Cooling system and circuit board hot press

Abstract

This utility model relates to a cooling system and a circuit board hot press. The cooling system includes a cooling medium supply component and a cooling medium transmission component. The cooling medium transmission component includes a main cooling pipe and multiple branch cooling pipes. One end of the main cooling pipe is connected to the cooling medium supply component, and the other end of the main cooling pipe is connected to one end of each of the branch cooling pipes. The other ends of each branch cooling pipe are respectively connected to pressing heat-conducting components located in different areas of the hot press. The main cooling pipe transmits the cooling medium to the branch cooling pipes, and each branch cooling pipe corresponds to and cools multiple pressing heat-conducting components. This method can improve the pressing accuracy of the circuit board hot press.

Description

Technical Field

[0001] This application relates to the field of printed circuit board processing technology, and in particular to a cooling system and a circuit board hot press. Background Technology

[0002] The hot press machine is one of the core pieces of equipment in the production process of printed circuit boards (PCBs). It is used in the pressing process of PCBs. Specifically, it uses heat and pressure to press multiple copper foils, prepregs and core boards (the substrate with etched circuits) into a whole, thereby forming a multi-layer conductive circuit interconnection structure.

[0003] Currently, during the hot pressing operation of a circuit board hot press, the high internal temperature of the hot plate is transferred and diffused between various components of the circuit board hot press through heat conduction. As a result, the components in direct contact with the hot plate inevitably experience thermal expansion, wear, and thermal deformation due to prolonged exposure to high temperatures. Consequently, the circuit board hot press struggles to provide the uniform and stable pressure required for circuit board pressing, leading to low pressing accuracy in current circuit board hot presses. Utility Model Content

[0004] Therefore, it is necessary to provide a cooling system and a circuit board hot press that can improve the pressing accuracy of the circuit board hot press in response to the above-mentioned technical problems.

[0005] In a first aspect, this application provides a cooling system comprising a cooling medium supply component and a cooling medium transmission component. The cooling medium transmission component includes a main cooling pipe and multiple branch cooling pipes. One end of the main cooling pipe is connected to the cooling medium supply component, and the other end of the main cooling pipe is connected to one end of each of the branch cooling pipes. The other ends of each branch cooling pipe are respectively connected to a pressing heat-conducting component located in different areas of a hot press.

[0006] The main cooling pipe is used to transfer the cooling medium to the multiple cooling sub-pipes, which respectively cool multiple press-fit heat-conducting components.

[0007] In one embodiment, the plurality of pressing and heat-conducting components include a pressing and heating component, a pressing and movable platform, and a pressing and guiding component. The pressing and heating component is fixed to the hot press. One end of the pressing and guiding component is connected to the pressing and heating component, and the other end of the pressing and guiding component is movably connected to the pressing and movable platform. The pressing and movable platform carries a circuit board. The pressing and movable platform can move towards the pressing and heating component via the pressing and guiding component until the circuit board is pressed and heated against the pressing and heating component.

[0008] In one embodiment, the pressing heating assembly includes a top plate of the hot press, and the pressing guiding assembly includes a guide rail and a slider. The guide rail is fixed to multiple corner positions at the bottom of the top plate of the hot press and is perpendicular to the top plate of the hot press. The slider is embedded in the groove of the guide rail, one end of the slider is slidably connected to the guide rail, and the other end of the slider is fixedly connected to the pressing movable platform.

[0009] In one embodiment, the plurality of cooling sub-pipes include a first cooling water supply pipe and a second cooling water supply pipe, the second cooling water supply pipe including a first cooling water supply branch pipe and a second cooling water supply branch pipe; the first cooling water supply pipe cools the pressing guide assembly through the cooling medium, the first cooling water supply branch pipe cools the pressing heating assembly through the cooling medium, and the second cooling water supply branch pipe cools the pressing moving platform through the cooling medium.

[0010] In one embodiment, the cooling medium transmission assembly further includes a main cooling return water pipe, and the plurality of cooling branch pipes further include cooling return water pipes. The first cooling water supply pipe and the cooling return water pipe form a cooling circulation loop through the cooling chamber of the pressure guiding assembly. One end of the first cooling water supply pipe is connected to the main cooling pipe, and the other end of the first cooling water supply pipe is connected to the inlet of the cooling chamber of the pressure guiding assembly. One end of the cooling return water pipe is connected to the outlet of the cooling chamber of the pressure guiding assembly, and the other end of the cooling return water pipe is connected to the main cooling return water pipe.

[0011] In one embodiment, the cooling system further includes a first temperature monitoring component, and the second cooling water supply pipe is provided with a first flow valve; the first temperature monitoring component monitors a first temperature value corresponding to both the pressing heating component and the pressing moving platform, and the flow valve opening of the first flow valve is adjusted based on the first temperature value.

