Integrated vapor chamber liquid cooling composite heat dissipation device

Abstract

This utility model discloses an integrated vapor chamber liquid-cooled composite heat dissipation device, including a liquid-cooled plate and a vapor chamber connected to the liquid-cooled plate; the vapor chamber is used to transfer heat from a heat source to the liquid-cooled plate; the lower surface of the liquid-cooled plate is recessed upward to form a liquid-cooling cavity; the vapor chamber includes a lower shell and an upper cover covering the lower shell, and a vapor chamber is formed between the upper cover and the lower shell; the lower surface of the lower shell is provided with a boss protruding downward, and the vapor chamber extends into the boss; the lower surface of the boss is a heat source contact surface that contacts the heat source; the upper surface of the upper cover is provided with a fin module protruding upward; the upper cover covers the liquid-cooling cavity and is sealed to the liquid-cooled plate by vacuum brazing; the fin module is located inside the liquid-cooling cavity; thereby, it can eliminate interfacial thermal resistance, has a simple structure, and ensures airtightness.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and in particular to an integrated heat dissipation device with liquid cooling and heat dissipation. Background Technology

[0002] With the rapid development of computer technology, data center servers are being deployed in high-density or even ultra-high-density configurations to meet the demands of high-performance computing services. During server operation, the increasing power of electronic chips leads to a continuous increase in heat flux density, causing heat to concentrate on the CPU surface. Traditional air cooling systems risk being unable to meet these cooling requirements, often necessitating the use of vapor chambers or liquid cooling plates to further enhance heat dissipation. These vapor chambers or liquid cooling plates are typically used independently.

[0003] Traditional vapor chambers rely on phase change heat transfer, which, while achieving temperature uniformity, cannot quickly dissipate heat to distant locations, leading to the vapor chamber drying out and failing under sustained high power. Independent liquid cooling plates, on the other hand, suffer from excessive thermal resistance due to limited heat exchange area when in direct contact with the chip, necessitating an additional vapor chamber layer. Therefore, vapor chambers and liquid cooling plates are often used in combination. However, current solutions for combining the two involve bolting the vapor chamber and liquid cooling plate together, resulting in a 0.03℃·cm gap at the interface. 2 With a contact thermal resistance of over / W and a bulky structure, it is difficult to guarantee a tight seal.

[0004] Therefore, a new technology needs to be developed to solve the above problems. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology, and its main purpose is to provide an integrated heat dissipation device with liquid cooling and heat exchange of a heat exchange plate, which can eliminate interfacial thermal resistance, has a simple structure, and ensures airtightness.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] An integrated vapor chamber liquid-cooled composite heat dissipation device includes a liquid-cooled plate and a vapor chamber connected to the liquid-cooled plate. The vapor chamber is used to transfer heat from a heat source to the liquid-cooled plate. The lower surface of the liquid-cooled plate is recessed upward to form a liquid-cooling cavity. The vapor chamber includes a lower shell and an upper cover covering the lower shell. A vapor chamber is formed between the upper cover and the lower shell. The lower surface of the lower shell is provided with a boss protruding downward. The vapor chamber extends into the boss. The lower surface of the boss is a heat source contact surface that contacts the heat source. The upper surface of the upper cover is provided with a fin module protruding upward. The upper cover covers the liquid-cooling cavity and is sealed to the liquid-cooled plate by vacuum brazing. The fin module is located inside the liquid-cooling cavity.

[0008] As a preferred embodiment, the inner wall of the steam chamber is sintered to form a sintered copper powder layer.

[0009] As a preferred embodiment, the upper surface of the lower shell is recessed into a cavity that extends into the interior of the boss. The upper cover covers the cavity to form the vapor chamber, and the sintered copper powder layer is formed on the inner wall of the cavity.

[0010] As a preferred embodiment, a plurality of bosses are provided, and the plurality of bosses are arranged at intervals on the lower surface of the lower shell.

[0011] As a preferred embodiment, the liquid cooling plate is provided with a first interface end and a second interface end for liquid conduction, and both the first interface end and the second interface end are connected to the liquid cooling cavity.

[0012] As a preferred embodiment, the heat source contact surface is plated with a nickel plating layer.

[0013] As a preferred embodiment, the fin module includes a plurality of fins, and the root of the fins connecting to the upper surface of the cover has a rounded corner.

