An optical module

Abstract

The optical module disclosed herein includes a circuit board, a laser, an optical modulation chip, an optical fiber array, and a collimating lens. The optical modulation chip is coupled to both the laser and the optical fiber array. Since the mode waist radius of the optical modulation chip is larger than that of the laser, the input mode spot of the optical modulation chip is larger than the output mode spot of the laser. The output mode spot of the laser is magnified to match the input mode spot of the optical modulation chip. An adjustable lens group, including a first lens and a second lens, is provided in the output optical path of the collimating lens. The distance between the second lens and the first lens is adapted to the ratio of the mode waist radius of the optical modulation chip to that of the laser. By adjusting the distance between the second lens and the first lens, different ratios between the mode waist radii of the optical modulation chip and the laser can be matched, thereby ensuring compatibility between different types of lasers and different types of optical modulation chips.

Description

Technical Field

[0001] This disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, advancements in optical communication technology have become increasingly important. In optical communication technology, the optical module, as one of the key components in optical communication equipment, enables photoelectric signal conversion; and in the development of optical communication technology, the data transmission rate of optical modules is required to continuously improve. Utility Model Content

[0003] In some embodiments, an optical module is provided to be compatible with coupling between different types of lasers and different types of optical modulation chips.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] Circuit board;

[0006] A laser, electrically connected to the circuit board, is used to output light that does not carry a signal.

[0007] An optical modulation chip, coupled to the laser, is used to receive the light that does not carry a signal and modulate it to generate an optical signal; the relative position between the optical modulation chip and the laser is fixed, and the mode field waist radius of the optical modulation chip is larger than the mode field waist radius of the laser.

[0008] An optical fiber array is optically coupled to the optical modulation chip to transmit the modulated optical signal;

[0009] A collimating lens is located in the output optical path of the laser.

[0010] The adjustable lens group includes a first lens and a second lens. The first lens is located on one side of the collimating lens, and the second lens is located between the first lens and the optical modulation chip. The focused light spot output by the second lens is larger than the light spot on the laser's output end face. The distance between the second lens and the first lens is adapted to the ratio of the mode field waist radius of the optical modulation chip to the mode field waist radius of the laser.

[0011] The above technical solution has the following advantages or beneficial effects: The optical module includes a circuit board, a laser, an optical modulation chip, a fiber array, and a collimating lens. The laser is electrically connected to the circuit board and is used to output light without carrying a signal. The optical modulation chip is coupled to the laser and is used to receive the light without carrying a signal and modulate it to generate an optical signal. The fiber array is optically coupled to the optical modulation chip to transmit the optical signal modulated by the optical modulation chip. The relative position between the optical modulation chip and the laser is fixed. A collimating lens is provided on the laser output optical path to collimate the diverging light emitted by the laser. The mode field waist radius of the optical modulation chip is larger than that of the laser, so the input mode spot of the optical modulation chip is larger than the output end face spot of the laser. The output end face spot of the laser can be magnified to match the input mode spot of the optical modulation chip. Different laser models have different mode field waist radii, and different optical modulation chips have different mode field waist radii. Therefore, different magnifications need to be tuned to match the ratio between the mode field waist radii of the optical modulation chip and the laser, thus matching the coupling mode spots and increasing the coupling efficiency between them. To this end, an adjustable lens group is provided in the output optical path of the collimating lens. The adjustable lens group includes a first lens and a second lens. The first lens is located on one side of the collimating lens, and the second lens is located between the first lens and the optical modulation chip. The focused light spot output by the second lens is larger than the light spot at the laser's output end face, thereby matching the input light spot size of the optical modulation chip. Meanwhile, the spacing between the second lens and the first lens is adapted to the ratio of the mode field waist radius of the optical modulation chip to the mode field waist radius of the laser. Therefore, when the relative distance between the optical modulation chip and the laser is fixed, by adjusting the spacing between the second lens and the first lens, different ratios between the mode field waist radius of the optical modulation chip and the mode field waist radius of the laser can be matched, thereby enabling the coupling between different types of lasers and different types of optical modulation chips.