[0012] In one embodiment, the cooling system further includes a second temperature monitoring component and a third temperature monitoring component. The first cooling water supply branch pipe is equipped with a second flow valve, and the second cooling water supply branch pipe is equipped with a third flow valve. The second temperature monitoring component monitors a second temperature value of the pressing heating component, and the third temperature monitoring component monitors a third temperature value of the pressing moving platform. The opening degree of the second flow valve is adjusted based on the second temperature value, and the opening degree of the third flow valve is adjusted based on the third temperature value.

[0013] In one embodiment, the cooling system further includes a fourth temperature monitoring component; the cooling return water main pipe is provided with a first ball valve, the cooling main pipe is provided with a second ball valve, and the first cooling water supply water pipe is provided with a fourth flow valve; the fourth temperature monitoring component monitors a fourth temperature value of the pressing heating component, and the flow valve opening of the fourth flow valve is adjusted based on the fourth temperature value.

[0014] In one embodiment, the cooling medium transport assembly further includes a cooling safety conduit equipped with a safety valve.

[0015] Secondly, this application provides a circuit board hot press, the circuit board hot press including the cooling system described above.

[0016] The aforementioned cooling system includes a cooling medium supply component and a cooling medium transmission component. The cooling medium transmission component comprises a main cooling pipe and multiple branch cooling pipes. One end of the main cooling pipe is connected to the cooling medium supply component, and the other end is connected to one end of each of the branch cooling pipes. The other ends of each branch cooling pipe are respectively connected to the heat-conducting pressing components located in different areas of the hot press. During the hot pressing process of the circuit board, the main cooling pipe transmits the cooling medium supplied by the cooling medium supply component to the branch cooling pipes. These branch cooling pipes then cool multiple heat-conducting pressing components via the cooling medium, ensuring that the heat-conducting pressing components in different areas of the hot press are cooled through different branch cooling pipes. Therefore, by coordinating the design of the cooling medium supply component and the cooling medium transmission component, the goal of cooling different pressing heat-conducting components in different areas is achieved. This allows the cooling capacity of the cooling system to accurately match the actual multiple cooling needs of the circuit board hot press, rather than relying on a single cooling circuit to complete the hot pressing cooling. Thus, it overcomes the technical defect that the high internal temperature of the hot plate will be transferred and diffused between various components of the circuit board hot press through heat conduction, causing the components in direct contact with the hot plate to inevitably experience thermal expansion, wear, and thermal deformation due to prolonged exposure to high temperature. Consequently, the circuit board hot press is unable to provide the uniform and stable pressure required for circuit board pressing during the pressing process. Therefore, the pressing accuracy of the circuit board hot press is improved. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the accompanying drawings required for operation in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1This is a schematic diagram of the components of a cooling system in one embodiment;

[0019] Figure 2 This is a schematic diagram of the cooling pipes of the pressing platform in one embodiment;

[0020] Figure 3 This is a schematic diagram of the piping of a cooling medium transport assembly in one embodiment;

[0021] Figure 4 This is a schematic diagram of the circuit board hot press in one embodiment. Detailed Implementation

[0022] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0024] It is understood that the terms "first," "second," etc., used in this invention may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this invention, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0025] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0026] It is understandable that "at least one" refers to one or more, and "multiple" refers to two or more. "At least a part of an element" refers to part or all of an element.

[0027] When used herein, the singular forms of “a,” “an,” and “ / the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items:

[0028] In this embodiment, the cooling medium supply component and the cooling medium transmission component in the cooling system can be one or more. This embodiment does not make a specific limitation. However, for the sake of explanation, the following description takes the cooling system as having a host computer, a carriage body and an image acquisition mechanism as an example.

[0029] Further reference Figure 1 , Figure 1 To illustrate the components of the cooling system, the cooling system 10 includes a cooling medium supply assembly 11 and a cooling medium transmission assembly 12. The cooling medium transmission assembly 12 includes a main cooling pipe 121 and multiple branch cooling pipes 122. One end of the main cooling pipe is connected to the cooling medium supply assembly, and the other end of the main cooling pipe 121 is connected to one end of each of the branch cooling pipes 122. The other ends of the branch cooling pipes 122 are respectively connected to the pressing heat conduction assembly 13 located in different areas of the hot press.

[0030] The main cooling pipe 121 is used to transfer the cooling medium to multiple cooling branch pipes 122, and the multiple cooling branch pipes 122 respectively cool multiple voltage heat conduction components 13 through the cooling medium.

