A chemical mechanical polishing pad mounting device

Abstract

This application provides a chemical mechanical polishing pad mounting device, including a base, with a mounting part at one end of the base. The mounting part includes a bottom wall and a surrounding wall circumferentially surrounding the bottom wall. The surrounding wall and the bottom wall form a mounting groove. An alignment mechanism is provided on the surrounding wall. The mounting groove and the alignment mechanism are configured to achieve axial centering and positioning of the ceramic disc and the wax-free adsorption pad, thereby effectively improving the alignment accuracy between the wax-free adsorption pad and the ceramic disc, enabling the wax-free adsorption pad to accurately adhere to the ceramic disc, improving the bonding success rate, reducing the risk of material waste, and the chemical mechanical polishing pad mounting device of this application greatly simplifies the process structure and reduces costs.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a chemical mechanical polishing pad mounting device. Background Technology

[0002] In the chemical mechanical polishing process, the wax-free adsorption pad adsorbs the workpiece to be polished through the bottom cloth material inside the Pocket holes (blind holes). The Pocket holes are designed with the same depth and are evenly distributed on the substrate. The liquid film adsorption force of liquid media such as water can adsorb thin parts such as semiconductor wafers and their epitaxial products and optical components onto the wax-free adsorption pad, so that the products are fixed in place during the processing and do not fall off. After processing, it is easy to remove the wafers and there is no problem of residual wax or adhesive left on the products as with wax or film polishing.

[0003] When performing chemical mechanical polishing (CMP) on semiconductor wafers and optical components without wax, a wax-free CMP pad is typically attached to a ceramic disk while simultaneously supporting the product during polishing. Currently, the attachment of the wax-free pad is mostly done manually. For example, a small portion of the release paper on the back of the pad is torn off, and the pad is visually aligned with the ceramic disk. A fixture is then used to press it firmly until the entire pad is adhered to the disk. Finally, a weight or press is used to press the disk down. However, manual alignment has a high margin of error, making it difficult to accurately align the axes. Errors can significantly affect the adhesive strength, sometimes necessitating the replacement of the pad and resulting in material waste.

[0004] Therefore, how to effectively improve the alignment accuracy of the wax-free adsorption pad and the ceramic disc during the pasting process is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of this, this application proposes a chemical mechanical polishing pad mounting device, which aims to effectively improve the alignment accuracy of the wax-free adsorption pad and the ceramic disc during the pasting process.

[0006] This application provides a chemical mechanical polishing pad mounting device, including a base, one end of which is provided with a mounting part, the mounting part including a bottom wall and a surrounding wall circumferentially surrounding the bottom wall, the surrounding wall and the bottom wall forming a mounting groove, the surrounding wall being provided with an alignment mechanism, the mounting groove and the alignment mechanism being configured to achieve axial centering and positioning of a ceramic disc and a wax-free adsorption pad.

[0007] In one embodiment, the alignment mechanism is disposed on the end face of the enclosure wall away from the bottom wall. The alignment mechanism includes at least two positioning blocks, which are spaced apart, and the inner surfaces of the at least two positioning blocks are coplanar with the inner surface of the enclosure wall.

[0008] In one embodiment, the enclosure includes a semi-circular fixed side plate and a semi-circular movable side plate. The fixed side plate is fixedly disposed on the bottom wall, and the movable side plate is configured to open or close the mounting slot. When the mounting slot is opened, the ceramic disc can be moved into or out of the mounting slot.

[0009] In one embodiment, one end of the movable side plate is rotatably connected to one end of the fixed side plate via an axially extending pivot, and the other end of the movable side plate is detachably connected to the other end of the fixed side plate.

[0010] In one embodiment, the mounting portion, the wax-free adsorption pad, and the ceramic disc are all circular;

[0011] And / or, the other end of the base is provided with a support base.

[0012] In one embodiment, an upper pressure plate is also included. The upper pressure plate includes a pressure plate, and the pressure plate has a positioning groove on the side facing the base. The positioning groove engages with the alignment mechanism to achieve integrated bonding and pressing of the ceramic disc and the wax-free adsorption pad.

