A type of engineered wood flooring for underfloor heating
By designing square placement channels and buffer structures in the engineered wood flooring, the problem of bulging or gaps caused by different material expansion coefficients in underfloor heating environments is solved, thus improving the stability and service life of the flooring.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG SHUIMO JIANGNAN NEW MATERIAL TECH CO LTD
- Filing Date
- 2025-07-07
- Publication Date
- 2026-07-03
AI Technical Summary
Solid wood composite flooring may experience bulging or gaps in underfloor heating environments due to differences in the coefficients of thermal expansion of the materials.
A placement channel is formed by using square first and second solid wood boards, which are fixed by connectors. The contact base plate is inserted into the channel and a buffer strip is fitted on it. The mortise and tenon structure is used for fixation, and the buffer material reduces the impact of material expansion on the stability of the floor.
It improves the stability of engineered wood flooring in underfloor heating environments and extends the service life of the flooring.
Smart Images
Figure CN224452142U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of composite flooring technology, and in particular to a solid wood composite flooring for underfloor heating. Background Technology
[0002] Composite flooring is a type of flooring. However, composite flooring involves artificially altering the natural structure of the flooring material to achieve certain physical properties that meet specific requirements. In the market, composite flooring often refers to engineered wood flooring and solid wood composite flooring.
[0003] Currently, engineered wood flooring used for underfloor heating will expand and shrink continuously due to the constant heating and cooling of the underfloor heating system over a long period of time. Engineered wood flooring uses a variety of materials, and different materials have different coefficients of expansion, which can cause engineered wood flooring to bulge or develop gaps over time. Utility Model Content
[0004] The summary section of this application is intended to provide a brief overview of the concepts, which will be described in detail in the detailed description section below. This summary section is not intended to identify key or essential features of the claimed technical solutions, nor is it intended to limit the scope of the claimed technical solutions.
[0005] In order to overcome the shortcomings of the prior art, this application provides a solid wood composite floor for underfloor heating.
[0006] To achieve the above objectives, this application adopts the following technical solution, including:
[0007] The first solid wood board is square.
[0008] A second solid wood board is placed at the bottom of the first solid wood board. The second solid wood board is square, and the first solid wood board and the second solid wood board form a first placement channel.
[0009] Multiple connectors are provided, and the first solid wood board is fixedly connected to the second solid wood board through the multiple connectors.
[0010] A contact base plate is disposed at the bottom of the second solid wood board, and the top of the contact base plate is inserted into the first placement channel;
[0011] A buffer strip is disposed in the first placement channel, the buffer strip is sleeved on the contact base plate, and the buffer strip abuts against the inner wall of the first placement channel.
[0012] Furthermore, the structure of the first solid wood board is the same as that of the second solid wood board.
[0013] Furthermore, the first solid wood board includes;
[0014] Contact plate;
[0015] The first protrusion is provided in multiple ways, and each of the multiple first protrusions is formed by at least a portion of the bottom surface of the contact plate extending to the bottom. Each corner of the contact plate is provided with a first protrusion.
[0016] Furthermore, the second solid wood board includes;
[0017] Sandwich panel;
[0018] The second protrusion is provided in multiple forms, each of which is formed by extending at least a portion of the top surface of the sandwich panel upwards, and one second protrusion is provided at each corner of the sandwich panel.
[0019] Furthermore, the number of the first bumps is the same as the number of the second bumps, with one first bump corresponding to one second bump.
[0020] Furthermore, the connector includes:
[0021] The locking post is cylindrical, with a first protrusion inserted at one end and a second protrusion inserted at the other end.
[0022] A first deformation plate is inserted into one end of the locking stake, and the first deformation plate abuts against one of the first protrusions;
[0023] The second deformation plate is inserted into the other end of the locking stake, and the second deformation plate abuts against one of the second protrusions.
[0024] Furthermore, the contact base plate includes:
[0025] A first base plate is disposed at the bottom of the sandwich panel, and the first base plate abuts against the sandwich panel;
[0026] The second base plate is configured as a disc, and is fixedly installed on the top of the first base plate. The second base plate is inserted into the interlayer plate.
