C-axis compensation device and polishing apparatus

CN224445580UActive Publication Date: 2026-07-03LENS SYST INTEGRATION CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
LENS SYST INTEGRATION CO LTD
Filing Date
2025-08-05
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

[0006]本申请的目的是提供一种C轴补偿装置及研磨抛光设备,用于解决在降低操作高度时,现有的吸附装夹治具中气路连接软管在狭小空间内存在安装与拆卸困难的问题

Benefits of technology

[0034]本申请提供的C轴补偿装置,应用于研磨抛光设备,C轴补偿装置中的负压吸附治具座采用负压吸附产品进行打磨,连通负压吸附治具座的做的负压气体流道形成于C轴本体内,并且C轴本体上套设气密罩,气密罩与所述C轴本体之间形成动密封配合,气密罩的外周壁上设有外接负压装置的抽气孔,抽气孔可向外抽气,抽气孔通过气密罩上的真空环槽与负压气体流道连通。由此,本申请提供的C轴补偿装置中的整个负压气流的气路中并未采用气滑环和连接软管,如此为降低操作高度,C轴本体的轴向空间被压缩时,C轴本体内的负压气体流道会随之缩短进行适配,结构上更简单,无需考虑连接软管的拆装问题,降低了维护成本。

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Abstract

The application relates to the technical field of polishing equipment, and discloses a C-axis compensation device and a grinding and polishing equipment. The C-axis compensation device comprises a C-axis module and a negative pressure adsorption jig seat. The C-axis module comprises a C-axis body, a rotary driving mechanism and an airtight cover. The C-axis body is in transmission connection with the rotary driving mechanism. The airtight cover is sleeved on the C-axis body and forms a dynamic sealing cooperation with the C-axis body. A vacuum ring groove is arranged on the inner wall of the airtight cover around the axial direction of the airtight cover. An exhaust hole connected with a negative pressure device is arranged on the outer peripheral wall of the airtight cover. The negative pressure adsorption jig seat is arranged at one end of the C-axis body away from the rotary driving mechanism. Negative pressure adsorption holes are arranged on the bearing surface of the negative pressure adsorption jig seat. A negative pressure gas flow channel is arranged in the C-axis body and is communicated with the vacuum ring groove and the negative pressure adsorption holes. In the C-axis compensation device, the gas path of the whole negative pressure airflow is not affected by the axial space compression of the C-axis body, and the structure is simple and the maintenance cost is low.
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Description

Technical Field

[0001] This application belongs to the field of polishing equipment technology, specifically relating to a C-axis compensation device and a grinding and polishing equipment. Background Technology

[0002] Grinding and polishing is one of the important processes in product processing. There are various ways to clamp and fix products in existing grinding and polishing machines, such as using clamping mechanisms, magnetic fixation, or negative pressure adsorption fixation.

[0003] In the grinding and polishing machine for negative pressure adsorption fixation, the adsorption clamping fixture is installed on the C-axis module. The C-axis module usually includes a drive motor, C-axis body, air slip ring and dust cover. One end of the C-axis body is installed on the reducer, and after passing through the air slip ring, the other end is fixedly connected to the adsorption clamping fixture.

[0004] Since the air slip ring is a standard part, its central rotating rotor can continuously rotate to transmit vacuum, but it itself does not have load-bearing capacity. Therefore, the C-axis body cannot be directly mounted on the rotor; it must pass through the rotor and connect to the reducer. Simultaneously, the rotor's air vent and the fixture mounting plate's air extraction port need to be connected via a flexible hose. This connection structure is relatively complex and fragile, easily affected by dust and debris during grinding and polishing, which can lead to malfunctions. Therefore, a dust cover needs to be added below the fixture mounting plate for isolation.