[0013] In one embodiment, the upper pressure plate further includes a plurality of first connecting supports connected to the circumferential edge of the pressure plate, and the circumferential edge of the base is provided with a plurality of second connecting supports. The first connecting supports and the second connecting supports are connected by connectors, so that the upper pressure plate and the base can be close to or far apart, thereby achieving the pressing and bonding of the ceramic disc and the wax-free adsorption pad.

[0014] In one embodiment, the upper pressure plate includes a reinforcing rib plate, which is connected to the side of the pressure plate away from the base and connected to the first connecting support, and the reinforcing rib plate is symmetrically arranged about the pressure plate.

[0015] In one embodiment, the connector is a bolt, and a plurality of the bolts are of the same specification.

[0016] In one embodiment, the wax-free adsorption pad has blind holes, and the pressure plate has through holes corresponding to the positions of the blind holes.

[0017] In summary, this application provides a chemical mechanical polishing pad mounting device, including a base, one end of which is provided with a mounting part. The mounting part includes a bottom wall and a surrounding wall circumferentially surrounding the bottom wall. The surrounding wall and the bottom wall form a mounting groove. An alignment mechanism is provided on the surrounding wall. The mounting groove and the alignment mechanism are configured to achieve axial centering and positioning of the ceramic disc and the wax-free adsorption pad, thereby effectively improving the alignment accuracy between the wax-free adsorption pad and the ceramic disc, enabling the wax-free adsorption pad to accurately adhere to the ceramic disc, improving the bonding success rate, reducing the risk of material waste, and the chemical mechanical polishing pad mounting device of this application greatly simplifies the process structure and reduces costs. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the base of the chemical mechanical polishing pad mounting device in the closed state according to an embodiment of this application.

[0019] Figure 2 This is a schematic diagram of the base of the chemical mechanical polishing pad mounting device in the open state according to an embodiment of this application.

[0020] Figure 3 This is a schematic diagram of the structure of the ceramic disc and the wax-free adsorption pad of the chemical mechanical polishing pad mounting device in one embodiment of this application.

[0021] Figure 4 This is a schematic diagram of the upper pressure plate of a chemical mechanical polishing pad mounting device in one embodiment of this application.

[0022] Figure 5 This is an exploded view of a chemical mechanical polishing pad mounting device in one embodiment of this application.

[0023] Reference numerals: 10-base; 12-wax-free adsorption pad; 14-ceramic disc; 16-mounting part; 18-bottom wall; 20-enclosure wall; 22-mounting groove; 24-support base; 26-positioning block; 28-fixed side plate; 30-movable side plate; 31-opening; 32-upper pressure plate; 34-pressure plate; 36-first connecting support; 38-second connecting support; 40-bolt; 42-through hole; 44-positioning groove; 46-reinforcing rib plate; 48-blind hole; 50-through hole. Detailed Implementation

[0024] Before describing the embodiments in detail, it should be understood that this application is not limited to the detailed structures or element arrangements described below or in the accompanying drawings. This application can be implemented in other ways. Furthermore, it should be understood that the wording and terminology used herein are for descriptive purposes only and should not be construed as limiting. The terms "comprising," "including," "having," and similar expressions used herein mean to include the items listed thereafter, their equivalents, and other additional items. In particular, when describing "an element," this application does not limit the number of elements to one, but may include multiple elements.

