heat dissipation part 32, first straight part 321, connecting part 322, second straight part 323, cold end 324;

[0036] Thermocouple 4, fixing pin 5;

[0037] Wafer heater 100. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and / or processing steps closely related to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0040] Additionally, it should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0041] Please see Figures 1 to 11 As shown, an embodiment of this utility model provides a wafer heater 100 for heating a wafer. The wafer heater 100 includes a support portion 1, a heating assembly 3, and a heating stage 2 fixed to the top of the support portion 1. The heating stage 2 is used to transfer heat to a heat-treated object (not shown). The heat-treated object includes, but is not limited to, a wafer. The heating stage 2 can be formed as a plate-like structure with a preset shape. As an example, the heating stage 2 can be formed as a circular plate-like structure, but is not necessarily limited to this. The support portion 1 is used to support the heating stage 2. The wafer is placed above the heating stage 2, and the heating assembly 3 is used to heat the wafer.

[0042] Please see Figures 1 to 7 As shown, the heating table 2 includes a heating base 21, a connector 22, and a fixing base 23. The side of the fixing base 23 facing away from the heating base 21 is fixedly connected to the support part 1. The fixing base 23 is fixedly connected to the heating base 21 via the connector 22. The heating base 21 has two first guide holes 212 on the side facing the fixing base 23, and the fixing base 23 has two second guide holes 232 corresponding to the first guide holes 212 on the side facing the heating base 21. A fixing pin 5 is inserted into the first guide holes 212 and the second guide holes 232 to achieve pre-positioning of the fixing base 23 and the heating base 21, thereby confirming the assembly direction. The fixing pin 5 can be a cylindrical pin, a pin, a dowel, or other fastener, and is not limited here.

[0043] The mounting base 23 has a first anti-fool hole 231 on the side facing the support part 1 for positioning and installation, and to facilitate confirmation of the assembly direction.

[0044] In this embodiment, the connector 22 is a brazed preform, and the shape of the connector 22 matches the shape of the fixing seat 23. The fixing seat 23 and the heating seat 21 are fixed by welding the brazed preform.

[0045] Furthermore, the brazing preform is a brazing sheet, specifically a nickel brazing sheet, and the shape of the fixing seat 23 matches the shape of the connecting part 22. The fixing seat 23 is vacuum brazed to the heating seat 21 by the nickel brazing sheet.

[0046] The heating base 21 is located on the side of the heating platform 2 facing away from the support portion 1. The surface of the heating base 21 facing the support portion 1 has a mounting groove 211 for mounting a portion of the heating assembly 3. The heating assembly 3 is pressed flat into the mounting groove 211 by external force, and then compacted and tightened to ensure complete contact between the heating assembly 3 and the bottom of the mounting groove 211, increasing heat transfer efficiency. The mounting groove 211 is used to mount the heating element 31 within the heating assembly 3. The shape of the mounting groove 211 matches the heating element 31. The shape of the mounting groove 211 is formed by continuously spiraling outwards from the center of the heating base 21 in a direction away from the center.

[0047] Preferably, the bottom of the mounting groove 211 should be a precision-machined flat surface, and its width should be slightly larger than the diameter of the heating component 3, generally with a 0.2mm installation allowance to facilitate the smooth embedding of the heating component 3. The design of this mounting groove 211 should take into account the temperature field distribution of the heating component 3 on the entire surface of the heating table 2, and should avoid corresponding mounting holes.

[0048] Please see Figure 3 , Figure 8 , Figure 9 and Figure 10As shown, the support part 1 is located below the heating platform 2 and has a mounting cavity 11 inside. The heating assembly 3 is at least partially installed in the mounting cavity 11. The support part 1 includes a sleeve 12, a lifting platform 13, and a protective tube 14 connected in sequence. The mounting cavity 11 is formed between the sleeve 12, the lifting platform 13, and the protective tube 14. The sleeve 12 is fixedly connected to the heating platform 2. The sleeve 12 is provided with a second anti-fool hole 1211 corresponding to the first anti-fool hole 231. The assembly direction is confirmed by inserting a fixing pin 5 into the first anti-fool hole 231 and the second anti-fool hole 1211, thereby achieving the pre-positioning of the sleeve 12 and the heating platform 2.

