A smart lock chip sticker

Abstract

This disclosure relates to a smart unlocking chip sticker, comprising a first PVC layer, a chip layer, a wave-absorbing material layer, and a release paper layer stacked sequentially. The chip layer comprises a first adhesive-free film, a second PVC layer, a chip coil, and a second adhesive-free film stacked sequentially. By enclosing the chip coil within the first adhesive-free film, the second PVC layer, and the second adhesive-free film, the chip coil is not in direct contact with the first PVC layer and the wave-absorbing material layer. The first adhesive-free film, the second PVC layer, and the second adhesive-free film provide a certain degree of protection for the chip coil, preventing damage to the chip coil during the removal of the smart unlocking chip sticker, thereby extending the service life of the smart unlocking chip sticker. Because the chip coil is enclosed within the first adhesive-free film, the second PVC layer, and the second adhesive-free film, the smart unlocking chip sticker has good waterproof performance. Furthermore, because the first adhesive-free film is a smooth and soft material, it does not feel rough to the touch after being pasted onto an object, minimizing the impact on the user experience.

Description

Technical Field

[0001] This disclosure relates to the field of unlocking chip sticker technology, specifically to a smart unlocking chip sticker. Background Technology

[0002] With the continuous advancement of technology and the booming development of the economy, RFID (Radio Frequency Identification) products have gradually integrated into our daily lives and become an inevitable product of social progress. From smart payments to logistics tracking, from access control to identity verification, the application scope of RFID technology is becoming increasingly widespread, making it an important force driving social progress.

[0003] Against this backdrop, smart products are constantly evolving towards greater convenience, efficiency, and security. They strive for compactness, portability, ease of use, space-saving design, and multi-functionality. Driven by these demands, smart unlocking chip stickers have emerged and become an indispensable part of people's daily lives.

[0004] In the prior art, the thickness of the smart unlocking chip is approximately 0.7mm to 1mm. Chinese patent CN206975687U disclosed a smart unlocking chip on February 6, 2018, which includes a chip body. The chip body is composed of a first PVC layer, a main chip structure layer, an anti-metal electromagnetic interference material layer, and an adhesive release paper. The first PVC layer is located on the surface layer, the main chip structure layer and the anti-metal electromagnetic interference material layer are located in the middle layer, and the adhesive release paper is located at the bottom layer. The main chip structure layer is composed of an RFID chip structure and a transmitting antenna structure, and the RFID chip structure and the transmitting antenna structure are built into the main chip structure layer. The first PVC layer is a surface layer printed with various textures, patterns, or text content.

[0005] The aforementioned patent places the main chip structure layer between the first PVC layer and the anti-metal electromagnetic interference material layer, making the smart unlocking chip thinner and easier to carry. However, the aforementioned patent still has the following drawbacks:

[0006] Because the main chip structure layer of the aforementioned patent is in direct contact with the first PVC layer and the anti-metal electromagnetic interference material layer, when the smart unlocking chip sticker is pasted onto items such as the back cover of a mobile phone, the main chip structure layer is easily damaged during the process of peeling off the smart unlocking chip sticker, causing the smart unlocking chip sticker to become unusable and affecting its lifespan. Although PVC material has a certain degree of waterproof performance, when pasted onto items such as the back cover of a mobile phone, there is a certain gap between the back cover of the mobile phone and the first PVC layer due to the adhesive release paper. Without other materials covering the chip coil, liquid can easily seep in through this gap, causing the chip coil to short-circuit. Therefore, the aforementioned patent also has the problem of insufficient waterproof performance.

[0007] Meanwhile, since the main chip structure layer is in direct contact with the first PVC layer and the anti-metal interference material layer, after being pasted onto items such as the back cover of a mobile phone, the first PVC layer will form a coil-shaped protrusion at the corresponding position of the main chip structure layer, which is quite uncomfortable to the touch, and coil marks will appear on items such as the back cover of a mobile phone, affecting the user experience. Utility Model Content

[0008] In order to solve the problems existing in the prior art, the purpose of this disclosure is to provide a smart unlocking chip sticker to solve the problems of limited service life and poor user experience of the existing smart unlocking chip stickers.

[0009] The smart unlocking chip sticker disclosed herein includes a first PVC layer, a chip layer, a wave-absorbing material layer, and a release paper layer that are sequentially stacked and pressed together.

[0010] The chip layer, along the direction from the first PVC layer to the release paper layer, includes a first adhesive-free film, a chip coil, a second PVC layer, and a second adhesive-free film, which are sequentially laminated and pressed together.

[0011] Preferably, the microwave absorbing material layer is a microwave absorbing adhesive backing.

[0012] Preferably, a tear-resistant structure is formed on one side of the release paper layer.