[0025] Please refer to Figures 1 to 3As shown, one embodiment of this application provides a chemical mechanical polishing pad mounting device for mounting a wax-free adsorption pad and a ceramic disc. The chemical mechanical polishing pad mounting device includes a base 10, one end of which is provided with a mounting part 16. The mounting part 16 includes a bottom wall 18 and a surrounding wall 20 circumferentially surrounding the bottom wall 18. The surrounding wall 20 and the bottom wall 18 together form a mounting groove 22 for placing the ceramic disc 14. The enclosure 20 is provided with an alignment mechanism for aligning the axis of the wax-free adsorption pad 12. The mounting groove 22 and the alignment mechanism are configured to achieve axial centering and positioning of the ceramic disc 14 and the wax-free adsorption pad 12. For example, the axis defined by the enclosure 20 coincides with the axis defined by the alignment mechanism, that is, the enclosure 20 and the alignment mechanism are coaxially arranged. This allows the axis of the ceramic disc 14, which is engaged in the mounting groove 22, to coincide with the axis of the wax-free adsorption pad 12, which is installed by the alignment mechanism, so as to achieve axial centering and positioning. Then, the wax-free adsorption pad 12 can be moved along the alignment mechanism to fit against the ceramic disc 14. The chemical mechanical polishing pad mounting device of this application can effectively improve the alignment accuracy between the wax-free adsorption pad 12 and the ceramic disk 14, reduce human error, reduce errors caused by manual visual operation, and make the wax-free adsorption pad 12 accurately adhere to the ceramic disk 14, thereby improving the bonding success rate and reducing the risk of material waste. In addition, the chemical mechanical polishing pad mounting device of this application greatly simplifies the process structure, is simple to implement, and reduces costs.

[0026] In this embodiment, the base 10, the wax-free adsorption pad 12, the ceramic disc 14, and the mounting portion 16 are all designed to be circular. Therefore, the axis defined by the surrounding wall 20, the axis defined by the alignment mechanism, the axis of the wax-free adsorption pad 12, and the axis of the ceramic disc 14 refer to the central axis passing through the center of their respective circles. This application uses the mounting groove 22 to center the ceramic disc 14, therefore, the diameter of the ceramic disc 14 is the same as the diameter of the mounting groove 22. Similarly, the alignment mechanism centers the wax-free adsorption pad 12, therefore, the diameter of the wax-free adsorption pad 12 is the same as the diameter of the circle defined by the alignment mechanism. However, depending on actual design requirements, the diameter of the mounting groove 22 can be the same as or different from the diameter of the circle defined by the alignment mechanism.

[0027] It should be understood that in other embodiments, the above-mentioned elements may also be designed in other shapes, as long as they can be aligned and positioned by the chemical mechanical polishing pad mounting device of this application.

[0028] In the illustrated embodiment, a support base 24 is provided at the other end of the base 10. For example, the support base 24 is located on the side of the bottom wall 18 away from the surrounding wall 20. The support base 24 can be used to support the base 10 on a plane, raising the height of the mounting part 16 to facilitate the installation of the wax-free adsorption pad 12 and the ceramic disc 14. The support base 24 is designed, for example, to be cylindrical, and is connected to the center of the bottom wall 18 to ensure the stability of the mounting part 16. Optionally, the diameter of the support base 24 is designed to be smaller than the diameter of the mounting part 16.

[0029] In this embodiment, the alignment mechanism is disposed on the end face of the enclosure 20 away from the bottom wall 18. Specifically, the alignment mechanism includes two positioning blocks 26, which are circumferentially spaced on the upper end face of the enclosure 20, and the inner surfaces of the two positioning blocks 26 are coplanar with the inner surface of the enclosure 20. The inner surface of the positioning block 26 refers to the surface of the positioning block 26 near the mounting groove 22, and the inner surface of the enclosure 20 refers to the surface of the enclosure 20 located on the side of the mounting groove 22. Since the enclosure 20 is circular, its radially inner surface is an arc surface; correspondingly, the inner surfaces of the positioning blocks 26 are also designed to be arc-shaped. Furthermore, the coplanarity of the inner surfaces of the two positioning blocks 26 with the inner surface of the enclosure 20 ensures that the diameter of the circle defined by the enclosure 20 is the same as the diameter of the circle defined by the two positioning blocks 26, i.e., the diameter of the wax-free adsorption pad 12 is the same as the diameter of the ceramic disc 14.

[0030] Understandably, in this embodiment, there are two positioning blocks 26. In other embodiments, there may be more than two positioning blocks 26.