[0012] In some embodiments, the collimating lens has a first focal length f1, the first lens has a second focal length f2, and the second lens has a third focal length f3;

[0013] The distance between the first lens and the second lens is d;

[0014] The equivalent focal length of the adjustable lens group

[0015] The above technical solution has the following advantages or beneficial effects: the collimating lens has a first focal length f1, the first lens has a second focal length f2, and the second lens has a third focal length f3. The distance between the first lens and the second lens is d, and the equivalent focal length of the adjustable lens group is... The equivalent focal length of the adjustable lens group can be calculated using the first focal length f1, the second focal length f2, the third focal length f3, and the distance d between the first and second lenses. By adjusting the distance d between the first and second lenses, the equivalent focal length of the adjustable lens group can be changed, thereby adapting to different ratios between the mode waist radius of the optical modulation chip and the mode waist radius of the laser. This allows for compatibility with different types of lasers and optical modulation chips, improving the flexibility and applicability of the optical module.

[0016] In some embodiments, the focal length of the first lens is greater than the focal length of the collimating lens;

[0017] The focal length of the second lens is greater than the focal length of the collimating lens.

[0018] The above technical solution has the following advantages or beneficial effects: the focal length of the first lens is greater than that of the collimating lens, and the focal length of the second lens is also greater than that of the collimating lens. This design ensures that the optical signal is properly amplified and focused when passing through the adjustable lens group, thereby further improving the coupling efficiency between the optical modulation chip and the laser. At the same time, the larger focal length design also helps to reduce optical signal loss and improve the transmission performance of the optical module.

[0019] In some embodiments, if the ratio between the mode field waist radius of the optical modulation chip and the mode field waist radius of the laser increases, then the distance between the second lens and the first lens increases.

[0020] The above technical solution has the following advantages or beneficial effects: when the ratio between the mode waist radius of the optical modulation chip and the mode waist radius of the laser increases, the required tuning magnification increases. By increasing the distance between the second lens and the first lens, the equivalent focal length of the adjustable lens group is increased, thereby increasing the magnification of the adjustable lens group, so that the magnified light spot can better match the input mode spot size of the optical modulation chip.

[0021] In some embodiments, if the ratio between the mode field waist radius of the optical modulation chip and the mode field waist radius of the laser decreases, then the distance between the second lens and the first lens decreases.

[0022] The above technical solution has the following advantages or beneficial effects: when the ratio between the mode waist radius of the optical modulation chip and the mode waist radius of the laser decreases, the required tuning magnification decreases. By reducing the distance between the second lens and the first lens, the equivalent focal length of the adjustable lens group is reduced, thereby reducing the magnification of the adjustable lens group, so that the magnified light spot can better match the input mode spot size of the optical modulation chip.

[0023] In some embodiments, an optical module is provided, comprising:

[0024] Circuit board;

[0025] A laser, electrically connected to the circuit board, is used to output light that does not carry a signal.

[0026] An optical modulation chip, coupled to the laser, is used to receive the light that does not carry a signal and modulate it to generate an optical signal; the relative position between the optical modulation chip and the laser is fixed, and the mode field waist radius of the optical modulation chip is larger than the mode field waist radius of the laser.

[0027] An optical fiber array is optically coupled to the optical modulation chip to transmit the modulated optical signal;

[0028] A collimating lens is located in the output optical path of the laser.

[0029] An adjustable lens group includes a first lens and a second lens. The first lens is located on one side of the collimating lens, and the second lens is located between the first lens and the optical modulation chip. The focused light spot output by the second lens is larger than the light spot on the laser's output end face. The relative distance between the second lens and the first lens enables the adjustable lens group to have a target magnification, which is proportional to the ratio of the mode field waist radius of the optical modulation chip to the mode field waist radius of the laser.

