A package structure of a light engine

Abstract

The utility model discloses a kind of packaging structures of light engine, including PCB board and FA-MT connector, FA-MT connector and PCB board interval arrangement, two groups of three three one group four-channel components are horizontally spaced on PCB board, FA-MT connector is interval arrangement with two groups of four-channel components, PCB board is electrically connected with four-channel component, one group of four-channel components away from FA-MT connector is electrically connected with FA-MT connector by first connecting component, another group of four-channel components close to FA-MT connector is electrically connected with FA-MT connector by second connecting component.The utility model by twenty-four four-channel optical module is decomposed into two groups of twelve channel structure, and twelve channel structure is combined using existing mature four-channel component, i.e. Twelve channel structure is converted into three groups of four-channel structure, solve the problem of expensive twelve channel drive chip, the scheme adopts the mode of four-channel component combination, significantly reduces material cost and supply chain risk, while maintaining the same optical communication performance index.

Description

Technical Field

[0001] This utility model relates to the field of optical fiber technology, and in particular to a packaging structure for an optical engine. Background Technology

[0002] In military high-speed optical interconnect systems, such as shipborne radar data processing, avionics information buses, and airborne transmission links, higher demands are placed on the bandwidth density and transmission reliability of optical communication modules. In particular, 24-channel optical modules offer significant advantages in meeting the requirements of high throughput, high interference resistance, and compact module integration.

[0003] Currently, there are no driver chips for 24-channel modulation. Generally, 12-channel driver chips are used for layout and splicing. However, there are few suppliers of 12-channel driver chips on the market, and they are expensive and have long delivery cycles, making it difficult to support cost control and supply chain security for large-scale deployment. Utility Model Content

[0004] (a) Purpose of the utility model

[0005] To address the technical problems existing in the background art, this utility model proposes a packaging structure for an optical engine. By decomposing the 24-channel optical module into two groups of 12-channel structures, and combining the 12-channel structures with existing mature 4-channel components, the 12-channel structure is converted into three groups of 4-channel structures. This solves the problem of the high price of 12-channel driver chips. This solution adopts a 4-channel component combination method, which significantly reduces material costs and supply chain risks, while maintaining the same optical communication performance indicators.

[0006] (II) Technical Solution

[0007] This utility model provides a packaging structure for an optical engine, including a PCB board and an FA-MT connector. The FA-MT connector and the PCB board are spaced apart. Two sets of four-channel components in groups of three are horizontally spaced on the PCB board. The FA-MT connector is spaced apart from the two sets of four-channel components. The PCB board is electrically connected to the four-channel components. One set of four-channel components farther away from the FA-MT connector is electrically connected to the FA-MT connector through a first connecting component. The other set of four-channel components closer to the FA-MT connector is electrically connected to the FA-MT connector through a second connecting component.

[0008] Preferably, the first connection component includes three four-channel fiber arrays, each of which corresponds to one of the three four-channel components located away from the FA-MT connector. The four-channel fiber arrays are electrically connected to the four-channel components and to the FA-MT connector.

[0009] Preferably, the second connection component includes a twelve-channel fiber array, which is electrically connected to three four-channel components near the FA-MT connector, and the twelve-channel fiber array is electrically connected to the FA-MT connector.

[0010] Preferably, the four-channel component includes a four-channel driver chip and a four-channel optical chip. The four-channel driver chip and the four-channel optical chip are spaced apart and both are disposed on the PCB board. The four-channel driver chip is electrically connected to the PCB board, the four-channel driver chip is electrically connected to the four-channel optical chip, and the four-channel optical chip is coupled to the four-channel fiber array or the twelve-channel fiber array.

[0011] Preferably, the four-channel driver chip and the four-channel optical chip are connected to the PCB board via silver paste.

[0012] Preferably, both the four-channel fiber array and the twelve-channel fiber array are connected to the PCB board using structural adhesive.

[0013] Preferably, the PCB board and the four-channel driver chip are electrically connected by gold wires, and the four-channel driver chip and the four-channel optical chip are electrically connected by gold wires.

