Substrate temperature rapid stabilization adjustment device

Abstract

This utility model relates to the field of substrate technology and discloses a substrate temperature rapid stabilization adjustment device, including a protective shell. A fixed mounting mechanism is provided at the bottom of the protective shell, an adjustment component for adjustment is provided at the top of the protective shell, and a uniform heat dissipation mechanism is provided at the bottom of the protective shell. The fixed mounting mechanism includes a sliding outer shell, and a braking component for pushing is fixedly connected inside the sliding outer shell. Two fixed balls are slidably connected inside the sliding outer shell, and a connecting fixing strip is slidably connected to the outside of the fixed balls. In this utility model, the elastic force generated by the compression of an elastic spring pushes the fixing strip tightly against the external mounting surface, achieving a stable installation of the device on the bottom of the substrate. The installation process can be completed simply by pushing the connecting fixing strip, improving the stability and reliability of the device, and making it suitable for various scenarios with high requirements for installation stability.

Description

Technical Field

[0001] This utility model relates to the field of substrate technology, and in particular to a device for rapid and stable adjustment of substrate temperature. Background Technology

[0002] In today's highly industrialized and technologically advanced era, numerous fields such as electronics manufacturing, semiconductor processing, and materials research and development are booming, placing increasingly stringent demands on the precision and stability of their production processes. As the foundational component that carries core elements or participates in critical processes in these fields, the precise temperature control of the substrate has become a key factor determining product quality, production efficiency, and even the competitiveness of the entire industry. Whether it's the precise temperature environment required for photolithography and etching in chip manufacturing, or the temperature conditions necessary to ensure uniform melting and solidification of solder during electronic packaging, advanced substrate temperature control technology is indispensable.

[0003] Most substrate temperature control devices use simple heating elements to directly heat the substrate, and then use temperature sensors to feed back temperature signals. The controller then adjusts the heating power to achieve temperature control. Cooling relies mainly on basic air cooling or water cooling methods, lacking precise control methods.

[0004] In existing technologies, traditional devices are often complex in structure, have many parts, and require complicated installation steps. They require professional technicians to spend a lot of time assembling and debugging. On fast-paced industrial production lines, this not only slows down the speed of equipment upgrades and production line layout adjustments, but may also increase the risk of equipment failure due to human error. Therefore, a rapid and stable substrate temperature regulation device is proposed to solve the above problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a rapid and stable substrate temperature adjustment device, which aims to improve the problem of rapid installation of some devices in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a substrate temperature rapid stabilization adjustment device, comprising a protective shell, a fixed mounting mechanism at the bottom of the protective shell, an adjustment component for adjustment at the top of the protective shell, a uniform heat dissipation mechanism at the bottom of the protective shell, the fixed mounting mechanism comprising a sliding outer shell, the outer side of the sliding outer shell being fixedly connected to the outside of the protective shell, a braking component for pushing being fixedly connected inside the sliding outer shell, two fixed balls being slidably connected inside the sliding outer shell, and a connecting fixing strip being slidably connected to the outer side of the fixed balls;

[0007] As a further description of the above technical solution: the uniform heat dissipation mechanism includes a temperature-conducting layer, the outside of which is fixedly connected to the bottom of the protective shell, a temperature-equalizing layer is fixedly connected to the bottom of the temperature-conducting layer, a temperature-sensing layer is fixedly connected to the bottom of the temperature-equalizing layer, and a receiving and transmitting layer is fixedly connected to the bottom of the temperature-sensing layer.

[0008] As a further description of the above technical solution: the braking assembly includes a connecting post, the outside of which is fixedly connected to the inside of the sliding housing, and an elastic spring is fixedly connected to the bottom of the connecting post;

[0009] As a further description of the above technical solution: the bottom of the elastic spring is slidably connected to two push balls, and the outside of the push balls is slidably connected to the outside of the fixed ball;

[0010] As a further description of the above technical solution: the outer surface of the elastic spring is slidably connected to the inside of the sliding housing, and the outer surface of the pushing ball is slidably connected to the inside of the sliding housing;

[0011] As a further description of the above technical solution: a fan is fixedly connected inside the protective shell, and a heater is connected inside the protective shell;

[0012] As a further description of the above technical solution: a partition is provided on the opposite side of the fan and the heater, and the outside of the partition is fixedly connected to the inside of the protective shell;

[0013] As a further description of the above technical solution: the adjustment component includes a temperature control shell, the bottom of which is fixedly connected to the top of the protective shell, an adjustment disc is fixedly connected to the outside of the temperature control shell, and a connecting wire is fixedly connected to the outside of the temperature control shell, the connecting wire being fixedly connected to the outside of the protective shell.

[0014] This utility model has the following beneficial effects:

[0015] 1. In this utility model, the elastic force generated by the compression of the elastic spring pushes the fixing pusher tightly against the external mounting surface, realizing the stable installation of the device on the bottom of the substrate. The installation process can be completed simply by pushing the connecting fixing strip, and it can ensure that the device will not easily loosen during use, thus improving the stability and reliability of the device. It is suitable for various scenarios with high requirements for installation stability.