[0049] In this embodiment, the sleeve 12 includes a welding portion 121, a main body portion 122, and a stepped portion 123. The main body portion 122 is formed in the shape of a cylindrical tube with an internal empty space. The sleeve 12 has an outwardly protruding welding portion 121 on the side near the heating table 2, and the support portion 1 is connected to the heating table 2 through the welding portion 121. The welding portion 121 has a second anti-fool hole 1211 corresponding to the first anti-fool hole 231. That is, by inserting the fixing pin 5 into the first anti-fool hole 231 and the second anti-fool hole 1211, the sleeve 12 and the heating table 2 are pre-positioned, and then the heating table 2 and the support portion 1 are fixedly connected at the welding portion 121 by diffusion welding.

[0050] A stepped portion 123 is provided on the side of the sleeve 12 facing away from the heating table 2, and the stepped portion 123 extends from the sleeve 12 in a direction away from the sleeve 12. The main body 122 and the stepped portion 123 are integrally formed. The inner diameter of the stepped portion 123 is equal to the inner diameter of the sleeve 12. The stepped portion 123 is a small round tube coaxially arranged with the main body 122. A third anti-fooling hole 1231 is provided on the stepped portion 123.

[0051] A lifting platform 13 is also provided at one end of the support part 1 near the step part 123. The lifting platform 13 is fixedly connected to the step part 123. The lifting platform 13 is provided with a fourth anti-fool hole 131 corresponding to the third anti-fool hole 1231. The lifting platform 13 and the step part 123 are pre-positioned by inserting a fixing pin 5 into the third anti-fool hole 1231 and the fourth anti-fool hole 131. Subsequently, the lifting platform 13 and the step part 123 are welded and fixed. The lifting platform 13 is provided with a through channel. The channel communicates with the cavity of the sleeve 12. One end of the lifting platform 13 is fixed to the end of the sleeve 12 away from the heating stage 2, and the other end of the lifting platform 13 is installed on the lifting machine. The wafer is clamped in the cavity and located above the heating stage 2. The height of the lifting platform 13 is adjusted by the lifting machine, thereby changing the distance between the heating stage 2 and the wafer to precisely control the heating power and efficiency. For example, when low-power heating is required, the distance between the heating stage 2 and the wafer is increased. When high-power rapid heating is required, reduce the distance between the heating stage 2 and the wafer.

[0052] In other embodiments, the heating stage 2 is used to hold the object to be heat-treated and to transfer heat. The object to be heat-treated includes, but is not limited to, a wafer. The heating stage 2 has a flat bearing surface for holding the wafer, the bearing surface being located on the side of the heating stage 2 facing the wafer.

[0053] The protective tube 14 is fixed to the side of the lifting platform 13 opposite to the sleeve 12. The lifting platform 13 is used to install part of the heating assembly 3. Pre-tightening members 141 are provided on both sides of the protective tube 14 to press the end of the heat dissipation part 32. The pre-tightening member 141 includes through holes on both sides of the protective tube 14 and screws that pass through the through holes. The heat dissipation part 32 is pressed by tightening the screws.

[0054] The protective tube 14 has a grounding wire 142 at the end facing away from the lifting platform 13 to release leakage current or static charge from accidentally charged parts generated during equipment operation, ensuring electrical safety. In this embodiment, the grounding wire 142 is a steel wire rope. Preferably, the end of the protective tube 14 is also provided with a gasket 143, and one end of the grounding wire 142 passes through a reserved hole in the gasket 143 and is fixedly connected to the protective tube 14. The gasket 143 is welded and fixed to the lifting platform 13.

[0055] Please see Figure 3 and Figure 4 As shown, a thermocouple 4 is installed inside the mounting cavity 11, with one end of the thermocouple 4 positioned within the heating platform 2. Specifically, the temperature-sensing end of the thermocouple 4 is embedded in the temperature-sensing groove of the heating base 21, used to detect the temperature of the heating platform 2. The thermocouple 4 is arranged adjacent to the heating assembly 3, with a gap between the outer surfaces of the heating assembly 3 and the thermocouple 4. This gap between the heating assembly 3 and the outer surfaces of the thermocouple 4 forms a thermal radiation barrier, blocking the direct heat conduction path through the air convection layer. This prevents the transient high temperature of the heating assembly 3 during operation from directly impacting the sensing element of the thermocouple 4, thus preventing measurement drift caused by long-term thermal stress.