[0030] The above technical solution has the following advantages or beneficial effects: The optical module includes a circuit board, a laser, an optical modulation chip, a fiber array, and a collimating lens. The laser is electrically connected to the circuit board and is used to output light without carrying a signal. The optical modulation chip is coupled to the laser and is used to receive the light without carrying a signal and modulate it to generate an optical signal. The fiber array is optically coupled to the optical modulation chip to transmit the optical signal modulated by the optical modulation chip. The relative position between the optical modulation chip and the laser is fixed. A collimating lens is provided on the laser output optical path to collimate the diverging light emitted by the laser. The mode field waist radius of the optical modulation chip is larger than that of the laser, so the input mode spot of the optical modulation chip is larger than the output end face spot of the laser. The output end face spot of the laser can be magnified to match the input mode spot of the optical modulation chip. Different laser models have different mode field waist radii, and different optical modulation chips have different mode field waist radii. Therefore, different magnifications need to be tuned to match the ratio between the mode field waist radii of the optical modulation chip and the laser, thus matching the coupling mode spots and increasing the coupling efficiency between them. To this end, an adjustable lens group is provided in the output optical path of the collimating lens. The adjustable lens group includes a first lens and a second lens. The first lens is located on one side of the collimating lens, and the second lens is located between the first lens and the optical modulation chip. The focused light spot output by the second lens is larger than the light spot at the laser's output end face, thereby matching the input light spot size of the optical modulation chip. Simultaneously, by adjusting the relative distance between the second lens and the first lens, the adjustable lens group achieves a target magnification, which is proportional to the ratio between the mode field waist radii of the optical modulation chip and the laser, thus ensuring compatibility between different laser models and different optical modulation chip models.

[0031] In some embodiments, the collimating lens has a first focal length f1, the first lens has a second focal length f2, and the second lens has a third focal length f3;

[0032] The distance between the first lens and the second lens is d;

[0033] The equivalent focal length of the adjustable lens group

[0034] The above technical solution has the following advantages or beneficial effects: the collimating lens has a first focal length f1, the first lens has a second focal length f2, and the second lens has a third focal length f3. The distance between the first lens and the second lens is d, and the equivalent focal length of the adjustable lens group is... The equivalent focal length of the adjustable lens group can be calculated using the first focal length f1, the second focal length f2, the third focal length f3, and the distance d between the first and second lenses. By adjusting the distance d between the first and second lenses, the equivalent focal length of the adjustable lens group can be changed, thereby adapting to different ratios between the mode waist radius of the optical modulation chip and the mode waist radius of the laser. This allows for compatibility with different types of lasers and optical modulation chips, improving the flexibility and applicability of the optical module.

[0035] In some embodiments, the focal length of the first lens is greater than the focal length of the collimating lens;

[0036] The focal length of the second lens is greater than the focal length of the collimating lens.

[0037] The above technical solution has the following advantages or beneficial effects: the focal length of the first lens is greater than that of the collimating lens, and the focal length of the second lens is also greater than that of the collimating lens. This design ensures that the optical signal is properly amplified and focused when passing through the adjustable lens group, thereby further improving the coupling efficiency between the optical modulation chip and the laser. At the same time, the larger focal length design also helps to reduce optical signal loss and improve the transmission performance of the optical module.

[0038] In some embodiments, if the ratio between the mode field waist radius of the optical modulation chip and the mode field waist radius of the laser increases, then the distance between the second lens and the first lens increases.

[0039] The above technical solution has the following advantages or beneficial effects: when the ratio between the mode waist radius of the optical modulation chip and the mode waist radius of the laser increases, the required tuning magnification increases. By increasing the distance between the second lens and the first lens, the equivalent focal length of the adjustable lens group is increased, thereby increasing the magnification of the adjustable lens group, so that the magnified light spot can better match the input mode spot size of the optical modulation chip.

[0040] In some embodiments, if the ratio between the mode field waist radius of the optical modulation chip and the mode field waist radius of the laser decreases, then the distance between the second lens and the first lens decreases.