[0027] A buffer ring is fitted onto the second base plate, and the buffer ring abuts against the sandwich plate;
[0028] The third base plate is fixedly installed on top of the second base plate. The third base plate is located inside the first placement channel and is configured to fit the shape of the first placement channel. The buffer strip is sleeved on the third base plate.
[0029] Furthermore, a second placement channel is provided in the middle of the sandwich panel, and the second bottom plate is disposed in the second placement channel.
[0030] The advantages of this application are: it provides a solid wood composite flooring for underfloor heating, by first fitting a buffer strip onto the top of the contact base plate, then placing the top of the contact base plate between the first and second solid wood boards, and fixing the first and second solid wood boards together with multiple connectors. At this time, the top of the contact base plate is fixed in the first placement channel. Then, the remaining part of the contact base plate is fixed to the top of the contact base plate, and the fixing of the remaining part of the contact base plate to the top of the contact base plate can be achieved through a mortise and tenon structure, which will not be elaborated on here. Therefore, the problem of different expansion ratios of different materials when the solid wood composite flooring used for underfloor heating expands due to heat will not affect the stability of the flooring and increase its service life. Attached Figure Description
[0031] The accompanying drawings, which form part of this application, are used to provide a further understanding of the application and to make other features, objects, and advantages of the application more apparent. The illustrative embodiments and descriptions of this application are used to explain the application and do not constitute an undue limitation of the application.
[0032] Furthermore, throughout the accompanying drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the elements are not necessarily drawn to scale.
[0033] In the attached diagram:
[0034] Figure 1 This is a schematic diagram of the structure of this application.
[0035] Figure 2 This is a schematic diagram showing the positional relationship between the second solid wood board and the connector in this application.
[0036] Figure 3 This is a schematic diagram showing the positional relationship between the locking pile and the first deformation plate in this application.
[0037] Figure 4 This is a schematic diagram showing the positional relationship between the contact plate and the first protrusion in this application.
[0038] Figure 5 This is a schematic diagram showing the positional relationship between the buffer ring and the buffer strip in this application.
[0039] The meanings of the reference numerals in the figure are as follows:
[0040] 11. First solid wood board; 111. Contact plate; 112. First protrusion; 12. Second solid wood board; 121. Sandwich panel; 121a. Second placement channel; 122. Second protrusion; 13. Connector; 131. Locking post; 132. First deformation plate; 133. Second deformation plate; 14. Contact base plate; 141. First base plate; 142. Second base plate; 143. Buffer ring; 144. Third base plate; 15. Buffer strip; 16. First placement channel. Detailed Implementation
[0041] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.
[0042] It should also be noted that, for ease of description, only the parts relevant to the application are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other.
[0043] It should be noted that the concepts of "first" and "second" mentioned in this disclosure are used only to distinguish different devices, modules or units, and are not used to limit the order of functions performed by these devices, modules or units or their interdependencies.
[0044] It should be noted that the terms "a" and "a plurality of" used in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".
[0045] The names of messages or information exchanged between multiple devices in the embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of such messages or information.
[0046] This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.
[0047] like Figure 1-4 As shown in one embodiment of this application, the solid wood composite floor for underfloor heating includes: a first solid wood board 11, a second solid wood board 12, a plurality of connectors 13, a contact base plate 14, and a buffer strip 15.
[0048] The first solid wood board 11 is square.
[0049] The second solid wood board 12 is disposed at the bottom of the first solid wood board 11. The second solid wood board 12 is square, and the first solid wood board 11 and the second solid wood board 12 form a first placement channel 16.
[0050] The connector 13 is provided in multiple ways, and the first solid wood board 11 is fixedly connected to the second solid wood board 12 through the multiple connectors 13.
[0051] The contact base plate 14 is disposed at the bottom of the second solid wood board 12, and the top of the contact base plate 14 is inserted into the first placement channel 16.