[0031] It should be noted that the cooling medium supply component 121 is used to store, prepare, and supply the cooling medium, which can specifically be cooling water, cooling oil, or compressed air, etc. The cooling medium supply component 11 provides a power source and medium source for the cooling system 10. The cooling medium supply component 11 can drive the cooling medium to move through external force, or the cooling medium can move actively due to its own gravity. In some feasible embodiments, the cooling medium supply component 11 can be composed of a water tank and a water pump. Since the cooling medium supply component 11 is connected to the main cooling pipe 121, when the cooling system 10 needs to cool the circuit board during the hot pressing process, the water pump can pressurize the cooling water in the water tank and deliver it to the cooling medium transmission component 12. The cooling medium transmission component 12 is used to construct the transmission path of the cooling medium and transport the cooling medium via the main cooling pipe 121 to the pressing heat conduction component 13 located in different areas of the hot press. Specifically, the main cooling pipe 121 is the transmission component in the cooling medium transmission component 12. The main channel receives and transmits the cooling medium supplied by the cooling medium supply component 11 downwards. Multiple cooling branch pipes 122 distribute the cooling medium to the pressing heat conduction components 13 in different areas of the hot press. The materials and dimensions of the main cooling pipe 121 and the multiple cooling branch pipes 122 can be the same or different. In some feasible embodiments, the main cooling pipe 121 is a 50mm seamless stainless steel pipe, and each cooling branch pipe 122 is a 20mm copper pipe. The pressing heat conduction component 13 is a high-temperature component that directly contacts the circuit board hot press. Specifically, the pressing heat conduction component may include an upper closing plate, a movable platform, a lower closing plate, and guide rails. It is understood that the pressing heat conduction component that directly contacts the heat source may vary depending on the structural design of the circuit board hot press. For example, for a platform-heated hot press, the circuit board heat conduction component may include a movable platform, a fixed platform, an upper closing plate, and guide rails. For example, for a mold-heated hot press, the circuit board heat conduction component may include an upper closing plate, a lower closing plate, a movable platform, and guide rails.

[0032] It should be noted that multiple cooling branch pipes 122 can be connected to the main cooling pipe 121 in parallel. Each cooling branch pipe 122 corresponds to a press-fit heat conduction component. For example, in one feasible embodiment, multiple outlets are provided on the side of the main cooling pipe 121, and each outlet is connected to a cooling branch pipe 122. Different press-fit heat conduction components can be independently divided by physical partitioning. For example, each area is equipped with a cooling branch pipe 122, and the cooling capacity of different areas can be different based on the different inner diameters of the cooling branch pipes 122.

[0033] Through the coordination between the cooling medium supply component 11 and the cooling medium transmission component 12 of the cooling system 10, wherein the cooling medium transmission component 12 includes a main cooling pipe 121 and multiple cooling branch pipes 122, one end of the main cooling pipe 121 is connected to the cooling medium supply component 11, and the other end of the main cooling pipe 121 is connected to one end of the multiple cooling branch pipes 122, the other ends of the multiple cooling branch pipes 122 are respectively connected to the pressing heat conduction component 13 located in different areas of the hot press, the cooling medium supply component 11 can drive the cooling medium to be transmitted to the cooling medium transmission component 122. The cooling medium transfer component 12, after receiving the cooling medium through the main cooling pipe 121, transfers the cooling medium to multiple cooling branch pipes 122. Since each of the multiple cooling branch pipes 122 is connected to a pressing heat-conducting component 13 located in a different area of ​​the hot press, heat exchange can be completed between each cooling branch pipe 122 and its corresponding pressing heat-conducting component 13, thereby achieving cooling of the multiple pressing heat-conducting components. Specifically, the heat exchange can be achieved through direct contact conduction or indirect convection heat transfer; thus, the components located in the hot press... The heat-conducting components 13 in different areas of the press are cooled by different cooling pipes 122. Therefore, the coordinated design of the cooling medium supply component 11 and the cooling medium transmission component 12 achieves the goal of cooling different heat-conducting components 13 in different areas. This allows the cooling capacity of the cooling system 10 to accurately match the actual multiple cooling needs of the circuit board hot press, rather than relying on a single cooling circuit to complete the hot pressing cooling. Therefore, it overcomes the technical defect that the high internal temperature of the hot plate will be transferred and diffused between various parts of the circuit board hot press through heat conduction, causing the parts in direct contact with the hot plate to inevitably experience thermal expansion, wear, and thermal deformation due to prolonged exposure to high temperature. This makes it difficult for the circuit board hot press to provide the uniform and stable pressure required for circuit board pressing during the pressing process. On the other hand, since the parts in direct contact with the hot plate do not need to be exposed to high temperature for a long time, their thermal expansion range is significantly reduced, the wear rate is reduced, and the risk of thermal deformation is greatly alleviated, thereby extending the service life of the parts. Therefore, while improving the pressing accuracy of the circuit board hot press, it also improves the service life of the circuit board hot press.

