An array sensor monitoring device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU YAWEI MACHINE TOOL
- Filing Date
- 2025-05-29
- Publication Date
- 2026-07-03
Smart Images

Figure CN224444936U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of monitoring device technology, specifically to an array-type sensor monitoring device. Background Technology
[0002] Internal sensor monitoring technology for laser cutting heads is a key component in ensuring the quality and efficiency of laser processing. It integrates various types of sensors inside the laser cutting head to monitor and adjust parameters during the cutting process in real time.
[0003] One such technology is light scattering sensor monitoring, which is used to monitor the quality of the laser beam and its interaction with materials in real time. By analyzing the scattered light generated by the laser beam during the cutting process, this technology can provide important information about the laser cutting process, thereby optimizing cutting parameters and improving processing quality.
[0004] Currently, most intelligent cutting heads place their internal light scattering sensors on the inner side of the cavity. The light beam generated at the processing surface is reflected back into the cavity and collected and analyzed by the side-mounted light scattering sensor. However, the feedback parameters of the side-mounted light scattering sensor may be affected by the intensity of the reflected beam. Because the scattered light signal is weak, high-level signal amplifiers or filtering techniques are often required to extract useful information. Furthermore, specialized algorithms need to be developed to analyze the data and derive key indicators related to the cutting process.
[0005] To effectively collect scattered light, the optical path usually needs to be carefully designed to ensure that the sensor can receive sufficient signal strength without being affected by strong direct light. Utility Model Content
[0006] To overcome the shortcomings of existing technologies, an array-type sensor monitoring device is provided to solve the problems mentioned in the background art, such as insufficient scattered light intensity and inaccurate feedback data during laser cutting.
[0007] To achieve the above objectives, an array-type sensor monitoring device is provided, comprising: a device housing, which is installed at the lower end of a laser cutting head, and inside the device housing, from top to bottom, an upper protective lens, a collimating lens, a focusing lens, a first reflector module, a second lower protective lens, and a lower protective lens are sequentially installed; a side box is connected to the outer wall of the device housing, and a second reflector module is installed inside the side box, with an array-type sensor provided on the outer side of the second reflector module; and an intelligent monitoring camera is installed on the upper side of the side box.
[0008] Furthermore, the bottom of the device housing is provided with an injection hole, and the top of the housing is provided with a mounting hole.
[0009] Furthermore, the side wall of the device housing is provided with a side light hole, and the first reflector module and the second reflector module are located on both sides of the side light hole.
[0010] Furthermore, both the first reflector module and the second reflector module are tilted and parallel to each other.
[0011] Furthermore, the array sensor is configured as a light scattering sensor.
[0012] Furthermore, the intelligent monitoring camera is fixedly connected to the outer wall of the device housing via a horizontal mounting plate at its upper end, and the camera lens of the intelligent monitoring camera faces downward.
[0013] Furthermore, an upper light-emitting hole is provided on the upper side of the side housing, and the second reflector module is located below the upper light-emitting hole, which is located below the camera of the intelligent monitoring camera.
[0014] The beneficial effects of this utility model are as follows:
[0015] 1. The beam generated during the cutting process is split into wavelengths by the reflector module inside the cavity. The infrared wavelength beam is transmitted through the reflector module, while the visible light and wavelengths below are reflected by the reflector module and finally received and monitored by the array sensor. The beam information is collected without reducing the intensity of the scattered light by directly shining the separated beam.
[0016] 2. Using different types of light scattering sensors, it is possible to monitor the characteristics of the piercing process. Scattered light in the blue-violet band can be used to judge the plasma signal generated when the cutting quality is poor. Scattered light in different bands usually represents different cutting characteristics. For example, scattered light in the visible light band can be used to detect the characteristics of the piercing process, and scattered light in the blue-violet band can be used to judge the plasma signal generated when the cutting quality is poor, etc. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the device and laser installation structure according to an embodiment of the present invention.
[0018] Figure 2 This is a schematic diagram of the internal structure of the device according to an embodiment of the present invention.
[0019] Figure 3 This is a schematic diagram illustrating the working principle of an embodiment of the present invention.
[0020] Figure 4 This is a schematic diagram of the array sensor structure according to an embodiment of the present invention.
[0021] In the diagram: 1. Device housing; 11. Upper protective lens; 12. Collimating lens; 13. Focusing lens; 14. Reflector module one; 15. Lower second protective lens; 16. Lower protective lens; 17. Ejection port; 18. Mounting hole; 19. Side light port; 2. Side housing; 21. Upper light port; 3. Intelligent monitoring camera; 4. Mounting plate; 5. Reflector module two; 6. Array sensor. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] Reference Figures 1 to 4 As shown, this utility model provides an array-type sensor monitoring device, including: a device housing 1, which is installed at the lower end of a laser cutting head, and inside the device housing 1, from top to bottom, an upper protective lens 11, a collimating lens 12, a focusing lens 13, a first reflector module 14, a second lower protective lens 15, and a third lower protective lens 16 are installed sequentially. A side box 2 is connected to the outer wall of the device housing 1, and a second reflector module 5 is installed inside the side box 2. An array-type sensor 6 is provided on the outer side of the second reflector module 5. At the same time, an intelligent monitoring camera 3 is installed on the upper side of the side box 2.