[0041] The above technical solution has the following advantages or beneficial effects: when the ratio between the mode waist radius of the optical modulation chip and the mode waist radius of the laser decreases, the required tuning magnification decreases. By reducing the distance between the second lens and the first lens, the equivalent focal length of the adjustable lens group is reduced, thereby reducing the magnification of the adjustable lens group, so that the magnified light spot can better match the input mode spot size of the optical modulation chip. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are merely drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. Furthermore, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0043] Figure 1 This is a partial architecture diagram of an optical communication system according to some embodiments;

[0044] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0045] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0046] Figure 4 An exploded view of an optical module according to some embodiments;

[0047] Figure 5 This is a structural diagram of the internal structure of an optical module according to some embodiments;

[0048] Figure 6 This is an exploded view of the interior of an optical module according to some embodiments;

[0049] Figure 7 This is a structural diagram of a light emitting component according to some embodiments;

[0050] Figure 8 An exploded view of a light emitting component according to some embodiments;

[0051] Figure 9 An adjustable lens group structure according to some embodiments Figure 1 ;

[0052] Figure 10 An adjustable lens group structure according to some embodiments Figure 2 . Detailed Implementation

[0053] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0054] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0055] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0056] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0057] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0058] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0059] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0060] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0061] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0062] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0063] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0064] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0065] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0066] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0067] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0068] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0069] Figure 2 This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0070] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0071] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0072] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0073] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0074] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0075] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0076] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0077] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0078] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0079] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0080] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0081] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0082] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0083] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0084] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0085] In some implementations, the gold fingers 301 are disposed on one side of the surface of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers 301 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is required.

[0086] In some implementations, the gold fingers of the circuit board extend from the opening 204 and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers 301 are connected to the electrical connector inside the cage 106. The gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0087] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0088] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0089] In some embodiments, the optical module includes a light emitting component 400. In some embodiments, the optical module includes a light receiving component 500.

[0090] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold finger 301.

[0091] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0092] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0093] Figure 5 This is a diagram illustrating the internal structure of an optical module according to some embodiments. Figure 6 This is an exploded view of the interior of an optical module according to some embodiments. Figure 5 and Figure 6 As shown, in some embodiments, the optical module may include a substrate 700 to support and carry the light emitting component 400. The substrate 700 has good thermal conductivity, which is beneficial for heat dissipation of the light emitting component 400 and ensures that the light emitting component 400 can operate normally.

[0094] In some embodiments, a notch 302 is formed on the surface of the circuit board 300 to embed the substrate 700. If the size of the notch 302 is smaller than the area of ​​the substrate 700, the outer periphery of the substrate 700 supports the circuit board 300.

[0095] In some embodiments, the light emitting component 400 may include a laser 410. The laser 410 is located on the surface of the substrate 700. The laser 410 may emit light along its sides without modulating the optical signal, so that the light emitted by the laser 410 does not carry an optical signal. Exemplarily, the laser 410 is a DFB laser.

[0096] In some embodiments, the light emitting component 400 may include a collimating lens 420. The collimating lens 420 is located on the surface of the substrate 700. The collimating lens 420 is located in the light output path of the laser 410. The collimating lens 420 is used to collimate the diverging light emitted by the laser 410.

[0097] In some embodiments, the light emitting component 400 may include an isolator 430. The isolator 430 is located on the surface of the substrate 700. The isolator 430 is located in the light output path of the collimating lens 420 to prevent light emitted by the laser 410 from returning to the laser 410, thereby ensuring the light output quality of the laser 410.

[0098] In some embodiments, the light emitting component 400 may include an optical modulation chip 440. The optical modulation chip 440 is located on the surface of the substrate 700. The optical modulation chip 440 is located in the light output path of the isolator 430 and receives the light output from the isolator 430. The optical modulation chip 440 modulates the signal phase of the light output from the isolator 430 to generate an optical signal.

[0099] In some embodiments, the optical modulation chip 440 integrates an MZ modulator to modulate the optical signal and transmit it. Exemplarily, the optical modulation chip 440 can be a silicon photonics chip, a thin-film lithium niobate chip, or a III-V group photonics chip.

[0100] In some embodiments, the light emitting component 400 may include an optical fiber array 450. The optical fiber array 450 is located on the surface of the substrate 700. The optical fiber array 450 is end-face coupled to the optical modulation chip 440. The optical fiber array 450 is located in the light output path of the optical modulation chip 440 to transmit the optical signal modulated by the optical modulation chip 440 to the outside.