[0056] The four thermocouples are equipped with insulating sheaths to ensure electrical safety.

[0057] Please see Figure 11 As shown, the heating assembly 3 includes a heating part 31 and a heat dissipation part 32 fixedly connected. Preferably, the heating part 31 and the heat dissipation part 32 are integrally formed. The heating part 31 is embedded inside the heating table 2, specifically, the heating part 31 is installed in the mounting groove 211.

[0058] In this embodiment, the heating element 3 is a heating wire, preferably a stainless steel heating wire, whose Cr and Ni alloy composition forms a dense oxide film on the surface of the heating element 3, providing strong corrosion resistance in high-temperature, humid, or weakly acidic working environments. The heating temperature of the heating wire is around 400°C.

[0059] In some embodiments, the heating wire may also be made of other antioxidant materials, such as iron-chromium-aluminum resistance heating wire, without limitation. For high-temperature oxidation scenarios, iron-chromium-aluminum resistance heating wire FeCrAl is an alternative, as its Al2O3 protective film exhibits excellent anti-peeling properties below 800°C.

[0060] Preferably, the heating element 31 is a two-dimensional spiral. That is, the heating element 31 extends outward from its center point in a spiral manner, forming a spiral structure located in the same plane. Compared with traditional straight or wavy heating wires, this two-dimensional spiral structure increases the surface area by 30%-50% for the same length, significantly improving heat exchange efficiency. This configuration, by expanding the heat radiation surface and convection heat transfer area, increases the heating rate of the heating element 31 by more than 25%, while reducing the surface heat flux density of the heating component 3 and delaying the high-temperature oxidation process. At an operating temperature of 400℃, the thermal inertia of the spiral structure is lower than that of the straight structure, thereby shortening the temperature control response time. The heating element 31 is manufactured using a cold winding forming method. The heating element 31 is wound into a spiral shape using a CNC winding machine, and the winding tension is controlled to avoid plastic deformation. The cold winding forming process achieves precise forming of the heating element 31 through a CNC winding machine, avoiding resistance drift caused by plastic deformation. The stainless steel heating wire, combined with the stress-dispersing properties of spiral winding, enhances its resistance to thermal fatigue. The matching shape of the mounting groove 211 and the heating part 31 improves the fit between the contact surfaces of the heating part 31 and the mounting groove 211, reduces contact thermal resistance, and also facilitates the installation of the heating part 31.

[0061] In other embodiments, the heating element 31 may also be in the form of a cone, a spiral, or a combination of spiral and cone shapes to meet the requirements of conical containers and annular thermal fields, thereby reducing heating dead zones in complex geometric spaces.

[0062] The heat dissipation part 32 is at least partially installed within the mounting cavity 11. The heat dissipation part 32 is connected to the center point of the heating part 31. The heat dissipation part 32 extends from the heating part 31 toward the support part 1.

[0063] In this embodiment, the heat dissipation section 32 includes a first straight section 321, a connecting section 322, and a second straight section 323 connected in sequence. The first straight section 321 is connected to the center point of the heating section 31. The end of the second straight section 323 opposite to the first straight section 321 is provided with a cold end 324. The connecting section 322 connects the first straight section 321 and the second straight section 323. The connecting section 322 is a three-dimensional spiral section. Compared with a straight heat sink, the spiral structure of the connecting section increases the heat dissipation surface area, thereby significantly enhancing the heat radiation and natural convection heat transfer capabilities. The spiral structure induces air turbulence, increasing the convective heat transfer coefficient and improving heat dissipation efficiency.

[0064] Preferably, the connecting part 322 is manufactured using a cold winding method. A CNC winding machine winds the connecting part 322 into a spiral shape, controlling the winding tension to avoid plastic deformation. Then, after heat treatment, it undergoes annealing at 600-800℃ to eliminate residual stress generated during winding and stabilize the spiral shape. The work-hardened layer introduced by the cold winding process combines with the toughened structure after heat treatment to enhance the fatigue life of the connecting part 322. Furthermore, the surface of the connecting part 322 is polished to reduce surface roughness and decrease the adhesion area of ​​corrosive media; simultaneously, it reduces the adhesion of hydrocarbon deposits, thereby reducing carbon buildup.

[0065] In other embodiments, in applications where heat dissipation requirements are not high, the heat dissipation part 32 can also be a linear heating wire.