[0005] To meet the needs of manual loading operations, existing technologies reduce the overall operating height of the adsorption clamping fixture by compressing the axial space of the C-axis body. This makes it more difficult to install and remove the air connection hose in a confined space, significantly increasing the maintenance difficulty of the equipment. Moreover, it is difficult to compress the overall height of the C-axis module of this design to a reasonable height that conforms to ergonomics and operating habits. Summary of the Invention

[0006] The purpose of this application is to provide a C-axis compensation device and a grinding and polishing equipment to solve the problem that the air connection hose in the existing adsorption clamping fixture is difficult to install and disassemble in a confined space when the operating height is reduced.

[0007] To achieve the above objectives, the first aspect of this application provides a C-axis compensation device for use in grinding and polishing equipment, the C-axis compensation device comprising:

[0008] The C-axis module includes a C-axis body, a rotary drive mechanism, and an airtight cover. The C-axis body is drively connected to the rotary drive mechanism. The airtight cover is fitted onto the C-axis body and forms a dynamic seal with it. A vacuum annular groove is provided on the inner wall of the airtight cover around its own axial direction, and an air extraction hole for an external negative pressure device is provided on the outer peripheral wall of the airtight cover.

[0009] A negative pressure adsorption fixture is provided at the end of the C-axis body away from the rotary drive mechanism, and negative pressure adsorption holes are provided on the bearing surface of the negative pressure adsorption fixture.

[0010] The C-axis body is provided with a negative pressure gas flow channel that connects the vacuum annular groove and the negative pressure adsorption hole.

[0011] As a further improvement to the above technical solution:

[0012] In some embodiments, seals are provided on both sides of the vacuum annular groove, and the seals are located between the airtight cover and the C-axis body.

[0013] In some embodiments, the inner wall of the airtight shroud is provided with first sealing grooves on both sides of the vacuum ring groove to accommodate the corresponding sealing elements;

[0014] And / or, the outer peripheral wall of the C-axis body is provided with second sealing grooves on both sides of the vacuum ring groove to accommodate the corresponding sealing elements.

[0015] The sealing element is a star-shaped sealing ring, and the cross-section of the star-shaped sealing ring is X-shaped.

[0016] In some embodiments, the C-axis compensation device further includes:

[0017] The displacement compensation module has displacement compensation in the Y-axis and Z-axis directions;

[0018] A pressure detection module is mounted on the displacement compensation module, and the rotary drive mechanism is mounted on the pressure detection module; and

[0019] The pressure control module is electrically connected to the displacement compensation module and the pressure detection module.

[0020] In some embodiments, the displacement compensation module includes:

[0021] The Y-axis displacement compensation mechanism has displacement compensation in the Y-axis direction;

[0022] A Z-axis displacement compensation mechanism is mounted on the Y-axis displacement compensation mechanism and provides displacement compensation in the Z-axis direction; and

[0023] The mounting base is arranged on one side of the Z-axis displacement compensation mechanism and is drivenly connected to the Z-axis displacement compensation mechanism.

[0024] The pressure detection module is mounted on the mounting base.

[0025] In some embodiments, the Y-axis displacement compensation mechanism includes a first base and a Y-axis drive module. The Z-axis displacement compensation mechanism is slidably disposed on the first base along the Y-axis direction. The Y-axis drive module is disposed on the first base and drivenly connected to the Z-axis displacement compensation mechanism. The first power output component in the Y-axis drive module is arranged on the side of the Z-axis displacement compensation mechanism facing away from the mounting base.

[0026] And / or, the Z-axis displacement compensation mechanism includes a second base and a Z-axis drive module; the second base is driven to connect with the Y-axis displacement compensation mechanism, the mounting base is slidably disposed on one side of the second base along the Z-axis direction, the Z-axis drive module includes a second power output component, a transmission component and a Z-axis linear component, the Z-axis linear component is disposed on one side of the second base and driven to connect with the mounting base, the second power output component is disposed on the other side of the second base, wherein the output end of the second power output component faces upward and is driven to connect with the Z-axis linear component through the transmission component.

[0027] In some embodiments, the mounting base includes:

[0028] The upright plate is driven and connected to the Z-axis displacement compensation mechanism.