[0014] As a preferred embodiment, the fin module is provided in two sets, which are defined as the first fin module and the second fin module, respectively. The first fin module and the second fin module extend along the length direction of the upper cover, and the first fin module and the second fin module are arranged at intervals along the width direction of the upper cover.

[0015] A partition wall protrudes downward from the middle of the inner top wall of the liquid cooling cavity. The partition wall extends along the length of the liquid cooling plate to divide the liquid cooling cavity into a first liquid cooling cavity and a second liquid cooling cavity. One end of the partition wall is integrally connected to an inner sidewall of the liquid cooling plate, and the other end is kept at a distance from the other inner sidewall of the liquid cooling plate. One end of the first liquid cooling cavity and the second liquid cooling cavity are connected. The lower surface of the partition wall is flush with the lower surface of the liquid cooling plate.

[0016] The first fin module and the second fin module are located in the first liquid cooling cavity and the second liquid cooling cavity, respectively. The partition wall is located in the gap between the first fin module and the second fin module, and the lower surface of the partition wall abuts against the upper surface of the upper cover.

[0017] As a preferred embodiment, a plurality of first fins of the first fin module are arranged at uniform intervals along the width direction of the upper cover, and a first liquid cooling channel communicating with the first liquid cooling cavity is formed between two adjacent first fins. The first fins extend along the length direction of the upper cover. A groove is recessed on one side of the first fin in the width direction. One end of the groove extends to one end of the first fin, and the other end extends to the center of the first fin. The grooves of the plurality of first fins are arranged alternately along the first center line in the length direction of the first fin module.

[0018] As a preferred embodiment, several second fins of the second fin module extend along the length direction of the upper cover, and the several second fins are arranged alternately and evenly along the second center line in the length direction of the second fin module. A second liquid cooling channel is formed between two adjacent second fins on the same side of the second center line, and the second liquid cooling channels on both sides of the second center line are connected alternately.

[0019] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, it mainly involves a heat spreader consisting of a lower shell and an upper cover, with fin modules protruding upwards on the upper surface of the upper cover. The upper cover covers the liquid cooling cavity of the liquid cooling plate and is vacuum brazed to seal it to the liquid cooling plate. In this way, the heat spreader and the liquid cooling plate can form a metal-sealed connection through vacuum brazing, making the heat spreader and the liquid cooling plate an integrated structure. This eliminates the interfacial thermal resistance and realizes the integrated design of the heat spreader and the liquid cooling plate, so as to achieve the synergistic effect of efficient heat diffusion and forced convection heat dissipation. Moreover, the structure is simple and the sealing performance is guaranteed.

[0020] To more clearly illustrate the structural features, technical means, and specific objectives and functions of this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0021] Figure 1 This is a three-dimensional schematic diagram of the overall structure of an embodiment of this utility model;

[0022] Figure 2 This is a three-dimensional schematic diagram of the overall structure of an embodiment of this utility model from another angle;

[0023] Figure 3 This is a cross-sectional schematic diagram of an embodiment of the present utility model;

[0024] Figure 4 This is an exploded view of an embodiment of the present utility model;

[0025] Figure 5 This is another exploded view of an embodiment of the present utility model;

[0026] Figure 6 This is a three-dimensional schematic diagram of an embodiment of the present invention applied to a chip;

[0027] Figure 7 This is a three-dimensional schematic diagram of a liquid cooling plate according to an embodiment of the present utility model;

[0028] Figure 8 This is a top view of the top cover of an embodiment of the present utility model;

[0029] Figure 9 This is a partial top view of the upper cover according to an embodiment of the present utility model;

[0030] Figure 10 This is a top view of another partial structure of the top cover according to an embodiment of the present utility model.