[0013] Preferably, the tearing structure is a tearing section, wherein the edge portion of the release paper layer curls up in a direction away from the microwave absorbing material layer to form the tearing section;

[0014] Alternatively, the edge of the release paper layer may extend outward to form the tear-off portion.

[0015] Preferably, the thickness of the first PVC layer is 0.20 to 0.24 mm.

[0016] Preferably, the thickness of both the first adhesive-free film and the second adhesive-free film is 0.03 to 0.05 mm.

[0017] Preferably, the thickness of the chip coil is 0.03 to 0.05 mm; and the thickness of the second PVC layer is 0.05 to 0.1 mm.

[0018] Preferably, the total thickness of the microwave absorbing material layer and the release paper layer is 0.10 to 0.12 mm.

[0019] Preferably, a waterproof layer is provided between the first PVC layer and the chip layer, and between the chip layer and the microwave absorbing material layer.

[0020] Preferably, the waterproof layer is polyurethane, and the thickness of the waterproof layer is 0.01 to 0.025 mm.

[0021] The advantages of the smart unlocking chip sticker disclosed herein are as follows:

[0022] The chip layer is structurally designed by encapsulating the chip coil with a first adhesive-free film, a second PVC layer, and a second adhesive-free film. This prevents the chip coil from directly contacting the first PVC layer and the microwave absorbing material layer. The first adhesive-free film, the second PVC layer, and the second adhesive-free film provide some protection for the chip coil, preventing damage during the removal of the smart unlocking chip sticker and thus extending the lifespan of the smart unlocking chip sticker. Furthermore, because the chip coil is encapsulated by the first adhesive-free film, the second PVC layer, and the second adhesive-free film, the chip coil is in a sealed state, preventing liquid from penetrating into the chip coil and thus improving its waterproof performance.

[0023] Meanwhile, since the chip coil is covered by the first adhesive-free film, the second PVC layer, and the second adhesive-free film, the part in contact with the first PVC layer is the first adhesive-free film of the chip layer. The first adhesive-free film is a flat material with a relatively soft texture. After being pasted onto items such as the back cover of a mobile phone, although the first PVC layer will still produce a corresponding shape of protrusion at the corresponding position, the protrusion is softer than the coil-shaped protrusion in the prior art due to the flat surface and soft material of the first adhesive-free film, and does not feel uncomfortable to the touch. Furthermore, since the part in contact with the wave-absorbing material layer is the second adhesive-free film of the chip layer, which is similar to the first adhesive-free film in that it has a flat surface and a relatively soft material, it has less impact on the pasted items, and thus has less impact on the user experience. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of a smart unlocking chip sticker as described in this disclosure;

[0025] Figure 2 This is a schematic diagram of the chip layer structure;

[0026] Figure 3 This is a schematic diagram of one embodiment of the tearing structure;

[0027] Figure 4 This is a schematic diagram of another embodiment of the tearing structure.

[0028] Icon labels:

[0029] 1. First PVC layer; 2. Chip layer; 21. First adhesive-free film; 22. Chip coil; 23. Second PVC layer; 24. Second adhesive-free film; 3. Wave-absorbing material layer; 4. Release paper layer; 41. Tear-off structure. Detailed Implementation

[0030] like Figure 1As shown, the present invention discloses a smart unlocking chip sticker, comprising a first PVC layer 1, a chip layer 2, a wave-absorbing material layer 3, and a release paper layer 4, which are sequentially stacked and pressed together.

[0031] like Figure 2 As shown, the chip layer 2 is formed along the direction from the first PVC layer 1 to the release paper layer 4, comprising a first adhesive-free film 21, a second PVC layer 23, a chip coil 22, and a second adhesive-free film 24 that are sequentially stacked and pressed together.

[0032] Specifically, the first PVC layer 1 is located on the surface layer, with one side facing the external space and the other side bonded to the chip layer 2. The side of the first PVC layer 1 facing the external space can be printed with patterns related to the application scenario of the smart unlocking chip, and the other side is laminated to the chip layer 2.

[0033] The chip layer 2 and the absorbing material layer 3 are located in the middle layer. The chip layer 2 includes a first adhesive-free film 21, a chip coil 22, a second PVC layer 23 and a second adhesive-free film 24 stacked sequentially along the direction from the first PVC layer 1 to the release paper layer 4. The chip coil 22 can be composed of an RFID chip and a transmitting antenna structure, or it can be composed of other chips with wireless signal transmission functions and a transmitting antenna structure.