[0034] Due to the complex internal structure of the circuit board hot press, to reduce the layout difficulty of the cooling medium transmission component 12, the pressing heat conduction component 13 that needs to be cooled can be specifically analyzed. It is understood that in the hot pressing operation of the circuit board hot press, the high temperature inside the hot plate is mainly transferred through heat conduction, accompanied by heat radiation. Analysis shows that the pressing guide component will exhibit significant thermal expansion during heat transfer. Based on finite element simulation, it is known that the thermal expansion of the pressing guide component will cause relative torsion between circuit boards during the hot pressing process, resulting in severe wear of the pressing guide component during the hot pressing process. On the other hand, since the pressing heating component is in direct contact with the heat source, it will exhibit significant deformation at high temperatures, thus affecting the pressing accuracy of the circuit board. Since the pressing moving platform and the pressing heating component provide pressure to the circuit board through mutual cooperation, the pressing moving platform will also be affected by high temperature. Therefore, the pressing heat conduction components mainly affected by the heat source include the pressing heating component, the pressing moving platform, and the pressing guide component. Accordingly, corresponding cooling pipes can be set for the pressing heating component, the pressing moving platform, and the pressing guide component.

[0035] In one embodiment, the plurality of pressing heat-conducting components include a pressing heating component, a pressing movable platform, and a pressing guide component. The pressing heating component is fixed to a hot press. One end of the pressing guide component is connected to the pressing heating component, and the other end of the pressing guide component is movably connected to the pressing movable platform. The pressing movable platform carries a circuit board. The pressing movable platform can move towards the pressing heating component via the pressing guide component until the circuit board is pressed and heated against the pressing heating component.

[0036] It should be noted that the pressing heating assembly is used to provide a stable high-temperature heat source, converting specified energy into heat energy, thereby enabling the circuit board to reach the process temperature required for the hot pressing process. Specifically, the specified energy can be electrical energy or other types of energy, and the process temperature can be between 150℃ and 250℃. Specifically, the pressing heating assembly may include a temperature control system and a heating plate. The temperature control system may include a PID controller and a thermocouple, and the heating plate may be an aluminum alloy substrate with an embedded heating tube. The pressing movable platform is used to carry the circuit board along the pressing guide assembly, thereby accurately transmitting the pressure required for the circuit board to reach the hot pressing process through positioning with the pressure heating assembly. The size and material of the pressure movable platform are not specifically limited in this embodiment. The pressing guide assembly is used to limit the movement of the pressing movable platform in other directions, thereby enabling it to move vertically.

[0037] It should be noted that the pressing heating assembly can be fixed to the hot press by bolts or by locating pins. For example, in one feasible embodiment, the heating plate of the pressing heating assembly is fixed by two diamond pins and two cylindrical pins. One end of the pressing guide assembly can be fixedly connected to the pressing heating assembly based on a flange. The pressing movable platform can be installed on multiple linear bearings to form a clearance fit with the pressing guide assembly. It can be understood that graphite lubricating strips can be embedded inside the linear bearings to allow the pressing movable platform to move linearly along the pressing guide assembly under the action of the graphite lubricating strips. The circuit board can be placed on the pressing movable platform in a stacked or spaced manner, depending on the hot pressing requirements. Under the action of the drive assembly of the circuit board hot press, the pressing movable platform moves towards the pressing heating assembly via the pressing guide assembly until the circuit board is in contact with the pressing heating assembly. The circuit board is pressed and heated through the cooperation of the pressing heating assembly, the pressing movable platform, and the pressing guide assembly.

[0038] In this way, the cooling medium transfer assembly can be equipped with one main cooling pipe and three branch cooling pipes based on the pressing heating assembly, pressing moving platform, and pressing guide assembly. During the hot pressing process of the circuit board, the pressing heating assembly, pressing moving platform, and pressing guide assembly are cooled respectively through the three branch cooling pipes. This effectively controls the number of branch cooling pipes in the cooling medium transfer assembly while improving the hot pressing cooling of the circuit board by the circuit board hot press. Therefore, the cooling effect of component-level hot pressing cooling is improved simultaneously.

[0039] In one embodiment, the pressing heating assembly includes a top plate of the hot press, and the pressing guiding assembly includes a guide rail and a slider. The guide rail is fixed to multiple corner positions at the bottom of the top plate of the hot press and is perpendicular to the top plate of the hot press. The slider is embedded in the groove of the guide rail, one end of the slider is slidably connected to the guide rail, and the other end of the slider is fixedly connected to the pressing movable platform.