[0101] In some embodiments, the light emitted by the laser 410 is transmitted to the optical modulation chip 440, where it is modulated to generate an optical signal. The optical signal is then output from the optical modulation chip 440 and transmitted through the fiber array 450.

[0102] In some embodiments, the laser 410, collimating lens 420, and isolator 430 are located in the incident light path of the optical modulation chip 440, providing the light source to be modulated to the optical modulation chip 440. The fiber array 450 is coupled to the output light port of the optical modulation chip 440. Since the incident light port and the output light port of the optical modulation chip 440 are formed on the same side, the laser 410, collimating lens 420, isolator 430, and fiber array 450 are located on the same side of the optical modulation chip 440.

[0103] In some embodiments, the collimating lens 420 and the fiber array 450 are respectively bonded and fixed to the surface of the substrate 700 using a photocurable interface adhesive, such as UV optical adhesive. The photocurable interface adhesive has the characteristic of rapid curing at low temperatures, and its curing process does not require high temperatures, thus avoiding deformation of heat-sensitive optical components, such as the collimating lens 420 and the fiber array 450, due to high temperatures. Furthermore, the photocurable interface adhesive has a low shrinkage rate during curing, preventing deformation of the collimating lens 420 and the fiber array 450 due to stress, and preventing optical path misalignment, thereby ensuring optical path stability. In addition, the photocurable interface adhesive can cure quickly under ultraviolet light, which is beneficial for the passive coupling of the collimating lens 420 or the fiber array 450.

[0104] In some embodiments, the laser chip 401 and the optical modulation chip 440 are coupled together. If the mode field waist radius of the laser chip 401 is smaller than that of the optical modulation chip 440, the light spot size at the output end face of the laser chip 401 is smaller, while the input light spot size of the optical modulation chip 440 is larger. This results in a mode field mismatch between the laser chip 401 and the optical modulation chip 440, reducing their coupling efficiency. The mode field waist radius refers to the lateral dimension at the narrowest point of the beam propagation direction.

[0105] In some embodiments, different types of lasers 410 have different mode field waist radii. For example, the mode field waist radius of laser A1 is 1.27 μm, and the mode field waist radius of laser A2 is 1.75 μm.

[0106] In some embodiments, different models of optical modulation chips 440 have different mode field waist radii. For example, the mode field waist radius of the B1 model optical modulation chip 440 is 2.72 μm, the mode field waist radius of the B2 model optical modulation chip 440 is 2.95 μm, and the mode field waist radius of the B3 model optical modulation chip 440 is 3.32 μm.

[0107] In some embodiments, when different types of lasers 410 are coupled with different types of optical modulation chips 440, the amplification factor needs to be dynamically tuned to match the mode field between the laser 410 and the optical modulation chip 440. The amplification factor can be the ratio between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410.

[0108] In some embodiments, when the A1 type laser 410 is coupled to the B1 type optical modulation chip 440, the required amplification factor is 2.14. When the A1 type laser 410 is coupled to the B2 type optical modulation chip 440, the required amplification factor is 2.32. When the A1 type laser 410 is coupled to the B3 type optical modulation chip 440, the required amplification factor is 2.61.

[0109] In some embodiments, when the A2 type laser 410 is coupled to the B1 type optical modulation chip 440, the required amplification factor is 1.55. When the A2 type laser 410 is coupled to the B2 type optical modulation chip 440, the required amplification factor is 1.69. When the A2 type laser 410 is coupled to the B3 type optical modulation chip 440, the required amplification factor is 1.90.

[0110] Figure 7 This is a structural diagram of a light emitting component according to some embodiments. Figure 8 This is an exploded view of a light emitting component according to some embodiments. Figure 7 and Figure 8 As shown, in some embodiments, the light emitting component 400 is disposed on the surface of the substrate 700 to facilitate heat dissipation of the light emitting component 400. The substrate 700 has good thermal conductivity and is thermally connected to the upper housing 201. The light emitting component 400 is disposed on the surface of the substrate 700 to facilitate heat dissipation of the light emitting component 400 through the substrate 700, thus meeting the heat dissipation requirements of the light emitting component 400. For example, the heat generated by the laser 410 is dissipated to the upper housing 201 through the substrate 700, and a heat dissipation channel can be formed between the upper housing 201 of the optical module and the cage 106 of the host computer 100.