[0034] The chip coil 22 is placed on the second PVC layer 23. After the first adhesive-free film 21, the chip coil 22, the second PVC layer 23, and the second adhesive-free film 24 are laminated, the edges of the first adhesive-free film 21 and the second adhesive-free film 24 are adhered together, thereby covering the chip coil 22 and the second PVC layer 23, so that the chip coil 22 is in a sealed state. This prevents the chip coil 22 from directly contacting the first PVC layer 1 and the wave-absorbing material layer 3. The first adhesive-free film 21, the second PVC layer 23, and the second adhesive-free film 24 can provide a certain degree of protection for the chip coil 22, preventing damage to the chip coil 22 during the process of tearing off the smart unlocking chip sticker, thereby extending the service life of the smart unlocking chip sticker. Furthermore, since the chip coil 22 is in a sealed state, liquid cannot penetrate into the chip coil, thus improving the waterproof performance.

[0035] Release paper layer 4 is located at the bottom layer and is bonded to wave-absorbing material layer 3. This ensures that the wave-absorbing material layer 3 will not come into contact with the outside world when the smart unlocking chip described in this disclosure is not used, thus preventing the wave-absorbing material from being damaged due to scratches or falling off before use, and ensuring that the wave-absorbing effect of the wave-absorbing material layer 3 is not weakened.

[0036] Furthermore, the absorbing material layer 3 is an absorbing adhesive. The absorbing adhesive usually has only one side that is sticky. In the prior art, if the absorbing adhesive is used as an electromagnetic shielding material, the sticky side of the absorbing adhesive needs to be pasted to the chip coil 22. Therefore, a double-sided adhesive material needs to be added between the release paper layer 4 and the absorbing adhesive to make the absorbing adhesive bond to the release paper layer 4.

[0037] In this disclosure, the chip layer 2 includes a first adhesive-free film 21, a second PVC layer 23, a chip coil 22, and a second adhesive-free film 24 stacked sequentially. The second adhesive-free film 24 is a double-sided adhesive material. Therefore, the adhesive side of the microwave absorbing backing can be used as a material to bond with the object to be pasted. That is, the microwave absorbing backing can not only achieve the microwave absorption function, but also eliminate the need for additional double-sided adhesive material in the smart unlocking chip sticker of this disclosure. The second adhesive-free film 24 can both protect the chip coil 22 and bond with the microwave absorbing backing. Furthermore, since the surface of the second adhesive-free film 24 is flat and the material is soft, it avoids the chip coil 22 leaving coil marks on the pasted object, which would affect the user experience.

[0038] Furthermore, in order to facilitate the user to quickly peel off the release paper layer 4 to expose the microwave absorbing material layer 3 and then adhere it to the object to be pasted, a tear-off structure 41 is formed on one side of the release paper layer 4.

[0039] The tear-off structure 41 allows users to easily peel off the release paper layer 4, thus more quickly attaching the smart unlocking chip to the item to be attached, saving users time.

[0040] Furthermore, in one embodiment of this disclosure, such as Figure 3 As shown, the tear structure 41 is a tear section. The edge of the release paper layer 4 is raised away from the microwave absorbing material layer 3 to form a tear section. The tear section and the release paper layer 4 form a crease, which makes it convenient for users to determine the position of the tear section by the crease and quickly tear the release paper layer 4.

[0041] In another embodiment of this disclosure, such as Figure 4 As shown, the edge of the release paper layer 4 extends outward to form a tear section. The shape of the tear section can be designed according to the actual situation. Preferably, the shape of the tear section can be a semi-ellipse, or other conventional shapes such as a fan, quadrilateral, or polygon.

[0042] Furthermore, since the first PVC layer 1 is located on the outermost layer, there will be corresponding wear and tear during use. Therefore, the thickness of the first PVC layer 1 is 0.20 to 0.24 mm, preferably 0.22 mm. Setting the thickness of the first PVC layer 1 to 0.22 mm can meet the printing requirements without affecting the user experience due to excessive thickness.

[0043] The durability of the smart unlocking chip sticker described in this disclosure is ensured by setting the thickness of the first PVC layer 1.

[0044] Furthermore, the characteristic of the adhesive-free film is that it contains no adhesive, so it is thinner and lighter overall, thus reducing the thickness while also protecting the chip coil 22.

[0045] Specifically, the thickness of the first adhesive-free film 21 and the second adhesive-free film 24 is 0.03 to 0.05 mm, and preferably, the thickness of the first adhesive-free film 21 and the second adhesive-free film 24 is 0.04 mm.

[0046] Furthermore, a second PVC layer 23 is provided between the first adhesive-free film 21 and the chip coil 22. The function of the second PVC layer 23 is to improve the protection performance of the chip coil 22, and at the same time, further eliminate the indentation formed on the first PVC layer 1 in the shape of the chip coil 22, and further improve the user experience.

[0047] Specifically, the thickness of the second PVC layer 23 is 0.05 to 0.1 mm, preferably 0.1 mm; the thickness of the chip coil 22 is 0.03 to 0.05 mm, preferably 0.04 mm.