[0031] It is also understood that in other embodiments, the inner surface of the positioning block 26 may be not flush with the inner surface of the enclosure 20. For example, the inner surface of the positioning block 26 may be located radially inside the inner surface of the enclosure 20 (where the diameter of the circle defined by the enclosure 20 is larger than the diameter of the circle defined by the alignment mechanism) or radially outside the inner surface (where the diameter of the circle defined by the enclosure 20 is smaller than the diameter of the circle defined by the alignment mechanism), which can increase the application range of the chemical mechanical polishing pad mounting device.

[0032] In addition, another function of the positioning block 26 is to enable the threaded hole and the through hole 42 of the first connecting support 36 to be aligned, reducing the operation of rotation alignment, realizing the quick docking of the upper pressure plate 32 and the base 10, and improving the installation efficiency.

[0033] In other embodiments, the alignment mechanism may include a positioning plate (not shown), the inner surface of which may or may not be flush with the inner surface of the enclosure 20. In practice, the positioning plate may be formed by two positioning blocks 26 extending circumferentially relative to each other and combined into a single structure, as described in the above embodiments.

[0034] Furthermore, please also refer to Figure 1 and Figure 2 As shown, the enclosure 20 includes a semi-circular fixed side plate 28 and a semi-circular movable side plate 30. The fixed side plate 28 is fixedly mounted on the bottom wall 18; for example, the fixed side plate 28 and the bottom wall 18 are integrally formed, and an alignment mechanism is provided on the fixed side plate 28. The movable side plate 30 is configured to open or close the mounting slot 22. When the mounting slot 22 is open, the ceramic disc 14 can be moved into or out of the mounting slot 22. Specifically, the movable side plate 30 can switch between an open position and a closed position relative to the fixed side plate 28. When the movable side plate 30 is in the open position, an opening 31 is formed in the enclosure 20 at the movable side plate 30. At this time, the ceramic disc 14 can be moved into the mounting slot 22 through the opening 31, or the ceramic disc 14 can be removed from the mounting slot 22 through the opening 31. When the movable side plate 30 is in the closed position, the opening 31 is blocked, and the movable side plate 30 and the fixed side plate 28 together form a complete ring. Because the ceramic plate 14 is very heavy, it is easy to put it into the mounting slot 22, but difficult to take it out. The opening 31 formed by the rotatable connection between the movable side plate 30 and the fixed side plate 28 can facilitate the placement and removal of the ceramic plate 14.

[0035] In the illustrated embodiment, the movable side plate 30 is configured to be rotatably connected to the fixed side plate 28. One end of the movable side plate 30 is rotatably connected to one end of the fixed side plate 28 via an axially extending pivot, and the other end of the movable side plate 30 is detachably connected to the other end of the fixed side plate 28, allowing the movable side plate 30 to rotate relative to the fixed side plate 28 between an open position and a closed position. When the movable side plate 30 is in the closed position, it closes with the fixed side plate 28 to form a circular structure. When the movable side plate 30 is in the open position, it rotates away from the fixed side plate 28, creating an opening 31 in the closed circular structure to facilitate the insertion or removal of the ceramic disc 14.

[0036] Specifically, the movable side plate 30 and the fixed side plate 28 can be rotatably connected via a pivot. For example, the rotatable connection end of the fixed side plate 28 is provided with a pivot groove, and the opposite side walls of the pivot groove are provided with first shaft holes. The rotatable connection end of the movable side plate 30 is provided with a pivot portion protruding circumferentially, and the pivot portion is provided with a second shaft hole. The first shaft hole, the second shaft hole, and the pivot are all parallel to the central axis of the mounting portion 16, so that the movable side plate 30 can rotate radially outward. During installation, the pivot portion extends into the pivot groove, and the pivot passes through the second shaft hole, with its two ends respectively connected to the two first shaft holes, thereby realizing the rotatable connection between the movable side plate 30 and the fixed side plate 28. Preferably, the extension length of the pivot portion can be reduced to prevent interference between the pivot portion and the ceramic disk 14 during rotation.

