A high-power stage light copper substrate

Abstract

This utility model discloses a high-power stage lamp copper substrate, relating to the field of copper substrate technology. The high-power stage lamp copper substrate includes an insulating heat-conducting plate and a circuit board disposed on the surface of the insulating heat-conducting plate. The surface of the circuit board is fixedly connected with circuits. It also includes: a fiberglass panel layer disposed at the bottom of the insulating heat-conducting plate, with a thermoelectric separation component fixedly connected to the bottom of the fiberglass panel layer. The thermoelectric separation component includes a copper substrate layer, a semi-cured adhesive layer, and heat dissipation protrusions. The semi-cured adhesive layer has several first openings. A material plate disposed at the bottom of the insulating heat-conducting plate is also included, with a water-cooling heat dissipation component fixedly connected to the top of the material plate. This utility model, through the setting of the thermoelectric separation component and the water-cooling heat dissipation component, effectively produces a finished thermoelectric separation copper substrate. The heat dissipation protrusions are used for thermoelectric separation and heat dissipation, resulting in ideal heat dissipation performance. It is suitable for high-power LED light assemblies such as stage lamps and industrial / mining lamps.

Description

Technical Field

[0001] This utility model relates to the field of copper substrate technology, specifically a copper substrate for high-power stage lights. Background Technology

[0002] High-power stage lights, industrial and mining lights and other similar products use LED light sets with high power and generate a lot of heat. Existing circuit boards have poor heat dissipation due to the insulating layer and other structures, which will cause serious damage with long-term use and are not suitable for use in high-power LED light sets.

[0003] Utility model patent CN206059429U discloses a high-power LED copper substrate with thermoelectric separation, comprising a heat sink, an insulating layer on the upper surface of the heat sink, a circuit board on the upper surface of the insulating layer, and a printed layer on the upper surface of the circuit board. The upper surface of the heat sink has several raised heat conductors, the insulating layer has several through holes for the heat conductors to pass through, the circuit board has several small holes for the heat conductors to pass through, each heat conductor has an exposed upper surface, and the circuit board has several metal solder contact points, with metal solder contact points on both sides of each heat conductor. This utility model has the advantages of simple structure, long product life, drop resistance, good heat dissipation, small size, and low cost.

[0004] However, the existing high-power stage light copper substrate, despite the good thermal conductivity of copper, cannot cope with the excessive heat demand when the power of the light fixture increases further. This causes the copper substrate to expand, and may even damage the components, affecting the stable operation of the stage light fixture and the normal operation of surrounding equipment. Utility Model Content

[0005] This invention provides a high-power stage light copper substrate that has the advantage of improving heat dissipation efficiency. It solves the problem that although copper has good thermal conductivity, when the power of the lamp is further increased, the copper substrate is unable to cope with the excessive heat demand, which leads to the expansion of the copper substrate and even damage to the components, affecting the stable operation of the stage light and the normal operation of the surrounding equipment.

[0006] To improve heat dissipation efficiency, this utility model provides the following technical solution: a high-power stage lamp copper substrate, comprising an insulating heat-conducting plate and a circuit board disposed on the surface of the insulating heat-conducting plate, wherein circuit lines are fixedly connected to the surface of the circuit board, and further comprising: a fiberglass panel layer disposed at the bottom of the insulating heat-conducting plate, wherein a thermoelectric separation component is fixedly connected to the bottom of the fiberglass panel layer, the thermoelectric separation component comprising a copper substrate layer, a semi-cured adhesive layer and heat dissipation protrusions, wherein a plurality of first openings are formed on the semi-cured adhesive layer; a material plate disposed at the bottom of the insulating heat-conducting plate, wherein a water-cooling heat dissipation component is fixedly connected to the top of the material plate, wherein the water-cooling heat dissipation component comprises a water flow pipe, an upper heat sink and a lower heat sink, wherein connectors are fixedly connected to both ends of the water flow pipe; a second electroplated copper layer disposed at the top of the fiberglass panel layer, wherein a fiberglass layer is fixedly connected to the bottom of the second electroplated copper layer, and a third electroplated copper layer is fixedly connected to the bottom of the fiberglass layer.

[0007] As a preferred embodiment of the present invention, the thermoelectric separation component includes a copper substrate layer fixedly connected to the bottom of the fiberglass panel layer.

[0008] As a preferred embodiment of this utility model, a semi-cured adhesive layer is fixedly connected to the top of the copper substrate layer, and a heat dissipation protrusion is fixedly connected to the surface of the semi-cured adhesive layer.

[0009] As a preferred technical solution of this utility model, the water-cooled heat dissipation component includes a water flow pipe fixedly connected to the top of the material plate.