[0014] Compared with the prior art, the above-mentioned technical solution of this utility model has the following beneficial technical effects:

[0015] In this invention, the technical solution decomposes the 24-channel optical module into two groups of 12-channel structures and combines the 12-channel structures with existing mature 4-channel components, thus converting the 12-channel structure into three groups of 4-channel structures. This solves the problem of the high price of 12-channel driver chips. The solution uses a combination of 4-channel components, which significantly reduces material costs and supply chain risks while maintaining the same optical communication performance indicators. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the packaging structure of a light engine proposed in this utility model.

[0017] Reference numerals: 1. PCB board; 2. FA-MT connector; 3. Four-channel fiber optic array; 4. Twelve-channel fiber optic array; 5. Four-channel driver chip; 6. Four-channel optical chip. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of this utility model.

[0019] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, such as welding, riveting, or bonding; it can also be a detachable connection, such as threaded connection, keyed connection, or pin connection; or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; or it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] like Figure 1 As shown, the present invention proposes a packaging structure for an optical engine, including a PCB board 1 and an FA-MT connector 2. The FA-MT connector 2 and the PCB board 1 are spaced apart. Two sets of four-channel components in groups of three are horizontally spaced on the PCB board 1. The FA-MT connector 2 is spaced apart from the two sets of four-channel components. The PCB board 1 is electrically connected to the four-channel components. One set of four-channel components farther away from the FA-MT connector 2 is electrically connected to the FA-MT connector 2 through a first connecting component. The other set of four-channel components closer to the FA-MT connector 2 is electrically connected to the FA-MT connector 2 through a second connecting component.

[0022] This technical solution decomposes the 24-channel optical module into two groups of twelve-channel structures and combines them with existing mature four-channel components, thus converting the twelve-channel structure into three groups of four-channel structures. This solves the problem of the high price of twelve-channel driver chips. The solution adopts a combination of four-channel components, which significantly reduces material costs and supply chain risks, while maintaining the same optical communication performance indicators.

[0023] Furthermore, this application also proposes that the first connection component includes three four-channel fiber arrays 3, each of which corresponds to one of the three four-channel components located away from the FA-MT connector. The four-channel fiber arrays 3 are electrically connected to the four-channel components and to the FA-MT connector.

[0024] Therefore, this technical solution decomposes the 24 channels into three independent four-channel units through modular design. Each unit uses a standardized four-channel fiber array 3 for optical signal transmission. Compared with the solution of directly using a twelve-channel fiber array 4, the four-channel fiber array 3 has higher process maturity and lower manufacturing cost. Furthermore, when installing with three four-channel fiber arrays 3, since the three four-channel fiber arrays 3 are located on the side away from the FA-MT connector 2, it is necessary to complete the installation of the second connection component first. However, by using three four-channel fiber arrays 3, this can be dispersed, reducing the installation intensity of the twelve-channel fiber array 4.

[0025] Furthermore, this application also proposes that the second connection component includes a twelve-channel fiber array 4, which is electrically connected to three four-channel components near the FA-MT connector, and the twelve-channel fiber array 4 is electrically connected to the FA-MT connector.

[0026] In response, this technical solution replaces the traditional multi-four-channel fiber array 3 splicing scheme with a single twelve-channel fiber array 4, effectively solving the problems of large space occupation and high assembly complexity in multi-channel optical interconnect systems. The twelve-channel fiber array 4 directly integrates the output signals of three four-channel components, reducing intermediate connection links and thus reducing insertion loss and signal crosstalk risk. This solution significantly improves the integration of optical modules and signal transmission reliability while maintaining the same number of channels.

[0027] Furthermore, this application also proposes that the four-channel component includes a four-channel driver chip 5 and a four-channel optical chip 6, the four-channel driver chip 5 and the four-channel optical chip 6 are spaced apart and both are disposed on the PCB board 1, the four-channel driver chip 5 and the PCB board 1 are electrically connected, the four-channel driver chip 5 and the four-channel optical chip 6 are electrically connected, and the four-channel optical chip 6 is mutually coupled to the four-channel fiber array 3 or the twelve-channel fiber array 4.