[0031] Explanation of reference numerals in the attached diagram:

[0032] 10. Liquid cooling plate 11. Spacer wall

[0033] 12. First liquid cooling chamber; 13. Second liquid cooling chamber

[0034] 14. First interface end 15. Second interface end

[0035] 20. Heat spreader plate 21. Lower shell

[0036] 211. Cavity 22. Top Cover

[0037] 23. Steam chamber 24. Boss

[0038] 241. Heat source contact surface; 30. First fin module

[0039] 31. First fin 311. Groove

[0040] 32. First liquid cooling channel; 33. First centerline

[0041] 40. Second fin module 41. Second fin

[0042] 42. Second liquid cooling channel 43. Second centerline

[0043] 50. Chip. Detailed Implementation

[0044] In the description of this utility model, it should be noted that if terms such as "center", "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "inner", and "outer" appear to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0045] Please refer to Figures 1 to 10 As shown, it illustrates the specific structure of the integrated vapor chamber liquid-cooled composite heat dissipation device provided in an embodiment of this utility model. It is primarily used, but not limited to, for heat dissipation of high power density chips, and is particularly suitable for power densities exceeding 500W / cm². 2 Heat dissipation of chips (such as GPUs, AI accelerator chips, and high-power lasers).

[0046] This integrated vapor chamber liquid-cooled composite heat dissipation device includes a liquid cooling plate 10 and a vapor chamber 20 connected to the liquid cooling plate 10. The vapor chamber 20 is used to transfer heat from the heat source to the liquid cooling plate 10. The lower surface of the liquid cooling plate 10 has an upwardly recessed liquid cooling cavity. The vapor chamber 20 includes a lower shell 21 and an upper cover 22 covering the lower shell 21. The lower shell 21 is preferably made of oxygen-free copper, and its thickness can be 0.5-2.0 mm. A vapor chamber 23 is formed between the upper cover 22 and the lower shell 21. The lower surface of the lower shell 21 has a downwardly protruding boss 24, which matches the shape of the chip 50. The vapor chamber 23 extends into the boss 24. The lower surface of the boss 24 is a heat source contact surface 241 that contacts the heat source. The upper surface of the upper cover 22 has an integrally protruding fin module. The upper cover 22 is made of copper or copper-aluminum composite. The thickness of the upper cover 22 of the heat spreader 20 can be 2mm, the fin height of the fin module can be 3-8mm, and the spacing between the fins can be 0.2-0.5mm. The upper cover 22 covers the liquid cooling cavity and is connected to the liquid cooling plate 10 by vacuum brazing. The fin module is located inside the liquid cooling cavity. In this way, by directly processing the fin module on the upper cover 22 of the heat spreader 20 and forming a metal seal with the liquid cooling plate 10 by vacuum brazing, the interface thermal resistance is eliminated, and the traditional thermal pad / bolt connection is eliminated. The integrated design of the heat spreader 20 and the liquid cooling plate 10 is realized, achieving the purpose of modular compact design, which can adapt to high heat flow scenarios in narrow spaces. In addition, the heat of the chip 50 is concentratedly absorbed by the bottom boss 24 of the lower shell 21 of the heat spreader 20, and transferred to the fin area through the phase change of the working fluid inside the vapor chamber 23. Then, the heat is forcibly dissipated by the liquid cooling channel, realizing the coordinated heat transfer of the boss 24 and the fins.

[0047] The inner wall of the steam chamber 23 is sintered to form a sintered copper powder layer; the sintered copper powder layer is preferably a sintered copper powder capillary layer with a porosity of 50-70%; the steam chamber 23 is filled with a working fluid (e.g., water) with a filling rate of 80%. Preferably, in this embodiment, the upper surface of the lower shell 21 is recessed to form a cavity 211, the cavity 211 extends into the interior of the boss 24, and the upper cover 22 covers the cavity 211 to form the steam chamber 23, and the sintered copper powder layer is formed on the inner wall of the cavity 211.

[0048] The boss 24 is provided in several parts, and the bosses 24 are arranged at intervals on the lower surface of the lower shell 21. In this embodiment, there are three bosses 24. The height of the bosses 24 is matched with the chip thickness tolerance (±0.1mm) to ensure uniform contact pressure.

[0049] The heat source contact surface 241 is plated with a nickel plating layer; the thickness of the nickel plating layer is 2-5μm, and the surface flatness is ≤0.05mm.

[0050] The fin module includes several fins, and the root of the fins connected to the upper surface of the cover 22 has a rounded corner to avoid brazing stress concentration. The rounded corner is R0.3mm.

[0051] In this embodiment, the fin module is provided in two sets, which are defined as the first fin module 30 and the second fin module 40, respectively. The first fin module 30 and the second fin module 40 extend along the length direction of the upper cover 22, and the first fin module 30 and the second fin module 40 are arranged at intervals along the width direction of the upper cover 22.