[0040] It should be noted that the pressing and heating assembly is used to provide a stable high-temperature heat source to heat and press the circuit board, ensuring that the circuit board completes lamination, curing, and other processes at a specific temperature. Specifically, the pressing and heating assembly can be an upper plate, i.e., the top plate of the hot press. The guide rail is fixed to the bottom of the top plate of the hot press, providing precise movement guidance for the slider, limiting the platform's horizontal displacement, and ensuring smooth movement along the vertical direction (Z-axis) to ensure pressing accuracy. The guide rail is perpendicular to the surface of the top plate of the hot press, specifically installed on the bottom guide rail of the top plate using bolts, locating pins, etc. The guide rail can be fixed at the four corner points of the bottom of the pressing and heating plate. The slider is embedded in the guide rail groove, forming a sliding pair. The sliding of the slider on the guide rail achieves the guiding function. One end of the slider is slidably connected to the guide rail, and the other end of the slider... One end is fixedly connected to the pressing platform; the slider, as a motion transmission component, is fixedly connected to the pressing platform via bolts, connecting plates, or guide columns, driving the platform to move up and down along the guide rail. It can be understood that in the circuit board hot press of this embodiment, the upper plate is used as the core heat source. The pressing guide assembly composed of the guide rail and the slider controls the movement trajectory of the pressing platform. After the guide rail is fixed at the four corners of the bottom of the upper plate, the slider is embedded in the guide rail groove, with one end slidingly connected to the guide rail and the other end fixedly connected to the pressing platform, forming a stable vertical motion guide structure. In this circuit board hot press, the components that mainly contact the heat source may include the upper plate, the pressing platform, the guide rail, and the slider. By setting corresponding cooling channels, component-level cooling of each component can be achieved.

[0041] In this way, the cooling medium transmission assembly can be equipped with one main cooling pipe and three branch cooling pipes based on components such as the pressing heating plate, pressing movable platform, guide rail, and slider. During the hot pressing process of the circuit board, the three branch cooling pipes cool the pressing heating plate, pressing movable platform, guide rail, and slider respectively. This not only improves the hot pressing cooling of the circuit board by enhancing the hot pressing cooling of the circuit board, but also effectively controls the pipe routing of the branch cooling pipes in the cooling medium transmission assembly, thus simultaneously improving the cooling effect of component-level hot pressing cooling.

[0042] In one embodiment, the multiple cooling sub-pipes include a first cooling water supply pipe and a second cooling water supply pipe, and the second cooling water supply pipe includes a first cooling water supply branch pipe and a second cooling water supply branch pipe; the first cooling water supply pipe cools the pressing guide assembly through a cooling medium, the first cooling water supply branch pipe cools the pressing heating assembly through a cooling medium, and the second cooling water supply branch pipe cools the pressing moving platform through a cooling medium.

[0043] It should be noted that the cooling requirements of different pressing heat conduction components vary, resulting in different cooling medium requirements. For example, the wear of the pressing guide component directly affects the service life of the circuit board hot press, thus requiring continuous cooling during the hot pressing process. The pressing platform and pressing components, relatively speaking, have lower cooling requirements than the pressing guide component. Therefore, to more effectively control the number of cooling sub-pipes, multiple pressing heat conduction components with lower cooling requirements can share the same cooling water supply pipe, while pressing heat conduction components with higher cooling requirements can have separate cooling water supply pipes. Specifically, the multiple cooling sub-pipes include a first cooling water supply pipe and a second cooling water supply pipe. The first cooling water supply pipe is solely responsible for cooling the pressing guide component, while the second cooling water supply pipe includes a first cooling water supply branch pipe and a second cooling water supply branch pipe. The first cooling water supply branch pipe is solely responsible for cooling the pressing heating component, and the second cooling water supply branch pipe is solely responsible for cooling the pressing platform.

[0044] Since the pressing guide assembly directly participates in mechanical movement, wear and heat generation can significantly affect the equipment's accuracy and lifespan. A separate first cooling water supply pipe ensures a continuous and stable flow of cooling medium, preventing mechanical failures due to insufficient cooling. Meanwhile, the cooling requirements of the pressing heating assembly and the pressing moving platform are relatively low and similar. Supplying cooling medium through two branch pipes of the second cooling water supply pipe satisfies their respective heat dissipation needs while avoiding excessive cooling that could interfere with the temperature stability of the heating assembly. Therefore, while ensuring the effective cooling of the circuit board hot press, the stability of the cooling system is further improved.