[0029] A horizontal plate is disposed at the lower end of the vertical plate and extends along the Y-axis; and

[0030] A tie plate is arranged above the horizontal plate and connects the vertical plate and the horizontal plate respectively.

[0031] In some embodiments, the C-axis compensation device further includes a leveling plate, which is disposed between the pressure detection module and the displacement compensation module, and leveling bolts are provided around the leveling plate.

[0032] The second aspect of this application also provides a grinding and polishing apparatus, including at least one C-axis compensation device according to the first aspect described above.

[0033] Compared with the prior art, the C-axis compensation device and grinding and polishing equipment provided in this application have at least the following beneficial effects:

[0034] The C-axis compensation device provided in this application is applied to grinding and polishing equipment. The negative pressure adsorption fixture in the C-axis compensation device uses a negative pressure adsorption product for grinding. A negative pressure gas flow channel connected to the negative pressure adsorption fixture is formed within the C-axis body. An airtight cover is fitted onto the C-axis body, forming a dynamic seal with the airtight cover. The outer peripheral wall of the airtight cover has an extraction port for an external negative pressure device, allowing air to be extracted outwards. The extraction port communicates with the negative pressure gas flow channel through a vacuum ring groove on the airtight cover. Therefore, the entire negative pressure airflow path in the C-axis compensation device provided in this application does not use air slip rings or connecting hoses. To reduce the operating height, when the axial space of the C-axis body is compressed, the negative pressure gas flow channel within the C-axis body shortens accordingly for adaptation. The structure is simpler, eliminating the need to consider the disassembly and assembly of connecting hoses, thus reducing maintenance costs.

[0035] Other features and advantages of the embodiments of this application will be described in detail in the following detailed description section. Attached Figure Description

[0036] The accompanying drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the following detailed description to explain the embodiments of this application, but do not constitute a limitation on the embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without any inventive effort. In the drawings:

[0037] Figure 1 This is a three-dimensional structural diagram of a grinding and polishing device provided in an embodiment of this application;

[0038] Figure 2 This is a three-dimensional structural diagram of a C-axis compensation device provided in an embodiment of this application.

[0039] Figure 3 for Figure 2 The front view of the C-axis compensation device shown;

[0040] Figure 4 for Figure 3 Sectional view along the middle AA direction;

[0041] Figure 5 for Figure 4 A magnified view of a portion of point B in the middle;

[0042] Figure 6 This is a three-dimensional structural schematic diagram of the C-axis compensation device provided in an embodiment of this application from another perspective.

[0043] Explanation of reference numerals in the attached figures

[0044] 10. C-axis compensation device; 20. Multi-axis polishing head device; 30. XY-axis two-dimensional platform; 40. Base; 50. Z-axis lifting device;

[0045] 100. C-axis module; 110. C-axis body; 111. Negative pressure gas flow channel; 120. Rotary drive mechanism; 130. Airtight cover; 131. Vacuum ring groove; 132. Air extraction hole; 133. First sealing groove; 140. Sealing element; 150. Displacement compensation module; 151. Y-axis displacement compensation mechanism; 1510. First base; 1511. Y-axis drive module; 1511a. First power output assembly; 1511b. Y-axis linear assembly; 152. Z-axis displacement compensation mechanism; 1520. Second base; 1521. Z-axis drive module; 1521a. Second power output assembly; 1521b. Transmission assembly; 1521c. Z-axis linear assembly; 153. Mounting base; 1530. Vertical plate; 1531. Horizontal plate; 1532. Tie plate; 160. Pressure detection module; 170. Horizontal adjustment plate;

[0046] 200. Negative pressure adsorption fixture base; 210. Negative pressure adsorption hole. Detailed Implementation

[0047] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this application.

[0048] The present application will now be described in detail with reference to the accompanying drawings and exemplary embodiments.

[0049] Example 1

[0050] Please see Figure 1 , Figure 2 and Figure 3 This embodiment provides a C-axis compensation device 10, which can be applied to grinding and polishing equipment. The C-axis compensation device 10 is used to clamp the workpiece to be ground and polished and to contact the polishing head in the grinding and polishing equipment to perform grinding and polishing operations.