[0111] In some embodiments, when different types of lasers 410 are coupled with different types of optical modulation chips 440, different amplification factors need to be adjusted. The target amplification factor is proportional to the ratio between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410. Wherein, if the relative position between the laser 410 and the optical modulation chip 440 is fixed, then the relative distance between them is fixed.

[0112] In some embodiments, the optical module may include an adjustable lens group 460. The adjustable lens group 460 is disposed between the laser 410 and the optical modulation chip 440 to focus and amplify the light spot at the output end face of the laser 410 to match the input light spot of the optical modulation chip 440, thereby increasing the mode field adaptation and coupling efficiency between the laser 410 and the optical modulation chip 440.

[0113] In some embodiments, the adjustable lens group 460 is located in the light output path of the collimating lens 420. The relative distance between the adjustable lens group 460 and the collimating lens 420 is not fixed. The collimating lens 420 has a fixed focal length. The adjustable lens group 460 enables focusing and magnification tuning.

[0114] In some embodiments, the adjustable lens group 460 may include a first lens 461. The first lens 461 is located in the light output path of the collimating lens 420. The first lens 461 has a fixed focal length.

[0115] In some embodiments, the adjustable lens group 460 may include a second lens 462. The second lens 462 is located between the first lens 461 and the optical modulation chip 440. The second lens 462 has a fixed focal length.

[0116] In some embodiments, the collimating lens 420 is used to collimate the light beam emitted by the laser 410. By adjusting the relative position between the second lens 462 and the first lens 461, continuous tuning of the magnification can be achieved.

[0117] In some embodiments, the focal length of the first lens 461 is greater than the focal length of the collimating lens 420, and the focal length of the second lens 462 is greater than the focal length of the collimating lens 420. This design ensures that the optical signal is properly amplified and focused when passing through the adjustable lens group 460, thereby further improving the coupling efficiency between the optical modulation chip 440 and the laser 410. Simultaneously, the larger focal length design also helps reduce optical signal loss and improve the transmission performance of the optical module.

[0118] In some embodiments, different types of lasers 410 have different mode field waist radii, and different types of optical modulation chips 440 have different mode field waist radii. Therefore, different amplification factors need to be tuned to adapt the ratio between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410, match the coupling mode spots between the two, and increase the coupling efficiency between the two.

[0119] In some embodiments, the adjustable lens group 460 is made to have a target magnification by adjusting the relative distance between the second lens 462 and the first lens 461. The target magnification is proportional to the ratio between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410, thereby enabling the coupling between different types of lasers 410 and different types of optical modulation chips 440.

[0120] In some embodiments, the relative distance between the second lens 462 and the first lens 461 is proportional to the target magnification, and thus proportional to the ratio between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410.

[0121] In some embodiments, when the ratio between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410 increases, the required tuning magnification increases. By increasing the distance between the second lens 462 and the first lens 461, the equivalent focal length of the adjustable lens group 460 is increased, thereby increasing the magnification of the adjustable lens group 460, so that the magnified light spot can better match the input mode spot size of the optical modulation chip 440.

[0122] In some embodiments, when the ratio between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410 decreases, the required tuning magnification decreases. By reducing the distance between the second lens 462 and the first lens 461, the equivalent focal length of the adjustable lens group 460 is reduced, thereby reducing the magnification of the adjustable lens group 460, so that the magnified light spot can better match the input mode spot size of the optical modulation chip 440.

[0123] In some embodiments, the collimating lens 420 has a first focal length f1, the first lens 461 has a second focal length f2, and the second lens 462 has a third focal length f3. The distance between the first lens 461 and the second lens 462 is d, and the equivalent focal length of the adjustable lens group 460 is... The equivalent focal length of the adjustable lens group 460 can be calculated using the first focal length f1, the second focal length f2, the third focal length f3, and the distance d between the first lens 461 and the second lens 462.