[0037] Understandably, in other embodiments, the movable side plate 30 and the fixed side plate 28 can also be rotatably connected by other rotating structures, and this application is not limited to this. Furthermore, the axial direction of the rotating shaft can also be set to be non-parallel to the central axis of the mounting portion 16. For example, the axial direction of the rotating shaft can be set to be parallel to a radial direction of the enclosure 20, allowing the movable side plate 30 to rotate upwards, as long as the opening and closing of the enclosure 20 is achieved without affecting the loading and unloading of the ceramic disc 14.

[0038] In other embodiments, the movable side plate 30 and the fixed side plate 28 can be detachably connected, for example by means of buckles, adhesives or screws. The detachable connection can also enable the enclosure 20 to switch between open and closed states, thereby facilitating the loading and unloading of the ceramic disc 14.

[0039] In existing technologies, as the size of wax-free adsorption pads increases, uneven pressure in some areas during the compaction process with heavy objects can lead to premature seepage and delamination during use. Furthermore, using a press for compaction requires specific equipment, resulting in wasted machine space. Existing technologies achieve radial adjustment of the wax-free adsorption pad through an adjusting plate, drive pin, and base plate, while the fixing unit clamps the ceramic disc using an adjusting rod and threaded knob, resulting in a complex mechanical structure. Moreover, after the wax-free adsorption pad is applied, a press is required for compaction, failing to provide an integrated solution for the application and compaction process.

[0040] Please also refer to Figure 4 and Figure 5 As shown, the chemical mechanical polishing pad mounting device also includes an upper pressure plate 32. The upper pressure plate 32 is used to press the base 10 and the wax-free adsorption pad 12 and ceramic disc 14 after they have been aligned, positioned, and pasted together, so that the two are tightly joined and the ceramic disc 14 and the wax-free adsorption pad 12 are integrated and pressed together. Specifically, the upper pressure plate 32 includes a pressure plate 34. The pressure plate 34 has a positioning groove 44 on the side facing the base 10. The positioning groove 44 engages with the alignment mechanism to realize the positioning and installation of the upper pressure plate 32 and the base 10, and at the same time facilitates the upper pressure plate 32 to press the wax-free adsorption pad 12 and ceramic disc 14. In this embodiment, two positioning grooves 44 are provided. The two positioning grooves 44 correspond to the positions of the two positioning blocks 26 and are positioned and engaged with each other.

[0041] Furthermore, the upper pressure plate 32 also includes a plurality of first connecting supports 36 connected to the circumferential edge of the pressure plate 34, the plurality of first connecting supports 36 being evenly spaced along the circumference of the pressure plate 34. Correspondingly, the circumferential edge of the base 10 is provided with a plurality of second connecting supports 38, the plurality of second connecting supports 38 being evenly spaced along the circumference of the bottom wall 18, for example, the second connecting supports 38 and the mounting part 16 being an integrally formed structure, for example. The plurality of first connecting supports 36 and the plurality of second connecting supports 38 are connected one-to-one by connectors, so that the upper pressure plate 32 and the base 10 can be brought closer or further apart, realizing the pressing and bonding of the ceramic plate 14 and the wax-free adsorption pad 12. The engaging cooperation between the positioning groove 44 and the alignment mechanism can also realize the alignment of the first connecting supports 36 and the second connecting supports 38, improving installation efficiency. Under the connection of the connector, the upper pressure plate 32 can press against the base 10, and the pressure plate 34 can press against the wax-free adsorption pad 12, thereby pressing the wax-free adsorption pad 12 firmly onto the ceramic disc 14. Alternatively, after the upper pressure plate 32 is connected to the base 10 through the connector, an external object can be used to press the upper pressure plate 32, thereby applying downward pressure to the wax-free adsorption pad 12.