[0051] In this embodiment, the C-axis compensation device 10 includes a C-axis module 100 and a negative pressure adsorption fixture 200. The negative pressure adsorption fixture 200 is disposed on the C-axis module 100, and a negative pressure device is externally connected to the negative pressure adsorption fixture 200 to adsorb the product to be ground and polished. The C-axis module 100 can drive the negative pressure adsorption fixture 200 and the adsorbed product to rotate together. In this embodiment, the rotation axis is defined as the C-axis.

[0052] Please see Figure 3 , Figure 4 and Figure 5The C-axis module 100 includes a C-axis body 110, a rotary drive mechanism 120, and an airtight cover 130. The C-axis body 110 is connected to the rotary drive mechanism 120. The airtight cover 130 is fitted onto the C-axis body 110 and forms a dynamic seal with it. A vacuum annular groove 131 is provided on the inner wall of the airtight cover 130 around its own axial direction, and an air extraction hole 132 for an external negative pressure device is provided on the outer peripheral wall of the airtight cover 130. It can be understood that the airtight cover 130 can be set on the fixed base of the rotary drive mechanism 120, and through the dynamic seal, the C-axis body 110 can rotate relative to the airtight cover 130, but it can prevent airflow from entering the vacuum annular groove 131 through the assembly gap between the airtight cover 130 and the C-axis body 110.

[0053] The negative pressure adsorption fixture 200 is located at the end of the C-axis body 110 away from the rotary drive mechanism 120. A negative pressure adsorption hole 210 is provided on the bearing surface of the negative pressure adsorption fixture 200. The C-axis body 110 contains a negative pressure gas flow channel 111 that connects the vacuum annular groove 131 and the negative pressure adsorption hole 210. Thus, by providing negative pressure through an external negative pressure device, the airflow on the bearing surface of the negative pressure adsorption fixture 200 sequentially passes through the negative pressure adsorption hole 210, the negative pressure gas flow channel 111, the vacuum annular groove 131, and the extraction hole 132 before entering the negative pressure device. This creates a negative pressure airflow on the bearing surface of the negative pressure adsorption fixture 200 that adsorbs the product.

[0054] Specifically, in this embodiment, sealing elements 140 are provided on both sides of the vacuum ring groove 131. The sealing elements 140 are located between the airtight cover 130 and the C-axis body 110. The sealing elements 140 achieve dynamic sealing between the airtight cover 130 and the C-axis body 110, preventing external airflow from entering the vacuum ring groove 131 from the assembly gap between the airtight cover 130 and the C-axis body 110, ensuring the negative pressure adsorption capacity of the negative pressure adsorption fixture 200, and ensuring the stability of the adsorbed product.

[0055] In some embodiments, the inner wall of the airtight cover 130 is provided with first sealing grooves 133 on both sides of the vacuum ring groove 131 to accommodate corresponding sealing elements 140; thus, a sealing element 140 can be provided in each first sealing groove 133, and the sealing element 140 abuts against the outer peripheral wall of the C-axis body 110 to form a dynamic seal, thereby ensuring the sealing performance on both sides of the vacuum ring groove 131.

[0056] In some other embodiments, the outer peripheral wall of the C-axis body 110 is provided with second sealing grooves on both sides of the vacuum ring groove 131 to accommodate corresponding sealing elements 140; thus, a sealing element 140 can be provided in each second sealing groove, and the sealing element 140 abuts against the inner wall of the airtight cover 130 to form a dynamic seal, thereby ensuring the sealing of both sides of the vacuum ring groove 131.

[0057] In some other embodiments, the inner wall of the airtight cover 130 is provided with a first sealing groove 133 on both sides of the vacuum ring groove 131 to accommodate the corresponding sealing element 140, and at the same time, the outer peripheral wall of the C-axis body 110 is provided with a second sealing groove on both sides of the vacuum ring groove 131 to accommodate the corresponding sealing element 140. In this way, the sealing element 140 is simultaneously inserted into the first sealing groove 133 and the second sealing groove, which can achieve dynamic sealing to ensure the sealing of both sides of the vacuum ring groove 131, and also provide a certain axial limit.