[0010] As a preferred embodiment of this utility model, an upper heat sink is fixedly connected to the top of the water flow pipe, and a lower heat sink is fixedly connected to the bottom of the upper heat sink.

[0011] As a preferred embodiment of this utility model, a through hole is provided on the upper surface of the second electroplated copper layer, and a through hole is provided on the surface of the third electroplated copper layer.

[0012] As a preferred technical solution of this utility model, the inner surface of the through hole is provided with a first copper plating layer, and multiple sets of fixing holes are opened on both sides of the fiberglass panel layer.

[0013] As a preferred embodiment of this utility model, the insulating heat-conducting plate has multiple sets of mounting holes on both sides, and the upper heat sink has multiple sets of positioning holes on both sides.

[0014] Compared with the prior art, this utility model provides a high-power stage light copper substrate, which has the following beneficial effects:

[0015] This high-power stage light copper substrate, through the setting of a thermoelectric separation component, firstly involves cutting the copper substrate layer, then creating the heat dissipation protrusions through dry film exposure, development, and etching to dissipate heat from the LED beads. Next, the fiberglass panel layer is cut and drilled to create through-holes. These through-holes are thickened by copper plating to prevent bursting after lamination. Then, circuitry is fabricated using a dry film negative and the required circuitry on both sides is etched. A first opening matching the heat dissipation protrusions is then made on the semi-cured adhesive layer, and a second opening matching the heat dissipation protrusions is made on the fiberglass panel layer. Both the heat dissipation protrusions and the fiberglass panel layer are browned to increase lamination adhesion. Finally, each layer is hot-pressed, thus effectively producing the finished thermoelectric separated copper substrate. Utilizing the heat dissipation protrusions for thermoelectric separation and heat dissipation, the heat dissipation effect is ideal, making it suitable for high-power LED light assemblies such as stage lights and industrial / mining lights.

[0016] This high-power stage light copper substrate utilizes a water-cooled heat dissipation component. To enhance heat dissipation, water enters the substrate through water pipes and comes into contact with the heat sources, absorbing the generated heat. As the water absorbs heat, its temperature rises. The continuous flow of water carries the heat away from the heat source area. During this flow, heat is transferred to the upper and lower heat sinks, accelerating the heat transfer. The heat sinks, with their numerous fins, significantly increase their surface area, resulting in a larger heat exchange area with the air. Through continuous airflow, the heat sinks transfer heat to the air and carry it away, ensuring efficient heat dissipation and maintaining the copper substrate temperature within a stable and ideal range, preventing overheating and protecting the normal operation of the copper substrate. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the overall disassembled structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the thermoelectric separation component of this utility model;

[0020] Figure 4 This is a schematic diagram of the water-cooled heat dissipation component structure of this utility model;

[0021] Figure 5 This is a schematic diagram of the overall structure of this utility model.

[0022] In the diagram: 1. Insulating heat-conducting plate; 2. Circuit board; 3. Circuit wire; 4. Fiberglass panel layer; 5. Thermoelectric separation component; 501. Copper substrate layer; 502. Semi-cured adhesive layer; 503. Heat dissipation boss; 6. Material plate; 7. Water-cooled heat dissipation component; 701. Water flow pipe; 702. Upper heat sink; 703. Lower heat sink; 8. Connector; 9. Second electroplated copper layer; 10. Fiberglass layer; 11. Third electroplated copper layer; 12. First copper plating layer. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figures 1-5 This utility model discloses a high-power stage lamp copper substrate, including an insulating heat-conducting plate 1 and a circuit board 2 disposed on the surface of the insulating heat-conducting plate 1. Circuit lines 3 are fixedly connected to the surface of the circuit board 2. The substrate also includes: a fiberglass panel layer 4 disposed at the bottom of the insulating heat-conducting plate 1. A thermoelectric separation component 5 is fixedly connected to the bottom of the fiberglass panel layer 4. The thermoelectric separation component 5 includes a copper substrate layer 501, a semi-cured adhesive layer 502, and a heat dissipation boss 503. The semi-cured adhesive layer 502 has several first openings. A material plate 6 disposed at the bottom of the insulating heat-conducting plate 1. A water-cooled heat dissipation component 7 is fixedly connected to the top of the material plate 6. The water-cooled heat dissipation component 7 includes a water flow pipe 701, an upper heat sink 702, and a lower heat sink 703. Connectors 8 are fixedly connected to both ends of the water flow pipe 701. A second electroplated copper layer 9 disposed at the top of the fiberglass panel layer 4. A fiberglass layer 10 is fixedly connected to the bottom of the second electroplated copper layer 9. A third electroplated copper layer 11 is fixedly connected to the bottom of the fiberglass layer 10.

[0025] Specifically, the thermoelectric separation component 5 includes a copper substrate layer 501 fixedly connected to the bottom of the fiberglass panel layer 4.