[0066] However, in this embodiment, by winding the connector 322 into a spiral shape, the physical path length from the high-temperature zone to the terminal is increased for the same distance compared to a straight conductor connector 322. Heat is lost more as it is conducted along a longer metal path, thus reducing the heat flow and final temperature reaching the cold end 324.

[0067] The connecting part 322 is machined into a cylindrical spiral heating wire with equal pitch, which is beneficial for uniform heating. Furthermore, the connecting part 322 is spirally wound around the outside of the thermocouple 4, forming a space between the connecting part 322 and the outer surface of the thermocouple 4, creating a thermal buffer layer. The connecting part 322 and the thermocouple 4 do not contact each other, blocking direct heat conduction to avoid excessively high local temperatures of the thermocouple 4, which could affect measurement accuracy and reduce the possibility of damage to the thermocouple 4 due to local overheating.

[0068] Preferably, the ratio of the pitch of the connecting portion 322 to the diameter of the connecting portion 322 is ≤5. This setting ensures a safe distance between any two adjacent spiral sub-coils in the heating zone. Increasing the pitch reduces the electric field strength below the critical value, avoiding local electric field concentration and preventing short circuits or arcing breakdowns between any two adjacent spiral sub-coils.

[0069] The pitch of the connecting part 322 can be adjusted according to the length and uniformity of the heating wire. By adjusting the ratio of pitch to diameter, the power density can be continuously adjusted within a controllable range to adapt to different heating rate requirements. In this embodiment, the ratio of the pitch to diameter of the connecting part 322 is 5, which reduces the electric field strength to below the critical value and increases the uniformity of heating.

[0070] Furthermore, the connecting part 322 is a three-dimensional spiral heating wire, and the ratio of the spiral diameter of the connecting part 322 to the inner diameter of the mounting cavity 11 is ≥0.9. The diameter of the spiral is close to the size of the mounting cavity, and the spiral heating wire fits the mounting cavity 11 more closely, achieving better heat conduction. At the same time, it is more stable during installation and less prone to shaking.

[0071] The connecting portion 322 includes 2 to 10 spiral sub-coils. The number of spiral sub-coils can be adjusted according to the heating power, and the connecting portion 322 can have 2, 3, 4, 5...8, 9, 10 spiral sub-coils; no limitation is set here. In this embodiment, the connecting portion 322 has 4 spiral sub-coils.

[0072] The cold junction 324 is located at the end of the heat sink 32 opposite to the heating section 31, and is exposed outside the mounting cavity 11. The cold junction 324, being exposed outside the mounting cavity 11, allows for natural convection, thus lowering its temperature. Both the cold junction 324 and the thermocouple 4 are electrically connected to a controller (not shown). When the heating section 31 is powered on, it heats the wafer. The thermocouple 4 detects the temperature of the heating stage 2 and sends the detected temperature signal to the controller. The controller receives the temperature signal from the thermocouple 4 and controls the power supply of the heating section 31 according to a preset program, thereby controlling the heating temperature and heating efficiency.

[0073] The cold end 324 contains a conductive part and insulating adhesive covering the conductive part. The conductive part is a terminal block. The terminal block includes a positive electrode, a negative electrode, and a ground electrode. The ground electrode must abut against the inner metal wall of the cold end 324 to form a conductive path with contact resistance, ensuring rapid conduction of leakage current. The terminal block is generally connected to the second straight section 323 by welding, crimping, bolting, or other methods.

[0074] Preferably, the insulating adhesive is a high-temperature resistant insulating potting compound. The high-temperature resistant insulating potting compound is injected into the cold end 324 and cured. The potting compound fills the microscopic gaps between the conductive part and the inner metal wall, increasing the creepage distance to prevent current leakage, thereby achieving insulation and sealing, and enabling stable operation in high-temperature environments. The cold end 324 is electrically connected to the controller via the conductive part, supplying power to the heating assembly 3.

[0075] Preferably, the cold end 324 is further provided with an insulating sheath. The insulating sheath covers the conductive part, providing electrical protection. The insulating sheath can be made of insulating materials such as nylon or rubber. The nylon or rubber sheath provides mechanical protection, preventing insulation failure caused by wear.

[0076] In some preferred embodiments, the wafer heater 100 is a stainless steel heater, which is made entirely of stainless steel and has strong corrosion resistance and thermal fatigue resistance.