[0058] Optionally, the seal 140 is a star-shaped seal ring with an X-shaped cross-section. The X-shaped star-shaped seal ring can provide vacuum sealing, meet the requirements of rotational wear and heat dissipation, and prevent polishing dust and debris from falling in, making it perfectly suited for grinding and polishing conditions.

[0059] In some embodiments, the C-axis compensation device 10 further includes a dust cover, which covers the outside of the airtight cover 130 to further prevent polishing dust and debris from falling between the airtight cover 130 and the C-axis body 110.

[0060] Compared to existing technologies, the C-axis compensation device 10 provided in this embodiment does not use air slip rings and connecting hoses in the entire negative pressure airflow path. In order to reduce the operating height, when the axial space of the C-axis body 110 is compressed, the negative pressure gas flow channel 111 inside the C-axis body 110 will shorten accordingly to adapt. The structure is simpler, there is no need to consider the disassembly and assembly of connecting hoses, reducing maintenance costs, and the overall height can be adjusted more easily to a reasonable height that conforms to ergonomics and operating habits.

[0061] Example 2

[0062] Please see Figure 1 , Figure 2 and Figure 3 This embodiment provides a C-axis compensation device 10, which can be applied to grinding and polishing equipment. This embodiment is an improvement on the technology of Embodiment 1 described above. The difference between this embodiment and Embodiment 1 is as follows:

[0063] The C-axis compensation device 10 provided in this embodiment further includes a displacement compensation module 150, a pressure detection module 160, and a pressure control module. The displacement compensation module 150 has displacement compensation in the Y-axis direction and the Z-axis direction; the pressure detection module 160 is disposed on the displacement compensation module 150, and the rotary drive mechanism 120 is disposed on the pressure detection module 160; the pressure control module is electrically connected to the displacement compensation module 150 and the pressure detection module 160.

[0064] Furthermore, the displacement compensation module 150 includes a Y-axis displacement compensation mechanism 151, a Z-axis displacement compensation mechanism 152, and a mounting base 153. The Y-axis displacement compensation mechanism 151 provides displacement compensation in the Y-axis direction; the Z-axis displacement compensation mechanism 152 is mounted on the Y-axis displacement compensation mechanism 151 and provides displacement compensation in the Z-axis direction. The mounting base 153 is arranged on one side of the Z-axis displacement compensation mechanism 152 and is drivenly connected to the Z-axis displacement compensation mechanism 152.

[0065] The pressure detection module 160 is mounted on the mounting base 153. The pressure detection module 160 can monitor the pressure changes of the polishing head on the product in real time.

[0066] Please refer to the following: Figure 6 The Y-axis displacement compensation mechanism 151 includes a first base 1510 and a Y-axis drive module 1511. The Z-axis displacement compensation mechanism 152 is slidably disposed on the base along the Y-axis direction. The Y-axis drive module 1511 is disposed on the first base 1510 and is drivenly connected to the Z-axis displacement compensation mechanism 152. The first power output component 1511a in the Y-axis drive module 1511 is arranged on the side of the Z-axis displacement compensation mechanism 152 facing away from the mounting base 153.

[0067] Optionally, the Y-axis drive module 1511 can be a cylinder, hydraulic cylinder, electric cylinder, linear motor, or lead screw motor. For example, when the Y-axis drive module 1511 is selected as a lead screw motor, the first power output component 1511a is a motor.

[0068] It is understandable that by arranging the first power output component 1511a on the side of the Z-axis displacement compensation mechanism 152 facing away from the mounting base 153, the space occupied on the lower side of the mounting base 153 can be reduced, and interference with the rotary drive mounted on the mounting base 153 can be avoided. This reduces the height of the entire mounting base 153 in the Z-axis direction, thereby reducing the installation height of the negative pressure adsorption fixture 200.