[0048] Furthermore, the total thickness of the microwave absorbing material layer 3 and the release paper layer 4 is 0.10 to 0.12 mm, preferably 0.10 mm.

[0049] In summary, the overall thickness of the smart unlocking chip sticker described in this disclosure is about 0.54mm, which is thinner and lighter than the existing technology with a thickness of 0.7 to 1mm, thus providing users with a nearly imperceptible user experience, and also has advantages such as a certain degree of waterproofing.

[0050] Furthermore, in order to further improve the waterproof performance of the smart unlocking chip sticker described in this disclosure, waterproof layers are provided between the first PVC layer 1 and the chip layer 2, and between the chip layer 2 and the wave-absorbing material layer 3.

[0051] By incorporating a waterproof layer, the smart unlocking chip sticker described in this disclosure can be adapted to more application environments and its performance in extreme scenarios can be improved.

[0052] Furthermore, in one embodiment of this disclosure, the waterproof layer is polyurethane. Polyurethane has high elasticity and ductility, which can adapt to the slight deformation and movement of the substrate, effectively preventing cracks and leaks. In addition, polyurethane has good weather resistance and can resist the erosion of external factors such as ultraviolet rays, air pollutants and oxidation for a long time. It is not easy to age or deteriorate. At the same time, polyurethane also has excellent water resistance, which can effectively block the penetration of water and moisture, thus achieving a good waterproof effect. Therefore, polyurethane is selected as the material for the waterproof layer.

[0053] More specifically, the thickness of the waterproof layer is 0.01 to 0.025 mm.

[0054] Even after adding a waterproof layer, the overall thickness of the smart unlocking chip sticker disclosed herein remains between 0.56 and 0.59 mm, which is still less than the thickness of 0.7 to 1.0 mm in the prior art. Furthermore, given that the PVC material already possesses a certain degree of waterproof performance, this disclosure adds a waterproof layer to further enhance the waterproof performance of the smart unlocking chip sticker and provide users with a nearly imperceptible user experience. After the smart unlocking chip sticker is pasted onto the back cover of a mobile phone, since no indentation in the shape of the chip coil 22 will be formed on the first PVC layer 1, users will not experience any discomfort such as a sharp edge when using the phone, thus improving the user experience of the smart unlocking chip sticker disclosed herein.

[0055] In the description of this disclosure, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings and is only for the convenience of describing this disclosure and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this disclosure.

[0056] For those skilled in the art, various other corresponding changes and modifications can be made based on the technical solutions and concepts described above, and all such changes and modifications should fall within the protection scope of the claims disclosed herein.

Claims

1. An intelligent unlocking chip patch, characterized in that, It includes a first PVC layer (1), a chip layer (2), a microwave absorbing material layer (3), and a release paper layer (4) that are sequentially stacked and pressed together; The chip layer (2) includes a first adhesive-free film (21), a chip coil (22), a second PVC layer (23), and a second adhesive-free film (24) that are sequentially laminated and pressed together along the direction from the first PVC layer (1) to the release paper layer (4).

2. The smart unlocking chip patch according to claim 1, characterized in that, The microwave absorbing material layer (3) is a microwave absorbing adhesive.

3. The smart unlocking chip patch of claim 2, wherein, A tear-off structure (41) is formed on one side of the release paper layer (4).

4. The smart unlocking chip patch of claim 3, wherein, The tear structure (41) is a tear section, and the edge portion of the release paper layer (4) is raised in a direction away from the microwave absorbing material layer (3) to form the tear section; Alternatively, the edge of the release paper layer (4) may extend outward to form the tear section.

5. The smart unlocking chip sticker of claim 1, wherein, The thickness of the first PVC layer (1) is 0.20 to 0.24 mm.

6. The smart unlocking chip patch of claim 1, wherein, The thickness of both the first adhesive-free film (21) and the second adhesive-free film (24) is 0.03 to 0.05 mm.

7. The smart unlocking chip patch of claim 1, wherein, The thickness of the chip coil (22) is 0.03 to 0.05 mm; the thickness of the second PVC layer (23) is 0.05 to 0.1 mm.

8. The smart unlocking chip patch of claim 1, wherein, The total thickness of the microwave absorbing material layer (3) and the release paper layer (4) is 0.10 to 0.12 mm.

9. The smart unlocking chip patch of claim 1, wherein, A waterproof layer is provided between the first PVC layer (1) and the chip layer (2), and between the chip layer (2) and the microwave absorbing material layer (3).

10. The smart unlocking chip patch of claim 9, wherein, The waterproof layer is made of polyurethane, and its thickness is 0.01 to 0.025 mm.

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