[0042] Preferably, the connector is a bolt 40. The torque applied by the bolt 40 causes the pressure plate 34 to press down on the wax-free adsorption pad 12, thereby making the wax-free adsorption pad 12 and the ceramic plate 14 fit tightly together. This improves the adhesion between the wax-free adsorption pad 12 and the ceramic plate 14, reduces the adhesion instability and failure rate caused by relying on heavy presses, avoids problems such as premature seepage and delamination and waste of machine usage, and achieves an integrated solution for the adhesion and pressing action of the wax-free adsorption pad 12.

[0043] More specifically, the upper pressure plate 32 is disposed on one side of the base 10 where the mounting groove 22 is provided. The second connecting support 38 is provided with a through hole 42 for the bolt 40 to pass through. The axial direction of the through hole 42 is parallel to the central axis of the mounting part 16. The first connecting support 36 is provided with a screw hole (not shown) on the side facing the base 10. The axial direction of the screw hole is parallel to the central axis of the mounting part 16. After the bolt 40 passes through the through hole 42, it is threaded into the screw hole. The torque of the threaded connection realizes the continuous downward pressure of the upper pressure plate 32. The number of the first connecting support 36 and the second connecting support 38 is the same, for example, three of each. In other embodiments, other numbers may also be provided.

[0044] Furthermore, the multiple bolts 40 are configured to be of identical specifications, meaning that the multiple bolts 40 are completely identical, including parameters such as bolt length, thread diameter, pitch, tolerance grade, and shape. During installation, the multiple bolts 40 can be configured to have the same torque. For example, three bolts 40 can be used, allowing the downward pressure of the upper pressure plate 32 to act evenly on the wax-free adsorption pad 12, thereby ensuring a better and tighter fit between the wax-free adsorption pad 12 and the ceramic disc 14, improving the uniformity of adhesion. During installation, a torque wrench can be used to adjust the torque of the three bolts 40 to ensure that the torque of the three bolts 40 is the same.

[0045] In a preferred embodiment, the upper pressure plate 32 further includes a reinforcing rib 46. The reinforcing rib 46 is connected to the side of the pressure plate 34 away from the base 10 and is connected to the first connecting support 36. For example, the end of the first connecting support 36 away from the base 10 protrudes from the side of the pressure plate 34 away from the base 10. The reinforcing rib 46, the first connecting support 36, and the pressure plate 34 can be an integrally formed structure, and the reinforcing rib 46 is symmetrically arranged about the pressure plate 34. The reinforcing rib 46 is used to increase the structural strength of the upper pressure plate 34, prevent the pressure plate 34 from deforming during the compaction process, and at the same time, ensure that the downward pressure force is evenly distributed on the pressure plate 34, thereby achieving the compaction operation of the ceramic disc 14 and the wax-free adsorption pad 12.

[0046] In this embodiment, three reinforcing ribs 46 are provided, and the three reinforcing ribs 46 are arranged symmetrically. For example, the reinforcing ribs 46 are designed as triangles, and the width of the reinforcing ribs 46 gradually decreases in the radial direction inward along the pressure plate 34. The end of the reinforcing ribs 46 away from the first connecting support 36 extends to the center of the pressure plate 34.

[0047] In the illustrated embodiment, the wax-free adsorption pad 12 has blind holes 48 filled with a soft adsorption material. The pressure plate 34 has through holes 50 corresponding to the blind holes 48. The through holes 50 are used to avoid contact between the pressure plate 34 and the material inside the blind holes 48, preventing damage to the material. For example, the shape and size of the through holes 50 are designed to be the same as those of the blind holes 48. For example, three blind holes 48 and three through holes 50 are provided, with the three blind holes 48 evenly spaced along the circumference of the wax-free adsorption pad 12, and the three through holes 50 evenly distributed between the three reinforcing ribs 46. During installation, the positions of the three through holes 50 correspond one-to-one with the three blind holes 48.