[0124] In some embodiments, the magnification between the laser 410 and the optical modulation chip 440 is equal to the ratio of the equivalent focal length of the adjustable lens group to the first focal length. For example, if the first focal length of the collimating lens 420 is a fixed value, then the relative distance between the second lens 462 and the first lens 461 is proportional to the target magnification.

[0125] In some embodiments, the first focal length f1, the second focal length f2, and the third focal length f3 are fixed values. When the relative position between the laser 410 and the optical modulation chip 440 is fixed, the equivalent focal length of the adjustable lens group 460 can be changed by adjusting the distance d between the first lens 461 and the second lens 462. This allows for adaptation to different ratios between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410, thereby enabling compatibility between different types of lasers 410 and optical modulation chips 440, and improving the flexibility and applicability of the optical module.

[0126] In some embodiments, the focal lengths of the collimating lens 420, the first lens 461, and the second lens 462 can be 0.6 mm, 2 mm, and 1.5 mm, respectively.

[0127] In some embodiments, the equivalent focal length of the adjustable lens group 460 can be: The magnification of the focusing system formed by the collimating lens 420 and the adjustable lens group 460 is [missing information]. Clearly, the magnification is related to the distance d between the first lens 461 and the second lens 462, and the two are directly proportional.

[0128] Figure 9 An adjustable lens group structure according to some embodiments Figure 1 , Figure 10 An adjustable lens group structure according to some embodiments Figure 2 .like Figure 9 and Figure 10 As shown, in some embodiments, the adjustable lens group 460 is located in the light output path of the collimating lens 420. The relative position between the adjustable lens group 460 and the collimating lens 420 is not fixed.

[0129] In some embodiments, by adjusting the distance d between the first lens 461 and the second lens 462, the equivalent focal length of the adjustable lens group 460 can be changed, thereby adapting to different ratios between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410, thus enabling compatibility between different types of lasers 410 and optical modulation chips 440, and improving the flexibility and applicability of the optical module.

[0130] In some embodiments, when the ratio between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410 increases, the required tuning magnification increases. By increasing the distance between the second lens 462 and the first lens 461, the equivalent focal length of the adjustable lens group 460 is increased, thereby increasing the magnification of the adjustable lens group 460, so that the magnified light spot can better match the input mode spot size of the optical modulation chip 440.

[0131] In some embodiments, when the ratio between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410 decreases, the required tuning magnification decreases. By reducing the distance between the second lens 462 and the first lens 461, the equivalent focal length of the adjustable lens group 460 is reduced, thereby reducing the magnification of the adjustable lens group 460, so that the magnified light spot can better match the input mode spot size of the optical modulation chip 440.

[0132] In some embodiments, when the ratio between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410 is a first ratio, the distance between the first lens 461 and the collimating lens 420 is L1, and the distance between the second lens 462 and the first lens 461 is D1. When the ratio between the mode field waist radius of the optical modulation chip 440 and the mode field waist radius of the laser 410 is a second ratio, the distance between the first lens 461 and the collimating lens 420 is L2, and the distance between the second lens 462 and the first lens 461 is D2.

[0133] In some embodiments, different types of lasers 410 have different mode field waist radii. For example, the mode field waist radius of laser A1 is 1.27 μm, and the mode field waist radius of laser A2 is 1.75 μm.

[0134] In some embodiments, different models of optical modulation chips 440 have different mode field waist radii. For example, the mode field waist radius of the B1 model optical modulation chip 440 is 2.72 μm, the mode field waist radius of the B2 model optical modulation chip 440 is 2.95 μm, and the mode field waist radius of the B3 model optical modulation chip 440 is 3.32 μm.

[0135] In some embodiments, when the A1 type laser 410 is coupled to the B1 type optical modulation chip 440, the required target magnification is 2.14. In this case, the distance d between the first lens 461 and the second lens 462 is 1.16 mm.

[0136] In some embodiments, when the A1 type laser 410 is coupled to the B2 type optical modulation chip 440, the required target magnification is 2.32. In this case, the distance d between the first lens 461 and the second lens 462 is 1.35 mm.