[0026] In this embodiment, the thermoelectric separation component 5 includes a copper substrate layer 501 fixedly connected to the bottom of the fiberglass panel layer 4. First, the copper substrate layer 501 is cut, and then the fiberglass panel layer 4 is cut and drilled to obtain a through hole. The through hole is thickened by copper electroplating to prevent bursting after pressing. A second opening matching the heat dissipation boss 503 is opened on the fiberglass panel layer 4.

[0027] Specifically, a semi-cured adhesive layer 502 is fixedly connected to the top of the copper substrate layer 501, and a heat dissipation boss 503 is fixedly connected to the surface of the semi-cured adhesive layer 502.

[0028] In this embodiment, a semi-cured adhesive layer 502 is fixedly connected to the top of the copper substrate layer 501. Then, a first opening matching the heat dissipation protrusion 503 is made on the semi-cured adhesive layer 502. The heat dissipation protrusion 503 is fixedly connected to the surface of the semi-cured adhesive layer 502. The heat dissipation protrusion 503 and the fiberglass panel layer 4 are respectively browned to increase the lamination bonding force. Then, each layer is hot-pressed. The heat dissipation protrusion 503 is used for heat and electricity separation and heat dissipation. The heat dissipation effect is ideal and it is suitable for high-power LED light groups such as stage lights and industrial and mining lights.

[0029] Specifically, the water-cooled heat dissipation component 7 includes a water flow pipe 701 fixedly connected to the top of the material plate 6.

[0030] In this embodiment, the water-cooled heat dissipation component 7 includes a water flow pipe 701 fixedly connected to the top of the material plate 6. The water flow pipe 701 is fixedly connected to the top of the material plate 6 and is responsible for guiding the flow of water, thereby achieving temperature control of the heat dissipation area.

[0031] Specifically, an upper heat sink 702 is fixedly connected to the top of the water flow pipe 701, and a lower heat sink 703 is fixedly connected to the bottom of the upper heat sink 702.

[0032] In this embodiment, a lower heat sink 703 is fixedly connected to the bottom of the upper heat sink 702. The upper heat sink 702 is fixedly connected to the top of the water flow pipe 701, which enhances heat exchange, allowing the water to exchange heat more effectively with the heat sink when it flows, thereby reducing the temperature of the fluid. The lower heat sink 703 is fixedly connected to the bottom of the upper heat sink 702, corresponding to the upper heat sink 702, further enhancing the heat dissipation effect. By providing more surface area for heat exchange with the air, the heat dissipation performance is improved.

[0033] Specifically, the upper surface of the second electroplated copper layer 9 is provided with a through hole, and the surface of the third electroplated copper layer 11 is provided with a through hole.

[0034] In this embodiment, the upper surface of the second electroplated copper layer 9 is provided with a via, and the surface of the third electroplated copper layer 11 is provided with a via. The via provides a path for electrical connection between different circuit layers. The electrical connection between layers is realized through the via, avoiding the use of more external leads and connections, simplifying circuit design, and thus improving the stability and reliability of the circuit board.

[0035] Specifically, the inner surface of the through hole is provided with a first copper plating layer 12, and multiple sets of fixing holes are opened on both sides of the fiberglass panel layer 4.

[0036] In this embodiment, the inner surface of the via is provided with a first copper plating layer 12, and multiple sets of fixing holes are opened on both sides of the fiberglass panel layer 4. The inner surface of the via usually needs to be treated by the first copper plating layer 12 to improve the conductivity and connection quality of the via. It enhances the connection effect between the via and the circuit layer by depositing a copper layer. The fiberglass panel layer 4 is the core layer of the copper substrate, and the multiple sets of fixing holes on both sides facilitate connection and fixation with other components.

[0037] Specifically, the insulating heat-conducting plate 1 has multiple sets of mounting holes on both sides, and the upper heat sink 702 has multiple sets of positioning holes on both sides.

[0038] In this embodiment, multiple sets of mounting holes are provided on both sides of the insulating heat-conducting plate 1, and multiple sets of positioning holes are provided on both sides of the upper heat sink 702. The mounting holes facilitate the installation of screws and fasteners to fix the insulating heat-conducting plate 1 and the upper heat sink 702 together, helping the components to remain stable during use and preventing loosening and displacement caused by external forces or vibrations. The positioning holes ensure that the components on both sides can be correctly aligned during assembly, avoiding inaccurate assembly due to errors.