[0028] Therefore, this technical solution integrates the four-channel driver chip 5 and the four-channel optical chip 6 on the PCB board 1. This solution avoids the use of expensive twelve-channel driver chips and achieves 24-channel modulation function by combining multiple four-channel components, which significantly reduces costs while ensuring performance.

[0029] Furthermore, this application also proposes that the four-channel driver chip 5 and the four-channel optical chip 6 are connected to the PCB board 1 via silver paste.

[0030] Therefore, this technical solution achieves the interconnection between the chip and the PCB board 1 through silver paste. Compared with the traditional soldering process, silver paste connection can avoid the risk of thermal damage to the optical chip caused by high temperature soldering. Secondly, the flexibility of silver paste can alleviate the stress problem caused by the difference in thermal expansion coefficient between the PCB and the chip. Finally, this process simplifies the production process, eliminates the need for complex reflow soldering equipment, and helps to improve production efficiency and yield.

[0031] Furthermore, this application also proposes that both the four-channel fiber array 3 and the twelve-channel fiber array 4 are connected to the PCB board 1 by structural adhesive.

[0032] This technical solution achieves a reliable connection between the fiber optic array and the PCB board 1 using structural adhesive. The high bonding strength of the epoxy resin can effectively resist mechanical impact in military environments, while the optimized curing process avoids stress concentration inside the adhesive layer.

[0033] Furthermore, this application also proposes that the PCB board 1 and the four-channel driver chip 5 are electrically connected by gold wires, and the four-channel driver chip 5 and the four-channel optical chip 6 are electrically connected by gold wires.

[0034] This technical solution achieves highly reliable electrical interconnection through gold wire bonding. The ductility of the gold wire can alleviate deformation caused by thermal stress and prevent solder joint cracking during temperature cycling. The single-point bonding process can precisely control the interconnect impedance and improve the integrity of high-frequency signals. The diameter and arc height of the gold wire are adjustable to meet the chip stacking requirements of different package heights.

[0035] It should be understood that the specific embodiments described above are merely illustrative or explanatory of the principles of this utility model and do not constitute a limitation thereof. Therefore, any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and scope of this utility model should be included within its protection scope. Furthermore, the appended claims are intended to cover all variations and modifications falling within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A package structure of a light engine, characterized by, The device includes a PCB board and an FA-MT connector, with the FA-MT connector and the PCB board spaced apart. The PCB board has two sets of four-channel components arranged horizontally at intervals of 3:

3. The FA-MT connector is spaced apart from the two sets of four-channel components. The PCB board is electrically connected to the four-channel components. One set of four-channel components farther from the FA-MT connector is electrically connected to the FA-MT connector through a first connecting component, and the other set of four-channel components closer to the FA-MT connector is electrically connected to the FA-MT connector through a second connecting component.

2. The package structure of a light engine according to claim 1, wherein, The first connection component includes three four-channel fiber arrays, each of which corresponds to one of the three four-channel components located away from the FA-MT connector. The four-channel fiber arrays are electrically connected to the four-channel components and to the FA-MT connector.

3. The package structure of a light engine according to claim 2, wherein, The second connection component includes a twelve-channel fiber array electrically connected to three four-channel components near the FA-MT connector, and the twelve-channel fiber array is electrically connected to the FA-MT connector.

4. The package structure of a light engine according to claim 3, wherein, The four-channel component includes a four-channel driver chip and a four-channel optical chip. The four-channel driver chip and the four-channel optical chip are spaced apart and are both disposed on the PCB board. The four-channel driver chip is electrically connected to the PCB board, and the four-channel driver chip is electrically connected to the four-channel optical chip. The four-channel optical chip is coupled to the four-channel fiber array or the twelve-channel fiber array.

5. The package structure of a light engine according to claim 4, wherein, The four-channel driver chip and the four-channel optical chip are connected to the PCB board via silver paste.

6. The package structure of a light engine according to claim 3, wherein, Both the four-channel fiber array and the twelve-channel fiber array are connected to the PCB board using structural adhesive.

7. The package structure of a light engine according to claim 4, wherein, The PCB board and the four-channel driver chip are electrically connected by gold wires, and the four-channel driver chip and the four-channel optical chip are electrically connected by gold wires.

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