[0052] A partition wall 11 protrudes downward from the middle of the inner top wall of the liquid cooling cavity. The partition wall 11 extends along the length of the liquid cooling plate 10 to divide the liquid cooling cavity into a first liquid cooling cavity 12 and a second liquid cooling cavity 13. One end of the partition wall 11 is integrally connected to an inner sidewall of the liquid cooling plate 10, and the other end is spaced apart from the other inner sidewall of the liquid cooling plate 10. One end of the first liquid cooling cavity 12 and the second liquid cooling cavity 13 are connected. The lower surface of the partition wall 11 is flush with the lower surface of the liquid cooling plate 10. The first fin module 30 and the second fin module 40 are located in the first liquid cooling cavity 12 and the second liquid cooling cavity 13, respectively. The partition wall 11 is located within the gap between the first fin module 30 and the second fin module 40. The lower surface of the partition wall 11 abuts against the upper surface of the upper cover 22.

[0053] The first fin module 30 has a plurality of first fins 31 arranged at uniform intervals along the width direction of the upper cover 22, and a first liquid cooling channel 32 connected to the first liquid cooling cavity 12 is formed between two adjacent first fins 31. The first fins 31 extend along the length direction of the upper cover 22. A groove 311 is recessed on one side of the width direction of the first fin 31. One end of the groove 311 extends to one end of the first fin 31, and the other end extends to the center of the first fin 31. The grooves 311 of the plurality of first fins 31 are arranged alternately along the first center line 33 in the length direction of the first fin module 30, so as to optimize the turbulence in the liquid cooling channel by the alternating arrangement.

[0054] The second fin module 40 has several second fins 41 extending along the length of the upper cover 22. The second fins 41 are arranged alternately and at uniform intervals along the second center line 43 along the length of the second fin module 40. A second liquid cooling channel 42 is formed between two adjacent second fins 41 on the same side of the second center line 43. The second liquid cooling channels 42 on both sides of the second center line 43 are connected alternately to optimize the turbulence in the liquid cooling channel through the alternating arrangement.

[0055] The liquid cooling plate 10 is provided with a first interface end 14 and a second interface end 15 for liquid conduction. The first interface end 14 and the second interface end 15 are both connected to the liquid cooling cavity. Preferably, the first interface end 14 and the second interface end 15 are respectively connected to the first liquid cooling cavity 12 and the second liquid cooling cavity 13.

[0056] In some embodiments, the fin height can be 30-50% of the height of the liquid cooling cavity, and the fin extension direction forms an angle of 45-90° with the coolant flow direction.

[0057] The fins can be machined by CNC milling to form an array of fins on the upper cover 22, with a surface roughness Ra≤1.6μm to enhance the wettability of the brazing filler metal.

[0058] Vacuum brazing can use brazing filler metal (melting point 650-680℃) at 10 -3 Heating to 680℃ under vacuum for 10 minutes achieves bonding.

[0059] The sealing test can be performed using a helium mass spectrometer leak detector, with a leak rate ≤1×10⁻⁶. -8 Pa·m 3 / s.

[0060] Its heat conduction path is as follows:

[0061] Chip heat → Heat distribution through vapor chamber 20 and boss 24 → Evaporation of sintered copper powder capillary layer → Vapor diffusion to fin area → Condensation and heat release to fins → Forced convection in liquid cooling channel removes heat.

[0062] The actual measurement comparison data of the integrated heat dissipation plate liquid cooling composite heat dissipation device of this utility model and the traditional liquid cooling plate 10 are shown in the table below:

[0063]

[0064] The integrated vapor chamber liquid-cooled composite heat dissipation device of this utility model has the following performance advantages: the measured total thermal resistance is ≤0.15℃ / W (from chip junction temperature to coolant), and it can withstand a transient heat flux density of 1000W / cm³. 2 (Lasts 10ms)

[0065] In summary, the key design feature of this utility model lies in its use of a heat spreader consisting of a lower shell and an upper cover. A fin module protrudes upwards from the upper surface of the upper cover, allowing the upper cover to cover the liquid cooling cavity of the liquid cooling plate and be vacuum brazed to create a sealed metal connection between the heat spreader and the liquid cooling plate. This creates an integrated structure, eliminating interfacial thermal resistance and achieving an integrated design that enables efficient heat diffusion and forced convection cooling. The design is simple and ensures a tight seal.