[0069] Please refer to the following: Figure 6 The Z-axis displacement compensation mechanism 152 includes a second base 1520 and a Z-axis drive module 1521. The second base 1520 is drivenly connected to the Y-axis displacement compensation mechanism 151. The mounting base 153 is slidably disposed on one side of the second base 1520 along the Z-axis direction. The Z-axis drive module 1521 includes a second power output component 1521a, a transmission component 1521b, and a Z-axis linear component 1521c. The Z-axis linear component 1521c is disposed on one side of the second base 1520 and drivenly connected to the mounting base 153. The second power output component 1521a is disposed on the other side of the second base 1520. The output end of the second power output component 1521a faces upward and is drivenly connected to the Z-axis linear component 1521c through the transmission component 1521b.

[0070] It is understandable that the output end of the second power output component 1521a is set upwards, so that the entire body of the second power output component 1521a is located below the output end, thereby reducing the space occupied above and further reducing the height of the C-axis module 100 in the Z-axis direction, which in turn reduces the installation height of the negative pressure adsorption fixture 200.

[0071] Optionally, the second power output assembly 1521a can be a motor. The transmission assembly 1521b can be a synchronous belt drive assembly 1521b, a sprocket drive assembly 1521b, a gear drive assembly 1521b, etc. The Z-axis linear assembly 1521c adopts a lead screw and nut assembly.

[0072] The working principle of the displacement compensation module 150 in this embodiment is as follows: When the polishing head in the grinding and polishing equipment polishes the product to be polished, the pressure detection module 160 will monitor the applied force in real time. When compensation adjustment is required, such as in the Y-axis direction and / or Z-axis direction, the Y-axis drive module 1511 drives the Z-axis displacement compensation mechanism 152 and the C-axis module 100 and the negative pressure adsorption fixture seat 200 installed on the Z-axis displacement compensation mechanism 152 to perform Y-axis direction movement compensation; the Z-axis drive module 1521 directly drives the C-axis module 100 and the negative pressure adsorption fixture seat 200 installed on the Z-axis displacement compensation mechanism 152 to perform Z-axis direction movement compensation.

[0073] Specifically, during the grinding and polishing process, the Y-axis drive module 1511 applies a suitable thrust in the Y-axis direction to the C-axis module 100 and controls the pressure application based on the pressure information fed back by the pressure detection module 160; the Z-axis drive module 1521 applies a suitable thrust in the Z-axis direction to the C-axis module 100 and controls the pressure application based on the pressure information fed back by the pressure detection module 160. By applying compensated forces in both directions, the product is kept at the appropriate pressure required for polishing, thus improving the grinding and polishing effect. In this way, when the force applied by the polishing head is inconsistent, the pressure sensor detects the pressure change and feeds the pressure data back to the pressure control module. Based on the pressure feedback value, the pressure control module controls the Y-axis drive module 1511 and / or the Z-axis drive module 1521 to perform corresponding directional compensation, thereby ensuring that the product always maintains a balanced and controllable pressure.

[0074] Optionally, the pressure detection module 160 can be selected as a pressure sensor or a pressure strain gauge. The pressure control module can be selected as a microcontroller or a PLC controller.

[0075] Please see Figure 2 and Figure 3The mounting base 153 includes a vertical plate 1530, a horizontal plate 1531, and tie plates 1532. The vertical plate 1530 is drivenly connected to the Z-axis displacement compensation mechanism 152; the horizontal plate 1531 is disposed at the lower end of the vertical plate 1530 and extends along the Y-axis direction. Thus, the vertical plate 1530 and the horizontal plate 1531 form an L-shaped structure. Two tie plates 1532 are provided, which are respectively arranged above the horizontal plate 1531 and connect the vertical plate 1530 and the horizontal plate 1531, thereby improving the structural stability and structural strength of the mounting base 153 through tension. The rotation drive mechanism 120 of the C-axis module 100 is disposed on the horizontal plate 1531 and between the two tie plates 1532.