[0045] In one embodiment, the cooling medium transmission assembly further includes a cooling return water main pipe, and the multiple cooling branch pipes further include cooling return water pipes. The first cooling water supply pipe and the cooling return water pipe form a cooling circulation loop through the cooling chamber of the pressure guiding assembly. One end of the first cooling water supply pipe is connected to the cooling main pipe, and the other end of the first cooling water supply pipe is connected to the inlet of the cooling chamber of the pressure guiding assembly. One end of the cooling return water pipe is connected to the outlet of the cooling chamber of the pressure guiding assembly, and the other end of the cooling return water pipe is connected to the cooling return water main pipe.

[0046] It should be noted that, to improve the utilization rate of the cooling medium, a cooling return water main pipe can also be included in the cooling transmission component. This main pipe represents the central pipe that collects all the returned cooling medium. It collects the high-temperature cooling medium discharged from each component and returns it to the cooling source, forming a closed loop. Multiple cooling branch pipes include cooling return water pipes, which represent branch return pipes extending from the outlet of the pressurized heat conduction component. These pipes can directionally transport the cooling medium discharged from a single component to the main return water pipe, preventing mixing and interference between the return liquids from different components. For example, in one feasible implementation, the cooling medium is cooling water. Through water supply and return circulation, the heat generated during the operation of the pressurized heat conduction component is continuously removed, maintaining the temperature stability of the component.

[0047] It should be noted that during the hot pressing process of the circuit board, the first cooling water supply pipe obtains low-temperature cooling medium from the main cooling pipe and delivers it to the cooling chamber inlet of the pressing guide component. The temperature of the low-temperature cooling medium rises after heat exchange with the pressing guide component. The cooling water return pipe can guide the heated cooling medium into the cooling chamber for cooling, so that it can be recycled later. Therefore, the cooling water return pipe ensures the sustainable use of the cooling medium and avoids the problem of resource waste.

[0048] It is understandable that, in addition to providing cooling return water pipes for the pressing guide assembly, cooling return water pipes can also be provided for other pressing heat conduction components. In one feasible approach, refer to... Figure 2 , Figure 2 This is a schematic diagram of the cooling pipes for the pressing platform. 21 is the inlet hose for the pressing platform, and 22 is the return hose for the pressing platform, thus ensuring the recycling of the cooling medium used to cool the pressing platform.

[0049] In one embodiment, the cooling system further includes a first temperature monitoring component, and the second cooling water supply pipe is provided with a first flow valve; the first temperature monitoring component monitors a first temperature value corresponding to both the pressing heating component and the pressing moving platform, and the flow valve opening of the first flow valve is adjusted based on the first temperature value.

[0050] It should be noted that since the pressing heating assembly and the pressing moving platform share the second cooling water supply pipe, the cooling water flowing through the second cooling water supply pipe can be effectively controlled by a first flow valve installed in the second cooling water supply pipe. The first temperature monitoring assembly is used to monitor the temperature of the pressing heating assembly and the pressing moving platform in real time. Specifically, the first temperature monitoring assembly can be a temperature sensor. Based on the first temperature value fed back by the first temperature monitoring assembly, the flow rate of the cooling medium in the second cooling water supply pipe can be dynamically adjusted to achieve precise temperature control. For example, in one feasible embodiment, when the first temperature value detected by the temperature sensor is greater than a first preset value... Under the given temperature threshold, the opening of the first flow valve is adjusted from 50% to 80%. When the second temperature value detected by the temperature sensor is less than or equal to the second preset temperature threshold, the opening of the first flow valve is adjusted from 50% to 30%. In this way, by setting a first temperature monitoring component in the cooling system and a first flow valve in the second cooling water supply pipeline, the opening of the first flow valve can be adjusted according to the first temperature value monitored in real time by the first temperature monitoring component. This achieves the purpose of dynamically adjusting the flow rate of the cooling medium in the second cooling water supply pipeline, thus improving the cooling accuracy of the circuit board hot press for hot pressing and cooling circuit boards.

[0051] In one embodiment, the cooling system further includes a second temperature monitoring component and a third temperature monitoring component. A second flow valve is provided on the first cooling water supply branch pipe, and a third flow valve is provided on the second cooling water supply branch pipe. The second temperature monitoring component monitors a second temperature value of the pressing heating component, and the third temperature monitoring component monitors a third temperature value of the pressing moving platform. The opening degree of the second flow valve is adjusted based on the second temperature value, and the opening degree of the third flow valve is adjusted based on the third temperature value.