[0066] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. An integrated vapor chamber liquid cooling composite heat dissipation device, comprising a liquid cooling plate and a vapor chamber connected to the liquid cooling plate; the vapor chamber is used to transfer heat of a heat source to the liquid cooling plate; characterized in that: The lower surface of the liquid cooling plate is recessed upward to form a liquid cooling cavity; the heat spreader includes a lower shell and an upper cover covering the lower shell, and a vapor cavity is formed between the upper cover and the lower shell. The lower surface of the lower shell is provided with a boss protruding downward, and the vapor cavity extends into the inside of the boss. The lower surface of the boss is a heat source contact surface that is in contact with the heat source. The upper surface of the upper cover is provided with a fin module protruding upward. The upper cover covers the liquid cooling cavity and is sealed to the liquid cooling plate by vacuum brazing. The fin module is located inside the liquid cooling cavity.

2. The integrated heat dissipation device with liquid cooling and heat exchange according to claim 1, characterized in that: The inner wall of the steam chamber is sintered to form a sintered copper powder layer.

3. The integrated heat dissipation device with liquid cooling and heat exchange according to claim 2, characterized in that: The upper surface of the lower shell is recessed into a cavity that extends into the interior of the boss. The upper cover covers the cavity to form the steam chamber, and the sintered copper powder layer is formed on the inner wall of the cavity.

4. The integrated heat dissipation device with liquid cooling and heat exchange according to claim 1, characterized in that: The boss is provided in a plurality of manners, and the plurality of bosses are arranged at intervals on the lower surface of the lower shell.

5. The integrated heat dissipation device with liquid cooling and heat exchange according to claim 1, characterized in that: The liquid cooling plate is provided with a first interface end and a second interface end for liquid conduction, and both the first interface end and the second interface end are connected to the liquid cooling cavity.

6. The integrated heat dissipation device with liquid cooling and heat exchange according to claim 1, characterized in that: The heat source contact surface is plated with a nickel plating layer.

7. The integrated heat dissipation device with liquid cooling and heat exchange according to claim 1, characterized in that: The fin module includes a plurality of fins, and the root of the fins connected to the upper surface of the cover has a rounded corner.

8. The integrated heat dissipation device with liquid cooling and heat exchange according to claim 1, characterized in that: The fin module is provided in two sets, which are defined as the first fin module and the second fin module, respectively. The first fin module and the second fin module extend along the length direction of the upper cover, and the first fin module and the second fin module are arranged at intervals along the width direction of the upper cover. A partition wall protrudes downward from the middle of the inner top wall of the liquid cooling cavity. The partition wall extends along the length of the liquid cooling plate to divide the liquid cooling cavity into a first liquid cooling cavity and a second liquid cooling cavity. One end of the partition wall is integrally connected to an inner sidewall of the liquid cooling plate, and the other end is kept at a distance from the other inner sidewall of the liquid cooling plate. One end of the first liquid cooling cavity and the second liquid cooling cavity are connected. The lower surface of the partition wall is flush with the lower surface of the liquid cooling plate. The first fin module and the second fin module are located in the first liquid cooling cavity and the second liquid cooling cavity, respectively. The partition wall is located in the gap between the first fin module and the second fin module, and the lower surface of the partition wall abuts against the upper surface of the upper cover.

9. The integrated heat dissipation device with liquid cooling and heat exchange according to claim 8, characterized in that: The first fin module has a plurality of first fins arranged at uniform intervals along the width direction of the upper cover, and a first liquid cooling channel connecting the first liquid cooling cavity is formed between two adjacent first fins. The first fins extend along the length direction of the upper cover. A groove is recessed on one side of the first fin in the width direction. One end of the groove extends to one end of the first fin, and the other end extends to the center of the first fin. The grooves of the plurality of first fins are arranged alternately along the first center line in the length direction of the first fin module.

10. The integrated heat dissipation device with liquid cooling and heat exchange according to claim 8, characterized in that: The second fin module has several second fins that extend along the length of the upper cover. The second fins are arranged alternately and evenly along the second center line along the length of the second fin module. A second liquid cooling channel is formed between two adjacent second fins on the same side of the second center line. The second liquid cooling channels on both sides of the second center line are connected alternately.

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