Modular cell phone back clamp heat spreader
CN224439467UActive Publication Date: 2026-06-30SHENZHEN XINPUCHENG TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN XINPUCHENG TECHNOLOGY CO LTD
- Filing Date
- 2025-06-24
- Publication Date
- 2026-06-30
AI Technical Summary
Technical Problem
Existing mobile phone back clip coolers have a fixed internal structure, leaving very little room for user customization and offering limited functionality, making it difficult to meet the heat dissipation needs of high-performance mobile phones.
Method used
The modular design uses a second spring support block to fix the heat-conducting sheet, and a magnetic terminal to power the battery. Combined with the first and third spring support clamps and support pads, the heat-conducting sheet can be replaced and stably clamped, thus enhancing the heat dissipation effect.
Benefits of technology
It enables modular replacement of heat-conducting plates, increases user customization options, enhances heat dissipation and stability, reduces electronic waste, and improves safety.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224439467U_ABST
Abstract
This utility model discloses a modular mobile phone back clip heat sink, relating to the field of heat sink technology. It includes a frame, a cooling fan fixedly mounted on one side of the frame, a semiconductor cooling chip fixedly mounted inside the frame, and a power supply battery installed inside the frame. An installation cavity is formed inside the frame, and a heat-conducting plate is installed inside the installation cavity. A second spring is fixedly mounted on the inner wall of the installation cavity, and a locking block is fixedly mounted on one end of the second spring. A slot that matches the locking block is formed on one side of the heat-conducting plate, and the heat-conducting plate is fixedly installed inside the installation cavity through the locking block and the slot. In the technical solution provided by this utility model, the second spring is used to support the locking block, allowing the locking block to engage with the slot, thereby fixing the heat-conducting plate in the frame. By replacing the heat-conducting plate with different materials, the heat dissipation effect of the heat sink can be adjusted. The heat-conducting plate can be replaced according to the actual usage scenario, thus realizing a modular and replaceable design and increasing user customization space.
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