[0016] 2. In this utility model, the heat-conducting layer has good thermal conductivity, which can quickly and evenly transfer the heat or cold from the inside of the protective shell to the temperature-equalizing layer. The temperature-equalizing layer further equalizes the temperature difference, thereby making the temperature distribution on the substrate surface more uniform. For some processes that have high requirements for substrate temperature uniformity, such as semiconductor manufacturing and electronic packaging, this can effectively improve product quality and reduce product defects caused by uneven temperature. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the substrate temperature rapid stabilization adjustment device proposed in this utility model;

[0018] Figure 2 This is a schematic diagram of the receiving and transmitting layer of the substrate temperature rapid stabilization adjustment device proposed in this utility model;

[0019] Figure 3 This is a schematic diagram of the temperature equalization layer of the substrate temperature rapid stabilization and adjustment device proposed in this utility model;

[0020] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0021] Legend:

[0022] 1. Protective shell; 2. Fixing mechanism; 201. Connecting fixing strip; 202. Push ball; 203. Fixing ball; 204. Elastic spring; 205. Connecting column; 206. Sliding shell; 3. Temperature control shell; 4. Adjustment plate; 5. Connecting wire; 6. Uniform heat dissipation mechanism; 601. Fan; 602. Heater; 603. Partition; 604. Temperature conducting layer; 605. Temperature equalization layer; 606. Temperature sensing layer; 607. Receiving and transmitting layer. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Reference Figure 1 , Figure 3 and Figure 4An embodiment of this utility model provides a substrate temperature rapid stabilization adjustment device, including a protective shell 1. The protective shell 1 is used to effectively block external dust and moisture from interfering with the device. A fixed installation mechanism 2 is provided at the bottom of the protective shell 1. An adjustment component for adjustment is provided at the top of the protective shell 1. A uniform heat dissipation mechanism 6 is provided at the bottom of the protective shell 1.

[0025] The fixed installation mechanism 2 includes a sliding housing 206, which is externally fixedly connected to the outside of the protective housing 1. A braking assembly for pushing is fixedly connected inside the sliding housing 206. Two fixed balls 203 are slidably connected inside the sliding housing 206, and a connecting fixing strip 201 is slidably connected to the outside of the fixed balls 203.

[0026] The braking assembly includes a connecting post 205, which is externally fixedly connected to the inside of a sliding housing 206. An elastic spring 204 is fixedly connected to the bottom of the connecting post 205, which supports the elastic spring 204. Two push balls 202 are slidably connected to the bottom of the elastic spring 204. The elastic spring 204 is compressed to store elastic potential energy. Once the external force disappears, the elastic spring 204 releases the stored energy quickly by virtue of its elastic restoring force, pushing the fixed ball 203 outward to press tightly against the external mounting surface, thus achieving rapid and stable installation of the device. At the same time, it continuously provides a fastening force during device operation to prevent loosening. The push balls 202 are externally slidably connected to the outside of the fixed ball 203, and the elastic spring 204 is externally slidably connected to the inside of the sliding housing 206. The push balls 202 evenly distribute the thrust of the elastic spring 204 to the fixed ball 203.

[0027] Reference Figures 1 to 3The uniform heat dissipation mechanism 6 includes a heat-conducting layer 604, which is fixedly connected to the bottom of the protective shell 1. A temperature-equalizing layer 605 is fixedly connected to the bottom of the heat-conducting layer 604. The heat-conducting layer 604 can evenly diffuse heat from the heater 602 or energy introduced by the fan 601 at a very fast speed. A temperature sensing layer 606 is fixedly connected to the bottom of the temperature-equalizing layer 605. Due to its special structural design or material properties, the temperature-equalizing layer 605 further equalizes the temperature transmitted from the heat-conducting layer 604. A receiving and transferring layer 607 is fixedly connected to the bottom of the temperature sensing layer 606. The receiving and transferring layer 607 helps the heat-conducting layer 604 and the temperature-equalizing layer 605 to transfer heat or cold to the substrate more smoothly. A fan 601 is fixedly connected to the inside of the protective shell 1. Fan 601 is used to generate cold air. Heater 602 is connected inside the protective shell 1. Heater 602 is used to generate hot air. A partition 603 is provided on the opposite side of fan 601 and heater 602. The partition 603 is used to separate the temperature. The outside of partition 603 is fixedly connected to the inside of the protective shell 1. The adjustment component includes temperature control shell 3. Temperature control shell 3 integrates complex temperature control circuits, controllers and other key electronic components. The bottom of temperature control shell 3 is fixedly connected to the top of protective shell 1. An adjustment disk 4 is fixedly connected to the outside of temperature control shell 3. Adjustment disk 4 is used to directly operate adjustment disk 4 to set the required substrate temperature. A connecting wire 5 is fixedly connected to the outside of temperature control shell 3. The outside of connecting wire 5 is fixedly connected to the outside of protective shell 1. Connecting wire 5 is used to connect fan 601 and heater 602.