[0039] The working principle and usage process of this utility model are as follows: When performing thermoelectric separation, the copper substrate layer 501 is first cut, and then the heat dissipation protrusion 503 is obtained by dry film exposure, development, and etching to dissipate heat from the LED beads. Then, the fiberglass panel layer 4 is cut and drilled to obtain through holes. The through holes are thickened by copper plating to prevent bursting after pressing. Then, the circuit is fabricated and the required circuit lines 3 on both sides are etched using a dry film negative. Then, a first opening matching the heat dissipation protrusion 503 is opened on the semi-cured adhesive layer 502, and a second opening matching the heat dissipation protrusion 503 is opened on the fiberglass panel layer 4. The heat dissipation protrusion 503 and the fiberglass panel layer 4 are respectively subjected to browning treatment to increase the heat dissipation capacity. The lamination bonding force is then applied to each layer by hot pressing. When enhancing the heat dissipation effect of the copper substrate of the high-power stage light, water enters the pipe through the water flow pipe 701 and comes into contact with these heat sources, absorbing the heat generated by them. After absorbing the heat, the water temperature rises. In the water flow pipe 701, the water continuously flows, carrying the heat away from the heat source area. During the water flow, the heat is transferred through the water flow pipe 701 to the upper heat sink 702 and the lower heat sink 703. The upper heat sink 702 and the lower heat sink 703 accelerate the heat transfer. The heat sink has a large number of fins, which can greatly increase its surface area, and the heat exchange area with the air is also larger. Through continuous air flow, the heat sink transfers the heat to the air and carries it away.

[0040] In summary, this high-power stage light copper substrate, through the setting of the thermoelectric separation component 5, effectively produces a finished thermoelectric separated copper substrate. The heat dissipation protrusion 503 is used for thermoelectric separation and heat dissipation, resulting in ideal heat dissipation effect. It is suitable for high-power LED light groups such as stage lights and industrial and mining lights. Through the setting of the water-cooled heat dissipation component 7, the heat dissipation efficiency is ensured, and the temperature of the copper substrate is kept within a relatively stable and ideal range to prevent overheating and thus protect the normal operation of the copper substrate.

[0041] It should be noted that, in this document, terms such as "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0042] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-power stage lamp copper substrate, comprising an insulating heat-conducting plate (1) and a circuit board (2) disposed on the surface of the insulating heat-conducting plate (1), wherein circuit lines (3) are fixedly connected to the surface of the circuit board (2), characterized in that, Also includes: A fiberglass panel layer (4) is set at the bottom of the insulating heat-conducting plate (1). A thermoelectric separation component (5) is fixedly connected to the bottom of the fiberglass panel layer (4). The thermoelectric separation component (5) includes a copper substrate layer (501), a semi-cured adhesive layer (502), and a heat dissipation boss (503). A plurality of first openings are provided on the semi-cured adhesive layer. A material plate (6) is set at the bottom of the insulating heat-conducting plate (1). A water-cooled heat dissipation assembly (7) is fixedly connected to the top of the material plate (6). The water-cooled heat dissipation assembly (7) includes a water flow pipe (701), an upper heat dissipation fin (702) and a lower heat dissipation fin (703). Connectors (8) are fixedly connected to both ends of the water flow pipe (701). A second electroplated copper layer (9) is disposed on top of the fiberglass panel layer (4), and a fiberglass layer (10) is fixedly connected to the bottom of the second electroplated copper layer (9), and a third electroplated copper layer (11) is fixedly connected to the bottom of the fiberglass layer (10).

2. The high-power stage lamp copper substrate according to claim 1, characterized in that: The thermoelectric separation component (5) includes a copper substrate layer (501) fixedly connected to the bottom of the glass fiber panel layer (4).

3. The high-power stage lamp copper substrate according to claim 2, characterized in that: A semi-cured adhesive layer (502) is fixedly connected to the top of the copper substrate layer (501), and a heat dissipation boss (503) is fixedly connected to the surface of the semi-cured adhesive layer (502).

4. The high-power stage lamp copper substrate according to claim 1, characterized in that: The water-cooled heat dissipation component (7) includes a water flow pipe (701) fixedly connected to the top of the material plate (6).

5. A high-power stage lamp copper substrate according to claim 4, characterized in that: The top of the water pipe (701) is fixedly connected to an upper heat sink (702), and the bottom of the upper heat sink (702) is fixedly connected to a lower heat sink (703).

6. The high-power stage lamp copper substrate according to claim 1, characterized in that: The upper surface of the second electroplated copper layer (9) is provided with a through hole, and the surface of the third electroplated copper layer (11) is provided with a through hole.

7. The high-power stage lamp copper substrate according to claim 6, characterized in that: The inner surface of the through hole is provided with a first copper plating layer (12), and multiple sets of fixing holes are opened on both sides of the fiberglass panel layer (4).

8. The high-power stage lamp copper substrate according to claim 6, characterized in that: The insulating heat-conducting plate (1) has multiple sets of mounting holes on both sides, and the upper heat sink (702) has multiple sets of positioning holes on both sides.

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