[0024] In this embodiment, the device housing 1 is integrally disposed at one end of the laser beam emitting port of the laser fiber, and the device housing 1, the internal structure, the side box 2, the internal structure, and the intelligent monitoring camera 3 constitute the main structure of the array sensor monitoring device involved in this application.
[0025] like Figure 4 In the array sensor 6, there are 6a, 6b and 6c. 6a is set as three sets of light scattering sensors, 6b is set as four sets of light scattering sensors and 6c is set as five sets of light scattering sensors. These are used to monitor the characteristics of different piercing processes. The blue-violet light band scattered light can be used to judge the plasma signal generated when the cutting quality is poor.
[0026] like Figure 2 and Figure 3In the device housing 1, an ejection hole 17 is provided at the bottom, and a mounting hole 18 is provided at the top. A side light hole 19 is provided on the side wall of the device housing 1. A reflector module 14 and a reflector module 2 5 are located on both sides of the side light hole 19. Both reflector modules 14 and 2 5 are inclined and parallel. An array sensor 6 is a light scattering sensor. The intelligent monitoring camera 3 is fixedly connected to the outer wall of the device housing 1 through a horizontal mounting plate 4 at the top. The camera of the intelligent monitoring camera 3 faces downward. An upper light hole 21 is provided on the upper side of the side housing 2. The reflector module 2 5 is located below the upper light hole 21, and the upper light hole 21 is located below the camera of the intelligent monitoring camera 3.
[0027] Specifically, The protective lens is located inside the laser head cavity, and its main function is to prevent impurities such as spatter and dust from affecting the laser. Head contamination and damage Protective lenses are typically made of materials with high light transmittance and high hardness, enabling them to withstand certain impacts and high temperatures.
[0028] Specifically, the collimating lens 12 uses a convex lens or the like to make the diverging incident light parallel to the emitted light. In the laser emitter cavity, the collimating lens 12 is typically used to maintain the optical speed collimation between the laser resonant cavity and the focusing optical element.
[0029] Specifically, the substrate material of the reflector module is ultraviolet fused silica, and the high-reflectivity dielectric film on its surface is deposited using electron beam evaporation and ion-assisted deposition processes. It is mainly used for light transmission and focusing.
[0030] Specifically, the laser beam passes through the inside of the device housing 1 and is focused onto the material to be cut from the bottom emission port 17, while the laser's emission fiber port is placed in the mounting hole 18.
[0031] Specifically, the light refracted by the first reflector module 14 comes into contact with the second reflector module 5 through the side light hole 19, and then is split by the second reflector module 5 to the array sensor 6 and the intelligent monitoring camera 3.
[0032] In operation, the laser beam is emitted through the laser fiber optic port and passes sequentially through the upper protective lens, collimating lens, focusing lens, reflector module, lower second protective lens, and lower protective lens, finally converging onto the sheet metal to complete the cutting process. The scattered beam generated at the seam of the cut sheet metal passes sequentially through the lower protective lens, lower second protective lens, reflector module one, and reflector module two, and is ultimately received by the array sensor. The laser beam passes sequentially through the S1 and S2 surfaces of reflector module one from the fiber optic port to the sheet metal. The S2 surface of the reflector module is required to have a reflectivity >95% for wavelengths below the visible light band and a transmittance >95% for the laser infrared band. Reflector module two, through beam splitting, transmits the beam to the array sensor and reflects it to the intelligent monitoring camera at a certain ratio, thus enabling the array sensor to collect the scattered light reflected from the seam.
[0033] The array-type sensor monitoring device of this invention can effectively solve the problems mentioned in the background technology. Based on the existing array-type sensor monitoring device technology, it overcomes the problems of insufficient scattered light intensity and inaccurate feedback data, thereby achieving the effect of efficiency and quality separation.
[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An arrayed sensor monitoring device, comprising: The device housing (1) is characterized in that: the device housing (1) is installed at the lower end of the laser cutting head, and the device housing (1) is installed from top to bottom as follows: an upper protective lens (11), a collimating lens (12), a focusing lens (13), a first reflector module (14), a second lower protective lens (15) and a lower protective lens (16), and a side box (2) is connected to the outer wall of the device housing (1). The second reflector module (5) is installed inside the side box (2), and an array sensor (6) is provided on the outside of the second reflector module (5). At the same time, an intelligent monitoring camera (3) is installed on the upper side of the side box (2).
2. The array sensor monitoring device of claim 1, wherein, The device housing (1) has an injection hole (17) at the bottom and an installation hole (18) at the top.
3. The array sensor monitoring device of claim 1, wherein, The device housing (1) has a side light hole (19) on its side wall, and the first reflector module (14) and the second reflector module (5) are located on both sides of the side light hole (19).
4. The array sensor monitoring device of claim 1, wherein, Both the first reflector module (14) and the second reflector module (5) are tilted and parallel to each other.
5. The array sensor monitoring device of claim 1, wherein, The array sensor (6) is configured as a light scattering sensor.
6. The array sensor monitoring device of claim 1, wherein, The intelligent monitoring camera (3) is fixedly connected to the outer wall of the device housing (1) via a horizontal mounting plate (4) at its upper end, and the camera of the intelligent monitoring camera (3) faces downward.
7. The array sensor monitoring device of claim 1, wherein, The upper side of the side box (2) is provided with an upper light hole (21), and the second reflector module (5) is located below the upper light hole (21), and the upper light hole (21) is located below the camera of the intelligent monitoring camera (3).