[0028] Working principle: When the device needs to be installed on the bottom of the substrate, the protective shell 1 outside the sliding housing 206 is inside the connecting fixing bar 201, and the elastic spring 204 at the bottom of the connecting post 205 is compressed. The pushing ball 202 pushes the fixed ball 203 and the sliding housing 206 into the defined track. When the connecting fixing bar 201 reaches the appropriate position, the elastic force of the elastic spring 204 makes the fixed ball 203 press tightly against the external mounting surface, so as to achieve a stable installation of the device.

[0029] The bottom of the temperature control shell 3 is fixed to the top of the protective shell 1. The operator rotates the adjustment disc 4, which, in conjunction with the temperature control circuit inside the temperature control shell 3, transmits the control signal to the heater 602 and fan 601 inside the protective shell 1 through the connecting wire 5. When heating is required, the heater 602 is turned on to generate heat. The partition 603 isolates the fan 601 from the heater 602 to prevent heat loss too quickly and ensure that the heat is concentrated to raise the temperature of the substrate. If cooling is required, the fan 601 runs to introduce cold air from the outside and remove the heat inside the protective shell 1 to achieve cooling.

[0030] The bottom heat-conducting layer 604 contacts the heat or cold from inside the protective shell 1. With its excellent thermal conductivity, it quickly and evenly transfers the heat or cold to the temperature equalization layer 605. The temperature equalization layer 605 further equalizes the temperature difference. The temperature sensing layer 606 monitors the actual temperature of the substrate in real time and controls the heater 602 or fan 601 to adjust its working state to continuously keep the substrate temperature quickly and stably within the target range. The receiving and transfer layer 607 plays a role in assisting heat transfer and protecting the temperature sensing layer 606, ensuring the efficient operation of the entire temperature regulation system.

[0031] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A substrate temperature rapid stabilization and adjustment device, comprising a protective shell (1), characterized in that: The bottom of the protective shell (1) is provided with a fixed installation mechanism (2), the top of the protective shell (1) is provided with an adjustment component for adjustment, and the bottom of the protective shell (1) is provided with a uniform heat dissipation mechanism (6). The fixed installation mechanism (2) includes a sliding housing (206), the outside of which is fixedly connected to the outside of the protective shell (1), and the inside of which is fixedly connected to a braking assembly for pushing. The inside of the sliding housing (206) has two fixed balls (203) slidably connected, and the outside of the fixed balls (203) has a connecting fixing strip (201) slidably connected.

2. The substrate temperature rapid stabilization and adjustment device according to claim 1, characterized in that: The uniform heat dissipation mechanism (6) includes a temperature-conducting layer (604), the outside of which is fixedly connected to the bottom of the protective shell (1), a temperature-equalizing layer (605) is fixedly connected to the bottom of the temperature-conducting layer (604), a temperature-sensing layer (606) is fixedly connected to the bottom of the temperature-equalizing layer (605), and a receiving and transmitting layer (607) is fixedly connected to the bottom of the temperature-sensing layer (606).

3. The substrate temperature rapid stabilization and adjustment device according to claim 1, characterized in that: The braking assembly includes a connecting post (205), the outside of which is fixedly connected to the inside of the sliding housing (206), and an elastic spring (204) is fixedly connected to the bottom of the connecting post (205).

4. The substrate temperature rapid stabilization and adjustment device according to claim 3, characterized in that: The bottom of the elastic spring (204) is slidably connected to two push balls (202), and the outside of the push balls (202) is slidably connected to the outside of the fixed ball (203).

5. The substrate temperature rapid stabilization and adjustment device according to claim 4, characterized in that: The outer side of the elastic spring (204) is slidably connected to the inside of the sliding housing (206), and the outer side of the push ball (202) is slidably connected to the inside of the sliding housing (206).

6. The substrate temperature rapid stabilization and adjustment device according to claim 2, characterized in that: A fan (601) is fixedly connected inside the protective shell (1), and a heater (602) is connected inside the protective shell (1).

7. The substrate temperature rapid stabilization and adjustment device according to claim 6, characterized in that: A partition (603) is provided on the opposite side of the fan (601) and the heater (602), and the outside of the partition (603) is fixedly connected to the inside of the protective shell (1).

8. The substrate temperature rapid stabilization and adjustment device according to claim 1, characterized in that: The adjustment assembly includes a temperature control shell (3), the bottom of which is fixedly connected to the top of the protective shell (1), an adjustment disc (4) is fixedly connected to the outside of the temperature control shell (3), and a connecting line (5) is fixedly connected to the outside of the temperature control shell (3). The connecting line (5) is fixedly connected to the outside of the protective shell (1).

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