[0052] The buffer strip 15 is disposed in the first placement channel 16, the buffer strip 15 is sleeved on the contact base plate 14, and the buffer strip 15 abuts against the inner wall of the first placement channel 16.
[0053] The structure of the first solid wood board 11 is the same as that of the second solid wood board 12.
[0054] Specifically, the cushioning strip 15 can be made of rubber or soft oak.
[0055] In this embodiment, by first covering the top of the contact base plate 14 with a buffer strip 15, and then placing the top of the contact base plate 14 between the first solid wood board 11 and the second solid wood board 12, and fixing the first solid wood board 11 and the second solid wood board 12 together with multiple connectors 13, the top of the contact base plate 14 is fixed in the first placement channel 16. Then, the remaining part of the contact base plate 14 is fixed to the top of the contact base plate 14. The fixing of the remaining part of the contact base plate 14 to the top of the contact base plate 14 can be achieved through a mortise and tenon structure, which will not be elaborated on here. Therefore, the problem of different expansion ratios of different materials when the solid wood composite flooring used for underfloor heating expands due to heat will not affect the stability of the flooring and increase its service life.
[0056] like Figure 4 As shown, in one embodiment of this application, the first solid wood board 11 includes a contact plate 111 and a plurality of first protrusions 112.
[0057] The first protrusion 112 is provided in multiple ways, and each of the multiple first protrusions 112 is formed by at least a portion of the bottom surface of the contact plate 111 extending to the bottom. Each corner of the contact plate 111 is provided with a first protrusion 112.
[0058] The second solid wood board 12 includes a plywood 121 and a plurality of second protrusions 122.
[0059] The second protrusion 122 is provided in multiple ways, and each of the multiple second protrusions 122 is formed by extending at least a portion of the top surface of the sandwich plate 121 upwards. Each corner of the sandwich plate 121 is provided with a second protrusion 122.
[0060] The number of the first bump 112 is the same as the number of the second bump 122, and one first bump 112 corresponds to one second bump 122.
[0061] Specifically, the first placement channel 16 is set in a cross shape.
[0062] In this embodiment, multiple sets of first protrusions 112 and second protrusions 122 are correspondingly arranged so that the contact plate 111 and the interlayer plate 121 form a first placement channel 16.
[0063] like Figure 3-4 As shown, in one embodiment of this application, the connector 13 includes: a locking post 131, a first deformation plate 132, and a second deformation plate 133.
[0064] The locking post 131 is cylindrical, with one end of the locking post 131 having a first protrusion 112 inserted into it and the other end of the locking post 131 having a second protrusion 122 inserted into it.
[0065] The first deformation plate 132 is inserted into one end of the locking post 131, and the first deformation plate 132 abuts against one of the first protrusions 112.
[0066] The second deformation plate 133 is inserted into the other end of the locking post 131, and the second deformation plate 133 abuts against a second protrusion 122.
[0067] Specifically, the structure of the first deformable plate 132 is the same as that of the second deformable plate 133, and the cross-section of the first deformable plate 132 is set as an acute triangle.
[0068] In this embodiment, by pressing the contact plate 111 and the interlayer plate 121, one end of each locking post 131 is inserted into a first protrusion 112, and the other end of each locking post 131 is inserted into a second protrusion 122. When the first deformation plate 132 contacts the first protrusion 112, the first deformation plate 132 is pressed into the locking post 131, at which time one end of the locking post 131 expands and thus fixes one end of the locking post 131 to the first protrusion 112. When the second deformation plate 133 contacts the second protrusion 122, the second deformation plate 133 is pressed into the locking post 131, at which time the other end of the locking post 131 expands and thus fixes the other end of the locking post 131 to the second protrusion 122.
[0069] like Figure 4-5As shown, in one embodiment of this application, the contact base plate 14 includes: a first base plate 141, a second base plate 142, a buffer ring 143, and a third base plate 144.
[0070] The first base plate 141 is disposed at the bottom of the sandwich panel 121, and the first base plate 141 abuts against the sandwich panel 121.