[0052] It should be noted that since the first cooling water supply branch can provide cooling medium for multiple pressing heat conduction components, corresponding flow valves can be set for different pressing heat conduction components. That is, a second flow valve is set for the first cooling water supply branch, and a third flow valve is set for the second cooling water supply branch. Then, the second and third temperature monitoring components deployed in the cooling system monitor the temperature values ​​of the pressing heating component and the pressing moving platform, respectively, thereby achieving the purpose of dynamically adjusting the flow rate of the cooling medium in the first and second cooling water supply branch pipes. Therefore, the cooling accuracy of the circuit board hot press for hot pressing and cooling circuit boards is further improved.

[0053] In one embodiment, the cooling system further includes a fourth temperature monitoring component; a first ball valve is provided on the cooling return water main pipe, a second ball valve is provided on the cooling main pipe, and a fourth flow valve is provided on the first cooling water supply water main pipe; the fourth temperature monitoring component monitors a fourth temperature value of the pressing heating component, and the flow valve opening of the fourth flow valve is adjusted based on the fourth temperature value.

[0054] It should be noted that, similarly, to achieve the purpose of dynamically adjusting the flow rate of the cooling medium in the first cooling water supply pipe, a fourth flow valve can be installed in the first cooling water supply pipe. Similar to the above embodiment, the fourth temperature value of the pressing heating component can be monitored by the fourth temperature monitoring group, and then the opening of the fourth flow valve can be adjusted based on the relationship between the fourth temperature value and the second preset temperature threshold. On the other hand, due to the high transmission requirements of the main pipe, it is not necessary to install flow valves for precise flow control in the cooling return water main pipe and the cooling main pipe. Instead, ball valves for quick shut-off and coarse adjustment can be used. Specifically, a first ball valve is installed in the cooling return water main pipe and a second ball valve is installed in the cooling main pipe. In the event of a failure of the cooling medium component, the ball valve can be quickly closed to cut off the cooling medium supply, thereby improving the cooling safety of the cooling system.

[0055] In one embodiment, the cooling medium transport assembly further includes a cooling safety conduit equipped with a safety valve.

[0056] It should be noted that the cooling safety pipeline is a safety redundancy pipeline independent of the main circulation pipeline of the cooling medium assembly. It can be set up in parallel with the cooling branch pipeline to guide the cooling medium to divert when the main system pressure is abnormal, thereby avoiding overpressure damage to the thermo-cooling assembly. The safety valve, as an automatic pressure relief protection system, can automatically open when the pressure in the thermo-cooling assembly exceeds a set threshold, thereby releasing part of the medium to reduce the pressure. When the pressure in the thermo-cooling assembly is less than the set threshold, it will automatically close to prevent the thermo-cooling assembly from bursting, damaging equipment, or causing safety accidents due to excessive pressure. Specifically, the safety valve can be set in the middle of the cooling safety pipeline.

[0057] In one feasible approach, refer to Figure 3 , Figure 3This is a schematic diagram of the cooling medium transmission assembly. The pressing guide assembly is the guide rail 12 in the guide rail group, the pressing heating assembly is the upper closing plate 13, and the pressing movable platform is the movable platform. The cooling medium transmission assembly includes a main cooling pipe, a main cooling return water pipe, multiple cooling branch pipes, and a cooling safety pipe. The main cooling pipe is equipped with a first ball valve 8, the second cooling water supply pipe is equipped with a first flow valve, a T1 temperature sensor is used to detect the temperature of the upper closing plate 13, a T2 temperature sensor is used to detect the temperature of the movable platform, and a safety valve is installed in the cooling safety pipe.

[0058] Further reference Figure 4 , Figure 4 The diagram illustrates the structure of a circuit board hot press. In this diagram, 1 is the inlet pipe (main cooling pipe), 2 is the guide rail cooling water inlet pipe (first cooling water supply pipe), 3 is the guide rail cooling water return pipe (one end of the first cooling water return pipe), 4 is one end of the movable platform inlet pipe (one end of the second cooling water supply branch pipe), 5 is the upper plate inlet pipe (first cooling water supply branch pipe), 6 is the return pipe (main cooling water return pipe), 7 is ball valve 1 (first ball valve), 8 is ball valve 2 (second ball valve), 9 is the flow valve (first flow valve), 10 is the other end of the movable platform inlet hose, 11 is the movable platform return hose (the other end of the first cooling water return pipe), 12 is the hot press guide rail (the guide rail of the pressing guide assembly), 13 is the upper plate (the pressing heating plate of the pressing heating assembly), and the movable platform is the movable platform itself.