[0137] In some embodiments, when the A1 type laser 410 is coupled to the B3 type optical modulation chip 440, the required target magnification is 2.61. At this time, the distance d between the first lens 461 and the second lens 462 is 1.59 mm.

[0138] In some embodiments, when the A2 type laser 410 is coupled to the B1 type optical modulation chip 440, the required target magnification is 1.55. At this time, the distance d between the first lens 461 and the second lens 462 is 0.28 mm.

[0139] In some embodiments, when the A2 type laser 410 is coupled to the B2 type optical modulation chip 440, the required target magnification is 1.69. At this time, the distance d between the first lens 461 and the second lens 462 is 0.54 mm.

[0140] In some embodiments, when the A2 type laser 410 is coupled to the B3 type optical modulation chip 440, the required target magnification is 1.90. At this time, the distance d between the first lens 461 and the second lens 462 is 0.87 mm.

[0141] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An optical module characterized by comprising: include: Circuit board; A laser, electrically connected to the circuit board, is used to output light that does not carry a signal. An optical modulation chip, coupled to the laser, is used to receive the light that does not carry a signal and modulate it to generate an optical signal; The relative position between the optical modulation chip and the laser is fixed, and the mode field waist radius of the optical modulation chip is larger than that of the laser. An optical fiber array is optically coupled to the optical modulation chip to transmit the modulated optical signal; A collimating lens is located in the output optical path of the laser. The adjustable lens group includes a first lens and a second lens. The first lens is located on one side of the collimating lens, and the second lens is located between the first lens and the optical modulation chip. The focused light spot output by the second lens is larger than the light spot on the laser's output end face. The distance between the second lens and the first lens is adapted to the ratio of the mode field waist radius of the optical modulation chip to the mode field waist radius of the laser.

2. The optical module according to claim 1, characterized by The collimating lens has a first focal length f1, the first lens has a second focal length f2, and the second lens has a third focal length f3; The distance between the first lens and the second lens is d; Equivalent focal length of the tunable lens group 3. The optical module according to claim 1, characterized by The focal length of the first lens is greater than the focal length of the collimating lens; The focal length of the second lens is greater than the focal length of the collimating lens.

4. The optical module according to claim 1, characterized by As the ratio between the mode field waist radius of the optical modulation chip and the mode field waist radius of the laser increases, the distance between the second lens and the first lens increases.

5. The optical module of claim 1, wherein, As the ratio between the mode field waist radius of the optical modulation chip and the mode field waist radius of the laser decreases, the distance between the second lens and the first lens decreases.

6. An optical module characterized by comprising: include: Circuit board; A laser, electrically connected to the circuit board, is used to output light that does not carry a signal. An optical modulation chip, coupled to the laser, is used to receive the light that does not carry a signal and modulate it to generate an optical signal; The relative position between the optical modulation chip and the laser is fixed, and the mode field waist radius of the optical modulation chip is larger than that of the laser. An optical fiber array is optically coupled to the optical modulation chip to transmit the modulated optical signal; A collimating lens is located in the output optical path of the laser. An adjustable lens group includes a first lens and a second lens. The first lens is located on one side of the collimating lens, and the second lens is located between the first lens and the optical modulation chip. The focused light spot output by the second lens is larger than the light spot on the laser's output end face. The relative distance between the second lens and the first lens enables the adjustable lens group to have a target magnification, which is proportional to the ratio of the mode field waist radius of the optical modulation chip to the mode field waist radius of the laser.

7. The optical module according to claim 6, characterized by The collimating lens has a first focal length f1, the first lens has a second focal length f2, and the second lens has a third focal length f3; The distance between the first lens and the second lens is d; Equivalent focal length of the tunable lens group 8. The optical module according to claim 6, characterized by The focal length of the first lens is greater than the focal length of the collimating lens; The focal length of the second lens is greater than the focal length of the collimating lens.

9. The optical module of claim 6, wherein, The target magnification increases, and the interval between the second lens and the first lens increases.

10. The optical module of claim 6, wherein, The target magnification decreases, and the interval between the second lens and the first lens decreases.

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