[0071] The second base plate 142 is configured as a disc, and the second base plate 142 is fixedly disposed on the top of the first base plate 141. The second base plate 142 is inserted into the interlayer plate 121.
[0072] The buffer ring 143 is sleeved on the second base plate 142, and the buffer ring 143 abuts against the sandwich plate 121.
[0073] The third base plate 144 is fixedly disposed on the top of the second base plate 142. The third base plate 144 is disposed in the first placement channel 16. The third base plate 144 is configured to fit the shape of the first placement channel 16. The buffer strip 15 is sleeved on the third base plate 144.
[0074] The sandwich panel 121 has a second placement channel 121a in the middle, and the second bottom plate 142 is disposed in the second placement channel 121a.
[0075] Specifically, the buffer ring 143 can be made of rubber or soft oak.
[0076] In this embodiment, by covering the portion of the second base plate 142 that contacts the sandwich plate 121 with a buffer ring 143, the deformation of the second base plate 142 and the sandwich plate 121 when they expand due to temperature is received by the buffer ring 143, thereby reducing hard contact between the materials.
[0077] The above description is merely a selection of preferred embodiments of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the application involved in the embodiments of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described application concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in the embodiments of this disclosure.
Claims
1. A solid wood composite floor for underfloor heating, characterized in that: The engineered wood flooring for underfloor heating includes: The first solid wood board is square. A second solid wood board is placed at the bottom of the first solid wood board. The second solid wood board is square, and the first solid wood board and the second solid wood board form a first placement channel. Multiple connectors are provided, and the first solid wood board is fixedly connected to the second solid wood board through the multiple connectors. A contact base plate is disposed at the bottom of the second solid wood board, and the top of the contact base plate is inserted into the first placement channel; A buffer strip is disposed in the first placement channel, the buffer strip is sleeved on the contact base plate, and the buffer strip abuts against the inner wall of the first placement channel.
2. The solid wood composite floor for floor heating according to claim 1, characterized in that: The structure of the first solid wood board is the same as that of the second solid wood board.
3. The solid wood composite floor for floor heating according to claim 2, characterized in that: The first solid wood board includes; Contact plate; The first protrusion is provided in multiple ways, and each of the multiple first protrusions is formed by at least a portion of the bottom surface of the contact plate extending to the bottom. Each corner of the contact plate is provided with a first protrusion.
4. The solid wood composite floor for floor heating according to claim 3, characterized in that: The second solid wood board includes; Sandwich panel; The second protrusion is provided in multiple forms, each of which is formed by extending at least a portion of the top surface of the sandwich panel upwards, and one second protrusion is provided at each corner of the sandwich panel.
5. The solid wood composite floor for floor heating according to claim 4, characterized in that: The number of the first bumps is the same as the number of the second bumps, and one first bump corresponds to one second bump.
6. The solid wood composite floor for floor heating according to claim 5, characterized in that: The connector includes: The locking post is cylindrical, with a first protrusion inserted at one end and a second protrusion inserted at the other end. A first deformation plate is inserted into one end of the locking stake, and the first deformation plate abuts against one of the first protrusions; The second deformation plate is inserted into the other end of the locking stake, and the second deformation plate abuts against one of the second protrusions.
7. The solid wood composite floor for floor heating according to claim 6, characterized in that: The contact base plate includes: A first base plate is disposed at the bottom of the sandwich panel, and the first base plate abuts against the sandwich panel; The second base plate is configured as a disc, and is fixedly installed on the top of the first base plate. The second base plate is inserted into the interlayer plate. A buffer ring is fitted onto the second base plate, and the buffer ring abuts against the sandwich plate; The third base plate is fixedly installed on top of the second base plate. The third base plate is located inside the first placement channel and is configured to fit the shape of the first placement channel. The buffer strip is sleeved on the third base plate.
8. The solid wood composite floor for floor heating according to claim 7, characterized in that: The sandwich panel has a second placement channel in the middle, and the second bottom plate is disposed in the second placement channel.