[0059] In this way, the coolant circulation pipes are carefully designed within the crossbeam and movable platform of the hot press to ensure that the coolant can fully cover the main heat-generating areas and efficiently remove heat. On the other hand, cooling channels are set inside the guide rails according to their structure and working characteristics to achieve uniform cooling and effectively suppress thermal expansion and wear caused by high temperatures. At the same time, high-precision temperature sensors are installed in key parts of the hot press, such as the upper platen, movable platform, and guide rails, to monitor temperature changes in real time. Overall, this improves the pressing accuracy of the circuit board hot press and enhances the reliability and stability of the hot pressing cooling components.

[0060] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0061] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.

Claims

1. A cooling system, characterized in that, The cooling system includes a cooling medium supply component and a cooling medium transmission component. The cooling medium transmission component includes a main cooling pipe and multiple branch cooling pipes. One end of the main cooling pipe is connected to the cooling medium supply component, and the other end of the main cooling pipe is connected to one end of each of the branch cooling pipes. The other ends of each branch cooling pipe are respectively connected to a pressing heat-conducting component located in different areas of the hot press. The main cooling pipe is used to transfer the cooling medium to the multiple cooling sub-pipes, which respectively cool multiple press-fit heat-conducting components.

2. The system according to claim 1, characterized in that, The plurality of pressing and heat-conducting components include a pressing and heating component, a pressing and movable platform, and a pressing and guiding component. The pressing and heating component is fixed to the hot press. One end of the pressing and guiding component is connected to the pressing and heating component, and the other end of the pressing and guiding component is movably connected to the pressing and movable platform. The pressing and movable platform carries the circuit board. The pressing and movable platform can move towards the pressing and heating component via the pressing and guiding component until the circuit board is pressed and heated against the pressing and heating component.

3. The system according to claim 2, characterized in that, The pressing heating assembly includes the top plate of the hot press, and the pressing guide assembly includes a guide rail and a slider. The guide rail is fixed to multiple corner positions at the bottom of the top plate of the hot press and is perpendicular to the top plate of the hot press. The slider is embedded in the groove of the guide rail, one end of the slider is slidably connected to the guide rail, and the other end of the slider is fixedly connected to the pressing movable platform.

4. The system according to claim 2, characterized in that, The multiple cooling sub-pipes include a first cooling water supply pipe and a second cooling water supply pipe. The second cooling water supply pipe includes a first cooling water supply branch pipe and a second cooling water supply branch pipe. The first cooling water supply pipe cools the pressing guide assembly through the cooling medium. The first cooling water supply branch pipe cools the pressing heating assembly through the cooling medium. The second cooling water supply branch pipe cools the pressing moving platform through the cooling medium.

5. The system according to claim 4, characterized in that, The cooling medium transmission assembly further includes a main cooling return water pipe, and the multiple cooling branch pipes further include cooling return water pipes. The first cooling water supply pipe and the cooling return water pipe form a cooling circulation loop through the cooling chamber of the pressure guiding assembly. One end of the first cooling water supply pipe is connected to the main cooling pipe, and the other end of the first cooling water supply pipe is connected to the inlet of the cooling chamber of the pressure guiding assembly. One end of the cooling return water pipe is connected to the outlet of the cooling chamber of the pressure guiding assembly, and the other end of the cooling return water pipe is connected to the main cooling return water pipe.

6. The system according to claim 4, characterized in that, The cooling system further includes a first temperature monitoring component, and the second cooling water supply pipe is equipped with a first flow valve; the first temperature monitoring component monitors a first temperature value corresponding to both the pressing heating component and the pressing moving platform, and the opening degree of the first flow valve is adjusted based on the first temperature value.

7. The system according to claim 4, characterized in that, The cooling system further includes a second temperature monitoring component and a third temperature monitoring component. The first cooling water supply branch pipe is equipped with a second flow valve, and the second cooling water supply branch pipe is equipped with a third flow valve. The second temperature monitoring component monitors a second temperature value of the pressing heating component, and the third temperature monitoring component monitors a third temperature value of the pressing moving platform. The opening degree of the second flow valve is adjusted based on the second temperature value, and the opening degree of the third flow valve is adjusted based on the third temperature value.

8. The system according to claim 5, characterized in that, The cooling system also includes a fourth temperature monitoring component; the cooling return water main pipe is equipped with a first ball valve, the cooling main pipe is equipped with a second ball valve, and the first cooling water supply pipe is equipped with a fourth flow valve; the fourth temperature monitoring component monitors the fourth temperature value of the pressing heating component, and the flow valve opening of the fourth flow valve is adjusted based on the fourth temperature value.

9. The system according to any one of claims 1-8, characterized in that, The cooling medium transmission assembly also includes a cooling safety pipe, which is equipped with a safety valve.

10. A circuit board hot press, characterized in that, The circuit board hot press includes a cooling system as described in any one of claims 1 to 9.

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