[0076] It is understood that, in this embodiment, the mounting base 153, by arranging the two tie plates 1532 above the horizontal plate 1531, can further save space occupied in the Z-axis direction of the mounting plate compared to the solution of arranging them below. As a result, the mounting position of the mounting base 153 is lower, thereby reducing the installation height of the negative pressure adsorption fixture 200.

[0077] Thus, this embodiment effectively reduces the installation height of the negative pressure adsorption fixture 200 through the arrangement of the Y-axis drive module 1511 and the Z-axis drive module 1521 in the displacement compensation module 150, as well as the structural design of the mounting plate. Simultaneously, based on the C-axis module 100 provided in Embodiment 1, the axial dimension of the C-axis body 110 can be further compressed, allowing for a further reduction in the installation height of the negative pressure adsorption fixture 200 during the design phase. This ensures that the grinding and polishing operation height conforms to ergonomics and operating habits, alleviating the workload of operators and reducing work-related injuries and material waste.

[0078] In some embodiments, without considering reducing the installation height of the negative pressure adsorption fixture 200, two tie plates 1532 can also be set below the horizontal plate 1531 to support the horizontal plate 1531, which can also improve the structural stability and structural strength of the mounting base 153.

[0079] Please see Figure 2 and Figure 6 In some embodiments, the C-axis compensation device 10 further includes a leveling plate 170, which is disposed between the pressure detection module 160 and the displacement compensation module 150. Leveling bolts are provided around the leveling plate 170. Thus, the horizontal orientation of the entire C-axis module 100 can be adjusted by tightening the leveling bolts. Furthermore, a level can be installed on the leveling plate 170 to observe the levelness of the C-axis module 100, thereby improving the ease of adjustment.

[0080] Example 3

[0081] Please see Figure 1 and Figure 2 This embodiment provides a grinding and polishing device. The grinding and polishing device includes a base 40, a Z-axis lifting device 50, an XY-axis two-dimensional adjustment platform, a multi-axis polishing head device 20, and at least one C-axis compensation device 10 provided according to Embodiment 1 or Embodiment 2 above.

[0082] Both the Z-axis lifting device 50 and the XY-axis two-dimensional adjustment platform are mounted on the base 40. The multi-axis polishing head device 20 is installed on the Z-axis lifting device 50 and is located above the XY-axis two-dimensional adjustment platform. The multi-axis polishing head device 20 has multiple polishing heads, and the XY-axis two-dimensional adjustment platform has a C-axis compensation device 10 corresponding to the number of polishing heads. The Z-axis lifting device 50 can drive the multi-axis polishing head device 20 to move up and down in the vertical direction, and the XY-axis two-dimensional adjustment platform can realize position adjustment in the X-axis and Y-axis directions.

[0083] The Z-axis lifting device 50 and the XY-axis two-dimensional adjustment platform can both be driven linearly by linear mechanisms such as motor screws, electric cylinders, pneumatic cylinders, hydraulic cylinders, or linear motors.

[0084] It should be noted that, in this application, unless otherwise stated, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" used to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0085] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0086] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0087] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0088] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A C-axis compensation device applied to a lapping and polishing apparatus, characterized by, The C-axis compensation device (10) includes: The C-axis module (100) includes a C-axis body (110), a rotary drive mechanism (120), and an airtight cover (130). The C-axis body (110) is connected to the rotary drive mechanism (120) in a transmission manner. The airtight cover (130) is sleeved on the C-axis body (110) and forms a dynamic seal with the C-axis body (110). A vacuum annular groove (131) is provided on the inner wall of the airtight cover (130) around its own axial direction. An air extraction hole (132) for an external negative pressure device is provided on the outer peripheral wall of the airtight cover (130). A negative pressure adsorption fixture (200) is provided at one end of the C-axis body (110) away from the rotary drive mechanism (120), and a negative pressure adsorption hole (210) is provided on the bearing surface of the negative pressure adsorption fixture (200). The C-axis body (110) is provided with a negative pressure gas flow channel (111) that connects the vacuum ring groove (131) and the negative pressure adsorption hole (210).