[0077] In summary, the heating section 31 of this invention extends outward in a spiral pattern, starting from the center point, forming a radial heat flow path. This effectively improves the surface temperature uniformity of the heating stage 2, meeting the stringent requirements of semiconductor processes. The heating section 31 employs a spiral structure, which, for the same length, increases the surface area by 30%-50% compared to a straight heating wire, thereby increasing the heating area and improving heating efficiency. The continuous heat conduction path of the spiral structure results in a lower heat flux density than a straight one at the same temperature difference, reducing thermal stress damage to the wafer caused by thermal gradients. The spiral structure of the heating section 31, formed within the same plane, ensures a consistent heating distance between the heat source and the wafer, further improving heating uniformity.

[0078] The above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model.

Claims

1. A wafer heater, characterized in that, include: The support part (1) has an installation cavity (11) inside. A heating platform (2) is located at the top of the support (1); The heating assembly (3) includes a heating part (31) embedded inside the heating platform (2) and a heat dissipation part (32) passing through the mounting cavity (11). The heating part (31) and the heat dissipation part (32) are fixedly connected. The heating part (31) extends outward in a spiral manner, starting from its center point, forming a spiral structure located in the same plane.

2. The wafer heater according to claim 1, characterized in that, The heating table (2) includes a heating seat (21) on the side away from the support (1). The surface of the heating seat (21) facing the support (1) is provided with a mounting groove (211). The mounting groove (211) is used to install the heating part (31). The shape of the mounting groove (211) matches the heating part (31). The shape of the mounting groove (211) is formed by continuously spiraling outward in a direction away from the center of the heating seat (21).

3. The wafer heater according to claim 1, characterized in that, One end of the heat dissipation part (32) is connected to the center point of the heating part (31). The heat dissipation part (32) extends from the heating part (31) toward the support part (1). The heat dissipation part (32) is at least partially installed in the mounting cavity (11). The other end of the heat dissipation part (32) away from the heating part (31) is provided with a cold end (324) exposed in the mounting cavity (11).

4. The wafer heater according to claim 3, characterized in that, The heat dissipation part (32) includes a first straight part (321), a connecting part (322), and a second straight part (323) connected in sequence. The first straight part (321) is connected to the center point of the heating part (31), and the connecting part (322) extends from the first straight part (321) to the second straight part (323).

5. The wafer heater according to claim 4, characterized in that, The installation cavity (11) is provided with a thermocouple (4), one end of which is located in the heating platform (2). The connecting part (322) is spirally wound around the outside of the thermocouple (4), and a gap space is formed between the connecting part (322) and the outer surface of the thermocouple (4).

6. The wafer heater according to claim 1, characterized in that, The support part (1) includes a sleeve (12) and a lifting platform (13). The sleeve (12) is fixedly connected to the heating platform (2). One end of the lifting platform (13) is fixed to the end of the sleeve (12) away from the heating platform (2). The other end of the lifting platform (13) is installed on the elevator.

7. The wafer heater according to claim 6, characterized in that, The support part (1) also includes a protective tube (14), which is fixed to one end of the lifting platform (13) away from the sleeve (12), and the mounting cavity (11) is formed between the sleeve (12), the lifting platform (13) and the protective tube (14).

8. The wafer heater according to claim 2, characterized in that, The heating table (2) also includes a fixed seat (23) and a connector (22). The fixed seat (23) is fixedly connected to the heating table (21) through the connector (22). The side of the fixed seat (23) away from the connector (22) is fixedly connected to the support part (1). The connector (22) is a brazed preform, and the shape of the connector (22) matches the shape of the fixed seat (23).

9. The wafer heater according to claim 4, characterized in that, The support part (1) includes a sleeve (12) fixedly connected to the heating table (2), and the connecting part (322) is a three-dimensional spiral heating wire. The ratio of the spiral diameter of the connecting part (322) to the inner diameter of the sleeve (12) is ≥0.

9.

10. The wafer heater according to claim 9, characterized in that, The connecting part (322) is a cylindrical spiral heating wire with equal pitch. The connecting part (322) includes 2 to 10 spiral sub-coils, and 2 ≤ the ratio of the pitch of the connecting part (322) to the diameter of the connecting part (322) ≤ 5.

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