[0048] In summary, this application provides a chemical mechanical polishing pad mounting device, including a base, one end of which is provided with a mounting part. The mounting part includes a bottom wall and a surrounding wall circumferentially surrounding the bottom wall. The surrounding wall and the bottom wall form a mounting groove. An alignment mechanism is provided on the surrounding wall. The mounting groove and the alignment mechanism are configured to achieve axial centering and positioning of the ceramic disc and the wax-free adsorption pad, thereby effectively improving the alignment accuracy between the wax-free adsorption pad and the ceramic disc, enabling the wax-free adsorption pad to accurately adhere to the ceramic disc, improving the bonding success rate, reducing the risk of material waste, and the chemical mechanical polishing pad mounting device of this application greatly simplifies the process structure and reduces costs.

[0049] The concepts described herein may be implemented in other forms without departing from their spirit and characteristics. The specific embodiments disclosed should be considered illustrative rather than restrictive. Therefore, the scope of this application is determined by the appended claims, and not by the preceding description. Any changes within the literal meaning and equivalent scope of the claims should fall within the scope of those claims.

Claims

1. A chemical mechanical polishing pad mounting device, characterized by comprising: The device includes a base, one end of which is provided with a mounting part. The mounting part includes a bottom wall and a surrounding wall that surrounds the bottom wall. The surrounding wall and the bottom wall form a mounting groove. The surrounding wall is provided with an alignment mechanism. The mounting groove and the alignment mechanism are configured to achieve axial centering and positioning of the ceramic disc and the wax-free adsorption pad.

2. The chemical mechanical polishing pad mounting device of claim 1, wherein, The alignment mechanism is disposed on the end face of the enclosure wall away from the bottom wall. The alignment mechanism includes at least two positioning blocks, which are spaced apart, and the inner surfaces of the at least two positioning blocks are coplanar with the inner surface of the enclosure wall.

3. The chemical mechanical polishing pad mounting device as described in claim 1, characterized in that, The enclosure includes a semi-circular fixed side plate and a semi-circular movable side plate. The fixed side plate is fixedly mounted on the bottom wall, and the movable side plate is configured to open or close the mounting slot. When the mounting slot is opened, the ceramic disc can be moved into or out of the mounting slot.

4. The chemical mechanical polishing pad mounting device of claim 3, wherein the pad mounting device is configured to be mounted to a pad conditioner. One end of the movable side plate is rotatably connected to one end of the fixed side plate via an axially extending shaft, and the other end of the movable side plate is detachably connected to the other end of the fixed side plate.

5. The chemical mechanical polishing pad mounting device of claim 1, wherein the pad mounting device is configured to be mounted to a pad conditioner. The mounting part, the wax-free adsorption pad, and the ceramic disc are all circular. And / or, the other end of the base is provided with a support base.

6. The chemical mechanical polishing pad mounting device of any of claims 1-5, wherein, It also includes an upper pressure plate, which includes a pressure plate and a positioning groove on the side of the pressure plate facing the base. The positioning groove engages with the alignment mechanism.

7. The chemical mechanical polishing pad mounting device of claim 6, wherein the pad mounting device is configured to be mounted to a pad conditioner. The upper pressure plate also includes a plurality of first connecting supports connected to the circumferential edge of the pressure plate, and the circumferential edge of the base is provided with a plurality of second connecting supports. The first connecting supports and the second connecting supports are connected by connectors, so that the upper pressure plate and the base can be close to or far apart, thereby achieving the pressing and bonding of the ceramic disc and the wax-free adsorption pad.

8. The chemical mechanical polishing pad mounting device of claim 7, wherein the pad mounting device is configured to be mounted to a pad conditioner. The upper pressure plate includes a reinforcing rib plate, which is connected to the side of the pressure plate away from the base and connected to the first connecting support. The reinforcing rib plate is symmetrically arranged about the pressure plate.

9. The chemical mechanical polishing pad mounting device of claim 7, wherein the pad mounting device is configured to be mounted to a pad conditioner. The connecting component is a bolt, and multiple bolts are of the same specification.

10. The chemical mechanical polishing pad mounting device as described in claim 6, characterized in that, The wax-free adsorption pad has blind holes, and the pressure plate has through holes corresponding to the blind holes.

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