2. The C-axis compensation apparatus according to claim 1, characterized by, A sealing element (140) is provided on both sides of the vacuum ring groove (131), and the sealing element (140) is located between the airtight cover (130) and the C-axis body (110).

3. The C-axis compensation device according to claim 2, characterized by The inner wall of the airtight cover (130) is provided with first sealing grooves (133) on both sides of the vacuum ring groove (131) to accommodate the corresponding sealing element (140). And / or, the outer peripheral wall of the C-axis body (110) is provided with a second sealing groove on both sides of the vacuum ring groove (131) to accommodate the corresponding sealing element (140).

4. The C-axis compensation device according to claim 2 or 3, characterized by The sealing element (140) is a star-shaped sealing ring, and the cross-section of the star-shaped sealing ring is X-shaped.

5. The C-axis compensation device according to claim 1, characterized in that, The C-axis compensation device (10) further includes: The displacement compensation module (150) has displacement compensation in the Y-axis direction and the Z-axis direction; A pressure detection module (160) is mounted on the displacement compensation module (150), and a rotary drive mechanism (120) is mounted on the pressure detection module (160); and The pressure control module is electrically connected to the displacement compensation module (150) and the pressure detection module (160).

6. The C-axis compensation device according to claim 5, wherein The displacement compensation module (150) includes: Y-axis displacement compensation mechanism (151) has displacement compensation in the Y-axis direction; The Z-axis displacement compensation mechanism (152) is mounted on the Y-axis displacement compensation mechanism (151) and has displacement compensation in the Z-axis direction; and Mounting base (153) is arranged on one side of the Z-axis displacement compensation mechanism (152) and is drivenly connected to the Z-axis displacement compensation mechanism (152); The pressure detection module (160) is mounted on the mounting base (153).

7. The C-axis compensation device according to claim 6, wherein The Y-axis displacement compensation mechanism (151) includes a first base (1510) and a Y-axis drive module (1511). The Z-axis displacement compensation mechanism (152) is slidably disposed on the first base (1510) along the Y-axis direction. The Y-axis drive module (1511) is disposed on the first base (1510) and drivenly connected to the Z-axis displacement compensation mechanism (152). The first power output component (1511a) in the Y-axis drive module (1511) is arranged on the side of the Z-axis displacement compensation mechanism (152) facing away from the mounting base (153). And / or, the Z-axis displacement compensation mechanism (152) includes a second base (1520) and a Z-axis drive module (1521); the second base (1520) is driven to connect with the Y-axis displacement compensation mechanism (151), the mounting base (153) is slidably disposed on one side of the second base (1520) along the Z-axis direction, the Z-axis drive module (1521) includes a second power output component (1521a), a transmission component (1521b) and a Z-axis linear component (1521c), the Z-axis linear component (1521c) is disposed on one side of the second base (1520) and driven to connect with the mounting base (153), the second power output component (1521a) is disposed on the other side of the second base (1520), wherein the output end of the second power output component (1521a) faces upward and is driven to connect with the Z-axis linear component (1521c) through the transmission component (1521b).

8. The C-axis compensation apparatus according to claim 6, characterized by The mounting base (153) includes: The upright plate (1530) is driven to connect with the Z-axis displacement compensation mechanism (152); A horizontal plate (1531) is disposed at the lower end of the vertical plate (1530) and extends along the Y-axis direction; and A tie plate (1532) is arranged above the horizontal plate (1531) and connects the vertical plate (1530) and the horizontal plate (1531) respectively.

9. The C-axis compensation device according to any one of claims 5-6, wherein, The C-axis compensation device (10) also includes a leveling plate (170), which is disposed between the pressure detection module (160) and the displacement compensation module (150), and leveling bolts are provided around the leveling plate (170).

10. A lapping polishing apparatus characterized by comprising: Includes at least one C-axis compensation device (10) according to any one of claims 1-9.